It turns out that the big OEM design win liquid cooling solutions maker Asetek was bragging about, is the Radeon R9 390X, and the "undisclosed OEM" AMD. Pictures of a cooler shroud is doing rounds on Chinese tech forums, which reveals something that's similar in design to the Radeon R9 295X2, only designed for single-GPU. The shroud has its fan intake pushed to where it normally is for single-GPU cards; with cutouts for the PCIe power connectors, and a central one, through which liquid cooling tubes pass through.

One can also take a peek at the base-plate of the cooler, which will cool the VRM and memory under the fan's air-flow. The cooler design reveals that AMD wants its reference-design cards to sound quieter "at any cost," even if it means liquid cooling solutions that can be messy with multi-card CrossFire setups, and in systems that already use liquid-cooling for the CPU; and leave it to AIB partners to come up with air-cooled cards, with meatier heatsinks. Other specs of the R9 390X are unknown, as is launch date. It could be based on a member of the "Pirate Islands" family of GPUs, of which the new "Tonga" GPU driving the R9 285 is a part of. A possible codename of AMD's big chip from this family is "Fiji."

AMD's next generation GPU family that leverages upcoming silicon fab technologies to increase transistor counts, while maintaining or lowering thermal envelopes, is codenamed "Volcanic Islands," and we've known about that for some time now.

The centerpiece of "Volcanic Islands" family is "Hawaii," a high-end GPU that makes up top single- and dual-GPU SKUs; followed by "Maui" and "Tonga." Not much is known about these two. A dual-GPU product with two "Hawaii" chips is confusingly codenamed "New Zealand," which is already used to designate certain Radeon HD 7990 graphics cards. AMD is expected to debut its first "Volcanic Islands" GPUs in Q4-2013, when foundry partner TSMC's swanky new 20 nm node is expected to take flight.