ASUS is giving finishing touches to the launch of a new Zenbook 14 (UX434IQ) model with a combination of a Ryzen 4000 "Renoir" processor and NVIDIA's entry-level GeForce MX350 discrete graphics. Although never pictured and with no confirmation of whether it gets the swanky ScreenPad (a color touchscreen that works like the notebook's trackpad); the combine surfaced in a Futuremark database submission.

The Zenbook 14 (UX434IQ) combines an AMD Ryzen 7 4700U (8-core/8-thread) processor with NVIDIA GeForce MX350 discrete graphics, and more interestingly, 16 GB of LPDDR4x-4266 memory. The "Pascal" based MX350 graphics features 640 CUDA cores, and a 64-bit GDDR5 memory interface holding 2 GB of memory. It's marketed to offer a 2.5x performance uplift against an Intel Gen 9.5 iGPU, but we're not sure if it makes even a 1.5x uplift over the iGPU of the 4700U (448 "Vega" stream processors, 1600 MHz engine clock, plenty of memory bandwidth at its disposal thanks to LPDDR4x). The notebook also packs a decent Samsung PM981 1 TB NVMe SSD.

AMD's 8-core Ryzen 4000 "Renoir" mobile processors could see an affordable implementation with Acer's latest Swift 3 notebook model (Acer Swift 3 SF314-42). At an MSRP of $629, the upcoming Acer Swift 3 could be a typical implementation of the Ryzen 7 4700U processor - a notebook with just the processor (no discrete graphics), yielding a battery run-time of up to 11.5 hours along with quick charging (4 hours in 30 minutes of recharging).

The Acer Swift 3 SF314-42 is a 14-inch conventional form-factor notebook with a 1.57 cm thickness when closed, and 1.20 kg weight. Its display offers Full HD (1080p) resolution. Memory and storage details are still under the wraps, but it's likely that the notebook is equipped with 8 GB of hardwired DDR4 memory, and a single DDR4 SODIMM slot for further expansion. Acer is also working on the Aspire 5 A515-44, a 15.6-inch Full HD notebook powered by a Ryzen 5 4500U (6-core) processor, priced at $519.

AMD's 4th generation Ryzen desktop processors are expected to launch around September 2020, sources in the motherboard industry tell DigiTimes. Codenamed "Vermeer," successor to "Matisse," these processors will be socket AM4 multi-chip modules of up to two CPU complex dies based on the "Zen 3" microarchitecture, combined with an I/O controller die. The "Zen 3" chiplets are expected to be fabricated on a newer 7 nm-class process by TSMC, either N7P or N7+. The biggest design change with "Zen 3" is the doing away of CCX arrangement of CPU cores, with each chiplet holding a common block of cores sharing a last-level cache. This, along with clock speed headroom gains from the new node are expected to yield generational price-performance increases.

The "Zen 2" based 8-core "Renoir" die is also expected to make its socket AM4 debut within 2020, succeeding the "Picasso" based quad-core Ryzen 3000-series APUs. This is a particularly important product for AMD, as it is expected to compete with Intel's 10th generation Core i5 6-core/12-thread processors in terms of pricing, while offering more cores (8-core/16-thread) and a faster iGPU. The 4th gen Ryzen socket AM4 processor lineup will launch alongside AMD's 600-series motherboard chipset, with forwards- and backwards-compatibility (i.e., "Vermeer" and "Renoir" working with older chipsets, and older AM4 processors working on 600-series chipset motherboards). AMD was originally expected to unveil these processors at the 2020 Computex trade-show in June, but Computex itself is rescheduled to late-September.

When it launched late March, the AMD Ryzen 9 4900H held the distinction of being the fastest notebook processor, the very first time AMD held the distinction, but only for a brief period before Intel launched its Core i9-10980HK to take back the performance lead. Over in the 15 W category, AMD's Ryzen 7 4800U is holding the fort on two fronts - against the "Comet Lake-U" and the "Ice Lake-U." According to reports, AMD wants to take another swing at this category with a new flagship Ryzen 9 series part.

Called the Ryzen 9 4900U, and unearthed from the User Benchmark database by TUM_APISAK, the new SKU is designed to compete with the Core i7-10710U and Core i7-1065G7, in the 15 W category. Lenovo had a notebook featuring this part listed earlier this year. It is configured with an 8-core/16-thread CPU clocked at 1.80 GHz nominal, with up to 4.30 GHz boost, which may seem like a minor speed bump, until you compare its User Benchmark scores with those of the 4800U. Apparently, the 4900U has some boost algorithm secret sauce that makes it a double-digit percentage faster than the 4800U in multi-threaded tests (possibly better spread of boost clocks across multiple cores). The iGPU appears unchanged, with 8 "Vega" compute units (512 stream processors), and up to 1750 MHz engine clocks.

Reviews of AMD's flagship mobile processor, the Ryzen 9 4900HS went live today, and the verdict is clear. Intel has lost both performance and battery-efficiency leadership over its most lucrative computing segment: mobile client computing. In a Hardware Unboxed review comparing the 4900H to Intel's current Core i9 flagship, the i9-9880H, the AMD chip at its stock 45 W TDP beats the Intel one even with the Intel chip configured to 90 W cTDP.

The 4900HS posts 11.9% higher CineBench R20 score (both chips are 8-core/16-thread) when the Intel chip is bolstered with 90 W cTDP, and a whopping 33% faster when the i9-9980H is at its stock settings, and 54% faster when its capped at 35 W cTDP. It also ends up over 150% faster than AMD's last fastest mobile processor, the 12 nm "Picasso" based Ryzen 7 3750H. The story repeats with CineBench R15 (4900H being 34% faster than stock i9-9880H), 18% faster at Handbrake HEVC, 25% faster at Blender "Classroom," and 35% faster at 7-Zip benchmark. The AMD chip lags behind by 12% in the less-parallelized Photoshop. On creativity apps that do scale with cores, such as Premiere "Warp Stabilizer 4K," the 4900HS is 12.6% faster. Gaming performance remains an even split between the two chips. Find several more interesting test results and commentary in the Hardware Unboxed presentation here. Intel has already announced a response to the 4900HS in the form of the i9-10980HK.

An unknown Lenovo notebook powered by the 15-Watt Ryzen 7 4700U "Renoir" 8-core processor was put through Geekbench. The chip yielded scores of 4910 single-core, and 21693 multi-core. This puts the 4700U ahead of the Core i7-1065G7, which is known to score around 4400 points on average in the single-core test, and around 17000 on average, in the multi-core test, falling behind due to fewer CPU cores. The 4700U features an 8-core CPU based on the "Zen 2" microarchitecture. Its desktop compatriot, the Ryzen 7 3700X, is significantly faster, with around 20% higher single-core, and over 60% higher multi-core performance. This is probably because the 3700X is unconstrained with its 65-Watt TDP and significantly higher power limits. It also has four times more L3 cache, but that's probably to cushion the IFOP interconnect between the CPU chiplet and I/O die.

TechPowerUp today released the latest version of GPU-Z, the popular graphics subsystem information and diagnostic utility. Version 2.29.0 introduces new features and support for upcoming new graphics hardware. To begin with, support is added for Intel Iris Plus Graphics 645, AMD "Renoir" Ryzen 4000U and 4000H series processor iGPUs; Radeon RX 5600 XT, RX 5600, Radeon Pro Vega II, and HD 8280E. All Radeon RX 5000-series "Navi" GPUs now report game clock as "GPU clock" instead of base-clock. PCIe speed reporting on AMD "Vega" graphics cards has also been fixed. Fixed a GPU-Z application crash when GPU driver gets stopped (eg: during a driver update). Lastly, fixed a UX issue where window position wouldn't get saved if GPU-Z is running while you shut down or reboot the PC.

DOWNLOAD: TechPowerUp GPU-Z v2.29.0The change-log follows.

AMD today announced its Ryzen 4000-series mobile processors designed to compete with Intel's fastest, across both its 10th gen "Ice Lake" and "Comet Lake" mobile processors lines. At the heart of these processors is the 7 nm "Renoir" silicon, which doubles the CPU core count over the previous generation "Picasso," and improves IPC (single-thread performance) by a double-digit percentage. "Renoir" combines a CPU with 8 cores based on the "Zen 2" microarchitecture, with an iGPU that has the number-crunching machinery of "Vega," but with display- and multimedia-engines of "Navi." It is a monolithic piece of silicon with a dual-channel IMC that supports not just conventional DDR4 memory, but also fast LPDDR4X.

There are two distinct classes of Ryzen 4000 Mobile: U and H. The Ryzen 7 4800U, with its 15 W TDP, targets ultra-portable notebooks, and goes head-on against Intel's Core i7 "Ice Lake-U" processors, winning on the CPU front with its high core-count and IPC. The Ryzen 7 4800H, on the other hand, taps into the 45 W TDP headroom to dial up CPU and iGPU clock-speeds significantly, offering CPU performance that beats the desktop Core i7-9700K. It also introduces SmartShift, an iGPU + dGPU virtualization technology that lets your notebook dynamically switch between the two based on graphics load.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

Following the previous report about AMD's upcoming "Renoir" APU lineup of processors for notebook and desktop, we have new information about the new processor models and their configurations. Supposed to launch in early 2020, the Renoir lineup is supposed to feature up to 8 cores and 16 threads in high-end models. Dubbed Ryzen 4000 series, the new APU lineup will be available in four configurations determined by its TDP: 15 W and 45 W chips for notebooks, and 35 W and 65 W variants meant for desktop.

According to WCCFTech, AMD will launch high-performance Ryzen 9 4900H and Ryzen 7 4800H APUs soon in the first notebooks. Supposed to be part of the "H" series of mobile APUs, these models will feature high core count, that can reach up to 8 cores, SMT support as well, all within TPD of 45 Watts. A power-optimized Ryzen 7 4800HS has also appeared in the listings as a lower clocked alternative to Ryzen 7 4800H, which is supposed to feature lower TDP as well. All of the former processors appear listed as the base of ASUSes upcoming GA401 and GA502 laptops, featuring 16 GB of RAM, Windows 10, and a 14-inch display. While configurations of the laptop will affect its price, Ryzen 7 4800HS powered model is currently listed at 1904 EUR, featuring 16 GB of RAM and 1 TB of storage, so we now have a ballpark price estimate to speculate upon.

AMD's upcoming "Renoir" silicon will be the company's most important, as it will sit at the heart of not just desktops, but also notebooks and ultraportables. A brilliant report by _rogame on Reddit compiles the chip's many iGPU variants along with iGPU device-IDs, and slots them in various platform variants. Renoir will target four key market segments characterized by TDP: 15 W ultraportables, 45 W mainstream notebooks, 65 W mainstream desktops, and 35 W low-power desktops.

As for the iGPU itself, "Renoir" was last reported as being a processor that combines "Zen 2" CPU cores with an iGPU that has SIMD machinery from the "Vega" architecture, but with updated display- and multimedia-engines from "Navi." According to _rogame, Renoir's iGPU will have up to 13 NGCUs, which work out to 832 stream processors. AMD internally marks the iGPU as RV B##, where RV refers to "Radeon Vega," and B## referring to the iGPU variant. The commercial name of the iGPU will be different. B12 is the highest variant, with 12-13 CUs, B10 has 10-11 CUs, B8 has 8-9 CUs, B6 has 6 CUs, and B4 has 3-4 CUs. The B12 configuration will be exclusive to the mobile parts. The desktop parts cap out at B10. Renoir is expected to dominate AMD's processor launch cycle through the first half of 2020.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.20 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 6.20 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 6.20 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 6.20 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The latest AIDA64 update introduces optimized benchmarks for AMD Renoir and Intel Ice Lake processors, monitoring of sensor values on EVGA Z10 RGB displays, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.DOWNLOAD: FinalWire AIDA64 Extreme v6.20

AMD "Renoir" is the company's next-generation APU that improves iGPU and CPU performance over the current 12 nm "Picasso" APU. An AMD "Renoir" APU engineering sample running on a "Celadon-RN" platform prototyping board, was allegedly put through 3DMark 11, and its performance numbers surfaced on Reddit, in three data-sets corresponding with three hardware configurations. In the first one, dubbed "config 1," the CPU is clocked at 1.70 GHz, the iGPU at 1.50 GHz, and the system memory at DDR4-2667. In "config 2," the CPU runs at 1.80 GHz, and the iGPU and memory frequencies are unknown. In "config 3," the CPU runs at 2.00 GHz, the iGPU at 1.10 GHz, and the memory at DDR4-2667. Raw benchmark output from 3DMark 11 Performance preset are pasted for each of the configs below (in that order). The three mention 3DMark database result IDs, but all three are private when we tried to look them up.

The "config 1" machine scores 3,547 points in the performance preset of 3DMark 11. It's interesting to note here that the iGPU clock is significantly higher than that of "Picasso." In "config 2," a 3DMark performance score of 3,143 points is yielded. The CPU clock is increased compared to "config 1," but the score is reduced slightly, which indicates a possible reduction in iGPU clocks or memory speed, or perhaps even the iGPU's core-configuration. In "config 3," we see the highest CPU clock speed at 2.00 GHz, but a reduced iGPU clock speed at 1.10 GHz. This setup scores 2,374 points in the 3DMark performance preset, a 33% drop from "config 1," indicating not just reduced iGPU clocks, but possibly also reduced CU count. "Renoir" is expected to combine "Zen 2" CPU cores with an iGPU that has the number-crunching machinery of "Vega," but with the display- and multimedia-engines of "Navi."

AMD is expected to bring back its low-power APU family in 2020 with the new "Dali" silicon. Updated company roadmap slides see the inclusion of "Dali" as a "value mobile APU," positioned under "Renoir," a performance APU targeting both the mainstream notebook and desktop (socket AM4) platforms. AMD looks keen to branch out its APU business in two directions.

"Renoir" is expected to be a "Zen 2" based APU with CPU performance matching at least the Ryzen 5 3600 or 3700X, and a faster "Vega" based iGPU. It wouldn't surprise us if "Dali" is a monolithic 7 nm die with two "Zen 2" CPU cores and a tiny iGPU with 3-4 compute units. "Renoir," on the other hand, could be an MCM with an 8-core "Zen 2" chiplet and an enlarged I/O controller die that has the iGPU. "Dali" could see the light of the day only in 2020, by which time TSMC could substantially increase its 7 nm volumes and clear the decks for its new 7 nm EUV mass-production.

AMD's next-generation "Renoir" APU, which succeeds the company's 12 nm "Picasso," will be the company's truly next-generation chip to feature an integrated graphics solution. It's unclear as of now, if the chip will be based on a monolithic die, or if it will be a multi-chip module of a 7 nm "Zen 2" chiplet paired with an enlarged I/O controller die that has the iGPU. We're getting confirmation on two key specs - one, that the iGPU will be based on the older "Vega" graphics architecture, albeit with an updated display engine to support the latest display standards; and two, that the processor's memory controller will support the latest LPDDR4X memory standard, at speeds of up to 4266 MHz DDR. In comparison, Intel's "Ice Lake-U" chip supports LPDDX4X up to 3733 MHz.

Code-lines pointing toward "Vega" graphics with an updated display controller mention the new DCN 2.1, found in AMD's new "Navi 10" GPU. This controller supports resolutions of up to 8K, DSC 1.2a, and new resolutions of 4K up to 240 Hz and 8K 60 Hz over a single cable, along with 30 bits per pixel color. The multimedia engine is also suitably updated to VCN 2.1 standard, and provides hardware-accelerated decoding for some of the newer video formats, such as VP9 and H.265 at up to 90 fps at 4K, and 8K up to 24 fps, and H.264 up to 150 fps at 4K. There's no word on when "Renoir" comes out, but a 2020 International CES unveil is likely.