What you're looking at below is one of the first "Thin mini-ITX" motherboards sold in the retail channel. The GA-MSH61DI is designed for extremely compact mini-ITX cases, that are thinner than the rear panel of ATX/ITX form-factors, and all-in-one PCs. The board draws power from an external power brick through a 12V DC input jack, the board then gives out SATA and Molex power via cables. It seats socket LGA1155 "Sandy Bridge" Intel Core i3/i5/i7 processors with a maximum TDP of 95W.

The CPU socket is powered by a 3-phase VRM. The processor is backed by Intel H61 Express chipset. It is wired to two angled DDR3 SO-DIMM slots that can hold up to 8 GB of dual-channel DDR3-1333 MHz memory. There are no perpendicular expansion slots, but there's one mSATA slot that can hold an SSD, an mPCIe that can hold a wireless networking card, and an LVDS (low-voltage differential signaling) slot that can be used for devices such as VGA connections to LCD panels. The H61 chipset gives out two SATA 3 Gb/s ports apart from the mSATA slot.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today debuts the palm-sized ZBOX nano AD10 series mini-PCs. The new ZOTAC ZBOX nano AD10 series shrinks the standard ZBOX form factor and adds more home theatre PC friendly features for your digital media needs.

Powered by the AMD "Brazos" E-350 APU Platform with Discrete-Class AMD Radeon HD 6310 graphics, the ZOTAC ZBOX nano AD10 series packs plenty of performance with hardware video decode acceleration technologies for popular high-definition video formats, including Blu-ray and Adobe Flash, into a miniature 127mm x 127mm x 45mm form factor that fits in the palm of your hand.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class* four gigabit (Gb) DDR3 DRAM chips.

"With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers," he added.

ASUS displayed its new mini-ITX motherboard for IPC (industrial PC) market, the D27NM10-I IPC. As an IPC-ready board, it is designed for rugged industrial environments that have minimal cooling and require high uptime. The D27NM10-I IPC uses next-generation 32 nm Intel Atom "Cedar View" D2700 dual-core processor clocked at 2.13 GHz, featuring HyperTreading to yield 4 logical CPUs for the OS to deal with. The processor is wired to two DDR3 SO-DIMM slots supporting single-channel DDR3 memory. Intel NM10 is the chipset employed, it's also found on previous-generation Pine Trail platform.

A large heatsink covers both the processor and chipset, there are three 4-pin PWM fan headers on board in case a fan has to be latched on to it. The board draws power from an external DC power source over standard 2-pin DC input connector. It can also be powered by any switching power supply with a 4-pin Molex power connector. Storage connectivity includes two SATA 3 Gb/s ports. The only expansion here is an open-ended PCI-E x1, and a mini-PCI-E. There's plenty of serial connectivity, including two serial DE-9 ports on the read panel, and 3 via headers. Other connectivity includes 2-channel HD audio, dual gigabit Ethernet, display outputs that include DVI and D-Sub, and a number of USB 2.0 ports. The board uses UEFI with graphical EZ-Mode setup program.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

Team Group Inc. is going to release the new Team Mac SO-DIMM memory module at 2011 Computex Taipei. In order to provide enthusiasts with more diverse products, the Team Module series, which have garnered unbeatable public praise because of its excellent performance, will release for the first time the Team Mac memory module custom-made for Apple Mac notebook computers, developing a more professional and complete product line. Team Group Inc. employed its many years of accumulated technology research and development experience to break the space limits of notebook computers, using an extremely thin heat-sink design on the SO-DIMM modules that perfectly combines beautiful appearance with excellent performance. The feather lightweight Team Mac SO-DIMM memory module is the nova star of 2011 that will attract much attention.

Not only is the Team Mac SO-DIMM completely compatible with the Mac operating system, it has also passed Mac verifications, completely solving the troublesome compatibility problems for Mac users. Team Mac inherited Team Group's standard persistence for quality, and uses memory particles rigorously selected and tested by Team Group to guarantee optimal and excellent operating performances. In addition, Team Group provides both single channel and dual channels for the Team Mac memory modules, with capacities ranging from 2GB~8GB (4G*2 kit) to satisfy users' unlimited demand for upgrading.

The GS-AH6G3N embeds the new LGA1155 Intel platform for mobile products, with the most powerful and efficient processor and chipset for a reliable and durable business notebook. Designed for professional end users, our product includes all the most important features required by a utilization in a business environment. The GS-AH6G3N is therefore a very versatile business notebook, with the highest standard of performance and quality from GIGABYTE. It is nevertheless a stylish product, with an excellent design and ultra-thin profile, as well as a very light weight and a large power autonomy for the smoothest mobility. With its high value features, the GS-AH6G3N has everything to be the best work tool for your daily business life.

The GS-AH6G3N offers all the important features that e good business notebook should have. Probably the most critical feature, the GS-AH6G3N has a power autonomy of about 7 hours, which can be extended to 10 hours with a second battery docked in the swappable ODD bay (this bay can also dock a second HDD).

Kingston Technology Europe Ltd, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced the release of new Kingston HyperX 4GB and 8GB 1600MHz SO-DIMM kits. The dual-channel, plug and play CL9 memory kits are the fastest modules on the market specifically designed to support notebooks and mobile platforms using the new 2nd Generation Intel Core Mobile Processor Family, codenamed "Huron River".

"Our latest HyperX SO-DIMMs are the best way to boost the system performance of notebook PCs, as well as mini-ITX motherboards and mobile-based systems, by replacing standard memory with high-speed, higher capacity modules," said Mark Tekunoff, Senior Technology Manager, Kingston. "With the memory's simple plug and play feature, system performance is enhanced fast and effortlessly without the need of having to manually adjust the BIOS or load overclocking profiles."

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today unleashes the ZOTAC ZBOX AD02 series mini-PCs powered by the AMD E-350 APU platform. The ZOTAC ZBOX AD02 series delivers a premium computing experience with rich high-definition video playback capabilities and outstanding 3D visuals in a compact form factor.

The powerful AMD E-350 APU equips the ZOTAC ZBOX AD02 series with dual processor cores for lightning-fast system responsiveness and snappy multi-tasking abilities. Integrated AMD Radeon HD 6310 graphics enable compatibility with the latest Microsoft DirectX 11 titles for stunning 3D visuals on the ZOTAC ZBOX AD02 series.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today takes the award-winning ZBOX to SuperSpeed with the new ID41 series. The ZOTAC ZBOX ID41 series introduces SuperSpeed USB 3.0 and DDR3 technologies to the ZBOX mini-PC.

"External expansion is vital with mini-PCs. By adding SuperSpeed USB 3.0 technology to our award-winning ZBOX mini-PCs, we are able to offer external connectivity capable of speeds up to 5.0 Gb/s," said Carsten Berger, marketing director.

SAPPHIRE Technology, the world's largest manufacturer and supplier of graphics systems based on technology from AMD has just announced its first mainboard based on the exciting new APU (Accelerated Processing Unit) architecture from AMD. As a result of close collaboration with AMD, SAPPHIRE will introduce the SAPPHIRE Pure White Fusion E350M1W mainboard through its Global channel - heralding a new generation of low-power, fully featured PC solutions.

The SAPPHIRE Pure White Fusion E350M1W is a mini-ITX mainboard featuring the E350 (Zacate) APU from AMD. Zacate is the first generation of APU - a combination of CPU and GPU computing technologies onto a single die to improve the performance of both visual and data-intensive tasks. For the first time it combines high-performance serial computing and parallel graphics processing cores on a single chip. The SAPPHIRE Pure White Fusion E350M1W also uses the companion Hudson-M1 (A50M) Chip from AMD.

MSI, the global leading brand in motherboards, announced the launch of the upgraded version of IM-QM67 with the 2nd Generation Intel Core processor family (formerly codenamed "Sandy Bridge") to the Industrial Platform Computing (IPC) market segment. This motherboard supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products for the highest HD graphic quality.

MSI debuts the IM-QM67 based on the Intel Core i7 and Core i5 processors and the Intel QM67 Express chipset to provide the latest slim form factor for embedded applications. The IM-QM67 supports 6 kinds of display outputs, including LVDS, eDP, VGA, DVI, HDMI, and DP and it has great 3D graphics performance and support for up to 1080P high definition video. The IM-QM67 also features support for Intel Active Management Technology 7.0, Direct-X 10 shader model 4.0, and full hardware acceleration.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today supercharges energy-efficient computing with the new ZBOX Blu-ray AD03 series powered by the AMD E-350 APU platform. The ZOTAC ZBOX Blu-ray AD03 series combines discrete-class graphics processing with a dual processor cores for the perfect synergy of CPU and GPU that delivers a perfect digital media experience with unprecedented energy-efficiency.

AMD Radeon HD 6310 discrete-class graphics processing takes charge of all digital media processing tasks to enable the ZOTAC ZBOX Blu-ray AD03 series to deliver stunning Blu-ray and smooth streaming high-definition video playback. The ZOTAC ZBOX Blu-ray AD03 series is a potent casual gaming platform capable of rendering stunning 3D visuals with Microsoft DirectX 11 technology.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it has begun sample shipments of its newly developed 30nm process 4-gigabyte DDR3 SO-DIMM. The new memory module was built using currently available advanced 30nm process DRAM manufacturing technology and is composed of sixteen 2-gigabit DDR3 SDRAMs. It achieves a high density of 4 gigabytes.

Compared with Elpida's 40nm DRAM module, the new product uses 20% less operating current and 30% less standby current consumed by PC systems, and as a DRAM module it achieves one of the lowest levels of current consumption in the industry. The new eco-friendly DRAM product provide an effective power-saving response to today's need for a longer battery life for notebook PCs, netbooks, tablet PCs and other handheld electronic devices.

MSI, the global leading brand in motherboard, announces the latest mini-ITX motherboard, IM-PV-C, to IPC market. IM-PV-C is designed the latest Intel Atom processors N455/ N475/ D425/ D525 and the Intel ICH8M chipset which is an ideal low power and high performance solution for industrial applications.

MSI IM-PV-C comes to meet the requirements of a low power platform, especially in power input design. MSI IM-PV-C supports ATX and wide range DC 12V ~ 24V inputs as the different BOM option. For supporting high resolution video, MSI debuts IM-PV-C with great 3D graphics performance for a high definition up to 1080P videos.

In the view of the demand for an ultra mini size platform with fanless design strongly inquired from customers, MSI IPC announces the latest 3.5" small form factor, I3-945GSE-D, based on the Intel Atom N270 processor and the Intel 945GSE chipset which gives devices based on it enhanced graphics and power-saving capabilities.

MSI I3-945GSE-D is fanless and comes to meet the requirements of an ultra-low power platform, especially in power input design, MSI I3-945GSE-D support wide range DC 9V ~ 36V inputs, and it also supports for numerous display, includes VGA and LVDS.

Silicon Power, the world's leading manufacturer in flash memory and DRAM module, announced the launch of the pioneering DDR3 1600MHz standard memory module. With this brand-new product, general users can easily reach greater performance without overclocking it. Consistent and compatible with JEDEC standards and DDR3 systems, Silicon Power DDR3 1600MHz standard memory module is definitely perfect for increasing system efficiency.

Silicon Power DDR3 1600MHz standard memory module is consistent and compatible with JEDEC (Joint Electron Device Engineering Council) standards with 1600MHz clock rate, CL9 CAS latency, and 1.5V operating voltage. It adopts new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed rate. Meanwhile, Silicon Power insists on using original memory modules and FBGA packaging technology for excellent heat dissipation and accurate data transferring. Silicon Power single / dual / triple-channel memory kits are 100% tested to guarantee high performance of stability, durability and compatibility.

ZOTAC International, a leading innovator and the world's largest channel manufacturer, today introduces the new ZBOX HD-ID40 series - a new mini-PC powered by Intel Atom and NVIDIA Next-Generation ION technologies. The new ZBOX HD-ID40 packs full HD video playback capabilities, enhanced performance and greater expansion capabilities into a miniature form factor that can fit virtually anywhere.

An Intel Atom D525 dual-core processor with Intel Hyper Threading technology provides smooth multi-tasking capabilities for quick responsiveness with everyday applications and computing tasks with the ZOTAC ZBOX HD-ID40 series. Next-Generation NVIDIA ION graphics processing equips the ZOTAC ZBOX HD-ID40 series with rich multimedia capabilities for playback of Blu-ray movies and streaming high-definition content.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced it is currently manufacturing the world's first over-clocked 4GB SO-DIMM running at 1600 MHz. Super Talent Technology will now move forward with the shipment of 512M x64 (4GB) configurations of these new memory modules. While several manufactures are shipping DDR3 SO-DIMMs (small outline dual in-line memory modules), used in laptops and notebooks, supporting clock speeds of 1333 MHz, Super Talent's has moved beyond this limitation and produced a DDR3 SO-DIMM capable of over-clocking to an incredible 1600 MHz.

Ideal for today's extreme portable workstations and gaming machines, Super Talent's new 4GB SO-DIMM will enable these creative professionals to remove the memory bottleneck created by today's 1333MHz limitation. "As memory technology continues to move forward Super Talent will continue to push the limits of what is possible and deliver the fastest solutions available." - SuperTalent COO, CH Lee.

Transcend Information Inc., a worldwide leader in memory and storage products, today launched three new 4GB DDR3 DRAM modules using high-density 2-gigabit (2 Gbit) DDR3 chips: a DDR3-1333 MHz Long-DIMM, a DDR3-1333 MHz SO-DIMM, and a DDR3-1066 MHz SO-DIMM.

Transcend's 4GB 240-pin DDR3-1333 Long-DIMM for desktops runs at 1333 MHz with latencies of 9-9-9, while the 4GB DDR3-1333 SO-DIMM notebook memory module operates at 1333 MHz with latencies of 9-9-9, and the 4GB DDR3-1066 SO-DIMM runs at 1066 MHz with CL7 timings. Each module is optimized for stable 1.5V operation and is made with high density energy-efficient 2 Gbit chips, enabling conscientious users to take advantage of the best power-performance ratio available for their desktop or laptop computer.

Shuttle Inc., a leading developer and manufacturer of multi-form-factor solutions such as the world-famous XPC Mini-PC Barebones, today announces the official European sales launch of the XS35 series. There are in total eleven versions of the new model available, which all boast a compact format of just 38 mm in width, high connectivity and a completely passive (fanless) cooling system.

As the smallest-ever Mini-PC from Shuttle (25.2 x 3.85 x 16.2 [cm, DWH]) the XS35 offers particularly low energy consumption. The series is based on efficient technologies and uses the Intel Atom D510 dual-core processor (2x 1.66 GHz), SO-DIMM memory, 2.5 inch hard disks and slim-line drives. Since no fans are used at all, any models work virtually silently even under heavy load. Using no fans also means less maintenance is required.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today announces the new ZOTAC ZBOX Blu-ray series mini-PCs -- the world's first shipping mini-PCs with an integrated slot-load Blu-ray drive and slim and stylish design. The new ZOTAC ZBOX Blu-ray mini-PCs combine a powerful graphics processor with an energy-efficient system processor, premium integrated features and class-leading expansion capabilities to form mini-PCs capable of deliver premium high-definition video playback online and offline.

Next-Generation NVIDIA ION graphics technology with 16 unified shaders and 512MB of DDR3 memory enables the ZOTAC ZBOX Blu-ray series to deliver stunning high-definition Blu-ray video playback at resolutions up to 1080p. Hardware-accelerated Adobe Flash video support enables smooth playback of streaming high-definition content.

VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the addition of the VIA COME8X80 module to its COM Express portfolio; the world's first COM Express type product to take advantage of the high performance, 64-bit VIA Nano E-Series processor.

"The VIA COME8X80 module harnesses the power of VIA Nano platform to offer a uniquely integrated and performance-optimized COM Express product," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA COME8X80 also demonstrates our long-term commitment to bringing our leading processor technologies to the COM Express form factor."

MSI, the global leading brand in All-in-One PC, today announced the release of its new high-end performance All-in-One PC model featuring the all-new Intel Core i5/i3 series processors: The Wind Top AE2280.The Wind Top AE2280 comes with a glossy 21.5" 16:9 cinematic widescreen display with Full HD 1080p high resolution and multi-touch capabilities. Featuring the all-new Intel Core i5/i3 series processors, enhanced performance and intelligent multifunction operation, it allows for even more efficient handling of daily work tasks. And with the ATI Mobility Radeon HD series discrete graphics card, you can enjoy a more detailed and smoother picture when watching movies or playing 3D/HD games. The Wind Top AE2280 is also the world's first to feature Hollywood-grade THX TruStudio Pro audio performance technology that revolutionizes computer audio and video quality. As both a performance and home theatre All-in-One PC, it comes equipped with an abundance of MSI's exclusive touch control technologies that mark a new era in the computer user experience.

Lexar Media, a leading global provider of memory products for digital media, today announced high-density 4GB Crucial DDR3-1333MHz (PC3-10600) SODIMM notebook memory. These new 4GB SODIMM modules offer anyone seeking a desktop replacement option - including mobile consumers, enthusiasts, and workstation users - the enhanced computing performance they crave. Additionally, the notebook modules have been validated for compatibility with Intel's Core i7, i5, and i3 mobile processors.

"The shift from DDR2 to DDR3 memory in the mobile computing space allowed for higher memory bandwidths while using less power, which resulted in improved system performance and potentially longer battery life. Now, with the availability of high-density 4GB Crucial DDR3-1333MHz SODIMM modules, mobile users will push the limits of notebook system performance and speed even further," said Jim Jardine, Lexar Media's senior worldwide product manager.