According to the latest TrendForce statistics, the top ten IC designers worldwide posted a combined revenue of US$39.43 billion in 1Q22, or 44% growth YoY. Qualcomm, NVIDIA, Broadcom ranked in the top three. After the acquisition of Xilinx, AMD surpassed MediaTek in the fourth position. In addition, according to TrendForce tracking of IC design industry trends, revenue generated by Will Semiconductor and Cirrus Logic was enough to be included in the top ten for the first time.

Benefiting from growth performance in handsets and RF front-end divisions in addition to its IoT and automotive divisions in 1Q22, Qualcomm's quarterly revenue reached US$9.55 billion, or 52% growth YoY, ranking number one in the world. The expanded application of GPUs in data centers boosted this portion of NVIDIA's revenue to 45.4%, surpassing the 45% accounted for by its gaming business, combining for a total revenue of US$7.9 billion, or 53% growth YoY. Broadcom's revenue from semiconductor solutions is substantial, including network chips, broadband communication chips, and storage and bridging chips. Its business has maintained stable sales performance, with revenue reaching US$6.11 billion, or 26% growth YoY. After the addition of Xilinx, AMD's revenue reached US$5.89 billion, or 71% growth YoY. However, even excluding Xilinx, due to strong sales in its enterprise, embedded and semi-customized divisions, AMD's own business revenue still hit an all-time high of US$5.33 billion.

Linksys, a global leader in home and business WiFi networking solutions, today announced two new WiFi 6 mesh systems designed to deliver peak wireless performance for all at-home needs including remote working, streaming content, multi-user gaming and more. The Linksys Hydra 6 and Linksys Atlas 6 are Linksys' newest entry-level dual-band products in the company's family of WiFi 6 mesh systems and come at the most affordable prices to date for the brand.

"There is an increased need for wireless connectivity that can handle the influx of devices on home networks, and deliver reliable, secure and private connections," said Alan Cohen, VP of Marketing and Head of Product at Linksys. "Our mission is to connect everyone securely and through the launch of these systems, we provide our customers with two new options for fast speed, coverage, and connectivity at an affordable price point."

Qualcomm Technologies, Inc. announced another milestone in making extended reality (XR) the next computing platform with the Wireless AR Smart Viewer Reference Design, powered by the Snapdragon XR2 Platform. The cord-free reference design helps OEMs and ODMs more seamlessly and cost-efficiently prototype and bring to market lightweight, premium AR glasses to enable immersive experiences that unlock the metaverse.

Greater Performance, Sleeker Device: The purpose-built, premium Snapdragon XR2 Platform now packs powerful performance into a slim, smaller AR glass form factor. The AR reference design hardware, developed by Goertek, has a 40% thinner profile and a more ergonomically balanced weight distribution for increased comfort. SeeYA provides the dual micro-OLED binocular display enabling 1920 x 1080 per eye and frame rates up to 90 Hz and a no-motion-blur feature to deliver a seamless AR experience. Dual monochrome cameras and one RGB camera on the smart viewer enable six-degrees of freedom (6DoF) head tracking and hand tracking with gesture recognition to achieve AR precision.

Qualcomm Technologies, Inc. announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones. The Company's newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering power and performance enhancements for the ultimate boost across all on-device experiences. Snapdragon 7 offers a selection of high-end, in-demand features and technologies and enables them for more people around the world. According to the latest findings from Counterpoint Research, IDC, and Strategy Analytics, Qualcomm Technologies is the global leader in premium Android smartphone SoC industry share.

"In the mobile segment, our primary focus is to deliver new, groundbreaking features and technologies to the industry, and for our customers' flagship devices. We implement these features first in our Snapdragon 8-series and then waterfall them down our mobile roadmap," said Christopher Patrick, senior vice president and general manager, mobile handsets, Qualcomm Technologies, Inc. "The new Snapdragon 8+ and 7 Gen 1 both deliver breakthrough user experiences in their respective tiers."

AMD and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced a collaboration to optimize the Qualcomm FastConnect connectivity system for AMD Ryzen processor-based computing platforms, starting with AMD Ryzen PRO 6000 Series processors and the Qualcomm FastConnect 6900. With the FastConnect 6900 system, the latest AMD Ryzen processor-powered business laptops feature Wi-Fi 6 and 6E connectivity, including advanced wireless capabilities enabled with Windows 11.

In collaboration with Microsoft, next-generation Windows 11 PCs, such as the Lenovo ThinkPad Z Series and HP EliteBook 805 Series, can harness the full potential of Windows 11 Wi-Fi Dual Station through Qualcomm 4-Stream Dual Band Simultaneous. Multiple Wi-Fi bands outperform traditional single band connections for improved video conferencing experiences, reduced latency, and enhanced connection robustness. Leveraging the 6 GHz band, next-gen laptop users can take full advantage of its bandwidth and speed improvements without competing with any non-6E devices.

Industry-leading audio brand, Tronsmart, is pleased to announce the launch of its new true wireless earbuds, the Onyx Ace Pro. Cutting-edge Qualcomm Chip, aptX adaptive audio decoding and quad-mics with cVc 8.0 call reduction, it offers great audio and voice quality as well as smooth and reliable connection whether listening to music, in the gym or gaming. The Tronsmart Onyx Ace Pro is available to buy from the Tronsmart website, GeekBuying and AliExpress for $39.99/ £32. Amazon is likely to follow in June.

Features an advanced Qualcomm QCC3040 chip with Qualcomm aptX and aptX adaptive audio decoding as well as a 13 mm composite polymer driver, the Onyx Ace Pro delivers impressive sound in great depth and nuance. The combination allows every instrument to be presented perfectly across an expansive soundstage for a great quality listening no matter the genres. In addition, it includes quad-mics (2 each) with cVc 8.0 call reduction that enhances voice pick up and cancels background noise to isolate the voice and transmits in high clarity so that calls are crystal clear.

Leia Inc., the leading 3D experience platform leveraging proprietary nanotechnology and AI to democratize the Metaverse, today unveiled its next generation of 3D Lightfield displays, which offer a "window like'' view into the Metaverse and will connect more people, faster. The Metaverse will be one of the most transformative innovations of our generation, connecting and even crossing boundaries between our digital and physical worlds. Showcased in a 15.6" monitor at the Display Week Conference in San Jose, all Leia devices share the ability to switch between full-resolution 2D and 3D Lightfield. The 15.6" operates in 2D at 120 Hz in 4K, which supports traditional 2D uses like gaming, and switches to a 12-view Lightfield display when prompted by the app. The 3D parameters of the display respond to head-tracking, with a high refresh rate, and a rapid camera that works seamlessly with the SDK to update individual pixels on and with the monitor; the result is a deep sense of immersion and clarity—similar to how humans see things in the real world—while remaining comfortable for the naked eye.

The Continental Automotives Infotainment/Cluster system is also being shown, featuring a passive 8view Lightfield display driven by the Qualcomm SnapDragon 8155 chipset. The three-dimensional navigation solution for vehicle cockpits brings more intuitive interactions between driver and vehicle, thus enhancing driver safety. Leia's 12.3" switchable 3D Lightfield display developed with Continental is the first product ready for mass production. It comes in a flat or curved form factor to enable both traditional and modern cockpit designs.

"The beauty of 3D Lightfield is it enables a naturally immersive viewing experience on any display-based product from mobile phones to vehicle cockpits," said David Fattal, CEO of Leia Inc. "Leia's production facility is now fully certified automotive grade and we're working with leading companies across several industries to integrate 3D Lightfield displays into existing product lines. The power and potential of the Metaverse can only be unlocked when everyone can access it. Making this accessible to consumers everywhere is why Leia exists."

Qualcomm Technologies, Inc. today announced its Wi-Fi 7 capable Qualcomm Networking Pro Series Gen 3 family of platforms. Now sampling and available to global development partners, the Qualcomm Networking Pro Series, Gen3 is the world's highest performance Wi-Fi 7 network infrastructure platform portfolio commercially available. Building upon the multi-generation legacy of the Qualcomm Networking Pro Series platforms, the products combine Wi-Fi 7 features with Qualcomm Technologies' intelligent multi-channel management technologies to improve speeds, lower latency, and enhance network utilization for users of Wi-Fi 6/6E devices while offering game-changing throughput and incredibly low latency for the next generation of Wi-Fi 7 client devices.

"Qualcomm Technologies has enabled the era of 10 Gbps Wi-Fi with our first customer deliveries of the Wi-Fi 7 Networking Pro Series," said Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Qualcomm Technologies, Inc. "Combining support for the latest Wi-Fi 7 innovations with our unique product architecture, the platform enables solutions ranging from whole-home mesh to connectivity networks for large public venues. With this product line, we anticipate a new class of customer systems for both today's applications and the emerging Wi-Fi 7 ecosystem."

According to TrendForce research, due to vigorous stocking of various terminal applications causing a shortage of wafers in 2021, the global IC industry was severely undersupplied. This, coupled with spiking chip prices, boosted 2021 revenue of the global top ten IC design companies to US$127.4 billion, or 48% YoY. TrendForce further indicates three major disparities from the 2020 ranking. First, NVIDIA surpassed Broadcom to take the second position. Second, Taiwanese companies Novatek and Realtek rose to sixth and eighth place, respectively. Originally ranked tenth, Dialog was replaced at this position by Himax after Dialog was acquired by IDM giant Renesas.

Qualcomm continues its reign as number one in the world, primarily due to 51% and 63% growth YoY in sales of mobile phone SoC (System on Chip) and IoT chips, respectively. The addition of diversified development in its RF and automotive chip businesses were key to a 51% increase in revenue. NVIDIA implemented an integration of software and hardware, demonstrating its ambitions in creating a "comprehensive computing platform." Driven by annual growth of gaming graphics card and data center revenue at 64% and 59%, respectively, NVIDIA successfully climbed to second place. Broadcom benefited from the stable sales performance of network chips, broadband communication chips, and storage and bridging chips, with revenue growing 18% YoY. AMD's computer and graphics revenue grew by 45% YoY due to strong sales of the Ryzen CPU and Radeon GPU and rising average selling price. Coupled with accelerating demand from cloud companies, the annual revenue of AMD's enterprise, embedded, and semi-customized divisions increased by 113%, driving annual growth of total revenue to 68%.

The global smartphone applications processor (AP) market grew 23 percent to $30.8 billion in 2021, according to Strategy Analytics' Handset Component Technologies (HCT) service report. According to this Strategy Analytics' Handset Component Technologies (HCT) research report, " Smartphone Apps Processor Market Share Tracker Q4 2021: Qualcomm Increases Revenue Share Lead", Qualcomm, MediaTek, Apple, Samsung LSI and Unisoc grabbed the top-five revenue share ranking spots in the smartphone applications processor (AP) market in 2021.

Sravan Kundojjala, author of the report and Director of Handset Component Technologies service at Strategy Analytics, commented, "For the first time on an annual basis, MediaTek overtook Qualcomm in units and established over 75 million unit-lead in smartphone APs 2021. MediaTek capitalized on Qualcomm's defocus on mid and low tier 4G LTE APs and gained volume share. Despite the loss of unit share crown, Qualcomm exited 2021 with over 43% higher revenue than MediaTek, thanks to an increased mix of higher-priced premium and high-tier APs. Both companies performed well in the 5G AP segment and posted a 13-year high in their AP average selling prices (ASPs)."

According to TrendForce research, due to vigorous stocking of various terminal applications causing a shortage of wafers in 2021, the global IC industry was severely undersupplied. This, coupled with spiking chip prices, boosted 2021 revenue of the global top ten IC design companies to US$127.4 billion, or 48% YoY. TrendForce further indicates three major disparities from the 2020 ranking. First, NVIDIA surpassed Broadcom to take the second position. Second, Taiwanese companies Novatek and Realtek rose to sixth and eighth place, respectively. Originally ranked tenth, Dialog was replaced at this position by Himax after Dialog was acquired by IDM giant Renesas.

Qualcomm continues its reign as number one in the world, primarily due to 51% and 63% growth YoY in sales of mobile phone SoC (System on Chip) and IoT chips, respectively. The addition of diversified development in its RF and automotive chip businesses were key to a 51% increase in revenue. NVIDIA implemented an integration of software and hardware, demonstrating its ambitions in creating a "comprehensive computing platform." Driven by annual growth of gaming graphics card and data center revenue at 64% and 59%, respectively, NVIDIA successfully climbed to second place. Broadcom benefited from the stable sales performance of network chips, broadband communication chips, and storage and bridging chips, with revenue growing 18% YoY. AMD's computer and graphics revenue grew by 45% YoY due to strong sales of the Ryzen CPU and Radeon GPU and rising average selling price. Coupled with accelerating demand from cloud companies, the annual revenue of AMD's enterprise, embedded, and semi-customized divisions increased by 113%, driving annual growth of total revenue to 68%.

Qualcomm and Square Enix announced a collaboration to explore extended reality (XR) experiences for Square Enix's global network of leading development studios and intellectual property. The Advanced Technology Division (ATD) at Square Enix, will work on the Snapdragon Spaces XR Developer Platform and the two companies will collaborate on new paths to push the boundaries of immersive gaming experiences.

"Square Enix has always been committed to state-of-the-art game technology to push storytelling boundaries, delivering unforgettable experiences for our fans" said Ben Taylor, Technical Director, Square Enix Co., Ltd. "We have been investing in XR and look forward to building on Snapdragon Spaces. In particular, we think the time is right with XR to innovate on games of a classic genre we are especially known for and look forward to sharing them with the world to further our mission to help spread happiness across the globe."

Qualcomm today announced the launch of the Snapdragon Metaverse Fund, established to invest up to $100 million in developers and companies building unique, immersive XR experiences, as well as associated core augmented reality (AR) and related artificial intelligence (AI) technologies. The fund plans to deploy capital through a combination of venture investments in leading XR companies by Qualcomm Ventures and a grant program by Qualcomm Technologies, Inc. for developer ecosystem funding in XR experiences such as gaming, health and wellness, media, entertainment, education, and enterprise.

"We deliver the groundbreaking platform technology and experiences that will enable both the consumer and the enterprise to build and engage in the metaverse and allow the physical and digital worlds to be connected. Qualcomm is the ticket to the metaverse," said Cristiano Amon, president and CEO of Qualcomm Incorporated. "Through the Snapdragon Metaverse Fund, we look forward to empowering developers and companies of all sizes as they push boundaries of what's possible as we enter into this new generation of spatial computing."

Basemark launched today GPUScore, an all-new GPU (graphics processing unit) performance benchmarking suite for a wide device range from smartphones to high-end gaming PCs. GPUScore supports all modern graphics APIs, such as Vulkan, Metal and DirectX, and operating systems such as Windows, Linux, macOS, Android and iOS.

GPUScore will consist of three different testing suites. Today, the first one of these was launched, named Relic of Life. It is available immediately. Basemark will introduce the two other GPUScore testing suites during the following months. Relic of Life is ideal for benchmarking high-end gaming PCs' discrete graphics cards' GPUs. It requires hardware accelerated ray tracing, supports Vulkan and DirectX, and is available for both Windows and Linux. GPUScore: Relic of Life is an ideal benchmark for comparing Vulkan and DirectX accelerated ray tracing performance.

One of the big downsides of the now commonplace TWS Bluetooth earbuds in the market is battery life and Yamaha's latest addition, the TW-E5B are set to improve things. The new earbuds claim to offer up to 8.5 hours of listening time, with a further 2.5 charges, or 21.5 hours of battery life provided by the charging case. However, unlike many competing products, Yamaha doesn't support ANC, so if you're looking for a noise cancelling pair of earbuds, these aren't for you.

On the other hand, Yamaha has developed some features of its own, such as Yamaha True Sound that's said to deliver more realism, detail and clarity to the audio played. There's also a feature that Yamaha calls Listening Care that claims to reduce the risk of hearing loss by lowering the volume of certain frequencies that can cause hearing damage. Other features include support for Qualcomm's cVc (Clear Voice Capture) technology, as well as aptX Adaptive. There's also a specific gaming mode and support for Siri or Google Assistant. The speakers are a fairly typical set of 7 mm dynamic drivers that are housed in an IPX5 certified water and sweat resistant housing. Rather unusually, Yamaha has gone for tactile push buttons for controls, one on the left earbud for playback control and answering calls and two on the right earbud for volume control and track skipping. Yamaha provides four sets of ear pieces and a USB-C charging cable with the TW-E5B, as well as a dedicated app. So far only UK pricing appears to have been revealed, which is £129.99 or roughly US$170 when they arrive in retail at some point in April.

Samsung has reportedly been hacked by the LAPSUS$ hacker group who were responsible for the recent NVIDIA hack and source code releases. The group has previously stolen approximately 1 TB of data from NVIDIA servers and are currently demanding that NVIDIA release open-source GPU drivers and a bypass for the LHR GPU hash rate limiter. The stolen Samsung data is reportedly 190 GB in size containing the source code for Trusted Applets, bootloader, and account authentication in addition to biometric unlock algorithms and confidential source code from Qualcomm. This breach could have serious security ramifications for both Samsung & Qualcomm is these claims are substantiated.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that Qualcomm Technologies, Inc. has validated Samsung's 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on Qualcomm Technologies' Snapdragon mobile platforms.

Since developing the industry's first 14 nm-based LPDDR5X DRAM last November, Samsung has worked closely with Qualcomm Technologies to optimize its 7.5 gigabit-per-second (Gbps) LPDDR5X for use with Snapdragon mobile platforms. Delivering about 1.2 times faster speed than the 6.4 Gbps LPDDR5 deployed in today's premium smartphones, Samsung's LPDDR5X is expected to boost the performance of ultra-high-resolution video recording as well as AI features such as voice recognition, image recognition and natural language processing in next-generation smartphones. Furthermore, by adopting advanced circuit designs as well as dynamic voltage and frequency scaling (DVFS), LPDDR5X power consumption can be reduced by approximately 20%.

Intel, along with Advanced Semiconductor Engineering Inc. (ASE), AMD, Arm, Google Cloud, Meta, Microsoft Corp., Qualcomm Inc., Samsung and Taiwan Semiconductor Manufacturing Co., have announced the establishment of an industry consortium to promote an open die-to-die interconnect standard called Universal Chiplet Interconnect Express (UCIe). Building on its work on the open Advanced Interface Bus (AIB), Intel developed the UCIe standard and donated it to the group of founding members as an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.

"Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel's IDM 2.0 strategy," said Sandra Rivera, executive vice president and general manager of the Datacenter and Artificial Intelligence Group at Intel. "Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore's Law."

Qualcomm Technologies, Inc., today announced the world's most advanced Wi-Fi + Bluetooth connectivity system in the industry: FastConnect 7800. This advanced client connectivity solution marries the power of high-speed, ultra-low latency Wi-Fi with the latest Wi-Fi 7 specification and deploys an array of Bluetooth audio advancements that raise the bar on consumer expectations for sound quality. FastConnect 7800 leads the industry with the introduction of High Band Simultaneous (HBS) Multi-Link technology - the premium capability for Wi-Fi 7 networks that unlocks the vast potential of multiple 5 GHz and 6 GHz connections to deliver the highest throughput and lowest sustained latency, while reserving high-traffic 2.4 GHz spectrum for Bluetooth and lower-bandwidth Wi-Fi.

"With FastConnect 7800, Qualcomm Technologies reasserts its leadership by defining the future of wireless connectivity. Introducing the first Wi-Fi 7 solution to the industry might be enough for some, but with the introduction of HBS Multi-Link we take performance to the next level, shattering expectations for speed and latency," said Dino Bekis, vice president and general manager, Mobile Compute and Connectivity, Qualcomm Technologies, Inc. "Coupled with up to 50% lower power consumption and Intelligent Dual Bluetooth with advanced Snapdragon Sound capabilities, FastConnect 7800 is simply the best client connectivity offering in the industry."

Based on details posted by the Commercial Times in Taiwan, it would appear that Samsung Foundry is working on ways to win over customers from TSMC. The backstory is that fabless chip makers have had to change foundries over time, due to the fact that from a foundry side, it's expensive to be on the cutting edge and many foundries have stepped out of the race. This has left the fabless chip makers with fewer options and with TSMC as the de facto industry leader today. That said, as we've seen, NVIDIA and Qualcomm picked Samsung Foundry for some of their latest chips, but based on industry rumours, the yields aren't great.

Samsung Foundry has been trying to win over customers by offering attractive pricing compared to TSMC, but far from everyone has been interested. Some companies, like Apple, have tried to work with Samsung, but abandoned them in the end in favour of TSMC. Samsung is said to be courting both AMD and NVIDIA, as well as others, although only time will tell if we'll see any future product from either company being manufactured by Samsung Foundry. The fact that there are investigations into the yields at Samsung Foundry should be a concern for any future customer and isn't a good sign of where the company is heading.

Today, during Mobile World Congress 2022, Qualcomm Incorporated President and Chief Executive Officer, Cristiano Amon highlighted how Qualcomm Technologies, Inc. is continuing to bring best-in-case experiences to enterprise PCs and drive the convergence of the PC and mobile to increase productivity, connectivity, and security from anywhere. During last month's Consumer Electronics Show, the Company announced that over 200 enterprise customers were testing or deploying Windows 11 on Snapdragon laptops and 2-in-1 devices. Today, Amon outlined how strategic relationships with Microsoft, Lenovo, and many other ecosystem leaders are helping deliver the next generation of enterprise-ready PCs, powered by Snapdragon. Utilizing its global relationships, Qualcomm Technologies continues to lead the PC industry's inevitable transition to innovative and modern solutions from the portfolio of Snapdragon compute platforms.Quotes from key collaborators that Qualcomm Technologies is working with to drive innovation for always on, always connected enterprise PCs through Snapdragon Compute Platforms can be found here.

Although nothing has been officially confirmed by Qualcomm, it looks like the company will be moving away from Samsung for its 3 nm based chips, in favour of TSMC. The Elec also mentions that Qualcomm has moved some of its Snapdragon 8 Gen 1 production to TSMC, something that has already been hitting the rumour mill. The first batch of 4 nm Snapdragon 8 Gen 1 chips are said to already have entered the early stages of production. The main reason for the move is said to be poor yields by Samsung Foundry on its 4 nm node.

The yield rates are said to be a measly 35 percent for the Snapdragon 8 Gen 1, with Samsung's Exynos 2200 having even lower yields. This also helps explain why Samsung's mobile division has decided to limit the availability of its Exynos 2200 based phones to only a few regions. Apparently Qualcomm had to send staff over to Korea to help get the yields up to their current rate, but it's not hard to see why the company is shifting back to TSMC, as a 35 percent yield rate is simply not acceptable. Samsung is said to be auditing Samsung Foundry to find out what has gone wrong, as anything below 80-90 percent in terms of yield rate is simply not acceptable for mass production. Qualcomm will apparently continue to use Samsung Foundry for its 7 nm RF chips, where the yields must be within industry norms.

The Exynos 2200 SoC powering the Samsung Galaxy S22 Ultra in some regions such as the EU, posts some less-than-stellar graphics performance numbers, for all the hype around its AMD-sourced RDNA2 graphics solution, according to an investigative report by Erdi Özüağ, aka "FX57." Samsung brands this RDNA2-based GPU as the Samsung Xclipse 920. Further, Özüağ's testing found that the Exynos 2200 is considerably slower than the Qualcomm Snapdragon 8 Gen 1 powering the S22 Ultra in certain other regions, including the US and India. He has access to both kinds of the S22 Ultra.

In the UL Benchmarks 3DMark Wildlife test, the Exynos 2200 posted a score of 6684 points, compared to 9548 points by the Snapdragon 8 Gen 1 (a difference of 42 percent). What's even more interesting, is that the Exynos 2200 is barely 7 percent faster than the previous-gen Exynos 2100 (Arm Mali GPU) powering the S21 Ultra, which scored 6256 points. The story repeats with the GFXBench "Manhattan" off-screen render benchmark. Here, the Snapdragon 8 Gen 1 is 30 percent faster than the Exynos 2200, which performs on-par with the Exynos 2100. Find a plethora of other results in the complete review comparing the two flavors of the S22 Ultra.

Qualcomm Technologies, Inc. today announced the company has opened Extended Reality (XR) Labs in Europe. Europe already has a thriving augmented and virtual reality (AR/VR) community and Qualcomm Technologies is committed to making XR the future of mobile computing. The XR Labs will focus activities on XR R&D, engineering and key technology development areas such as advanced hand tracking and gesture control, 3D Mapping and SLAM/Localization services, multi-user experiences, and image recognition. Also, XR SDKs providing access to foundational XR technology including object and geo-tracking.

The new labs in Europe build on Qualcomm Technologies' commitment to make XR accessible to the masses and will be located across six cities in Europe initially, with the intention to add more in the future. The goal is to help design lightweight, sleek headworn glasses and make innovative technology available for developers through Snapdragon Spaces XR Developer Platform to build experiences that will transform everyday consumer, retail, industrial, enterprise, education and healthcare. Qualcomm Technologies is pushing the boundaries and charting its course to everyday use through continued R&D advancements.

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce's research. In terms of 8-inch wafers, due to factors such as difficult to obtain equipment and whether capacity expansion is cost-effective, most fabs can only expand production slightly by means of capacity optimization, equating to a CAGR of only 3.3%. In terms of demand, the products primarily derived from 8-inch wafers, PMIC and Power Discrete, are driven by demand for electric vehicles, 5G smartphones, and servers. Stocking momentum has not fallen off, resulting in a serious shortage of 8-inch wafer production capacity that has festered since 2H19. Therefore, in order to mitigate competition for 8-inch capacity, a trend of shifting certain products to 12-inch production has gradually emerged. However, if shortages in overall 8-inch capacity is to be effectively alleviated, it is still necessary to wait for a large number of mainstream products to migrate to 12-inch production. The timeframe for this migration is estimated to be close to 2H23 into 2024.