According to import-export database records obtained by WinFuture, we are informed that Qualcomm is testing an 18-core Snapdragon X2 Elite processor designated SC8480XP, representing a 50% increase in core count over the current 12-core Snapdragon X Elite. The silicon, developed under the "Project Glymur" codename, incorporates Oryon V3 architecture in what documentation describes as a "high-TDP" implementation exceeding the current generation's 80 W thermal envelope. Test platforms pair the processor with 48 GB of SK Hynix RAM and 1 TB NVMe storage. Reference documentation suggests integration as a system-in-package (SiP), potentially offering CPU and memory in a unified package, much like Intel's Lunar Lake and Apple M-series processors. Thermal management testing includes configurations with 120 mm AIO cooling solutions typical in desktop applications, though form factor targets remain unspecified.

Whether homogeneous high-performance cores or heterogeneous clusters, core architecture details remain undisclosed. Market positioning appears focused on high-TDP environments, suggesting that this new wave of Arm-based Windows processors plans to fight more aggressively in the AI PC space, which will see even NVIDIA join it in the coming months. Internal documentation potentially references "Snapdragon X2 Ultra Premium" branding, though the final nomenclature remains unconfirmed. Volume availability is not expected until 2026, allowing time for platform optimization and validation. Qualcomm has gathered feedback from its Snapdragon X Elite initial launch and working to improve performance and app compatibility for Windows-on-Arm platforms.