Wednesday, January 1st 2020
AMD CEO To Unveil "Zen 3" Microarchitecture at CES 2020
A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."
The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.
Source:
chiakokhua aka Retired Engineer (Twitter)
The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.
38 Comments on AMD CEO To Unveil "Zen 3" Microarchitecture at CES 2020
128c or 256c are still probably some time away.
For whatever reason (I'm sure everyone here has a theory...) it's hard for AMD to get contracts with OEMs with Zen SoCs.
APUs are mostly for the OEM segment (mobile in 100%).
AMD simply focuses on the high-end DIY desktops (of course apart from servers).
Which is fine because that's the segment Zen shines the most and, being brutally honest, the one that they're able to cover with Zen die supply.That's not even remotely true. Most of APUs go into OEM business desktops and notebooks. These are high margin territories.
Computex in June will give us SKU's and prices and Q3 will be launch. That's my guess. Pretty much like last year with Ryzen 3000.
Also i believe the paper is incorrect about Picasso. That should be 12nm Zen+.
At this very moment AMD Zen APUs aren't really used anywhere on large scale.
But there is a lot of potential to compete with Intel in both business and mobile segments (and the best paying overlap in particular).
AMD cant "finewine" their way into OEM's hands. They need to deliver a competitive product, day 1. As long as their mobile chips are a generation behind, it shows a lack of willigness to commit the resources to the mobile market. There is no reason the 4000 series APUs shouldn't be zen 3 cores with a navi GPU, and a full speed memory controller FFS! (their 3000 series APUs are limited to 2400, while their desktop 2000 series can push 2933, and their APUs are memory bandwidth limited. Meanwhile, intel is pushing 3733 in mobile).