Intel CEO Pat Gelsinger considers NVIDIA "extraordinarily lucky" to be leading the AI hardware industry. In a recent public discussion with the students of MIT's engineering school to discuss the state of the semiconductor industry, Gelsinger said that Intel should be the one to be leading AI, but instead NVIDIA got lucky. We respectfully disagree. What Gelsinger glosses over with this train of thought is how NVIDIA got here. What NVIDIA has in 2023 is the distinction of being one of the hottest tech stocks behind Apple, the highest market share in a crucial hardware resource driving the AI revolution, and of course the little things, like market leadership over the gaming GPU market. What it doesn't have, is access to the x86 processor IP.

NVIDIA has, for long, aspired to be a CPU company, right from its rumored attempt to merge with AMD in the early/mid 2000s, to its stint with smartphone application processors with Tegra, an assortment of Arm-based products along the way, and most recently, its spectacularly unsuccessful attempt to acquire Arm from Softbank. Despite limited luck with the CPU industry, to level up to Intel, AMD, or even Qualcomm and MediaTek; NVIDIA never lost sight of its goal to be a compute hardware superpower, which is why, in our opinion, it owns the AI hardware market. NVIDIA isn't lucky, it spent 16 years getting here.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

GIGABYTE released the GC-WIFI7, a WLAN card in the PCIe add-on card form-factor, which, as its name suggests, gives your desktop the power of Wi-Fi 7. Given how the new wireless networking standard is exotic and provides a more than 2.2x gain in Wi-Fi bandwidth over Wi-Fi 6E, GIGABYTE decided to give this accessory its coveted AORUS Gaming branding and product design. The card supports tri-band, and a theoretical maximum bandwidth of 5800 Mbps, with support for 320 MHz and 160 Hz channels. The card also supports MLO, in which it simultaneously connects to a 2.4 GHz and 5/6 GHz network. The card comes with a stylish antenna array that supports up to 5 dBi signal strength. Besides Wi-Fi 7, the card also provides Bluetooth 5.3 connectivity.

The most interesting aspect about this product is that it has three hardware revisions at launch. The Rev 1.0 card is based on a Qualcomm chipset; Rev 1.1 is based on a MediaTek chipset, and Rev 1.2 is based on Intel, all three offering identical hardware specs and performance levels. Rev 1.0 is based on a Qualcomm QCA FastConnect 7800 controller; Rev 1.1 rocks a MediaTek MT7927 controller; while the Rev 1.2 uses an Intel BE200. All three revisions are sold under the same SKU, and it's only in a brick-and-mortar store that you can figure out what you want by looking closely at the barcode sticker, where the revision is mentioned. The company didn't reveal pricing.

Microsoft is preparing a big update for its Windows operating system. Currently at version 11, the company is gearing up for the launch of Windows 12, which is supposed to bring a monumental shift in the tectonic plates of the regular PC user experience. Enhanced by AI, the Windows 12 OS should utilize many features like generative AI, large language models, some GPT integration, and many other tools that could benefit AI, like photo editors. The confirmation for the Windows 12 launch coming in 2024 is sourced from the Taiwanese Commercial Times, which analyzed comments from Barry Lam, the founder and chairman of PC contract manufacturer Quanta, and Junsheng (Jason) Chen, the chairman and chief executive of Acer.

Both of them underscored the importance of AI and that AI PCs are coming with the next version of Windows. Supposedly, the launch date for Windows 12 is set for June 2024. In that timeframe, hardware vendors should roll out their SoCs embedding AI processing elements at every silicon block. Qualcomm is set to debut its Snapdragon Elite X SoCs in mid-2024, aligning with the alleged release schedule of Windows 12. With more players like NVIDIA, AMD, and others planning to utilize an Arm instruction set for their next-generation PC chips, we expect to see Windows 12 get full-fledged support for Arm ISA and treat it like a first-class citizen in the OS.

EarFun's development kitchen remains hot. Delivering their first IEM and portable USB-C DAC just this past month, the awarded audio brand will be releasing the next generational leap from their current lineup, the Free Pro 3.

Revolutionizing True Wireless Audio and Noise Cancelation
The new true wireless earbuds are the first pair of earbuds that combine Snapdragon Sound Certification, Hi-Res audio, Qualcomm's QCC3072 SoC, the latest v5.3 Bluetooth certification, Low-Energy Audio protocol, and aptX Adaptive technology. It will also feature EarFun's proprietary QuietSmart 2.0 technology for active noise cancellation up to 43dB, and 6-mic cVc call noise-reduction. It will boast a generous battery life of up to 33 hours, an IPX5 certification, wireless charging, and multipoint connectivity. The Free Pro 3 will make use of EarFun's customizable audio app for total user configuration.

According to the latest Canalys forecasts, worldwide PC shipments are on the verge of recovery following seven consecutive quarters of decline. The market is expected to return to growth of 5% in Q4 2023, boosted by a strong holiday season and an improving macroeconomic environment. Looking ahead, full-year 2024 shipments are forecast to hit 267 million units, landing 8% higher than in 2023, helped by tailwinds including the Windows refresh cycle and emergence of AI-capable and Arm-based devices.

"The global PC market is on a recovery path and set to return to 2019 shipment levels by next year," said Canalys Analyst Ben Yeh. "The impact of AI on the PC industry will be profound, with leading players across OEMs, processor manufacturers, and operating system providers focused on delivering new AI-capable models in 2024. These initiatives will bolster refresh demand, particularly in the commercial sector. The total shipment share of AI-capable PCs is expected to be about 19% in 2024. This accounts for all M-series Mac products alongside the nascent offerings expected in the Windows ecosystem. However, as more compelling use-cases emerge and AI functionality becomes an expected feature, Canalys anticipates a fast ramp up in the development and adoption of AI-capable PCs."

Qualcomm Technologies, Inc. today announced the Snapdragon 7 Gen 3 Mobile Platform to amplify immersive experiences and bring premium performance to consumers' everyday life. The upgraded platform delivers across-the-board advancements to ignite on-device AI, fan-favorite mobile gaming, a creativity-charged camera and powerful 5G connectivity. The new platform is fully equipped to enable exciting new use-cases including up to 2.63 GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.

"Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series," said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "By working closely with our OEM partners, we're able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers." Snapdragon 7 Gen 3 will first be adopted by key OEMs including HONOR and vivo with the first device expected to be announced this month.

Creative Technology today announced the release of the much-anticipated Creative Aurvana Ace and Creative Aurvana Ace 2, the latest true wireless earbuds featuring the groundbreaking solid-state, all-silicon MEMS-based drivers. The Creative Aurvana Ace series, powered by xMEMS drivers, has been expertly tuned to deliver remarkable audio clarity with a wider frequency response ranging from 5 Hz to 40 KHz. With this comprehensive range, users will get to enjoy a truly immersive and lifelike audio experience, whether it's for music, movies, or conference calls.

These latest wireless earbuds also feature LE Audio with LC3 codec, Bluetooth 5.3, and Hybrid Active Noise Cancellation (ANC) plus Ambient Mode, along with up to 24 hours of total playtime, making them the definitive choice for audio enthusiasts seeking the very best in true wireless earbuds.

AMD FidelityFX Super Resolution (FSR) is an open-source resolution upscaling technology that takes lower-resolution input and uses super-resolution temporal upscaling technology, frame generation using AMD Fluid Motion Frames (AFMF) technology, and built-in latency reduction technology to provide greater-resolution output images from lower-resolution settings. While the technology is open-source, it battles in market share with NVIDIA and the company's Deep Learning Super Sampling (DLSS). However, in the mobile space, there hasn't been much talk about implementing upscaling technology up until now. According to a popular leaker @Tech_Reve on X/Twitter, we have information that AMD is collaborating with Samsung and Qualcomm to standardize on upscaling technology implementations in mobile SoCs.

Not only does the leak imply that the AMD FSR technology will be used in Samsung's upcoming Exynos SoC, but some AMD ray tracing will be present as well. The leaker has mentioned Qualcomm, which means that future iterations of Snapdragon are up to adopt the FSR algorithmic approach to resolution upscaling. We will see how and when, but with mobile games growing in size and demand, FSR could come in handy to provide mobile gamers with a better experience. Primarily, this targets Android devices, which Qualcomm supplies, where Apple's iPhone recently announced MetalFX Upscaling technology with an A17 Pro chip.

Qualcomm Snapdragon X is out to change the thin-and-light notebook market, and is out to eat the lunches of U-segment and possibly P-segment processors from Intel and AMD. The Arm based processor promises to be a competitor to Apple's M2 and M2 Max SoCs powering the latest generation of Macbooks, so Windows 11 and Chrome OS-based thin-and-lights could offer similar levels of performance and battery life. Geekerwan put the Adreno iGPU of the Snapdragon X Elite through a couple of benchmarks to show how they compare to the iGPUs of contemporary 15 W to 28 W class SoCs across Arm and x64 machine architectures, and a discrete NVIDIA GeForce RTX 3050 Laptop GPU.

In the 3DMark Wildlife Extreme benchmark, designed for graphics solutions of this class, the Snapdragon X Elite scored 39.2 FPS (average), compared to 60 FPS of the Apple M2 Max, 40 FPS of the Apple M2. The Core i7-13700H "Raptor Lake" is a 45 W mobile processor with an Intel Xe-LP based iGPU that has 96 EU. This chip scored just 22.5 FPS in this test. The surprise here is the Radeon 780M, the iGPU of the AMD Ryzen 7 7840HS, based on the latest RDNA3 architecture, with 12 compute units (768 stream processors). This chip did just 28 FPS, falling behind even the M2. The other benchmark is "Control" at 1080p with its lowest graphics settings, and here the results are fundamentally different. With "Control," we see the Snapdragon X Elite post a respectable 53 FPS, which is almost as fast as the 56 FPS by the Radeon 780M powering the Ryzen 7 7740HS, but ahead of the 43 FPS put by the Apple M2, and a whopping 145 FPS by the M2 Max.

We are thrilled to announce the highly anticipated launch of the BOOX Tab Ultra C Pro, the upgraded version of its predecessor and one of the newest ePaper Tablet PCs in 2023. In this article, we will explore the powerful features that make the Tab Ultra C Pro a versatile workstation, delivering ultra-smooth performance and unmatched productivity.

Sleeker Design, Enhanced Portability
The Tab Ultra C Pro features a sleek and sophisticated uni-body design, crafted from premium aluminium alloy. Its polished finish adds a contemporary charm, making it a true statement piece. We've made it even more portable with a thinner design of just 6.6 mm and a lighter body weighing only 450 g. To make sound adjustments easier, we've added two volume keys on the side. Plus, the 16MP camera with LED flash provides extra convenience for precise capture. The camera's metal finish perfectly complements the aluminium gloss of the back casing, creating a cohesive design. With its chic color, the Tab Ultra C Pro effortlessly blends into your personal and professional life, making a stylish statement wherever you go.

Linksys, an iconic Home and Small Office connectivity company, today announces its first WiFi 7 Mesh System home connectivity, Linksys Velop Pro 7. Purpose-built for the most efficient WiFi operating mode to date, the newest Linksys solution delivers incredible streaming, collaboration, and gaming experiences and can be setup in less than 10 minutes.

Linksys' fastest Mesh setup yet that's easy for all
Designed to make home connectivity simple and effortless for anyone, setup time has been reduced by 66% to less than 10 minutes so you can blanket your home with full coverage in less time than it takes to fold a load of laundry.

Micron Technology, Inc., announced today that it is now shipping production samples of its low-power double data rate 5X (LPDDR5X) memory - the industry's only 1β (1-beta) mobile-optimized memory - for use with Qualcomm Technologies, Inc.'s latest flagship mobile platform, Snapdragon 8 Gen 3. Running at the world's fastest speed grade of 9.6 gigabits per second (Gbps), Micron LPDDR5X provides the mobile ecosystem with the fast performance needed to unlock generative artificial intelligence (AI) at the edge. Enabled by its innovative, industry-leading 1β process node technology, Micron LPDDR5X also delivers advanced power-saving capabilities for mobile users.

"Generative AI is poised to unleash unprecedented productivity, ease of use, and personalization for smartphone users by delivering the power of large language models to flagship mobile phones," said Mark Montierth, corporate vice president and general manager of Micron's Mobile Business Unit. "Micron's 1β LPDDR5X combined with Qualcomm Technologies' AI-optimized Snapdragon 8 Gen 3 Mobile Platform empowers smartphone manufacturers with the next-generation performance and power efficiency essential to enabling revolutionary AI technology at the edge."

SK hynix Inc. announced today that it has started commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo), the world's fastest DRAM for mobile with 9.6 Gbps speed. The company said that it has obtained the validation that the LPDDR5T is compatible with Qualcomm Technologies' new Snapdragon 8 Gen 3 Mobile Platform, marking the industry's first case for such product to be verified by the U.S. company.

SK hynix has proceeded with the compatibility validation of the LPDDR5T, following the completion of the development in January, with support from Qualcomm Technologies. The completion of the process means that it is compatible with Snapdragon 8 Gen 3. With the validation process with Qualcomm Technologies, a leader in wireless telecommunication products and services, and other major mobile AP (Application Processor) providers successfully completed, SK hynix expects the range of the LPDDR5T adoption to grow rapidly.

At Snapdragon Summit, Qualcomm Technologies, Inc. today announced its latest premium mobile platform, the Snapdragon 8 Gen 3—a true titan of on-device intelligence, premium-tier performance, and power efficiency. As the premium Android smartphone SoC leader, Qualcomm Technologies' latest processor will be adopted for flagship devices by global OEMs and smartphone brands including ASUS, Honor, iQOO, MEIZU, NIO, Nubia, OnePlus, OPPO, realme, Redmi, RedMagic, Sony, vivo, Xiaomi, and ZTE.

"Snapdragon 8 Gen 3 infuses high-performance AI across the entire system to deliver premium-level performance and extraordinary experiences to consumers. This platform unlocks a new era of generative AI enabling users to generate unique content, help with productivity, and other breakthrough use cases." said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Each year, we set out to design leading features and technologies that will power our latest Snapdragon 8-series mobile platform and the next generation of flagship Android devices. The Snapdragon 8 Gen 3 delivers."

At Snapdragon Summit, Qualcomm Technologies, Inc. today announced the most powerful computing processor it has ever created for the PC: Snapdragon X Elite. This groundbreaking platform ushers in a new era of premium computing by delivering a massive leap forward with best-in-class CPU performance, leading on-device AI inferencing, and one of the most efficient processors in a PC with up to multiple days of battery life. As AI transforms how we interact with our PCs, Snapdragon X Elite is designed to support the intelligent and power-intensive tasks of the future that will enable powerful productivity, rich creativity, and immersive entertainment experiences from anywhere.

"Snapdragon X Elite represents a dramatic leap in innovation for computing as we deliver our new, custom Qualcomm Oryon CPU for super-charged performance that will delight consumers with incredible power efficiency and take their creativity and productivity to the next level," said Kedar Kondap, Senior Vice President & General Manager of Compute & Gaming, Qualcomm Technologies, Inc. "Powerful on-device AI experiences will enable seamless multitasking and new intuitive user experiences, empowering consumers and businesses alike to create and accomplish more." PCs powered by Snapdragon X Elite are expected mid-2024.

Thanks to the information from Windows Report, we have received numerous details regarding Qualcomm's upcoming Snapdragon Elite X chip for laptops. The Snapdragon Elite X SoC is built on top of Nuvia-derived Oryon cores, which Qualcomm put 12 off in the SoC. While we don't know their base frequencies, the all-core boost reaches 3.8 GHz. The SoC can reach up to 4.3 GHz on single and dual-core boosting. However, the slide notes that this is all pure "big" core configuration of the SoC, so no big.LITTLE design is done. The GPU part of Snapdragon Elite X is still based on Qualcomm's Adreno IP; however, the performance figures are up significantly to reach 4.6 TeraFLOPS of supposedly FP32 single-precision power. Accompanying the CPU and GPU, there are dedicated AI and image processing accelerators, like Hexagon Neural Processing Unit (NPU), which can process 45 trillion operations per second (TOPS). For the camera, the Spectra Image Sensor Processor (ISP) is there to support up to 4K HDR video capture on a dual 36 MP or a single 64 MP camera setup.

The SoC supports LPDDR5X memory running at 8533 MT/s and a maximum capacity of 64 GB. Apparently, the memory controller is an 8-channel one with a 16-bit width and a maximum bandwidth of 136 GB/s. Snapdragon Elite X has PCIe 4.0 and supports UFS 4.0 for outside connection. All of this is packed on a die manufactured by TSMC on a 4 nm node. In addition to marketing excellent performance compared to x86 solutions, Qualcomm also advertises the SoC as power efficient. The slide notes that it uses 1/3 of the power at the same peak PC performance of x86 offerings. It is also interesting to note that the package will support WiFi7 and Bluetooth 5.4. Officially coming in 2024, the Snapdragon Elite X will have to compete with Intel's Meteor Lake and/or Arrow Lake, in addition to AMD Strix Point.

Micron Technology, Inc., announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies' latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform. Micron's LPDDR5X and UFS 3.1 deliver next-level speed, performance and low-power consumption in the smallest form factors needed to support untethered mixed reality (MR) and virtual reality (VR) devices. Micron's LPDDR5X is the company's most advanced low-power memory, delivering power efficiency enabled by its innovative 1-alpha process node technology and JEDEC power advancements.

The global augmented reality (AR) and VR market is expected to reach $200 billion by 2030, growing at a compound annual growth rate of 24% from 2021.1 Micron's embedded products provide robust XR-ready solutions to accelerate customer adoption and realize the potential of this expanding market. Enabling concurrent processing across multiple applications and sensors, Micron's LPDDR5X and UFS 3.1 seamlessly integrate constantly changing presence, position and sensory perception in the metaverse to create realistic, immersive experiences for VR users.

Realizing the full potential of next-generation deep learning requires highly efficient AI infrastructure. For a computing platform to be scalable and cost efficient, optimizing every layer of the AI stack, from algorithms to hardware, is essential. Advances in narrow-precision AI data formats and associated optimized algorithms have been pivotal to this journey, allowing the industry to transition from traditional 32-bit floating point precision to presently only 8 bits of precision (i.e. OCP FP8).

Narrower formats allow silicon to execute more efficient AI calculations per clock cycle, which accelerates model training and inference times. AI models take up less space, which means they require fewer data fetches from memory, and can run with better performance and efficiency. Additionally, fewer bit transfers reduces data movement over the interconnect, which can enhance application performance or cut network costs.

Qualcomm Technologies, Inc. announced today that they are building on their long-standing collaboration with Google by bringing a RISC-V based wearables solution for use with Wear OS by Google. This expanded framework will help pave the way for more products within the ecosystem to take advantage of custom CPUs that are low power and high performance. Leading up to this, the companies will continue to invest in Snapdragon Wear platforms as the leading smartwatch silicon provider for the Wear OS ecosystem.

"Qualcomm Technologies have been a pillar of the Wear OS ecosystem, providing high performance, low power systems for many of our OEM partners," said Bjorn Kilburn, GM of Wear OS by Google. "We are excited to extend our work with Qualcomm Technologies and bring a RISC-V wearable solution to market."
"We are excited to leverage RISC-V and expand our Snapdragon Wear platform as a leading silicon provider for Wear OS. Our Snapdragon Wear platform innovations will help the Wear OS ecosystem rapidly evolve and streamline new device launches globally," said Dino Bekis, vice president and general manager, Wearables and Mixed Signal Solutions, Qualcomm Technologies, Inc.

Qualcomm is poised to significantly rebrand its PC chip lineup as it transitions from the existing 8cx series to the Snapdragon X Series, designed to differentiate its PC chips from Snapdragon processors in mobile devices. The new Snapdragon X Series will incorporate Qualcomm's Oryon CPU SKU, based on Nuvia's IP and praised for its advanced performance and power efficiency. In addition to the new CPU core, Qualcomm also plans to use a dedicated NPU for accelerating on-device AI applications. However, questions remain regarding the reactions of hardware partners, particularly in response to Qualcomm's request for proprietary power management integrated circuits (PMICs) to be used alongside Oryon SoCs.

This strategic rebranding also entails new logos and badges for the system, symbolizing the shift in the product lineup, and the company plans to introduce a simplified tiering structure for its PC ecosystem. Qualcomm currently holds a dominant position as an Arm-based SoC manufacturer for Windows-on-Arm devices. With this rebranding, Qualcomm hopes to position itself competitively in performance and in marketing as well, with established PC chip providers like AMD and Intel, potentially expanding Arm's market share in the PC industry. Further insights and details regarding the Snapdragon X Series will be revealed during the forthcoming Snapdragon Summit, scheduled from October 24 to 26.

Qualcomm Technologies, Inc. today announced two new spatial computing platforms - Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 - that will enable the next generation of mixed reality (MR), virtual reality (VR) devices and smart glasses. Snapdragon XR2 Gen 2 Platform: The platform brings premium MR and VR technology into a single chip architecture to unlock next level immersive experiences in thinner and more comfortable headsets, that don't require an external battery pack.

Engineered to deliver a lag free experience with breathtaking visuals and fully immersive sound, the platform allows users to blend virtual content with their physical surroundings and transition seamlessly between MR and VR experiences.

Big news from the Connect stage: Meta Quest 3 hits shelves October 10, and pre-orders are open now! The world's first mass-market mixed reality headset starts at $499.99 USD for the 128 GB version and $649.99 USD for those who want a larger storage capacity at 512 GB. But wait, there's more! For a limited time, your Meta Quest 3 purchase comes bundled with Asgard's Wrath 2 - a $59.99 USD value. And for the 512 GB SKU, we'll also kick in a six-month trial of Meta Quest+ for a combined value of over $100 USD.

Mixed Reality: Explore Like Never Before
Immersive experiences can transport you to fantastical worlds that defy the laws of physics, but the physical world—and the connections you've made there—are pretty important, too. That's why Meta Quest 3 features breakthrough mixed reality that enables a spectrum of experiences. You can watch immersive NBA games courtside or open a portal to another dimension right from the comfort of your living room - all while high-fidelity, full-color Passthrough keeps your physical surroundings in sight with over 10 times more pixels compared to Meta Quest 2.

According to SemiAccurate, Qualcomm is currently navigating through many challenges with its Oryon SoC for laptops. The current problem is that Qualcomm is insisting on integrating its own PMICs (Power Management Integrated Circuits), which are inherently designed for cell phones, causing significant compatibility and efficiency issues. This approach is reported to have led to escalated costs and disagreements with OEMs (Original Equipment Manufacturers), seemingly hindering Qualcomm's foothold in the laptop sector. These PMICs are highlighted as unsuitable and highly priced, requiring the adoption of high-density interconnect (HDI) PCBs engineered explicitly for cell phones, thus not designed to meet the current requirements of laptops optimally. The subsequent spike in production costs has ignited conflicts with OEMs, with several contemplating withdrawing from the project.

In response to the rising tensions, Qualcomm is allegedly providing financial compensation to the OEMs, potentially leading to selling SoCs at cost. The only good thing is the reported success of Nuvia-based Oryon SoC. The silicon is perfect at A0 stepping, and performance is reportedly good. However, power usage and efficiency are still in question. Forcing OEMs to use proprietary PMICs will likely have far-reaching impacts on Qualcomm's market strategies and relationships with OEMs. With disputes like this, we expect that Qualcomm-powered laptops are nearing availability, and we could see them in the coming months.

Qualcomm Technologies, Inc. is ushering in a new era of home connectivity, and new opportunities for service providers, with the introduction of the Qualcomm 10G Fiber Gateway Platform and its signature feature, Qualcomm Service Defined Wi-Fi technology.

The overwhelming majority of subscribers experience their broadband service through Wi-Fi. In today's broadband systems, the access network from the service provider to the home and Wi-Fi within the home are managed separately - with a quality of service which is nearly impossible to maintain across the entire network, given the diversity of devices, applications, connectivity technologies, and the near-constant change across all these elements.