Qualcomm Technologies, Inc. today announced the Dragonwing FWA Gen 4 Elite, the world's first 5G Advanced-capable FWA platform. Powered by the Qualcomm X85 5G Modem-RF, the platform sets a new benchmark for 5G broadband performance with downlink speeds up to 12.5 Gbps. The Dragonwing FWA Gen 4 Elite platform introduces comprehensive AI enhancements and integrates a powerful network Edge AI coprocessor with up to 40 TOPS of NPU processing power. This optimizes wireless connectivity across 5G broadband and Wi-Fi, while unlocking the power of generative AI for more devices, enabling a more reliable and harmonized user experience.

"The Dragonwing FWA Gen 4 Elite Platform is a technological breakthrough, building on over 500 5G FWA designs to date, and extends our tradition of delivering platforms that solve the broadband industry's greatest challenges," said Gautam Sheoran, vice president and general manager, wireless broadband and communications, Qualcomm Technologies, Inc. "By integrating unprecedented AI and connectivity capabilities, with the Qualcomm X85 at its core, this platform offers ultra-fast speeds, reliability and flexibility at a lower total cost than wired broadband, ultimately, enabling a future where seamless, intelligent networks transform the way we live and work."

RayNeo, a leading innovator in consumer Augmented Reality (AR) technology, has unveiled its latest XR glasses, the RayNeo Air 3s, at MWC 2025. Alongside this groundbreaking release, the company showcased its other two innovations: the AI-powered, Full-Color AR Glasses RayNeo X3 Pro and the Camera AI Glasses RayNeo V3. Together, these cutting-edge devices underscore RayNeo's unwavering commitment to redefining immersive experiences and enhancing everyday usability through advanced AR solutions.

RayNeo Air 3s: Lightweight XR for Seamless Daily Use
The RayNeo Air 3s redefines the landscape of lightweight XR glasses, seamlessly merging portability with state-of-the-art display technology. Equipped with 3840 Hz high-frequency dimming, a staggering 200,000:1 contrast ratio, and a 154% sRGB color gamut, the Air 3s delivers breathtaking image quality, setting a new benchmark for birdbath display solutions. Its expansive 201-inch virtual screen and TÜV Rheinland-certified eye comfort technology ensure an immersive yet comfortable experience, making it ideal for all-day wear.

According to import-export database records obtained by WinFuture, we are informed that Qualcomm is testing an 18-core Snapdragon X2 Elite processor designated SC8480XP, representing a 50% increase in core count over the current 12-core Snapdragon X Elite. The silicon, developed under the "Project Glymur" codename, incorporates Oryon V3 architecture in what documentation describes as a "high-TDP" implementation exceeding the current generation's 80 W thermal envelope. Test platforms pair the processor with 48 GB of SK Hynix RAM and 1 TB NVMe storage. Reference documentation suggests integration as a system-in-package (SiP), potentially offering CPU and memory in a unified package, much like Intel's Lunar Lake and Apple M-series processors. Thermal management testing includes configurations with 120 mm AIO cooling solutions typical in desktop applications, though form factor targets remain unspecified.

Whether homogeneous high-performance cores or heterogeneous clusters, core architecture details remain undisclosed. Market positioning appears focused on high-TDP environments, suggesting that this new wave of Arm-based Windows processors plans to fight more aggressively in the AI PC space, which will see even NVIDIA join it in the coming months. Internal documentation potentially references "Snapdragon X2 Ultra Premium" branding, though the final nomenclature remains unconfirmed. Volume availability is not expected until 2026, allowing time for platform optimization and validation. Qualcomm has gathered feedback from its Snapdragon X Elite initial launch and working to improve performance and app compatibility for Windows-on-Arm platforms.

Ahead of Mobile World Congress 2025, Qualcomm Technologies, Inc. and IBM (NYSE: IBM) announced an expanded collaboration to drive enterprise-grade generative artificial intelligence (AI) solutions across edge and cloud devices designed to enable increased immediacy, privacy, reliability, personalization, and reduced cost and energy consumption. Through this collaboration, the companies plan to integrate watsonx.governance for generative AI solutions powered by Qualcomm Technologies' platforms, and enable support for IBM's Granite models through the Qualcomm AI Inference Suite and Qualcomm AI Hub.

"At Qualcomm Technologies, we are excited to join forces with IBM to deliver cutting-edge, enterprise-grade generative AI solutions for devices across the edge and cloud," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "This collaboration enables businesses to deploy AI solutions that are not only fast and personalized but also come with robust governance, monitoring, and decision-making capabilities, with the ability to enhance the overall reliability of AI from edge to cloud."

Qualcomm has introduced "Dragonwing," a new brand portfolio consolidating its non-Snapdragon products for industrial applications. The portfolio encompasses industrial IoT, networking, and cellular infrastructure solutions previously marketed under various product lines. The Dragonwing stack integrates AI processing capabilities with low-power computing and connectivity technologies optimized for edge deployment. Target applications include industrial robotics, specialized cameras, industrial handhelds, and unmanned aerial systems. Qualcomm aims to position these solutions in sectors including energy utilities, manufacturing, retail, supply chain, and telecommunications infrastructure.

The branding effort marks a strategic diversification beyond Qualcomm's consumer-focused Snapdragon line. Visually, Dragonwing adopts a purple color scheme that combines elements from Qualcomm's corporate identity with a stylized dragon icon. The portfolio will debut at the Mobile World Congress in Barcelona (March 3-7) and Embedded World in Nuremberg (March 11-13). Although limited, for now, information about Dragonwing processors and solutions should appear soon and give an insight into interesting low-power solutions that will power the next stage of the industrial revolution. Qualcomm has decided to use its mobile development experience and know-how to tap a large market, and solid branding will help it differentiate from competitors instead of the generic product names used in the past. Additionally, Qualcomm's Dragonwing products are mostly focused on more mature nodes like 14 nm and larger, instead of chasing the 3 nm and smaller like its Snapdragon product portfolio.

The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.

Reports from Financial Times suggest Arm has plans to create its own CPU, set to hit the market in 2025 with Meta Platforms said to be one of the first customers. The chip is said to be a CPU for data center servers, with TSMC handling the manufacturing. However, when the Financial Times asked about this, SoftBank (the majority owner of Arm) and Meta stayed quiet, while Arm didn't give a statement. A Nikkei report from May 2024 suggested that a prototype AI processor chip would be completed by spring 2025 and available for sale by fall 2025, so the latest information from the Financial Times report feels like a confirmation of previous rumors.

Right now, Arm makes money by letting others use its instruction set and core designs to make their own chips. This new move could mean Arm will compete with its current customers. Sources in the industry say Arm is trying to win business from Qualcomm, with rumors that Arm has been bringing in executives from companies it works with to help develop this chip. While Qualcomm had talked in the past about giving Meta a data center CPU using Arm's design, it looks like Arm has won at least some of that deal. However, no technical or specification details are available currently for Arm's 1st in-house server CPU.

Qualcomm has announced its latest mid-range offering, dubbed the Snapdragon 6 Gen 4. Compared to its predecessor, the Snapdragon 6 Gen 3, the improvements on the CPU side are rather modest, with Qualcomm claiming an 11% improvement. The CPU, now based on TSMC N4, packs four ARMv9-based Cortex-A720 P-cores, along with four Cortex-A520 E-cores, making it an 8-core system as tradition. On the GPU side, however, a substantial 29% improvement has been asserted, although the specifics remain under wraps as of this writing.

The chipset can be paired with up to 16 GB of LPDDR5-3200 memory, and displays up to FHD+ at 144 Hz are supported. INT4 support is also present the new NPU, which should allow for decent on-device AI capabilities. Gaming performance should also witness a decent jump, thanks to the aforementioned GPU improvement, paired with Game Super Resolution (upscaling) and Frame Motion Engine (frame generation, every other frame). For connectivity, Wi-Fi 6E, Bluetooth 5.4, and 5G (mm Wave, sub-6 GHz) are present. Up to 200 MP single-camera systems are supported, with Snapdragon's LLV (Low Light Vision) technology, Of course, being a budget segment SoC, it would be futile to expect high-end photography capabilities. As for videography, 4k30 and 1080p120 are supported, along with HLG and HDR10.

Cristiano Amon, Qualcomm's Chief Executive Officer, made a major announcement during a recent company earnings call. Since late last year, technology news outlets have kept a collective eye trained on legal wranglings involving the mobile processor specialist and Arm Holdings. Qualcomm won a partial victory in December—a Delaware jury unanimously found that the: "use of Oryon cores in its Snapdragon X processors for client PCs did not violate its licensing agreements with Arm." However, said jury did not deliver a unanimous verdict on the trial's other lines of query—soon after concluding, Arm filed a motion for a new session.

According to a relatively new Reuters follow-up report, Arm has terminated one of its pursuits. During Wednesday's (February 5) meeting with industry analysts, the Qualcomm boss declared: "Arm recently notified us that it was withdrawing its October 22, 2024 notice of breach, and indicated that it has no current plan to terminate the Qualcomm architecture license agreement." Amon and his colleagues are likely celebrating this development, as well as claimed "positive growth" for Snapdragon X Elite-powered devices. Industry watchdogs believe that Arm could file for a retrial in the near future. According to The Register, the two companies are due to face-off again—albeit under different circumstances: "Qualcomm continues to pursue another case against Arm, alleging the UK outfit didn't honor some of its contractual obligations. Arm reckons that matter will reach the courts in the first half of 2026."

Ever since Apple graced the industry with its M-series chips, Windows enthusiasts have been holding out for a similar Arm-powered revolution for Windows laptops. Qualcomm attempted to do just that with its Snapdragon X Elite chip, advertising performance and efficiency that trades blows with Apple Silicon, while outpacing x86-based laptops in battery life. In reality, the X Elite SoC did bring impressive efficiency to the table, although its CPU performance and efficiency were soon bested by AMD's offerings, while the Adreno iGPU struggled to keep up with even last-gen counterparts since day-one.

Moreover, software compatibility was a major hurdle, making the X Elite systems borderline unusable for professionals with specific requirements that do not have Arm-native alternatives. As a result, the X Elite laptops had a sub 1% market share last fall - a daunting figure considering that Qualcomm had initially targeted 30 - 50% market share by 2029. That said, the story appears to be taking somewhat of a positive turn, with CEO Christiano Amon asserting that Snapdragon X-powered laptops accounted for over 10% of all $800+ laptops sold in December, in the US. Of course, the statement clearly addresses a very specific segment of the market, which makes the 10%+ number more modest that it may appear on paper.

Report with market evolution powered by AI—The global artificial intelligence (AI) chips market size is estimated to grow by USD 902.6 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 81.2% during the forecast period. Increased focus on developing AI chips for smartphones is driving market growth, with a trend towards convergence of AI and IoT. However, dearth of technically skilled workers for ai chips development poses a challenge. Key market players include Advanced Micro Devices Inc., Baidu Inc., Broadcom Inc., Cerebras, Fujitsu Ltd., Google LLC, Graphcore Ltd., Huawei Technologies Co. Ltd., Intel Corp., International Business Machines Corp., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., SambaNova Systems Inc., Samsung Electronics Co. Ltd., SenseTime Group Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and Tesla Inc.

Microsoft will roll out "NPU-optimized versions of DeepSeek-R1" directly to Copilot+ PCs—yesterday's announcement revealed that Qualcomm Snapdragon X-equipped systems will be first in line to receive support. Owners of devices—that harbor Intel Core Ultra 200V "Lunar Lake" processors—will have to wait a little longer, and reports suggest that AMD Ryzen AI 9 HX-based Copilot+ PCs will be third in Microsoft's queue. Interestingly, Team Red has published DeepSeek R1 model-related guides for Radeon RX graphics cards and Ryzen AI processors. Starting off, Microsoft's first release will be based on DeepSeek-R1-Distill-Qwen-1.5B—made available in AI Toolkit. Teased future updates will be 7B and 14B variants. These are expected to "arrive soon."

Microsoft reckons that the optimized models will: "let developers build and deploy AI-powered applications that run efficiently on-device, taking full advantage of the powerful Neural Processing Unit (NPUs) in Copilot+ PCs. The on-board AI-crunching solution is advertised as a tool for empowerment—allowing: "developers to tap into powerful reasoning engines to build proactive and sustained experiences. With our work on Phi Silica, we were able to harness highly efficient inferencing—delivering very competitive time to first token and throughput rates, while minimally impacting battery life and consumption of PC resources." Western companies appear to be participating in a race to swiftly adopt DeepSeek's open source model, due to apparent cost benefits. Certain North American organizations have disclosed their own views and reservations, but others will happily pay less for a potent alternative to locally-developed systems. In a separate bulletin (also posted on January 29), Microsoft's AI platform team revealed that a cloud-hosted DeepSeek R1 model is available on Azure AI Foundry and GitHub.

As evidenced in leaks from late last year, Qualcomm's Snapdragon 8 Elite mobile processor is no slouch in terms of gaming performance—to be more specific, it is surprisingly adept at emulating "AAA" titles in an Android OS environment. Past examples include test platforms—allegedly—hitting 60+ frames per second (FPS) in A Plague Tale: Innocence (2019), and an astounding 160 FPS in Red Dead Redemption's recent-ish PC conversion (originally a 2010 release on PS3 & Xbox 360). Earlier this week, NoI_Revenant's attention was drawn to intriguing camera footage that was freshly uploaded to Bilibili. Said video demonstrates the PC version (2019) of Red Dead Redemption 2 running on an unnamed mobile device equipped with Qualcomm's flagship SoC.

Follow-up posts and comments propose that the game was running via a specific (Android-based) emulation application: Winlator. Observers have pointed out that it is difficult to ascertain exact details regarding visual fidelity from an overly blurry video—the original uploader/leaker mentions that they implemented "low graphical settings." On-screen information shows measured frame rates hovering around the 60 FPS mark. Industry experts reckon that Qualcomm latest "game-changing" Adreno GPU is capable of surpassing AMD's omnipresent Radeon 780M—a popular integrated graphics solution, frequently found in Ryzen Z1 Extreme-equipped handheld gaming PCs.

Qualcomm's Snapdragon X2 processor family was outed last autumn—online sources revealed an Iceland-themed "Project Glymur" moniker, as well as the "SC8480XP" SKU codename. At the time, leakers suggested that Qualcomm engineers had started testing early samples around July/August—further speculation pointed to "Snapdragon X Elite Gen 2" chipsets being evaluated on desktop platforms.

Yesterday, Everest (aka Olrak29_) discovered another SKU—their social media post included an intriguing screenshot, extracted from a shipping manifest. The image's contents reveals the existence of an "Ultra Premium" model, with part number: X2-000-096. Qualcomm has publicly acknowledged that it is working on successors, for launch in 2025—its third generation of "Oryon" CPU cores are lined up for inclusion in the next-gen AI PC project. Second-gen "Oryon" cores are reserved for smartphone platforms. The leaked "Ultra Premium" chip could sit in a new product tier—possibly positioned above the already established high-end "Elite" range.

Last week, Samsung introduced its brand-new Galaxy S25 smartphone series—press material focused largely on various implementations of AI features, but industry watchdogs noted the crucial selection of Qualcomm-designed processors. A "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset" is the natural choice for this generation of Samsung flagship phones, given that proprietary Exynos designs have reportedly missed the mark (yet again). Samik Chatterjee—a J.P. Morgan analyst—believes that the latest collaboration will swell Qualcomm's revenues; he predicts a gain of $2 billion (USD). Snapdragon 8 Elite processors are utilized by the entire range of globally-released Galaxy S25 models.

The previous-gen S24 series featured a mix of Qualcomm-designed chips and Samsung Exynos silicon (for different regional markets)—market analysis estimates a total of 40 million unit shipments back in 2024. Previously, Qualcomm had a 70% share of Galaxy S24 chipsets—fast-forwarding to the present day, it becomes 100% with the rollout of Galaxy S25. Late last year, press outlets posited that the South Korean company's foundry division had moved on from a "problematic" 3 nm Gate-All-Around (GAA) process. Samsung's flagship-tier Exynos 2500 SoC was linked to this node, but insiders reckon that alternative external production avenues were explored—most notably with an arch-rival: TSMC. Industry moles reckon that Samsung's leadership has slashed foundry budgets for 2025—reports from last week suggest investments being halved, as teams move onto two nanometer processes.

Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

Qualcomm is becoming serious about its server CPU ambitions. Today, we have learned that Sailesh Kottapalli, Intel's former chief architect for Xeon server processors, has joined Qualcomm as Senior Vice President after 28 years at Intel. Kottapalli, who announced his departure on LinkedIn Monday, previously led the development of multiple Xeon and Itanium processors at Intel. Qualcomm's data center team is currently working on reference platforms based on their Snapdragon technology. The company already sells AI accelerator chips under the Qualcomm Cloud AI brand, supported by major providers including AWS, HPE, and Lenovo.

This marks Qualcomm's second attempt at entering the server CPU market, following an unsuccessful Centriq effort that ended in 2018. The company is now leveraging technology from its $1.4 billion Nuvia acquisition in 2021, though this has led to ongoing legal disputes with Arm over licensing terms. While Qualcomm hasn't officially detailed Kottapalli's role, the company confirmed in legal filings its intentions to continue developing data center CPUs, as originally planned by Nuvia.

Microsoft announced updates to the DirectX API that would pave the way for neural rendering. Neural rendering is a concept where portions of a frame in real-time 3D graphics are drawn using a generative AI model that works in tandem with classic raster 3D graphics pipeline, along with other advancements, such as real-time ray tracing. This is different from AI-based super resolution technologies. The generative AI here is involved in rendering the input frames for a super resolution technology. One of the nuts and bolts of neural rendering is cooperative vectors, enable an information pathway between the conventional graphics pipeline and the generative AI, telling it what it's doing, what needs to be done by the AI model, and what the ground truth for the model is.

Microsoft says that its HLSL team is working with AMD, Intel, NVIDIA, and Qualcomm to bring cross-vendor support for cooperative vectors in the DirectX ecosystem. The very first dividends of this effort will be seen in the upcoming NVIDIA GeForce RTX 50-series "Blackwell" GPUs, which will use cooperative vectors to drive neural shading. "Neural shaders can be used to visualize game assets with AI, better organize geometry for improved path tracing performance and tools to create game characters with photo-realistic visuals," Microsoft says.

Aetina, a leading provider of edge AI solutions and a subsidiary of Innodisk Group, today announced a collaboration with Qualcomm Technologies, Inc., who unveiled a revolutionary Qualcomm AI On-Prem Appliance Solution and Qualcomm AI Inference Suite for On-Prem. This collaboration combines Qualcomm Technologies' cutting-edge inference accelerators and advanced software with Aetina's edge computing hardware to deliver unprecedented computing power and ready-to-use AI applications for enterprises and industrial organizations.

The flagship offering, the Aetina MegaEdge AIP-FR68, sets a new industry benchmark by integrating Qualcomm Cloud AI family of accelerator cards. Each Cloud AI 100 Ultra card delivers an impressive 870 TOPS of AI computing power at 8-bit integer (INT8) while maintaining remarkable energy efficiency at just 150 W power consumption. The system supports dual Cloud AI 100 Ultra cards in a single desktop workstation. This groundbreaking combination of power and efficiency in a compact form factor revolutionizes on-premises AI processing, making enterprise-grade computing more accessible than ever.

EarFun, a global leader in wireless audio technology, has already made waves at CES 2025 with the debut of an impressive lineup of innovative products. From reimagined open-ear listening solutions to innovative AI-powered translation earbuds, EarFun continues to lead the audio technology industry with groundbreaking advancements.

EarFun Unveils Advanced AI Translation and Dual-Unit Wireless Audio Technology
At CES 2025, EarFun will showcase OpenJump, the all-new open-ear wireless earbuds, along with the EarFun Clip, the premium Wave Life Hybrid ANC over-ear headphones at attractive pricing, the enhanced Air Pro 4+ with AI translation, and the world's 1st Lossless Auracast USB Dongle

ASUS today announced a significant expansion of its innovative Copilot+ PC lineup, the fastest, most intelligent Windows PCs, bringing artificial intelligence (AI) capabilities to users in every segment—empowering more people than ever to embrace the exciting and burgeoning era of AI.

As AI reshapes both how people interact with technology and their expectations of what a computer should be, our all-new Copilot+ PC lineup is designed to meet the growing demand for more affordable, more efficient, more secure and faster laptops that elevate both personal and professional workflows. Powered by the latest AI-enabled processors from Qualcomm, AMD and Intel, and available in a diverse range of styles and form factors, ASUS is leading the charge in making AI technology universally accessible.

ASUS today announced the groundbreaking Zenbook A14 (UX3407) - the lightest 14-inch Copilot+ PC on the market, and also the first all-Ceraluminum ASUS laptop. Zenbook A14 is also the first Zenbook model powered by the latest Snapdragon X Series AI-enabled processors. Zenbook A14 redefines lightweight laptops, addressing traditional challenges like durability, performance, cooling, battery life, limited ports, and cost. Its all-Ceraluminum chassis is ultra-light at under 980 g, durable, and low-maintenance, designed for everyday use. Snapdragon X Series processors deliver outstanding power efficiency and performance with multi-working-day battery life, and the dual-fan thermal system ensures optimal cooling and boosts CPU TDP up to 45 W with minimal noise. As a Copilot+ PC, it enhances productivity and creativity with advanced AI capabilities.

The intuitive design includes an enlarged touchpad supporting Smart Gestures and a versatile range of I/O ports. Seamless integration with Windows Phone Link and Snapdragon Seamless lets users answer calls, manage notifications, and transfer files directly from the laptop. Users can even turn their phone into a webcam. Entertainment shines with the FHD ASUS Lumina OLED display and a powerful super-linear speaker system, offering a cinematic experience. Security is robust with the Microsoft Pluton processor and Windows passkeys for secure authentication storage. AI-driven features like the AI IR Camera system provide facial recognition for automatic login and logout, Adaptive Lock, and Adaptive Dimming, ensuring enhanced privacy and usability. With its lightweight design, robust performance, and advanced features, Zenbook A14 is a true game-changer in portable computing.

Expanding its AI PC leadership, Qualcomm Technologies, Inc. announced the Snapdragon X Platform, the 4th platform to join the Snapdragon X Series compute portfolio, designed to deliver performance, multi-day battery life, and Copilot+ PC experiences for even more users globally.

Redefining the PC Category for Mainstream Devices at $600
Utilizing the power of an 8-core Qualcomm Oryon CPU, Snapdragon X is delivering essential performance to the next-generation of PCs. This platform delivers up to 163% faster performance at ISO-power than our competitors who also require 168% more power at ISO-performance, the Snapdragon X processor balances performance and built-in intelligence with a 45 TOPS NPU that runs Copilot+ PC experiences more efficiently. With an integrated power efficient GPU, Snapdragon X supports dynamic graphics ideal for creating presentations, web browsing, or streaming content. Snapdragon X is an ideal solution for students, freelance workers, and budget-conscious consumers who need a reliable and powerful laptop that can keep up with their busy lives. Devices powered by Snapdragon X are expected to be available from leading OEMs including Acer, ASUS, Dell Technologies, HP and Lenovo in early 2025 enabling Copilot+ PCs in the $600 range.

At CES 2025, Qualcomm Technologies, Inc., today announced Qualcomm AI On-Prem Appliance Solution, an on-premises desktop or wall-mounted hardware solution, and Qualcomm AI Inference Suite, a set of software and services for AI inferencing spanning from near-edge to cloud. The combination of these new offerings allows for small and medium businesses, enterprises and industrial organizations to run custom and off-the-shelf AI applications on their premises, including generative workloads. Running AI inference on premises can deliver significant savings in operational costs and overall total cost of ownership (TCO), compared to the cost of renting third-party AI infrastructure.

Using the AI On-Prem Appliance Solution in concert with the AI Inference Suite, customers can now use generative AI leveraging their proprietary data, fine-tuned models, and technology infrastructure to automate human and machine processes and applications in virtually any end environment, such as retail stores, quick service restaurants, shopping outlets, dealerships, hospitals, factories and shop floors - where the workflow is well established, repeatable and ready for automation.

Emotiv, a global leader in EEG technology, announces its next-generation EEG Active Noise-Cancelling Earphones. These smart earphones enhance personal wellness by integrating advanced EEG technology to provide insights into cognitive performance and overall well-being—alongside exceptional sound quality.

Building on Emotiv's MN8 earphones launched in 2018 (the world's first EEG-enabled earphones), the MW20 marks the next evolution of wearable technology. Designed with precision, the product merges premium audio with neurotechnology to deliver actionable wellness insights and BCI capabilities in an intuitive form factor. Made of machined aluminium and sapphire glass, the earphones feature an ergonomic design engineered for optimal fit and precise acoustics.