Synology today announced the launch of the RackStation RS2825RP+, a powerful 3U 16-bay storage system engineered to meet the growing data management demands of small and medium-sized businesses. With redundant power supplies, flexible scalability, and built-in data protection, the RS2825RP+ is ideal for central file storage, endpoint and server backup, surveillance management, and other business-critical workloads.

"The RS2825RP+ is designed to deliver dependable performance, scalability, and resilience—without compromising affordability," said Peggy Weng, Product Manager at Synology. "It's a versatile solution that helps organizations stay agile, secure, and always online."

AI infrastructure buildout is pushing data center desings beyond the limits of conventional power delivery. Traditional in-rack 54 V DC distribution was designed for racks drawing tens of kilowatts and cannot scale to the megawatt requirements for next-generation AI facilities. At GTC and Computex 2025, NVIDIA introduced a comprehensive solution: an end-to-end 800-volt high-voltage DC (HVDC) infrastructure that will support 1-megawatt AI racks and beyond, with deployments planned to begin in 2027. Cooling and cabling already place immense strain on rack designs. NVIDIA's current GB200 and GB300 NVL72 systems can draw up to 132 kW per rack—significantly more than the 50 to 80 kW that most data halls were built to handle. If rack power rises to the 700 kW to 1 MW range under a 54 V distribution, it would require roughly 64 U of chassis space devoted solely to copper busbars, which is almost the entire rack, and about 200 kg of copper per rack. For a 1 GW installation, that adds up to nearly half a million metric tons of copper.

NVIDIA's 800 V HVDC architecture eliminates multiple AC-to-DC and DC-to-DC conversion stages by consolidating them into a single grid-edge rectifier. From a 13.8 kV AC feed, power is converted directly to 800 V DC and then routed through row-level busways to each rack. Compact DC-DC modules in the rack step down the voltage for the GPUs. Fewer power supply units mean fewer fans, lower heat output, and a simpler electrical footprint. Beyond scalability, 800 V HVDC offers up to 5 percent gains in end-to-end efficiency and a 45 percent reduction in copper usage. This results in lower electricity costs and reduced infrastructure buildout costs. To drive industry adoption, NVIDIA has partnered with leaders across the power ecosystem. Silicon and power-electronics specialists such as Infineon, MPS, Navitas, ROHM, STMicroelectronics, and Texas Instruments are contributing components. System integrators, including Delta, Flex Power, Lead Wealth, LiteOn, and Megmeet, are developing power shelves. Data-center infrastructure companies Eaton, Schneider Electric, and Vert iv are standardizing protective devices at every boundary from the power room to the rack. Below you can compare the traditional rack system in the top to the newly proposed variation in the middle and the bottom part of the image. Thanks to HardwareLuxx, we can even see how it looks in reality.

Infineon Technologies AG is revolutionizing the power delivery architecture required for future AI data centers. In collaboration with NVIDIA, Infineon is developing the next generation of power systems based on a new architecture with central power generation of 800 V high-voltage direct current (HVDC). The new system architecture significantly increases energy-efficient power distribution across the data center and allows power conversion directly at the AI chip (Graphic Processing Unit, GPU) within the server board. Infineon's expertise in power conversion solutions from grid to core based on all relevant semiconductor materials silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) is accelerating the roadmap to a full scale HVDC architecture.

This revolutionary step paves the way for the implementation of advanced power delivery architectures in accelerated computing data centers and will further enhance reliability and efficiency. As AI data centers already are going beyond 100,000 individual GPUs, the need for more efficient power delivery is becoming increasingly important. AI data centers will require power outputs of one megawatt (MW) and more per IT rack before the end of the decade. Therefore, the HVDC architecture coupled with high-density multiphase solutions will set a new standard for the industry, driving the development of high-quality components and power distribution systems.

The world's top provider of AI-centric infrastructure, Dell Technologies, announces innovations across the Dell AI Factory with NVIDIA - all designed to help enterprises accelerate AI adoption and achieve faster time to value.

Why it matters
As enterprises make AI central to their strategy and progress from experimentation to implementation, their demand for accessible AI skills and technologies grows exponentially. Dell and NVIDIA continue the rapid pace of innovation with updates to the Dell AI Factory with NVIDIA, including robust AI infrastructure, solutions and services that streamline the path to full-scale implementation.

The ICY DOCK ToughArmor EX MB601V4KW-B features a Tough-Cover IPX6-rated water-resistant front panel, providing superior protection against dust, splashes, and harsh environmental elements. Designed for military, field, and edge applications, this rugged enclosure supports one 2.5" U.2/U.3 NVMe SSD (up to 15 mm height) and fits into a standard external 3.5" drive bay - ideal for deployments where durability, mobility, and reliability are essential.

Engineered with full-metal construction and fan-less design, the MB601V4KW-B delivers PCIe Gen 4.0 transfer speeds up to 64 Gbps via a direct U.2 (SFF-8639) interface, making it well-suited for high-speed workflows such as AI model training, data logging, and industrial system caching. Drive-level security and protection are reinforced through a 2-segment keylock and EMI grounding, ensuring safe and stable operation in sensitive environments.

ASRock Rack Inc., the leading innovative server company, will showcase its high-performance AI server lineup at GTC 2025 in San Jose, California, from March 18-21. The featured solutions include next-gen AI servers based on the NVIDIA Blackwell Ultra platform and RTX PRO 6000 Blackwell Server Edition, and the debut of the liquid-cooled 4U8X-GNR2.

Agentic AI, autonomous systems that perceive, decide, and act, is gaining traction across industries, from healthcare to robotics. The growing demand for real-time interactions and adaptive learning is driving the need for accelerated computing servers with exceptional computational power. At GTC today, ASRock Rack showcases servers based on NVIDIA Blackwell Ultra, the latest addition to the NVIDIA Blackwell accelerated computing platform, offering optimized compute and increased memory, leading the way for a new era of AI reasoning, agentic AI, and physical AI applications.

Equal1 today unveils Bell-1, the first quantum system purpose-built for the HPC era. Unlike first-generation quantum computers that demand dedicated rooms, infrastructure, and complex cooling systems, Bell-1 is designed for direct deployment in HPC-class environments. As a rack-mountable quantum node, it integrates directly alongside classical compute—as compact as a GPU server, yet exponentially more powerful for the world's hardest problems. Bell-1 is engineered to eliminate the traditional barriers of cost, infrastructure, and complexity, setting a new benchmark for scalable quantum computing integration.

Bell-1 rewrites the rule book. While today's quantum computers demand specialized infrastructure, Bell-1 is a silicon-powered quantum computer that integrates seamlessly into existing HPC environments. Simply rack it, plug it in, and unlock quantum capabilities wherever your classical computers already operate. No new cooling systems. No extraordinary power demands. Just quantum computing that works in the real world, as easy to deploy as a high-end GPU server. It plugs into a standard power socket, operates at just 1600 W, and delivers on-demand quantum computing for computationally intensive workloads.

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is announcing full production availability of its end-to-end AI data center Building Block Solutions accelerated by the NVIDIA Blackwell platform. The Supermicro Building Block portfolio provides the core infrastructure elements necessary to scale Blackwell solutions with exceptional time to deployment. The portfolio includes a broad range of air-cooled and liquid-cooled systems with multiple CPU options. These include superior thermal design supporting traditional air cooling, liquid-to-liquid (L2L) and liquid-to-air (L2A) cooling. In addition, a full data center management software suite, rack-level integration, including full network switching and cabling and cluster-level L12 solution validation can be delivered as turn-key offering with global delivery, professional support, and service.

"In this transformative moment of AI, where scaling laws are pushing the limits of data center capabilities, our latest NVIDIA Blackwell-powered solutions, developed through close collaboration with NVIDIA, deliver outstanding computational power," said Charles Liang, president and CEO of Supermicro. "Supermicro's NVIDIA Blackwell GPU offerings in plug-and-play scalable units with advanced liquid cooling and air cooling are empowering customers to deploy an infrastructure that supports increasingly complex AI workloads while maintaining exceptional efficiency. This reinforces our commitment to providing sustainable, cutting-edge solutions that accelerate AI innovation."

NVIDIA's new GB200 "Blackwell" racks are running into trouble (again). Big cloud companies like Microsoft, Amazon, Google, and Meta Platforms are cutting back their orders because of heat problems, Reuters reports, quoting The Information. The first shipments of racks with Blackwell chips are getting too hot and have connection issues between chips, the report says. These tech hiccups have made some customers who ordered $10 billion or more worth of racks think twice about buying.

Some are putting off their orders until NVIDIA has better versions of the racks. Others are looking at buying older NVIDIA AI chips instead. For example, Microsoft planned to set up GB200 racks with no less than 50,000 Blackwell chips at one of its Phoenix sites. However, The Information reports that OpenAI has asked Microsoft to provide NVIDIA's older "Hopper" chips instead pointing to delays linked to the Blackwell racks. NVIDIA's problems with its Blackwell GPUs housed in high-density racks are not something new; in November 2024, Reuters, also referencing The Information, uncovered overheating issues in servers that housed 72 processors. NVIDIA has made several changes to its server rack designs to tackle these problems, however, it seems that the problem was not entirely solved.

ASRock Rack Inc., a leading innovative server company, announced upgrades to its extensive lineup to support AMD EPYC 9005 Series processors. Among these updates is the introduction of the new 6U8M-TURIN2 GPU server. This advanced platform features AMD Instinct MI325X accelerators, specifically optimized for intensive enterprise AI applications, and will be showcased at AMD Advancing AI 2024.

ASRock Rack Introduce GPU Servers Powered by AMD EPYC 9005 series processors
AMD today revealed the 5th Generation AMD EPYC processors, offering a wide range of core counts (up to 192 cores), frequencies (up to 5 GHz), and expansive cache capacities. Select high-frequency processors, such as the AMD EPYC 9575F, are optimized for use as host CPUs in GPU-enabled systems. Additionally, the just launched AMD Instinct MI325X accelerators feature substantial HBM3E memory and 6 TB/s of memory bandwidth, enabling quick access and efficient handling of large datasets and complex computations.

NVIDIA has reportedly discontinued its dual-rack GB200 NVL36x2 GPU model, opting to focus on the single-rack GB200 NVL72 and NVL36 models. This shift, revealed by industry analyst Ming-Chi Kuo, aims to simplify NVIDIA's offerings in the AI and HPC markets. The decision was influenced by major clients like Microsoft, who prefer the NVL72's improved space efficiency and potential for enhanced inference performance. While both models perform similarly in AI large language model (LLM) training, the NVL72 is expected to excel in non-parallelizable inference tasks. As a reminder, the NVL72 features 36 Grace CPUs, delivering 2,592 Arm Neoverse V2 cores with 17 TB LPDDR5X memory with 18.4 TB/s aggregate bandwidth. Additionally, it includes 72 Blackwell GB200 SXM GPUs that have a massive 13.5 TB of HBM3e combined, running at 576 TB/s aggregate bandwidth.

However, this shift presents significant challenges. The NVL72's power consumption of around 120kW far exceeds typical data center capabilities, potentially limiting its immediate widespread adoption. The discontinuation of the NVL36x2 has also sparked concerns about NVIDIA's execution capabilities and may disrupt the supply chain for assembly and cooling solutions. Despite these hurdles, industry experts view this as a pragmatic approach to product planning in the dynamic AI landscape. While some customers may be disappointed by the dual-rack model's cancellation, NVIDIA's long-term outlook in the AI technology market remains strong. The company continues to work with clients and listen to their needs, to position itself as a leader in high-performance computing solutions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing a new addition to its SuperCluster portfolio of plug-and-play AI infrastructure solutions for the NVIDIA Omniverse platform to deliver the high-performance generative AI-enhanced 3D workflows at enterprise scale. This new SuperCluster features the latest Supermicro NVIDIA OVX systems and allows enterprises to easily scale as workloads increase.

"Supermicro has led the industry in developing GPU-optimized products, traditionally for 3D graphics and application acceleration, and now for AI," said Charles Liang, president and CEO of Supermicro. "With the rise of AI, enterprises are seeking computing infrastructure that combines all these capabilities into a single package. Supermicro's SuperCluster features fully interconnected 4U PCIe GPU NVIDIA-Certified Systems for NVIDIA Omniverse, with up to 256 NVIDIA L40S PCIe GPUs per scalable unit. The system helps deliver high performance across the Omniverse platform, including generative AI integrations. By developing this SuperCluster for Omniverse, we're not just offering a product; we're providing a gateway to the future of application development and innovation."

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, today released its first full 10GbE L3 Lite managed switch, QSW-M3224-24T. Featuring twenty-four 10G Multi-Gig ports, L3 Lite management capabilities and MC-LAG network redundancy, QSW-M3224-24T assists enterprises in deploying stable and efficient mid to large-scale high-speed network infrastructure, accelerating 4K video streaming and AV-over-IP applications.

"As enterprises grow in scale and the number of networked devices increases, the demand for switches also escalates, making the management of large network infrastructure more complex and challenging." said Jerry Deng, Product Manager of QNAP, adding "as QNAP's first L3 managed switch offering multi-port 10GbE networking and advanced L3 management features, QSW-M3224-24T not only fulfills the needs of low-latency and high-density 10G network applications, but also supports advanced IP routing and network segmentation management. QSW-M3224-24T is ideal for small and medium-sized enterprises to expand their LAN efficiently and securely within a limited budget."

Amid an AI revolution sweeping through trillion-dollar industries worldwide, NVIDIA founder and CEO Jensen Huang will deliver a keynote address ahead of COMPUTEX 2024, in Taipei, outlining what's next for the AI ecosystem. Slated for June 2 at the National Taiwan University Sports Center, the address kicks off before the COMPUTEX trade show scheduled to run from June 3-6 at the Taipei Nangang Exhibition Center. The keynote will be livestreamed at 7 p.m. Taiwan time (4 a.m. PT) on Sunday, June 2, with a replay available at NVIDIA.com.

With over 1,500 exhibitors from 26 countries and an expected crowd of 50,000 attendees, COMPUTEX is one of the world's premier technology events. It has long showcased the vibrant technology ecosystem anchored by Taiwan and has become a launching pad for the cutting-edge systems required to scale AI globally. As a leader in AI, NVIDIA continues to nurture and expand the AI ecosystem. Last year, Huang's keynote and appearances in partner press conferences exemplified NVIDIA's role in helping advance partners across the technology industry.

GIGABYTE Technology, a pioneer in computer hardware, has taken a significant stride in shaping its European business model. Today, GIGABYTE has broadened its e-commerce platform, shop.gigabyte.eu, by integrating enterprise server and server motherboard solutions into its product portfolio. Being at the forefront of computer hardware manufacturing, GIGABYTE recognizes that it is imperative to expand its presence in the EMEA region to maintain its leadership across all markets. With the introduction of our enterprise-level server and motherboard solutions, we are dedicated to delivering a diverse range of high-performance products directly to our B2B clients.

GIGABYTE offers a complete product portfolio that addresses all workloads from the data center to edge including traditional and emerging workloads in HPC and AI to data analytics, 5G/edge, cloud computing, and more. Our enduring partnerships with key technology leaders ensure that our new products are at the forefront of innovation and launch with new partner platforms. Our systems embody performance, security, scalability, and sustainability. Within the e-commerce product portfolio, we offer a selection of models from our Edge, Rack, GPU, and Storage series. Additionally, the platform provides server motherboards for custom integration. The current selection comprises a mix of solutions tailored to online sales. For more complex solutions, customers can get in touch via the integrated contact form.

QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, today released the new Half-width Rackmount 16-port 10GbE switch series, including the L2 Web Managed QSW-M3216R-8S8T and the Unmanaged QSW-3216R-8S8T. The built-in eight 10GbE SFP+ and eight 10GbE RJ45 ports with backward compatibility fulfills the versatile demands of interfaces and speeds in high-speed network infrastructure. The half-width rackmount compact design also allows SMBs to flexibly deploy them in IT rooms or even on desks in offices.

"QNAP's best-selling all 10GbE switch series now releases two new half-width rackmount 16-port 10GbE models, offering more 10GbE ports to satisfy requirements for multiple high-bandwidth network devices in SMBs and offices. " said Jerry Deng, Product Manager of QNAP, adding "Managed and unmanaged models are available for easily upgrading to a full 10GbE high-speed LAN at an affordable price, and their small physical footprint makes them especially useful for businesses and organizations that lack physical space for dedicated IT hardware."

ASRock Rack, the leading innovative server company, today announced its latest server motherboard lineup now supports the AMD EPYC 8004 Series processors which extend the 4th Gen EPYC Family into new markets.

The AMD EPYC 8004 Series processors bring the benefits of the "Zen 4c" processor core to markets that seek strong performance but also have significant requirements for efficient, dense form factors, limited available power, and quieter operations. "AMD EPYC 8004 Processors are purpose-built to deliver strong performance and energy efficiency in an optimized, single-socket package," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "The combination of impressive performance and streamlined platform componentry of the EPYC 8004 Series CPUs means system builders can offer their customers cost-efficient business-relevant configurations."

Tech tipster momomo_us yesterday spotted that ASRock Rack had listed a new and interesting looking motherboard on its product website, albeit in a "preliminary" category—so pricing and availability have "to be determined" status currently. The W790D8UD-1L1N2T/BCM is a new addition to the company's selection of compact workstation boards, but it distinguishes itself by being the first example of a W790 chipset Deep Micro ATX mainboard with platform support for Intel's latest "Sapphire Rapids" Xeon W-2400 and W-3400 processors. The single E-type socket (LGA 4677) looks absolutely huge relative to the overall dimensions of its surroundings (264 × 266 mm). The Deep Micro ATX form factor is exclusive to AsRock Rack so it could be tricky to build with a W790D8UD-1L1N2T/BCM board, given that mainstream PC cases may not provide full compatibility with this proprietary configuration.

ASRock Rack W790D8UD-1L1N2T/BCM is capable of running up to 56 cores (the minimum being 6) and 2 TB of DDR5-4800 modules (eight DIMM slots) with a peak bandwidth of 307.2 GB/s, via the platform's advanced memory subsystem. Sapphire Rapids Xeon W processors can control up to 112 PCIe Gen 5 lanes (W-3400) and 64 PCIe Gen 5 lanes (W-2400). Tom's Hardware has kindly collated the rest of the specifications into sentence form: "As for the physical connectivity, the motherboard is equipped with four PCIe x16 slots, one M.2-2280 slot with a PCIe 4.0 x4 interface attached to the W790 PCH, and two OCuLink connectors for SSDs. Network connectivity includes two 10GbE ports controlled by Broadcom BCM57416, a GbE connector managed by the Intel I226, and another GbE handled by the Intel I210. In addition, it has a dedicated GbE port for remote management with the support of Aspeed AST2600 BMC, that is handled by the Realtek RTL8211F. The board also has an SPI connector for TPM modules, USB 3.2 Gen 1 ports, a COM port, and a D-Sub VGA display connector."

Dell Technologies expands the industry's top selling server portfolio, with an additional 13 next-generation Dell PowerEdge servers, designed to accelerate performance and reliability for powerful computing across core data centers, large-scale public clouds and edge locations. Next-generation rack, tower and multi-node PowerEdge servers, with 4th Gen Intel Xeon Scalable processors, include Dell software and engineering advancements, such as a new Smart Flow design, to improve energy and cost efficiency. Expanded Dell APEX capabilities will help organizations take an as-a-Service approach, allowing for more effective IT operations that make the most of compute resources while minimizing risk.

"Customers come to Dell for easily managed yet sophisticated and efficient servers with advanced capabilities to power their business-critical workloads," said Jeff Boudreau, president and general manager, Infrastructure Solutions Group, Dell Technologies. "Our next-generation Dell PowerEdge servers offer unmatched innovation that raises the bar in power efficiency, performance and reliability while simplifying how customers can implement a Zero Trust approach for greater security throughout their IT environments."

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

SilverStone today introduced the RM44, a workstation or small-business server case, which is designed to be used both as a tower, or as a 4U rackmount. The case supports SSI-EEB, SSI-CEB, E-ATX, ATX, Micro-ATX, and Mini-ITX form-factors; a single ATX power-supply, eight full-height expansion slots, and cooling that includes two 80 mm rear exhausts, and three 120 mm front intakes. As you can see from the pics below, the case can even be used to build the most inconspicuous high-end gaming PC. A steel reinforcement running along the length of the case holds a couple of 3.5-inch drives or three 2.5-inchers, and can firmly hold your add-on cards in place. included is a stand that lets you orient the case as a tower, while rails let you mount it in a rack. The case measures 440 mm x 176 mm x 468 mm (WxHxD). Front-panel connectivity includes two USB 3.2 type-A, and a USB 3.2 type-C. The company didn't reveal pricing.

Alphacool today introduces three different server racks in 1U, 2U and 4U formats. Alphacool is the first manufacturer to offer server racks that are directly prepared for water cooling components. Previous solutions consisted of expensive and complicated complete solutions from individual manufacturers with external cooling or you could buy corresponding water cooling sets for which you had to subsequently adapt cases.

Alphacool takes a different approach. The enclosures offer a largely classic interior design. However, special and versatile mounting options for reservoirs, pumps and radiators have been taken into account. A special carrier, which is included with every case, offers the possibility of accommodating radiators directly in the case. Further mounting options for the special and optionally available ES Distroplates allow neat hosing in the case. In this way, other components can also be easily integrated with the Alphacool ES quick connectors.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

ASRock Rack, a branch of ASRock focused on making server products, has today launched a new motherboard that can accommodate up to 64 core AMD EPYC CPU. Built on the new, proprietary form factor called "Deep Mini-ITX", the ROMED4ID-2T motherboard is just a bit bigger than the standard ITX board. The standard ITX boards are 170 x 170 mm, while this Deep Mini-ITX form extends the board by a bit. It measures 170 x 208.28 mm, or 6.7" x 8.2" for all of the American readers. ASRock specifies that the board supports AMD's second-generation EPYC "Rome" 7002 series processors. Of course, the socket for these CPUs is socket SP3 (LGA4094) with 4094 pins.

The motherboard comes with 4 DDR4 DIMM slots, of any type. Supported DIMM types are R-DIMM, LR-DIMM, and NV-DIMM. If you want the best capacity, LR-DIMM use enables you to use up to 256 GB of memory. When it comes to expansion, you can hook-up any PCIe 4.0 device to the PCIe 4.0 x16 slot. There is also an M.2 2280 key present, so you can fit in one of those high-speed PCIe 4.0 x4 M.2 SSDs. For connection to the outside world, the board uses an Intel X550-AT2 controller that controls two RJ45 10 GbE connectors. There are also two Slimline (PCIe 4.0 x8 or 8 SATA 6 Gb/s), and four Slimline (PCIe 4.0 x8) storage U.2 ports.