NVIDIA announced today it is opening its first Vietnam research and development center, signaling its confidence in the country's bright artificial intelligence future. The company is collaborating with the Vietnamese government to establish its new Vietnam Research and Development Center focused on AI. NVIDIA will use the R&D center to focus on software development, capitalizing on the country's strong talent pool of STEM engineers, and to engage industry leaders, startups, government agencies, universities and students to accelerate the adoption of AI.

"We are delighted to open NVIDIA's R&D center to accelerate Vietnam's AI journey," said Jensen Huang, founder and CEO of NVIDIA. "With our expertise in AI development, we will partner with a vibrant ecosystem of researchers, startups and enterprise organizations to build incredible AI right here in Vietnam."

The Biden administration is set to announce new, targeted restrictions on China's semiconductor industry, focusing primarily on emerging chip manufacturing equipment companies rather than broad industry-wide limitations. According to Bloomberg, these new restrictions are supposed to take effect on Monday. The new rules will specifically target two manufacturing facilities owned by Semiconductor Manufacturing International Corp. (SMIC) and will add select companies to the US Entity List, restricting their access to American technology. However, most of Huawei's suppliers can continue their operations, suggesting a more mild strategy. The restrictions will focus on over 100 emerging Chinese semiconductor equipment manufacturers, many of which receive government funding. These companies are developing tools intended to replace those currently supplied by industry leaders such as ASML, Applied Materials, and Tokyo Electron.

The moderated approach comes after significant lobbying efforts from American semiconductor companies, who argued that stricter restrictions could disadvantage them against international competitors. Major firms like Applied Materials, KLA, and Lam Research voiced concerns about losing market share to companies in Japan and the Netherlands, where similar but less stringent export controls are in place. Notably, Japanese companies like SUMCO are already seeing the revenue impacts of Chinese independence. Lastly, the restrictions will have a limited effect on China's memory chip sector. The new measures will not directly affect ChangXin Memory Technologies (CXMT), a significant Chinese DRAM manufacturer capable of producing high-bandwidth memory for AI applications.

Today at its inaugural IBM Quantum Developer Conference, IBM announced quantum hardware and software advancements to execute complex algorithms on IBM quantum computers with record levels of scale, speed, and accuracy.

IBM Quantum Heron, the company's most performant quantum processor to-date and available in IBM's global quantum data centers, can now leverage Qiskit to accurately run certain classes of quantum circuits with up to 5,000 two-qubit gate operations. Users can now use these capabilities to expand explorations in how quantum computers can tackle scientific problems across materials, chemistry, life sciences, high-energy physics, and more.

The CHERI Alliance CIC (Community Interest Company) today announced its official launch and the expansion of its membership, welcoming Chevin Technology (UK), Critical Technologies (USA), the Defence Science and Technology Laboratory (DSTL, UK), Google (USA), Light Momentum Technology Corporation (Taiwan), National Cyber Security Centre (NCSC, a part of GCHQ, UK), Parvat Infotech (India), SRI International (USA), TechWorks (UK), Trusted Computer Center of Excellence (USA), the University of Birmingham (UK), and the University of Glasgow (UK) as founding members.

Founded to unite hardware security leaders and system developers, the CHERI Alliance aims to establish CHERI (Capability Hardware Enhanced RISC Instructions) as the new standard for memory safety and scalable software compartmentalization.

According to the market research firm Mercury Research, the desktop CPU market has witnessed a remarkable transformation, with AMD seizing a substantial 28.7% market share in Q3 of 2024—a giant leap since the launch of the original Zen architecture in 2017. This 5.7 percentage point surge from the previous quarter is a testament to the company's continuous innovation against the long-standing industry leader, Intel. Their year-over-year growth of nearly ten percentage points, fueled by the success of their Ryzen 7000 and 9000 series processors, starkly contrasts Intel's Raptor Lake processors, which encountered technical hurdles like stability issues. AMD's revenue share soared by 8.5 percentage points, indicating robust performance in premium processor segments. Intel, witnessing a decline in its desktop market share to 71.3%, attributes this shift to inventory adjustments rather than competitive pressure and still holds the majority.

AMD's success story extends beyond desktops, with the company claiming 22.3% of the laptop processor market and 24.2% of the server segment. A significant milestone was reached as AMD's data center division generated $3.549 billion in quarterly revenue, a new record for a company not even present in the data center in any considerable quantity just a decade ago. Stemming from strong EPYC processor sales to hyperscalers and cloud providers, along with Instinct MI300X for AI applications, AMD's acceleration of data center deployments is massive. Despite these shifts, Intel continues to hold its dominant position in client computing, with 76.1% of the overall PC market, held by its strong corporate relationships and extensive manufacturing infrastructure. OEM partners like Dell, HP, Lenovo, and others rely heavily on Intel for their CPU choice, equipping institutions like schools, universities, and government agencies.

To anyone following gaming with any sort of regularity, it's plain to see that Roblox is by far one of the biggest, if not the biggest game among young audiences. Now, a new report from Hindenburg Research claims that Roblox has not only misrepresented its user count but has also failed to protect minors, who make up as much as 60% of the game platform's users. After Hindenburg released the statement, Roblox responded to the claim denying the allegations, citing that it strictly enforces its community standards, although it admits that bots and inflated user counts are an issue the company actively tries to fight.

Hindenburg's report alleges that Roblox has repeatedly inflated its user figure, intentionally using vague language to mislead its investors about how many users it has. The organization also claims to have discovered several cases of sexual abuse and exploitation of minors on the platform, citing incidents involving kidnapping and sexual assault against minors that stemmed from in-game meetings.

It looks like Epic Games's Tim Sweeney was onto something earlier this week when he claimed that the gaming landscape is changing. According to new research by MIDiA Research, online PVP and couch co-op games are more popular than single-player games in audiences aged 16-24, with older audiences overwhelmingly preferring single-player games.

The researchers surveyed 9,000 gamers in the US, UK, Australia, Canada, Germany, France, Sweden, South Korea, and Brazil, giving the study a pretty diverse sample, in terms of socio-economic and cultural backgrounds. Regardless of age group, single-player and PVP games were always the most popular genres, although a solid 53% of the participants in the study said that single-player games were their preference.

Alongside German Chancellor Olaf Scholz, senior European government officials and European-based global enterprises, IBM (NYSE: IBM) today unveiled the first IBM Quantum Data Center located outside of the United States. It is the company's second quantum data center in the world and marks a significant expansion of its fleet of advanced, utility-scale quantum systems available to global users via the cloud.

Now online in Ehningen, Germany, Europe's first IBM Quantum Data Center includes two new utility-scale, IBM Quantum Eagle-based systems, and will soon feature a new IBM Quantum Heron-based system. These systems are capable of performing computations beyond the brute-force simulation capabilities of classical computers.

A critical security flaw known as "Sinkclose" (CVE-2023-31315) has been identified in all AMD processors dating back to 2006, potentially affecting hundreds of millions of devices worldwide. This vulnerability allows malicious actors to exploit the chip architecture, leading to unauthorized access to sensitive data. Researchers Enrique Nissim and Krzysztof Okupski, researchers from the security firm IOActive, have revealed that the vulnerability can be exploited through various methods, enabling attackers to extract confidential information from affected systems, including passwords and personal data. The issue is especially concerning, given that it is present in all AMD CPUs made in the last 18 years and their widespread use in both consumer and enterprise environments. However, to exploit this vulnerability, an attacker must possess access to system's kernel. Downloading of malware-infused files can trigger it, so general safety measures are recommended.

The Sinkclose method exploits a little-known capability in AMD processors called TClose. This name is a blend of "TClose" and "Sinkhole," with the latter referring to a previous vulnerability found in Intel's System Management Mode in 2015. AMD chips employ a protective mechanism named TSeg, which blocks operating systems from accessing a specific memory area reserved for System Management Mode (SMM), known as System Management Random Access Memory (SMRAM). However, the TClose feature is designed to maintain backward compatibility with older hardware that might use the same memory addresses as SMRAM. It does this by remapping memory when activated. The security experts discovered that they could manipulate this TClose remapping function using only standard operating system permissions. By doing so, they could deceive the SMM into retrieving altered data, enabling them to redirect the processor and run their own instructions with the high-level privileges of SMM. This technique essentially allows attackers to bypass standard security measures and execute malicious code at one of the most privileged levels of the processor, potentially compromising the entire system.

Researchers at Fraunhofer IAF have made a significant advance in semiconductor materials by successfully fabricating aluminum yttrium nitride (AlYN) using metal-organic chemical vapor deposition (MOCVD). AlYN, known for its outstanding properties and compatibility with gallium nitride (GaN), shows great potential for energy-efficient, high-frequency electronics. Previously, AlYN could only be deposited via magnetron sputtering, but this new method opens the door to diverse applications. Dr. Stefano Leone from Fraunhofer IAF highlights AlYN's ability to enhance performance while reducing energy consumption, making it vital for future electronics.

In 2023, the team achieved a 600 nm thick AlYN layer with a record 30% yttrium concentration. They have since developed AlYN/GaN heterostructures with high structural quality and promising electrical properties, particularly for high-frequency applications. These structures demonstrate optimal two-dimensional electron gas (2DEG) properties and are highly suitable for high electron mobility transistors (HEMTs).

In a recent report by Mercury Research, AMD has shown significant progress in the CPU market during Q2 2024, particularly in the data center and laptop segments. AMD's most notable achievement comes in the server CPU space, where it now holds 24.1% of the market, a 5.6% increase year-over-year, and a 0.5% increase from the previous quarter. This growth is particularly impressive in terms of revenue, with AMD capturing 33.7% of server CPU revenue despite its lower unit share. This suggests that AMD's high-end EPYC processors carry premium prices in the data center market and are most of the unit volume. AMD has also made advancements in the laptop CPU segment, reaching a 20.3% market share. This represents a 1% increase from the previous quarter and a 3.8% rise year-over-year. The company's success in laptops can be attributed to solid demand for its existing products, propelled by Intel's reported supply issues with Meteor Lake processors.

However, AMD experienced a slight setback in the desktop CPU market, losing a 1% share to Intel quarter-over-quarter. AMD now controls 23% of this segment, compared to Intel's 77%. This dip may be due to AMD's preparation for the launch of its new Zen 5-based CPUs in August. Despite AMD's gains, Intel maintains its overall dominance in the CPU market. In the total client PC space, Intel holds a 78.9% market share, with AMD at 21.1%. Intel still holds the majority of revenue and market share on all fronts. However, AMD is executing well, and Intel's financial troubles could be a setback for team blue. More competition at every front is great to see, and we are curious to look at the data from upcoming quarters and analyze how well both of companies perform.

Researchers from the Helmholtz-Zentrum Dresden-Rossendorf (HZDR), TU Chemnitz, TU Dresden and Forschungszentrum Jülich have been the first to demonstrate that not just individual bits, but entire bit sequences can be stored in cylindrical domains: tiny, cylindrical areas measuring just around 100 nanometers. As the team reports in the journal Advanced Electronic Materials, these findings could pave the way for novel types of data storage and sensors, including even magnetic variants of neural networks.

"A cylindrical domain, which we physicists also call a bubble domain, is a tiny, cylindrical area in a thin magnetic layer. Its spins, the electrons' intrinsic angular momentum that generates the magnetic moment in the material, point in a specific direction. This creates a magnetization that differs from the rest of the environment. Imagine a small, cylinder-shaped magnetic bubble floating in a sea of opposite magnetization," says Prof. Olav Hellwig from HZDR's Institute of Ion Beam Physics and Materials Research, describing the subject of his research. He and his team are confident that such magnetic structures possess a great potential for spintronic applications.

A research team from the South Korean Institute for Basic Science (IBS) has developed a new method for growing 1D metallic materials less than 1 nm wide. They applied this technique to create a new structure for 2D semiconductor logic circuits, using the 1D metals as gate electrodes in very small transistors. However, creating very small transistors that can control electron movement within a few nanometers has been challenging. The size of semiconductor devices depends on the width and efficiency of the gate electrode. Current manufacturing processes can't make gate lengths below a few nanometers due to limitations in lithography. To address this, the team used the mirror twin boundary (MTB) of molybdenum disulfide, which is a 1D metal only 0.4 nm wide, as a gate electrode. The IBS team achieved the 1D MTB metallic phase by altering the crystal structure of a 2D semiconductor at the atomic level.

The International Roadmap for Devices and Systems (IRDS) predicts semiconductor technology to reach about 0.5 nm by 2037, with transistor gate lengths of 12 nm. The research team's transistor demonstrated a channel width as small as 3.9 nm, surpassing this prediction. The 1D MTB-based transistor also offers advantages in circuit performance. Unlike some current technologies (FinFETs or GAA) that face issues with parasitic capacitance in highly integrated circuits, this new transistor can minimize such problems due to its simple structure and narrow gate width.

Researchers from the University of California, San Diego, have unveiled a significant security vulnerability affecting Intel Raptor Lake and Alder Lake processors. The newly discovered flaw, dubbed "Indirector," exposes weaknesses in the Indirect Branch Predictor (IBP) and Branch Target Buffer (BTB), potentially allowing attackers to execute precise Branch Target Injection (BTI) attacks. The published study provides a detailed look into the intricate structures of the IBP and BTB within recent Intel processors, showcasing Spectre-style attach. For the first time, researchers have mapped out the size, structure, and precise functions governing index and tag hashing in these critical components. Particularly concerning is the discovery of previously unknown gaps in Intel's hardware defenses, including IBPB, IBRS, and STIBP. These findings suggest that even the latest security measures may be insufficient to protect against sophisticated attacks.

The research team developed a tool called "iBranch Locator," which can efficiently identify and manipulate specific branches within the IBP. This tool enables highly precise BTI attacks, potentially compromising security across various scenarios, including cross-process and cross-privilege environments. One of the most alarming implications of this vulnerability is its ability to bypass Address Space Layout Randomization (ASLR), a crucial security feature in modern operating systems. By exploiting the IBP and BTB, attackers could potentially break ASLR protections, exposing systems to a wide range of security threats. Experts recommend several mitigation strategies, including more aggressive use of Intel's IBPB (Indirect Branch Prediction Barrier) feature. However, the performance impact of this solution—up to 50% in some cases—makes it impractical for frequent domain transitions, such as those in browsers and sandboxes. In a statement for Tom's Hardware, Intel noted the following: "Intel reviewed the report submitted by academic researchers and determined previous mitigation guidance provided for issues such as IBRS, eIBRS and BHI are effective against this new research and no new mitigations or guidance is required."

According to Jon Peddie Research latest report, the global GPU and CPU markets ended Q1 2024 on growth. GPU shipments reached 70 million units, while PC CPU shipments increased by 33% year-over-year, the second consecutive yearly increase in over two decades. Over the next five years, discrete GPUs are projected to achieve 22% penetration in the PC market as the overall GPU installed approaches 3 billion units by 2026. Among major GPU vendors, AMD's market share dipped 0.7% from last quarter, while Intel gained 0.3% and Nvidia rose 0.4%. However, overall GPU shipments declined 9.9% quarter-over-quarter. The total GPU attach rate for PCs was 113%, slightly down from the prior quarter. Desktop graphics add-in board shipments also decreased 14.8%.

While Q1 is typically flat or down versus Q4, Jon Peddie Research's president suggests this quarter's performance could signal a return to normal seasonality. With Microsoft, AMD and Intel promoting AI PCs, and forecasts pointing to growth in Q2, there are optimistic signs - although semiconductor suppliers are guiding 7.9% down on average for next quarter.

AMD has reached a significant milestone, capturing a record-high share of the X86 CPU market in the first quarter of 2024, according to the latest report from Mercury Research. This achievement marks a significant step forward for the chipmaker in its long battle against rival Intel's dominance in the crucial computer processor space. The surge was fueled by strong demand for AMD's Ryzen and EPYC processors across consumer and enterprise markets. The Ryzen lineup's compelling price-to-performance ratio has struck a chord with gamers, content creators, and businesses seeking cost-effective computing power without sacrificing capabilities. It secured AMD's 23.9% share, an increase from the previous Q4 of 2023, which has seen a 19.8% market share.

The company has also made major inroads on the data center front with its EPYC server CPUs. AMD's ability to supply capable yet affordable processors has enabled cloud providers and enterprises to scale operations on AMD's platform. Several leading tech giants have embraced EPYC, contributing to AMD's surging server market footprint. Now, it is at 23.6%, a significant increase over the past few years, whereas AMD was just above 10% four years ago in 2020. AMD lost some share to Intel on the mobile PC front due to the Meteor Lake ramp, but it managed to gain a small percentage of the market share of client PCs. As AMD rides the momentum into the second half of 2024, all eyes will be on whether the chipmaker can sustain this trajectory and potentially claim an even larger slice of the x86 CPU pie from Intel in the coming quarters.Below, you can see additional graphs of mobile PC and client PC market share.

Global PC shipments grew around 3% YoY in Q1 2024 after eight consecutive quarters of declines due to demand slowdown and inventory correction, according to the latest data from Counterpoint Research. The shipment growth in Q1 2024 came on a relatively low base in Q1 2023. The coming quarters of 2024 will see sequential shipment growth, resulting in 3% YoY growth for the full year, largely driven by AI PC momentum, shipment recovery across different sectors, and a fresh replacement cycle.

Lenovo's PC shipments were up 8% in Q1 2024 off an easy comparison from last year. The brand managed to reclaim its 24% share in the market, compared to 23% in Q1 2023. HP and Dell, with market shares of 21% and 16% respectively, remained flattish, waiting for North America to drive shipment growth in the coming quarters. Apple's shipment performance was also resilient, with the 2% growth mainly supported by M3 base models.

While we are all used to having a system with a CPU, GPU, and, recently, NPU—X-Silicon Inc. (XSi), a startup founded by former Silicon Valley veterans—has unveiled an interesting RISC-V processor that can simultaneously handle CPU, GPU, and NPU workloads in a chip. This innovative chip architecture, which will be open-source, aims to provide a flexible and efficient solution for a wide range of applications, including artificial intelligence, virtual reality, automotive systems, and IoT devices. The new microprocessor combines a RISC-V CPU core with vector capabilities and GPU acceleration into a single chip, creating a versatile all-in-one processor. By integrating the functionality of a CPU and GPU into a single core, X-Silicon's design offers several advantages over traditional architectures. The chip utilizes the open-source RISC-V instruction set architecture (ISA) for both CPU and GPU operations, running a single instruction stream. This approach promises lower memory footprint execution and improved efficiency, as there is no need to copy data between separate CPU and GPU memory spaces.

Called the C-GPU architecture, X-Silicon uses RISC-V Vector Core, which has 16 32-bit FPUs and a Scaler ALU for processing regular integers as well as floating point instructions. A unified instruction decoder feeds the cores, which are connected to a thread scheduler, texture unit, rasterizer, clipping engine, neural engine, and pixel processors. All is fed into a frame buffer, which feeds the video engine for video output. The setup of the cores allows the users to program each core individually for HPC, AI, video, or graphics workloads. Without software, there is no usable chip, which prompts X-Silicon to work on OpenGL ES, Vulkan, Mesa, and OpenCL APIs. Additionally, the company plans to release a hardware abstraction layer (HAL) for direct chip programming. According to Jon Peddie Research (JPR), the industry has been seeking an open-standard GPU that is flexible and scalable enough to support various markets. X-Silicon's CPU/GPU hybrid chip aims to address this need by providing manufacturers with a single, open-chip design that can handle any desired workload. The XSi gave no timeline, but it has plans to distribute the IP to OEMs and hyperscalers, so the first silicon is still away.

NVIDIA's freshly unveiled "Blackwell" B200 and GB200 AI GPUs will be getting plenty of coverage this year, but many organizations will be sticking with current or prior generation hardware. Team Green is in the process of shipping out compromised "Hopper" designs to customers in China, but the region's appetite for powerful AI-crunching hardware is growing. Last year's China-specific H800 design, and the older "Ampere" A800 chip were deemed too potent—new regulations prevented further sales. Recently, AMD's Instinct MI309 AI accelerator was considered "too powerful to gain unconditional approval from the US Department of Commerce." Natively-developed solutions are catching up with Western designs, but some institutions are not prepared to queue up for emerging technologies.

NVIDIA's new H20 AI GPU as well as Ada Lovelace-based L20 PCIe and L2 PCIe models are weakened enough to get a thumbs up from trade regulators, but likely not compelling enough for discerning clients. The Telegraph believes that NVIDIA's uncompromised H100 AI GPU is currently in use at several Chinese establishments—the report cites information presented within four academic papers published on ArXiv, an open access science website. The Telegraph's news piece highlights one of the studies—it was: "co-authored by a researcher at 4paradigm, an AI company that was last year placed on an export control list by the US Commerce Department for attempting to acquire US technology to support China's military." Additionally, the Chinese Academy of Sciences appears to have conducted several AI-accelerated experiments, involving the solving of complex mathematical and logical problems. The article suggests that this research organization has acquired a very small batch of NVIDIA H100 GPUs (up to eight units). A "thriving black market" for high-end NVIDIA processors has emerged in the region—last Autumn, the Center for a New American Security (CNAS) published an in-depth article about ongoing smuggling activities.

Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America's first fan-out wafer-level packaging (FOWLP) research and development center.

The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing.

Extropic, a pioneer in physics-based computing, this week emerged from stealth mode and announced the release of its Litepaper, which outlines the company's revolutionary approach to AI acceleration through thermodynamic computing. Founded in 2022 by Guillaume Verdon, Extropic has been developing novel chips and algorithms that leverage the natural properties of out-of-equilibrium thermodynamic systems to perform probabilistic computations for generative AI applications in a highly efficient manner. The Litepaper delves into Extropic's groundbreaking computational paradigm, which aims to address the limitations of current digital hardware in handling the complex probability distributions required for generative AI.

Today's algorithms spend around 25% of their time moving numbers around in memory, limiting the speedup achievable by accelerating specific operations. In contrast, Extropic's chips natively accelerate a broad class of probabilistic algorithms by running them physically as a rapid and energy-efficient, physics-based process in their entirety, unlocking a new regime of AI acceleration well beyond what was previously thought achievable. In coming out of stealth, the company has announced the fabrication of a superconducting prototype processor and developments surrounding room-temperature semiconductor-based devices for the broader market, with the goal of revolutionizing the field of AI acceleration and enabling new possibilities in generative AI.

The HPC research projects DEEP-SEA, IO-SEA and RED-SEA are wrapping up this month after a three-year project term. The three projects worked together to develop key technologies for European Exascale supercomputers, based on the Modular Supercomputing Architecture (MSA), a blueprint architecture for highly efficient and scalable heterogeneous Exascale HPC systems. To achieve this, the three projects collaborated on system software and programming environments, data management and storage, as well as interconnects adapted to this architecture. The results of their joint work will be presented at a co-design workshop and poster session at the EuroHPC Summit (Antwerp, 18-21 March, www.eurohpcsummit.eu).

Lee Kang-Wook, Vice President of Research and Development at SK Hynix, has discussed the increased importance of advanced chip packaging with Bloomberg News. In an interview with the media company's business section, Lee referred to a tradition of prioritizing the design and fabrication of chips: "the first 50 years of the semiconductor industry has been about the front-end." He believes that the latter half of production processes will take precedence in the future: "...but the next 50 years is going to be all about the back-end." He outlined a "more than $1 billion" investment into South Korean facilities—his department is hoping to "improve the final steps" of chip manufacturing.

SK Hynix's Head of Packaging Development pioneered a novel method of packaging the third generation of high bandwidth technology (HBM2E)—that innovation secured NVIDIA as a high-profile and long term customer. Demand for Team Green's AI GPUs has boosted the significance of HBM technologies—Micron and Samsung are attempting to play catch up with new designs. South Korea's leading memory supplier is hoping to stay ahead in the next-gen HBM contest—supposedly 12-layer fifth generation samples have been submitted to NVIDIA for approval. SK Hynix's Vice President recently revealed that HBM production volumes for 2024 have sold out—currently company leadership is considering the next steps for market dominance in 2025. The majority of the firm's newly announced $1 billion budget will be spent on the advancement of MR-MUF and TSV technologies, according to their R&D chief.

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Cyberattacks are an existential risk, with 89% of organizations ranking ransomware as one of the top five threats to their viability, according to a November 2023 report from TechTarget's Enterprise Strategy Group, a leading analyst firm. And this is just one of many risks to corporate data—insider threats, data exfiltration, hardware failures, and natural disasters also pose significant danger. Moreover, as the just-released 2024 IBM X-Force Threat Intelligence Index states, as the generative AI market becomes more established, it could trigger the maturity of AI as an attack surface, mobilizing even further investment in new tools from cybercriminals. The report notes that enterprises should also recognize that their existing underlying infrastructure is a gateway to their AI models that doesn't require novel tactics from attackers to target.

To help clients counter these threats with earlier and more accurate detection, we're announcing new AI-enhanced versions of the IBM FlashCore Module technology available inside new IBM Storage FlashSystem products and a new version of IBM Storage Defender software to help organizations improve their ability to detect and respond to ransomware and other cyberattacks that threaten their data. The newly available fourth generation of FlashCore Module (FCM) technology enables artificial intelligence capabilities within the IBM Storage FlashSystem family. FCM works with Storage Defender to provide end-to-end data resilience across primary and secondary workloads with AI-powered sensors designed for earlier notification of cyber threats to help enterprises recover faster.