Well, the wait is over and early reviews for AMD's Strix Halo APUs have finally dropped. For those who kept up with the leaks and rumors, the high-end RDNA 3.5 Radeon 8060S iGPU was repeatedly rumored to features up to 40 CUs, allowing for raw performance that keeps up with several discrete-class mobile GPUs. Now that we have concrete information, it appears that the Strix Halo iGPU does indeed trade blows with mid-range mobile GPUs, which is an undeniably impressive feat for an integrated unit. Some of the fastest x86 iGPUs - the Arc 140 V, Radeon 890M, are all left in the dust, although Apple's highest-end offerings are unsurprisingly well ahead.

Starting off with 3D Mark Time Spy, the 40-CU Radeon 8060S, housed in the 13-inch ROG Flow Z13, managed an impressive score of 10,200 points according to Notebookcheck. This puts the iGPU in close proximity to other RTX 4070-powered 14-inch gaming laptops, such as the Zephyrus G14 which managed to rake in around 10,300 points. Compared to the previous iteration of the ROG Flow Z13, which boasts a 65-watt RTX 4070, the Radeon 8060S-powered Z13 pulls ahead by around 5%. Laptops with more substantial power envelopes do race ahead significantly, such as the 140-watt RTX 4070 Laptop-powered Razer Blade 14 which managed over 13,000 points. In the Steel Nomad benchmark, however, the Radeon 8060S appears less impressive, trailing behind not only the RTX 4070 Laptop, but also systems with the RTX 4060 Laptop GPU (110 W).

Late last month, an AMD "How to Sell" Ryzen AI MAX series guide appeared online—contents provided an early preview of the Radeon 8060S iGPU's prowess in 1080p gaming environments. Team Red seemed to have some swagger in their step; they claimed that their forthcoming "RDNA 3.5" integrated graphics solution was up to 68% faster than NVIDIA's discrete GeForce RTX 4070 Mobile GPU (subjected to thermal limits). Naturally, first-party/internal documentation should be treated with a degree of skepticism—the PC hardware community often relies on (truly) independent sources to form opinions. A Chinese leaker has procured a pre-release laptop that features a "Zen 5" AMD Ryzen AI Max+ 395 processor. By Wednesday evening, the tester presented benchmark results on the Tieba Baidu forums.

The leaker uploaded a screenshot from a 3DMark Time Spy session. No further insights were shared via written text. On-screen diagnostics pointed to a "Radeon 8050S" GPU, and the CPU being an "AMD Eng Sample: 100-000001243-50_Y." Wccftech double-checked this information; they believe that the OPN ID corresponds to a: "Ryzen AI MAX+ 395 with the Radeon 8060S, instead of the AMD Radeon 8050S iGPU...The difference between the two is that the Radeon 8060S packs the full 40 Compute Units while the Radeon 8050S is configured with 32 Compute Units. The CPU for each iGPU is also different and the one tested here packs 16 Zen 5 cores instead of the 12 Zen 5 cores featured on the Ryzen AI MAX 390." According to the NDA-busting screenshot, Team Red's Ryzen AI MAX+ 395 engineering sample racked up an overall score of 9006 in 3DMark Time Spy. Its graphics score tally came in at 10,106, while its CPU scored 5571 points. The alleged Radeon 8060S iGPU managed to pull in just under NVIDIA's GeForce RTX 4060 Mobile dGPU (average) score of 10,614. The plucky RDNA 3.5 40 CU iGPU seems to outperform a somewhat related sibling; the Radeon RX 7600M XT dGPU (with 32 RDNA 3 CUs) scored 8742 points. Radeon 8060S trails the desktop Radeon RX 7600 GPU by 884 points.

The AOKZOE A1 X was recently teased by its maker as a new AMD Strix Point-powered gaming handheld, featuring the commendably potent Ryzen AI 9 HX 370 APU with the equally admirable RDNA 3.5-based Radeon 890M iGPU. Details were scarce regarding the handheld, but now the company has shed some much-needed light on a few features of the upcoming handheld. We still do not have a clue as to when the handheld will finally see the light of day, or even an expected price bracket. Considering that AOKZOE is not nearly as well known as its competitors in this space, the A1 X can be expected to launch with a price tag that undercuts its rivals. Thanks to a previous teaser, already know that the A1 X will sport an 8-inch 120 Hz display with VRR support.

Addressing the features teased recently, AOKZOE has revealed that the handheld will sport a 72.7 Wh battery with support for bypass charging, allowing it to draw power directly without having to pass it through the battery, thereby increasing the battery's lifespan. Moreover, the A1 X will also sport MicroSD 4.0 support, allowing for transfer speeds of up to 300 MB/s. The handheld will sport dual USB4 ports, along with an OCuLink port which will allow for speedy eGPU connections for gaming sessions that demand more horsepower than the Radeon 890M can provide. Going by the shared images, the A1 X will also sport at least one USB-A port, which will surely come in handy when the need arises for additional peripherals.

Priced at the equivalent of $116, the China-exclusive Ryzen 5 7400F is a 6-core/12-thread processor powered by the older "Zen 4" microarchitecture, but which is based on the "Raphael" MCM, giving it a comprehensive PCIe Gen 5 I/O (as opposed to designing such a chip based on the "Phoenix Point" monolithic silicon with its PCIe Gen 4 I/O). The chip benefits from the full 32 MB on-die L3 cache being enabled on the "Zen 4" CCD, besides the full 1 MB per core L2 cache, and that I/O, but misses out on the iGPU. At its price, the 7400F is attracting a segment of value-conscious gamers.

To bring this chip at its price point, AMD had to cut costs somewhere, and Chinese PC enthusiast "Melon Master" soon found out where. On de-lidding (removing IHS) of the Ryzen 5 7400F, it was found that the chip does not use a soldered TIM like the other Ryzen 7000 series "Raphael" processors, instead using more cost-effective thermal paste, as is common in entry-level chips from both AMD and Intel. Harukaze5719 comments that this could be the reason the chip has a fairly noticeable Cinebench R23 performance delta against the Ryzen 5 7500F that's globally available, and has STIM, but is priced at $145. The 7400F and 7500F share the same base frequency of 3.70 GHz, but while the former boosts up to 4.70 GHz, the latter goes all the way up to 5.00 GHz.

ASUS is working on a new line of NUC mini PCs powered by the AMD Ryzen AI MAX "Strix Halo" mobile processors that come with oversized iGPUs and CPU core counts as high as 16-core/32-thread "Zen 5." This was sniffed out in shipping manifests by Olrak29_ on its way to being tested by the BIS (Bureau of Indian Standards) for regulatory certification similar to CE, with the manifest describing the NUC model as the "NUC14LNS," meaning that this box is from the NUC 14 series. The manifest describes the NUC sample as featuring the top of the line Ryzen AI MAX+ 395.

The Ryzen AI MAX+ 395 maxes out everything on the silicon, featuring 16 "Zen 5" CPU cores across two CCDs with full 512-bit FPUs, with 80 MB of "total cache" (L3+L2) between them; a 50 TOPS-class NPU that can locally accelerate Microsoft Copilot+, and that large RDNA 3.5 iGPU with 40 compute units (2,560 stream processors), 80 AI accelerators, and 40 ray accelerators. What's interesting about this NUC is that it will not come with SO-DIMM slots, since the "Strix Halo" SoC features a 256-bit wide LPDDR5X memory interface. It will either have hardwired memory, or use a pair of LPCAMM2 modules (each with a 128-bit bus width), which is less likely. With all the rage about AI developers using M4-powered Mac minis to accelerate DeepSeek, is ASUS eying a slice of the AI market?

After several months of teasers, the Ayaneo 3 gaming handheld has finally witnessed its official launch. The product will be available with two APUs - the Ryzen 7 8840U for the entry variant, and the Ryzen AI 9 HX 370 for the high-end variant. The system can be equipped with up to 64 GB of LPDDR5X-7500 memory, and a whopping 4 TB of SSD storage. The handheld will also feature modular controllers, which can be detached with the click of a single button.

The Ayaneo 3 will also give customers the option to chose between an LCD or an OLED panel, and as VideoCardz notes, selecting the OLED option does not change the final price. As mentioned earlier, the system will be available with either a Zen 4 or a Zen 5 APU. The Strix Point variant leads the Hawk Point part by almost around 50% in multicore tests, and the HX 370's integrated Radeon 890M iGPU is somewhere around 25% more performant than the 8840U's Radeon 780M. Clearly, the performance gap between the two variants will be substantial.

The Beelink SER9 Pro made headlines a few months ago as one of the first mini PCs with AMD's Strix Point APUs. Powered by the Ryzen AI 9 HX 370 APU with the powerful Radeon 890M iGPU, the SER9 Pro promised impressive performance and efficiency in a commendably compact form factor. Now, the brand has unveiled a new variant of the SER9 Pro, powered by the slightly less-powerful Ryzen AI 9 365 APU. This variant will likely be more affordable than its higher-tier sibling, which currently starts from $999 in the US.

The differences between the Ryzen AI HX 370 and the Ryzen AI 365 are actually more substantial than one might think. Both the APUs sport four Zen 5 cores, while the AI 365 gets only six Zen 5c cores compared to the HX 370's eight. The AI 365 also gets a 100 MHz lower boost clock, and a notably slower Radeon 880M iGPU with fewer shaders. Beelink had equipped the HX 370 variant with a 65 watt TDP, but has not disclosed the TDP value for the AI 365 variant yet. That said, going by synthetic benchmark scores, the Ryzen AI 9 365 variant will likely be roughly 20% and 10% slower in CPU and GPU performance respectively than the Ryzen AI HX 370 variant.

The market for compact gaming handheld is expanding at an unprecedented rate, thanks to the popularity boom that handhelds have received in recent months. The GPD Win Min (2025) is one such offering, sitting alongside the rest of interesting gaming products that GPD is known for. The Win Mini is now available for pre-order on Indiegogo, with a starting price of $769 (backers only), and a retail price of $839. Of course, interested buyers are encouraged to be mindful of the risks associated with crowdfunding campaigns, although GPD has mostly had a complaint-free track record.

Unfortunately, and rather unsurprisingly, the entry-level variant does not ship with the latest AMD Strix Point chips, but rather the older Hawk Point offerings, specifically the Ryzen 7 8840U with the Radeon 780M iGPU with 12 CUs. The higher-tier variants ship with Strix Point APUs, starting at the Ryzen AI 9 HX 365 APU, going all the way up to the 12-core Ryzen AI 9 HX 370 with the powerful Radeon 890M iGPU. To accommodate the new APUs, GPD has reworked the thermals, and has added room for full-sized M.2 2280 SSD drives as well. The product packs hall-effect joysticks, plug-and-play grips, and a bunch of useful ports including USB4, USB 3.2 Type-C, an SD Card slot, an audio jack, as well as a good old USB-A port. The 7-inch 1080p display ramps up to 120 Hz, and the system can be equipped with up to 64 GB of memory and 2 TB of PCIe 4.0 storage, and a 44.24 Wh battery is also present.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.

ASUS at the 2025 International CES showed off some of the first NUC desktops that meet Microsoft Copilot+ AI PC logo requirements. The new ASUS NUC 14 Pro AI measures 130 mm x 130 mm x 34 mm. It runs an Intel Core Ultra 200V series "Lunar Lake" processor. Depending on the processor model, you get 16 GB or 32 GB of hardwired LPDDR5X memory. You also get the processor's Xe2 "Battlemage" iGPU. Its NPU provides up to 45 AI TOPS of performance, meeting Copilot+ requirements. Storage is care of an M.2-2280 slot with NVMe Gen 4 x4 wiring. I/O options include two 40 Gbps Thunderbolt 4 ports including DisplayPort passthrough, and networking that includes Bluetooth 5.4 and Wi-Fi 7.

ASUS won't (or probably can't use the "NUC" moniker with AMD processors), and so there's the ExpertCenter PN54 for those who want essentially the same device, but with an AMD Ryzen AI 300 series processor. This mini PC has the same exact dimensions as the NUC 14 Pro AI, and is powered by a Ryzen AI 300 "Strix Point" processor, with options going all the way up to the Ryzen AI 9 HX 370. This chip includes the XDNA 2 NPU with 50 AI TOPS on tap, which means it meets Microsoft Copilot+ AI PC logo requirements. It also features the Radeon 870M RDNA 3.5 graphics with 16 CU. The chip uses standard dual-channel DDR5-5600 using SODIMMs. Storage includes an M.2-2280 slot with Gen 4 x4 wiring. In place of Thunderbolt 4, you get a couple of USB4 ports with 40 Gbps bandwidth and DP passthrough. Comms include Bluetooth 5.4 and Wi-Fi 7, just like on its Intel-powered sibling.

AMD today vastly fleshed out its mobile processor lineup with the introduction of two new processor lines besides the Ryzen AI Max 300 series. This includes the introduction of more processor models in the Ryzen AI 300 series that are powered by the "Strix Point" silicon, and the introduction of the Ryzen 200 series mobile processors, which are based on the older "Hawk Point" silicon. In 2024, AMD had debuted the Ryzen AI 300 series "Strix Point," but with just the top-end Ryzen AI 9 370 and 365, which came with maxed out 12-core/24-thread (4x Zen 5 + 8x Zen 5c) core configuration, and a maxed out iGPU with 16 CU. Today the company is introducing the Ryzen AI 7 350, the Ryzen AI 5 340, and their AMD PRO variants for commercial notebooks. Both the consumer and commercial parts have identical specs, except for the latter featuring the AMD PRO feature-set.

The Ryzen AI 7 350 comes with a CPU configuration of 8-core/16-thread (4x Zen 5 + 4x Zen 5c). All cores have a base frequency of 2.00 GHz, the Zen 5 cores boost up to 5.00 GHz. The iGPU on offer is the Radeon 860M, with 12 CU and an engine clock of up to 3.00 GHz. TDP is configurable between 15 W to 55 W. The Ryzen AI 5 340 comes with a 6-core/12-thread configuration (3x Zen 5 + 3x Zen 5c), and CPU clock speeds of 2.00 GHz base with 4.80 GHz boost achievable on the Zen 5 cores. The iGPU is heavily cut down, with just 4 CU available, and an iGPU engine clock of 2.90 GHz. Notebook designers can configure this chip with a wide power range from 15 W to 55 W. All four processor models mentioned above come with a Ryzen AI XDNA 2 NPU that's capable of 50 AI TOPS, which means they're all Microsoft Copilot+ AI PC logo eligible.

The Core Ultra 200H series of mobile processors is designed to cover the majority of mobile device use-cases from the next-generation. These chips are very much based on the latest "Arrow Lake" microarchitecture, but with a few clever design changes. This is a tile-based processor, just like the 200HX series; but the various tiles are different. The Compute tile, which packs the main CPU complex, is noticeably smaller, with 6 "Lion Cove" P-cores, and two "Skymont" E-core clusters with 8 E-cores sharing a 24 MB L3 cache, and a ringbus interconnect. Things get interesting with the SoC tile, which now contains two Low-power Island E-cores. At this point, it is unclear if these are "Skymont," or are older generation "Crestmont" cores, which would mean that Intel has carried over the SoC tile from "Meteor Lake-H."

The SoC tile also contains at 13 TOPS-class NPU, which means these chips miss out on Microsoft Copilot+ AI PC logo. The idea behind this could be that Intel is trying to promote the Core Ultra 200V series "Lunar Lake," which comes with a powerful 45 TOPS NPU. The company is announcing several new models of "Lunar Lake" today, including vPro ones. Switching focus back to "Arrow Lake-H," and our attention is drawn back to the SoC and I/O tiles, which miss out on the number of PCIe lanes, particularly Gen 5 ones, which the Core Ultra 200HX chips come with. The game changer for this chip, however, is the large Graphics tile. The iGPU of "Arrow Lake-H" is based on the same Xe-LPG graphics architecture as the one on "Meteor Lake," and not Xe2 "Battlemage" like on "Lunar Lake." However, this iGPU is vastly different from the one the "Arrow Lake-HX" comes with.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

"Twin Lake" is codename for a line of low-power x86-64 processors by Intel, which succeed the Core i3 N-series and N200 series "Alder Lake-N" processors. These non-socketed (BGA) chips power a wide range of devices from entry level notebooks and mini PCs to consumer NAS servers, and other embedded applications. The chips feature only E-cores. While "Alder Lake-N" used "Gracemont" cores, "Twin Lake" uses the swanky new "Skymont" cores, which serve as E-cores in "Lunar Lake" and "Arrow Lake" hybrid processors. "Skymont" cores feature massive IPC and clock-speed gains over "Gracemont," of nearly 50%, which pulls up their performance levels to match the "Golden Cove" and "Raptor Cove" P-cores of "Alder Lake" and "Raptor Lake," although these cores can't boost up to 5.00 GHz. We got the first name-drop of "Twin Lake" way back in May 2024. Jaykihn leaked what the processor lineup could look like.

The "Twin Lake" silicon features two "Skymont" E-core clusters sharing an L3 cache. At this point, the sizes of the shared L2 caches of the E-core clusters, and the size of the shared L3 cache are not known. On "Alder Lake-N," each "Gracemont" cluster features 2 MB of L2 cache, and the two clusters share a 6 MB L3 cache. The silicon also features an iGPU based on what is very likely the Xe-LPG graphics architecture, with four Xe cores worth 32 execution units (EU). The series is led by the Intel N355. This chip maxes out the "Twin Lake" silicon, enabling both "Skymont" clusters, for an 8-core/8-thread CPU configuration. The CPU comes with a base frequency of 3.00 GHz, and boosts up to 3.90 GHz. The chip comes with a configurable TDP of 9 W and 15 W. It comes with a maxed out iGPU, with all 32 EU being enabled, and a graphics frequency of 1.35 GHz.

AMD fans are undoubtedly on their toes to witness the performance improvements that Strix Halo is ready to bring forth. Unlike Strix Point, which utilizes a combination of Zen 5c and full-fat Zen 5 cores, Strix Halo will do away with the small cores for a Zen 5 "only" setup, allowing for substantially better multicore performance. Moreover, it is also widely expected that Strix Halo will boast chunky iGPUs that will bring the heat to entry-level and even some mid-range mobile GPUs, allowing Strix Halo systems to not require discrete graphics at all, with a prime example being the upcoming ROG Flow Z13 tablet.

As per recent reports, the upcoming Ryzen AI Max+ Pro 395 APU will sport an RDNA 3.5-based iGPU with a whopping 40 CUs, and will likely be branded as the Radeon 8060S. In a leaked Geekbench Vulkan benchmark, the Radeon 8060S managed to outpace the RTX 4060 Laptop dGPU in performance. However, according to yet another leaked benchmark, Passmark, the Radeon 8060S and the 32-CU 8050S scored 16,454 and 16,663 respectively - and no, that is not a typo. The 8060S with 40 CUs is marginally slower than the 8050S with 32 CUs, clearly indicating that the numbers are far from final. That said, performance in this range puts the Strix Halo APUs well below the RTX 4070 laptop GPU, and roughly the same as the RTX 3080 Laptop. Not bad for an iGPU, although it is almost certain that actual performance of the retail units will be higher, judging by the abnormally small delta between the 8050S and the 8060S.

OneXPlayer has pulled back the veil on its G1 gaming notebook, and the product sure does look intriguing. Calling it a notebook might not even be fair, considering that its 8.8-inch display barely exceeds tablet territory. However, for lovers of compact gaming systems and handhelds, the G1 looks like it ticks many boxes, and its detachable keyboard is undoubtedly a welcome addition.

The system is powered by AMD's 12-core Ryzen AI 9 HX 370 "Strix Point" APU with 4 Zen 5 and 8 Zen 5c cores, along with a powerful Radeon 890M iGPU with 16 CUs based on the RDNA 3.5 architecture. The aforementioned 8.8-inch display is quite the looker as well, featuring a 2.5K resolution with a speedy 144 Hz refresh rate. At least on paper, it appears that the OneXPlayer G1 leaves very little room for complaint.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 "Strix Halo" APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill's latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

Dynabook has introduced the Protégé X30W powered by up to an Intel Core Ultra 7 165H processor. At first glance, that hardly seems impressive, but a closer look at the device reveals that the laptop weighs a feather-light 989 grams, or roughly 2.2 lbs. The device is also a convertible, which means that the hinge allows for 360° rotation, effectively converting the laptop into a tablet.

Apart from its lightweight design, there is little else about the laptop that is worth noting. The highest-end variant sports a Core Ultra 7 165H, which is a plenty-powerful chip, featuring 6 performance cores and 8 efficiency cores for a total of 14 cores and 22 threads, since the Crestmont cores do not support Hyper-Threading. An 8-core Arc iGPU handles the graphics, and delivers decent performance that nearly matches the RTX 2050 Mobile in certain cases. The system features up to 32 GB of DDR5-5200 memory, and up to a 2 TB PCIe Gen 4 SSD.

Minisforum is an easily recognizable brand that is well-regarded for its lineup of mini PCs. The MS-A1 is one such mid-range offering that boasts an AM5 socket, and the product is now available to configure with the 16-core Ryzen 9 9950X with a 100 W TDP, which happens to be an absolute monstrosity of a desktop CPU with hefty cooling requirements.

The system was already available with a Ryzen 7 8700G, which was most likely performant enough for most people. The MS-A1 does not feature dedicated graphics, which is why the Ryzen 7 8700G was a great choice thanks to its relatively potent iGPU. However, it is no surprise that there are many workloads that demand raw CPU power over anything else, and the MS-A1 with the Ryzen 9 9950X will be an excellent option for such demanding scenarios. That said, since the system does not feature discrete graphics, the Radeon 610M iGPU found in the 9950X will simply not be able to keep up with any GPU-intensive workloads.

During Barclays 22nd Annual Global Technology Conference, Intel was a guest and two of the interim company co-CEOs Michelle Johnston Holthaus and David Zinsner gave a little update on the state of affairs at Intel. One of the most interesting aspects of the talk was Intel's upcoming "Panther Lake" processor—a direct successor to Intel Core Ultra 200S "Arrow Lake-H" mobile processors. The company confirmed that Panther Lake would utilize an Intel 18A node and that a few select customers have powered on Panther Lake on the E0 engineering sample chip. "Now we are using Intel Foundry for Panther Lake, which is our 2025 product, which will land on 18A. And this is the first time that we're customer zero in a long time on an Intel process," said interim co-CEO Michelle Johnston Holthaus, adding, "But just to give some assurances, on Panther Lake, we have our ES0 samples out with customers. We have eight customers that have powered on, which gives you just kind of an idea that the health of the silicon is good and the health of the Foundry is good."

While we don't know what ES0 means for Intel internally, we can assume that it is one of the first engineering samples on the 18A. The "ES" moniker usually refers to engineering samples, and zero after it could be the first design iteration. For reference, Intel's "Panther Lake-H" will reportedly have up to 18 cores: 6 P-cores, 8 E-cores, and 4 LP cores. The design brings back low-power island E-cores in the SoC tile. The P-cores use "Cougar Cove," which should have a higher IPC than "Lion Cove," while keeping the existing "Skymont" E-cores. The SoC tile may move from Arrow Lake's 6 nm to a newer process to fit the LP cores and an updated NPU. The iGPU is said to use the Xe3 "Celestial" architecture. With Arrow Lake-H launching in early 2025, Panther Lake-H likely won't arrive until 2026.

CES 2025 is less than a month away and leaks about AMD Strix Halo APUs are starting to emerge. Today we have confirmation via a leaked Geekbench Vulcan test that AMD will launch the Ryzen AI MAX+ PRO 395 w/ Radeon 8060S "Strix Halo" APU. Information reveals that this APU is equipped with 16 Zen 5 cores with 32 threads, a 3 GHz base frequency (4.4 GHz max), and a boost up to 5.1 GHz. It sports a 32 MB L3 cache per CCD for a total of 64 MB since it uses a dual CCD chip design. The TDP should be between 55-130 W. Moreover, the "PRO" in the product naming suggests that AMD could release non-PRO models at a later date.

The integrated Radeon 8060S iGPU adopts the RDNA 3.5 architecture with 40 computing units and was tested using an AMD reference board design codenamed AMD MAPLE-STXH and 64 GB of memory scoring 67,004 points in the Geekbench Vulkan test. This initial result is lower than AMD Radeon RX 7600 RDNA 3 discrete entry-level products (despite having more cores 40CU vs 32CU), and higher than NVIDIA GeForce RTX 3050. However, since the benchmark was run on an evaluation platform without optimized drivers and more likely using an early test sample product, we can expect the actual performance of the Radeon 8060S iGPU to be higher.

GPD recently updated its Win 4 gaming handheld with Strix Point APUs, and has now seemingly turned its attention to the Win Max 2. The system is available on Indiegogo, with an estimated shipping time set for sometime this December. The Strix Point update will not only bring improved performance to the table, but also enhance overall energy efficiency, which is crucial for such compact form factors.

The Win Max 2 is now available with AMD's latest Ryzen AI 9 HX 370 APU "Strix Point" APU, although a "Hawk Point" variant with a Ryzen 7 8840U is also available. The Strix Point APU outperforms the Hawk Point APU in almost every possible way, with the 12-core HX 370 pulling ahead of the 8-core 8840U by almost 45% in multithreaded benchmarks. In graphics performance, the story is much the same, with the Radeon 890M iGPU leading the 780M by almost 25% in synthetic benchmarks.

It's been public knowledge for a while now that Lenovo is planning an imminent successor to its Legion Go handheld that has proven rather popular among handheld gamers. Previous leaks and rumors indicated that the Legion Go S 8ARP1, as it will apparently be named, will be a more affordable version of the current Legion Go. Now, thanks to Roland Quandt, Windows Central, and WinFuture, more details about the upcoming Legion Go S have leaked, including images of the device, supposed specifications, and a potential price.

According to the leaks, the new affordable handheld gaming PC will feature some substantial hardware changes, including a slightly smaller eight-inch display, this time with a much lower 1920 × 1200p resolution and a slightly lower 120 Hz refresh rate. Gone, too, are the Nintendo Switch-style detachable controllers, with the Legion Go S instead featuring a white unibody design. What's more interesting than the leaked images of the Legion Go S or the hardware changes—detachable controllers or not, the Legion Go is still intended to be used as a handheld—is the new AMD APU that will seemingly power the Go S. The as-yet unannounced AMD Ryzen Z2G looks like it will be an odd core configuration featuring an AMD Radeon 680M iGPU and Zen 3+ cores. Ultimately, the APU seems like it will put the Legion Go S somewhere between the current-generation Legion Go and devices featuring the AMD Ryzen Z1 (non-extreme), which is a good place to be if Lenovo hopes to compete with the likes of the Steam Deck OLED, which will seemingly cost around the same as the Legion Go S, depending on which region you are in.

Recent Geekbench results have surfaced for Intel's unreleased Core Ultra 5 225F processor without an integrated GPU, showcasing interesting performance improvements over its predecessors. The benchmark results, initially shared by Benchleaks on X, reveal that this new 10-core chip delivers performance comparable to the higher-core-count Core i5-13600. The Core Ultra 5 225F achieved a single-core score of 2,653 points and a multi-core score of 13,028 points. The processor combines six P-cores, four E-cores, and 20 MB of L3 cache. During testing, the chip reached a maximum frequency of 4.887 GHz. When compared to its direct predecessor, the Core i5-14400F, the new 225F demonstrates significant improvements with approximately 13% better performance in both single and multi-core tests.

More impressively, it manages to edge out the 14-core Core i5-13600 by 5% across both metrics despite having fewer cores and threads. However, the 225F falls behind its premium sibling with four more E-cores, the Core Ultra 5 245K, which outperforms it by 16% in single-core and 44% in multi-core operations. The Core Ultra 5 225F is expected to be part of Intel's new 65 W TDP lineup, targeting mainstream desktop systems with limited overclocking capabilities. This positions it as a more energy-efficient alternative to the current 125 W TDP Core Ultra 200 series processors. While we wait for more firmware updates to boost Arrow Lake performance, Intel could target the launch of the F-series SKUs for CES 2025, which is just a few weeks away now.