A die-shot of AMD's 4 nm "Phoenix 2" monolithic APU emerged over the weekend—possibly the first example of a Team Red hybrid core processor, utilizing a combination of bog standard Zen 4 cores as well as "compacted" Zen 4c units. Phoenix 2 has been hiding in plain sight it seems, within Ryzen Z1 series APUs—that have much in common with mobile/laptop-oriented 7040U products. David Huang has posted an analysis of a Ryzen Z1 APU via his review as posted on Zhuanlan, where he investigates the intriguing combination of Zen 4 and Zen 4c cores.

As interpreted/translated by Tom's Hardware: "HWiNFO, a system information, monitoring, and diagnostics utility, confirms that the Ryzen Z1, codenamed Phoenix 2, is on the PHX2-A0 stepping. It differs from AMD's Ryzen 7040U series (Phoenix) with the PHX-A1 stepping. The Ryzen Z1 has been rumored to be a clone of the Ryzen 5 7540U for a long time now." Laptops housing the latter APU are reported to have reached retail markets in certain territories, while the Ryzen Z1 (non-Extreme) SoC has not debuted in any new devices. A cheaper ASUS ROG Ally is expected to arrive in the near future with the lesser chip.

As a part of its promotional deal with Bethesda for the upcoming Starfield game, AMD has announced a limited edition release of both its Radeon RX 7900 XTX graphics card and its Ryzen 7 7800X3D CPU. The latter is in all fairness a bit dull as far as limited editions go, as the only thing really limited is the packaging the CPU comes in. Despite being a limited production run of only 500 units, AMD didn't bother adding any extra marking on the CPU itself, making it less of a collectors edition than it could've been.

On the other hand, the Radeon RX 7900 XTX Starfield Special Edition gets a custom white shroud with a lot of little quirky bits of text on the card and an overall different feel to it compared to AMD's reference design cards. Again, we're looking at a limited run of 500 cards here too and it's not clear if these will be numbered or not. Neither product will be available to buy though, so the only way to get your hands on one or the other, is to enter one of multiple giveaways that either AMD or its partners will host in the near future. There's a video after the break with more details.

SolidRun has announced the world's first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun's Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.

ASUS Republic of Gamers (ROG) today announced the new ROG Strix SCAR 17 X3D, the perfect fusion of cutting-edge silicon and ROG engineering. Featuring the AMD Ryzen 9 7945HX3D mobile processor equipped with AMD 3D V-Cache technology for the very first time, the Strix SCAR 17 X3D takes performance to a whole new level. By doubling the L3 cache of the mighty Ryzen 9 7945HX processor, the Ryzen 9 7945HX3D gives users a boost in games that are hungry for this onboard ultrafast memory. Paired with a 240 Hz QHD display, Conductonaut Extreme liquid metal on the GPU, and a vapor chamber, the Strix SCAR 17 X3D is ready to dominate the leaderboards.

Making great processors even better
While the original 2023 ROG Strix SCAR 17 came equipped with AMD Ryzen 7000 Series processors, the AMD Ryzen 9 7945HX3D is truly in a league of its own. It leverages the power of AMD 3D V-Cache technology, a stacking of extra ultra-high-speed L3 cache vertically on top of one of the two core compute dies (CCD). This extra cache enables the eight cores to perform certain calculations quickly and efficiently, notably in gaming. For situations where increasing CPU frequency simply doesn't show significant performance gains, 3D V-Cache technology holds the potential to unlock extra compute power.

AYANEO, an Asian manufacturer known for its mobile handhelds, has introduced a new device, the AYANEO Kun. The Kun is powered by the latest AMD Ryzen 7 7840U mobile processor from the Ryzen 7040 series. This SoC includes eight Zen 4 cores and an integrated graphics unit based on the RDNA 3 architecture with 12 compute units. The console's dimensions stand at 312 x 133 x 21.9 mm, making it slightly wider but slimmer than ASUS's ROG Ally, with the exact weight yet to be disclosed. Kun's battery capacity is rated for 75Wh, as compared to other handhelds' 40 Wh, potentially indicating a longer battery life.

The AYANEO Kun's other notable features include its 8.4-inch display with an IPS panel and resolution of 1,920 x 1,200 pixels. For controls, the device utilizes a D-Pad and two Hall sensor-equipped joysticks for gaming. The shoulder buttons also employ Hall sensor technology. There are touchpads on either side of the display, along with other function keys and the A/B/X/Y keys. For the first time, AYANEO has integrated buttons at the back of the device, offering customizable functions. The device provides two Type-C (likely USB4), one USB Type-A, and one 3.5 mm jack connection. More comprehensive technical details, model variants, and pricing information are to be released during the official unveiling of the AYANEO Kun scheduled for August.

Today, Lenovo unveiled the newest additions to its ThinkPad mobile workstation portfolio. Powered by the latest AMD Ryzen PRO 7040 Series Mobile processors with optional NVIDIA RTX professional graphics, the new ThinkPad P16v, P16s Gen 2 and P14s Gen 4 complement the models announced in May 2023, offering customers a broad choice in mobile workstation PC solutions. ThinkPad P Series devices deliver breakthrough performance, premium design, and durability for demanding workflows across a variety of price points and include support for Windows 11 and several flavors of Linux. Bringing advanced and power-efficient processors with AMD PRO technologies and Ryzen AI on select models opens up an enhanced world of AI-driven features for advanced collaboration on ThinkPad mobile workstations.

"Our latest workstations are designed to help our customers make a difference and drive a positive long-lasting impact in their fields, whether it's research and design, engineering and finance, media and entertainment, healthcare and education, or anything else. We are committed to delivering human-centric innovations that empower our customers to unleash their potential with ThinkPad mobile workstations," said Rob Herman, VP and GM, Worldwide Workstation and Client AI Business at Lenovo.

US Computer component retailer Micro Center has announced that the store has struck an exclusive deal with AMD to be the sole retailer for the Ryzen 5 5600X3D processor. The CPU is apparently a limited edition release, although it's not clear how limited it'll be in terms of available quantities. The new CPU will launch on the 7th of July and has a base clock of 3.3 GHz and a boost clock of 4.4 GHz, each 100 MHz slower than the Ryzen 7 5800X3D. The CPU obviously has six CPU cores, which results in a total cache of 99 MB due to the missing two cores.

The TDP remains at 105 W and it appears that the Ryzen 5 5600X3D might just consist of failed Ryzen 7 5800X3D chips sold with two cores disabled. From what TPU understands, there should be some OEM availability of the Ryzen 5 5600X3D as well, based on what our sources have told us, but we don't have any details on which system integrators might be offering the CPU. Micro Center will be charging US$229.99, which is US$220 less than what the Ryzen 7 5800X3D launched at, although Micro Center is currently selling it at US$279.99. The Ryzen 5 5600X3D will also be offered at a discounted price when bought with eligible motherboard and memory bundles from Micro Center.

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

ASUS today announced the refreshed Vivobook 16 OLED (M1605), a slim-and-light laptop featuring up to an AI-enabled AMD Ryzen 7000 H-Series processor, and expertly engineered for everyday entertainment and productivity. Perfect performance is delivered by up to an AMD Ryzen 7000 H-Series processor with 16 GB RAM and up to a 1 TB SSD. Quiet and efficient cooling is provided by the dual-vented cooling system with two heat pipes and an IceBlade fan. The long-lasting up to 70 Wh battery gives users more freedom, and there's up to WiFi 6E for ultrafast connectivity.

This latest model features a superb OLED NanoEdge Pantone Validated display with 3.2K resolution, a 120 Hz refresh rate and a 0.2 millisecond response time - plus an 16:10 aspect ratio display for an extended view. The NanoEdge OLED displays offer up to a 1.000,000:1 contrast ratio with a screen-to-body ratio of up to 86.5%. It also benefits from TÜV Rheinland low blue-light certification to ensure eye comfort during long viewing sessions. The eye-catching slim and lightweight design is finished in a selection of on-trend colors. The 180° lay-flat hinge allows easy collaboration and sharing, and the comprehensive I/O capabilities include up to a USB-C 3.2 Gen 1 port with Power Delivery, two USB 3.2 Gen 1 Type-A ports, a USB 2.0 port, an HDMI output, and an audio combo jack.

Acer today announced the refreshed Acer Swift Edge 16 (SFE16-43) laptop, designed for dynamic professionals requiring high computing capability, productivity, and portability from their hardware. The lightweight laptop is powered by AMD Ryzen 7040 Series processors and up to AMD Radeon 780M graphics for next-gen performance and visuals, and features AMD Ryzen AI on select models with select processors, enabling the device to keep up with today's AI demands and more.

The Swift Edge 16 showcases a stunning 16-inch 3.2K OLED display with an upgraded refresh rate of 120 Hz and support for 100% DCI-P3 color gamut to provide true-to-life colors and images. The Windows 11 laptop also boasts compatibility with up to Wi-Fi 7, Microsoft Pluton, and a range of smart features so users can stay connected to fast wireless connections and have private data secured.

ASUS today announced the all-new 14-inch, 16:10 Chromebook CM34 Flip, delivering an exquisite blend of powerful performance and versatility to empower both work and study. This stylish laptop features up to an AMD Ryzen 5 7520C processor, and WiFi 6 and a long-lasting battery, so it's well-equipped to breeze through everyday tasks anywhere.

The versatile 360° ErgoLift hinge means Chromebook CM34 Flip has the flexibility to function in a diverse array of modes, while the optional garaged stylus enables intuitive input to jot down notes or capture ideas. To top it all off, military-grade durability, one-touch fingerprint unlock and a physical webcam shutter for instant privacy offer peace of mind—at home, in the office or classroom, or exploring the world.

AMD's cheapest Zen 4 X3D processor is shaping up to be its most popular. Sales numbers from Germany's Mindfactory posted by TechEpiphany seemingly shows the recently launched Ryzen 7 7800X3D outselling last year's Ryzen 7 5800X3D nearly 2:1, with 4,720 7800X3Ds selling to the 5800X3D's 2,510 over a few week period. While these figures show sales for only a single region, evidence for this momentum is reflected in other regional retailers as well as some global outlets. On Amazon, for example, the 7800X3D has made a frequent appearance on the top 10 best selling CPUs list, with the rest of the Zen 4 lineup trailing well behind. Newegg reports the 7800X3D to be among the top 5 best selling CPUs on the site at time of writing. Microcenter also shows the 7800X3D and 5800X3D side-by-side in seventh and eighth places respectively for popularity.

Despite recent troubles with the AM5 platform and Zen 4 X3D processors, the Ryzen 7 7800X3D is proving to be quite a success for AMD. The 7800X3D in our review was shown to be one of the most efficient processors we've ever tested, and offered gaming performance at or near the top of the charts across the gauntlet of games and resolutions thrown at it. The staggered release of the 7000X3D lineup, with the 7950X3D and 7900X3D launching first and the 7800X3D launching later, gave early signals that AMD knew what they had and wanted to push as many early adopters away from the better value chip as they could. Pricing for the Ryzen 7 7800X3D has been steady since it released, however we've already seen retailers offering discounts on the Ryzen 9 7950X3D and Ryzen 9 7900X3D, as they presumably struggle to sell as well as the more aggressively positioned 7800X3D.

According to investigations undertaken by Igor's Lab and Hardware Busters this week it seems that AMD's problematic lineup of Ryzen 7000 & Ryzen 7000X3D CPUs are consuming unexpected levels of power in short bursts when running in idle mode. In conducting more in-depth tests over the past few days, Igor Wallossek and (outgoing TPU PSU expert) Aristeidis Bitziopoulos have both found that that the aforementioned AMD processors are producing (to the testers' slight concern) power spikes in situations involving minimal computing activity. It is not currently known whether the sharp climbs in power consumption are in any way related to the burnout issues experienced by unlucky overclockers this week.

Aris/crmaris (at Hardware Busters) says that he has tested many of the affected processors in the past, but was not privy to any major problems relating to burnout or power consumption spikes. By running new tests this week, using his own Powenetics v2 board, Aris has found out that: "There are some interesting facts here, which I didn't pay much attention to during the reviews because I only look at the average values and not the peak ones in idle. In the 7950X3D, there is a high spike during idle at 130 W, which is unjustified because the peak CPU load is only 3.53%. Even with the Curve Optimized enabled and a -15 setting, the idle power spike is close to 125 W, so something is happening there. On the 7800X3D, the spike during idle stays low, but this is not the case for the 7900X, which has an idle power spike at 109 W, while the peak CPU load at idle was at 5.12%, so these 109 W are not justified, either."

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

AMD has today released another statement to the press, following on from controversy surrounding faulty Ryzen 7000X3D series processors - unlucky users are reporting hardware burnouts resulting from voltage-assisted overclocking. TPU has provided coverage of this matter this week, and made light of AMD's first statement yesterday. AMD ensures customers that it has fully informed ODM partners (motherboard manufacturers) about up-to-date and correct voltages for the Ryzen processor family - yet user feedback (via online hardware discussions) suggests that standard Ryzen 7000 models are also being affected by the burnout issue - this side topic has not been addressed by AMD (at the time of writing). This second statement repeats the previous one's recommendation that affected users should absolutely make contact with AMD Support personnel:

AMD Statement"We have root caused the issue and have already distributed a new AGESA that puts measures in place on certain power rails on AM5 motherboards to prevent the CPU from operating beyond its specification limits, including a cap on SOC voltage at 1.3 V. None of these changes affect the ability of our Ryzen 7000 Series processors to overclock memory using EXPO or XMP kits or boost performance using PBO technology. We expect all of our ODM partners to release new BIOS for their AM5 boards over the next few days. We recommend all users to check their motherboard manufacturers website and update their BIOS to ensure their system has the most up to date software for their processor.

Anyone whose CPU may have been impacted by this issue should contact AMD customer support. Our customer service team is aware of the situation and prioritizing these cases."

ASUS has released an official statement regarding the recently discovered issues with AMD Ryzen 7000 series CPUs, especially the Ryzen 7000X3D series. ASUS has also released EFI updates on Friday, that include thermal monitoring mechanism to protect motherboards and CPUs and is working on new updates that should be available soon and define new rules for AMD Expo and SoC voltage, which appear to be the main issue related to the CPU VDDIO/MC voltages.

We have already covered the first reports of damaged Ryzen 7000X3D series CPUs that suffered physical damage, and some motherboard manufacturers have already released new BIOS updates, including MSI. In the meantime, Roman "Der8auer" Hartung has also discovered that the issue might not be just limited to the Ryzen 7000X3D series, but could also impact the Ryzen 7000 X-series CPUs. Although there were no earlier reports on such issues, AMD Expo appears to be the main source of the problem and users can either disable it or manually set the SoC voltage, at least until motherboard makers come up with new BIOS updates or we hear an official statement from AMD.

An intriguing entry has appeared on the Geekbench Browser site, the information was uploaded with a timestamp from this morning (11:07 am on April 20 to be specific) pointing to a mobile ASUS device that was tested in GeekBench 5. The archived info dump reveals that the subject matter of the benchmark was the ASUS ROG Ally handheld gaming console, which has received a lot of attention in recent weeks - with it being touted as a very serious alternative to Valve's Steam Deck, a handheld gaming PC that is quite popular with enthusiasts. The ROG Ally will need to offer a potent hardware package if it stands to compete directly with the Steam Deck, and the latest information confirms that this new contender is very promising in that department. Geekbench 5 awarded an impressive OpenCL score of 35498 to the RC71L variant of the ROG Ally, an RC71X-assigned model is known to exist but details of its exact nature have not been revealed. This particular ROG Alloy unit was running Windows 11 Home (64-bit) under the operating system's performance power plan.

The new entry on Geekbench Browser shows that the Ally is packing an AMD Ryzen Z1 Extreme APU, which appears to be a customized version of the Ryzen 7 7840U APU mobile platform chipset - previous rumors have indicated that the latter would be in the driving seat. Both Phoenix range SoCs share the basic 8 cores and 16 thread makeup, but the Z1 Extreme is capable of boosting up to 5.062 GHz from a base frequency of 3.30 GHz. AMD's Radeon 780M iGPU (RDNA 3) is expected to deal with the Ally's graphical aspect, but the benchmark info dump only provides scant details about the GPU (codenamed "gfx1103") - most notably the presence of six computer units, an 800 MHz max frequency, and access to 8.20 GB of video memory. Number crunching boffins have calculated that the Ally could field 768 FP32 cores, courtesy of the dual issue SIMD design inherent to RDNA 3.

Gaming doesn't have to be enjoyed only on a high-end gaming PC. Announced today, Lenovo LOQ—pronounced "lock"—lets new gamers set out on the first steps of their gaming journeys, allowing them to explore new virtual worlds and connect with new real-world communities with gaming devices that are packed with features without breaking the bank. Offering plenty of choice, the brand-new lineup of Lenovo LOQ gaming laptops include the Intel-based Lenovo LOQ 16IRH8 and Lenovo LOQ 15IRH8 laptops as well as the Lenovo LOQ Tower 17IRB8 desktop PC, and the AMD-based Lenovo LOQ 16APH8 and Lenovo LOQ 15APH8 laptops. Inspired by Lenovo's premium Legion-branded gaming line-up, the new Lenovo LOQ line encompasses more than just design features such as the rear I/O notch on its laptops and the shared stylized 'O' in both brands' logos. The two sub-brands are complementary in catering to a wider gaming community, including beginner gamers setting off on their gaming paths to greatness with Lenovo LOQ as well as those leveling up to Lenovo Legion devices to compete against more advanced opponents.

"With the launch of the new Lenovo LOQ brand, we're building a lineage of gaming excellence and PC offerings that are not just for the gaming community's top players, but for new and future gamers alike," said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "Lenovo LOQ breaks down barriers to entry for gamers, empowering them to embark on adventures of connection and fun in the gaming world."

Those that are waiting for the Ryzen 7 7800X3D are in luck as the April 6th launch is just around the corner, and although we knew that the US launch price is set at $449, AMD did not give out any details about the price in Europe. Thankfully, first listings have started to appear, showing it in some stores at €530. Earlier, Computerbase gave an estimated price of around €509, considering that other two SKUs, the Ryzen 9 7950X3D and the Ryzen 9 7900X3D, both are 13 percent more expensive in Europe.

As spotted earlier by Videocardz, the Ryzen 7 7800X3D has appeared in Slovenia, listed at €530, which is pretty close to the estimated price. Another listing from Germany shows it listed at €607, which is a bit more expensive. This comes as a surprise considering that the tax in Slovenia is 22 percent, while in Germany it is set at 19 percent. Of course, some stores will try to add the early adopters tax as well, raising the price well above the MSRP, as the Ryzen 7 7800X3D could be quite popular.

A new benchmark of the AMD Radeon 780M RDNA3-based iGPU has now been spotted in Geekbench, showing it to be on par with the NVIDIA GeForce GTX 1650. The benchmark was done on the announced AMD Ryzen 7 7840HS CPU, which is a part of AMD's 4 nm Ryzen 7040 "Phoenix" lineup. The CPU in question is an 8-core/16-thread SKU with 40 MB of cache. It works at 3.8 GHz base and 5.1 GHz boost clocks and has a TDP of 35 W to 45 W. The same CPU comes with Radeon 780M RDNA3 iGPU with 12 Compute Units (CUs), for a total of 768 Stream Processors, and works at 2700 MHz.

The Geekbench OpenCL benchmark was fired up on a Chinese laptop with 32 GB of RAM and running on the Windows balanced power plan, where it scored a decent 36,757 points. This score puts it somewhere around the NVIDIA GeForce GTX 1650 and AMD Radeon RX 480 discrete graphics cards. This is an impressive result considering that this is a mid-SKU in the announced Ryzen 7040 series. Of course, we still do not know the specified TDP for this laptop, or what memory was used, so results might be slightly different. Since these laptops are yet to appear in retail, AMD is probably still tweaking the drivers, so we expect these numbers could be even higher for the full release.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.