Samsung Electronics Co., Ltd. today unveiled the Galaxy Book Go and Galaxy Book Go 5G, new additions to the Galaxy Book lineup, powered by the latest Qualcomm Snapdragon compute platforms. The Galaxy Book Go series provides more choices at accessible prices to consumers looking to achieve more anytime, anywhere.

"PCs continue to enable our digital lives, helping us connect to our friends and family, work remotely, and find outlets for creativity and relaxation," said Woncheol Chai, SVP and Head of Experience Planning Team, Mobile Communications Business, Samsung Electronics. "The Galaxy Book Go series is built for today's mobile-first users, who expect seamless communication, sustained productivity, and immersive entertainment—all in one device. With the new addition to the Galaxy Book, Samsung offers wider options to our consumers to choose a device that best fits their needs."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the availability of the latest Trident Z Royal Elite memory series, along with the introduction of new high-speed, low-latency performance memory specifications at DDR4-4000 CL14-15-15-35 and DDR4-3600 CL14-14-14-34. Built with Samsung 8 Gb B-die ICs to achieve these incredibly low latency timings, these new DDR4 memory specifications are the ideal choice for building a powerful workstation or the ultimate gaming system.

G.SKILL is dedicated to developing high-speed, low-latency memory kits for high performance PC systems, and achieving an extremely low CL14 latency on high-speed dual-ranked memory modules is no easy feat. Created with Samsung B-die ICs, G.SKILL is launching the incredible DDR4-4000 CL14-15-15-35 memory specification with 16 GB modules for a 32 GB (16 GB x2) kit capacity. Below is a screenshot showing the memory kit on the ASUS ROG STRIX Z590-E GAMING WIFI motherboard with the Intel Core i7-11700KF processor.

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

To preempt NVIDIA's GeForce RTX 3080 Ti launch, AMD had worked with its partners to release a refreshed Radeon RX 6900 XT based on a swanky new ASIC internally dubbed "XTXH." This is essentially the highest bin of the "Navi 21" silicon that allows 10% higher clock speeds over the standard RX 6900 XT. Our testing of one such card, the ASRock RX 6900 XT OC Formula, showed that the XTXH is able to trade blows with the RTX 3090, making it competitive with the RTX 3080 Ti. Interestingly, there seemed to lack a reference design "made by AMD" card based on this silicon. Turns out, AMD had other plans. This card was earlier believed to be the "Radeon RX 6900 XTX," when it was first leaked in April, but turns out, that AMD is allowing partners to simply call this the RX 6900 XT.

The reference design card uses a liquid-cooled design. The card itself is two slots thick, and about the size of the reference Radeon RX 6800, but two coolant tubes emerge from its top, which head to a 120 mm x 120 mm radiator. This is a purely liquid-cooled card, with no secondary air-based cooling, like the ASUS ROG Strix LC RX 6900 XT. The only sources of noise are the AIO pump-block, and the single included 120 mm fan. Besides 10% higher GPU clocks, the reference design card has an ace in the hole that custom-design XTXH cards lack—faster memory.

Enterprise SSD procurement has been rising on the back of growing server shipments since 2Q21, according to TrendForce's latest investigations. In particular, the share of 8 TB products in shipments of SSDs to data centers has shown the most noticeable growth, which is expected to persist through 3Q21. However, certain SSD components and parts may be in shortage due to insufficient foundry capacity. TrendForce is therefore revising the QoQ hikes in contract prices of enterprise SSDs for 3Q21 to 10-15% from the previous projection of 5-10%.

TrendForce further indicates that the high demand for enterprise SSDs in 3Q21 is attributed to several factors. First, North American cloud service providers (hyperscalers) have pretty much completed their inventory adjustments and now continue to expand their storage capacity. Second, the flow of incoming orders to traditional server brands is getting stronger over the quarters as government agencies and SMBs increase their budgets for IT infrastructure. Third, Intel and AMD are ramping up production for server CPUs based on their respective new processor platforms. Following the adoption of new CPUs, the overall demand for enterprise SSDs has also shifted to higher-density products because clients want to upgrade their computing power and storage capacity. Specifically, demand is mainly trending toward 4/8 TB SSDs since raising NAND Flash density can lower the cost of SSD deployment.

Samsung Electronics, the world leader in advanced memory technology, today unveiled its new enterprise solid-state drive (SSD) featuring Zoned Namespace (ZNS) technology—the PM1731a. Leveraging ZNS, the SSD will maximize available user capacity and offer an extended lifespan in storage server, data center and cloud environments.

"Samsung's ZNS SSD reflects our commitment to introducing differentiated storage solutions that can substantially enhance the reliability and lifetime of server SSDs," said Sangyeun Cho, senior vice president of the Memory Software Development Team at Samsung Electronics. "We plan to leverage quad-level cell (QLC) NAND technology in our next-generation ZNS drives to enable higher thresholds for storage performance and capacity in the enterprise systems of tomorrow."

AMD at its Computex event shed some light on its IP partnership with Samsung. We already knew this was going to be a closer collaboration than most IP licensing deals, as AMD themselves announced this would be a semi-custom solution designed between both companies. AMD CEO Lisa Su described the technology to be embedded in the upcoming Samsung Exynos SoC as being based on RDNA2 - but this likely is just a marketing and clarity perspective on AMD's technology being implemented, since between the design of RDNA2 and the announcement of the Samsung partnership a lot of water has necessarily run under AMD's graphics IP bridge.

Lisa Su did however confirm that two key RDNA2 technologies will find their way into Samsung's Exynos: Variable Rate Shading (VRS) and Raytracing. This isn't he first time VRS has made an appearance on a mobile SoC - it's already been implemented by Qualcomm in the Adreno 660 GPU (part of the Snapdragon 888 SoC design). However, Raytracing does seem to be a first for the SoC market, and Samsung might just edge out competition in its time to market with this technology. more details will certainly be shared as we get closer to the fabled AMD-partnered Exynos release.

Total NAND Flash revenue for 1Q21 increased by 5.1% QoQ to US$14.82 billion, according to TrendForce's latest investigations. In particular, bit shipments rose by 11% QoQ, while the overall ASP dropped by 5% QoQ; hence, bit shipment growth offset the decline in the overall ASP. Although NAND Flash demand from notebook computer and smartphone manufacturers remained high, clients from the data center segment exhibited relatively weak demand, since this segment had yet to leave the state of NAND Flash oversupply. Contract prices for this quarter therefore still mostly showed a considerable QoQ drop. On the other hand, OEMs/ODMs of end products began to increase procurement of NAND Flash products from the second half of January onward because they noticed that the shortage of NAND Flash controller ICs was affecting the production of medium- and low-density storage products. Besides avoiding a possible supply crunch in the future, OEMs/ODMs were placing additional orders because they were preparing for a push to expand market share. On account of these developments, the overall NAND Flash demand surpassed expectations in 1Q21.

Samsung Electronics today announced the global availability of its newly expanded Smart Monitor lineup, providing more display sizes and design options, along with new and enhanced smart features. The lineup now includes a larger 43-inch M7 (UHD resolution) model, delivering enhanced productivity and an immersive entertainment experience. The M5 (FHD resolution) models are now available in 24-inch, 27-inch and 32-inch displays, featuring a sleek design and a stylish new white color option.

The Samsung Smart Monitor series was launched in November 2020 as the world's first do-it-all screen designed for today's businesses, academia and consumers who are working, learning and staying entertained at home. The Smart Monitor offers integrated media and productivity apps, versatile connectivity, built-in speakers and a solar cell-powered remote control.

Samsung Electronics plans to build a new cutting-edge semiconductor fab in Austin, Texas, according to an ETimes report. An official announcement to this effect will be made later today, when South Korean President Moon and U.S. President Biden are scheduled to hold their first Summit meeting, in Washington DC. The facility will offer third-party contract manufacturing of semiconductor chips on the 5 nanometer EUV process. Samsung has earmarked an investment of $18 billion toward the construction of this fab, which will be located close to the company's existing foundry in Texas, which manufactures chips on the 14 nm node. Samsung's investment is in response to rising demand of high-volume logic chips by major American firms such as Amazon, Google, Microsoft, and Tesla.

Owing to the impact of the COVID-19 pandemic in 2020, not only did LED revenue experience a downward trajectory, but this decline also reached a magnitude rarely seen in recent years, according to TrendForce's latest investigations. However, as vaccinations begin taking place in 1H21, the LED market's long-stifled demand is expected to rebound from rock bottom. Hence, global LED market revenue will likely undergo a corresponding recovery this year as well, with a forecasted US$16.53 billion, an 8.1% increase YoY, in 2021. Most of this increase can be attributed to four major categories, including automotive LED, Mini/Micro LED, video wall LED, and UV/IR LED.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the industry's first integrated power management ICs (PMICs) — S2FPD01, S2FPD02 and S2FPC01, for the fifth-generation double data rate (DDR5) dual in-line memory module (DIMM). One major design improvement to the newest generation DRAM solution involves integrating the PMIC into the memory module — previous generations placed the PMIC on the motherboard — offering increased compatibility and signal integrity, and providing a more reliable and sustained performance.

For improved performance efficiency and load-transient responses, Samsung's new PMICs for DDR5 modules have been equipped with a high-efficiency hybrid gate driver and a proprietary control design (asynchronous-based dual-phase buck control scheme). This scheme allows the DC voltage to step down from high to low with a fast transient response to changes in the output load current and adapts the conversion accordingly to efficiently regulate its output voltage at near-constant levels. The control scheme also features both pulse width and pulse frequency modulation methods, preventing delays and malfunctions when switching modes.

The South Korean government, along with 153 Korean companies, has unveiled an ambitious plan to invest USD $450 billion over the next decade, to make its semiconductor manufacturing industry globally competitive, as China and the U.S. are executing similar national plans of their own, which threaten to blunt South Korea's competitiveness in the industry. Leading the effort will be Samsung Electronics and SK Hynix.

Samsung will be spending over $151 billion through 2030 in expanding its manufacturing facilities, while SK Hynix will spend $97 billion to expand its existing facilities; in addition to $106 billion planned to build four new fabs in the Yongin. Both Samsung and SK Hynix are predominantly memory companies, manufacturing DRAM and NAND flash products. This means that while Korea is globally competitive in semiconductor manufacturing overall, it is relying mainly on memory dies, and not logic dies (chips such as ASICs, CPUs, GPUs, SoCs, FPGAs, etc). The two could put in efforts to change this, so their foundry capacity attracts fabless logic IC companies away from Taiwan's TSMC, which specializes in logic over memory.

Samsung Display has announced that the world's leading certification company SGS certified its laptop OLED for gaming performance, which is featured in Samsung Electronics' latest laptop Galaxy Book Pro and Galaxy Book Pro 360. According to SGS's test results, the new Samsung Display OLED showed the blur length below 1.4 mm and the moving picture response time below 15.4 ms, both of which are crucial to enjoying dynamic and fast-paced action games. An LCD laptop with identical specs showed the maximum 2.1 mm blur length and the 26.4 ms moving picture response time. Its HDR contrast ratio, which quantifies the sharpness and the depth of an image, resulted in over 1,000,000:1.

According to Samsung Display, fast-paced video games that require higher performance often suffer degradations in image quality when played on a display with a long blur length, which could harm user experience. OLED has a very wide range of contrast thus offers more immersive gaming experience for consumers who favor dynamic, flamboyant games, Samsung Display says.

Owing to high demand generated by the proliferation of WFH and distance education, monitor shipment for 2020 reached 140 million units, an 8.6% growth YoY, which represents the highest growth in about 10 years, according TrendForce's latest investigations. With demand persisting through 1H21, monitor shipment for 1Q21 underwent a staggering YoY increase of 34.1%, and this figure is projected to exceed 10% for 2Q21. Total monitor shipment for 2021 will likely reach 150 million units, a 7.3% growth YoY. Gaming monitors, which have been gaining attention in the monitor market, are expected to make up 17.3% of this total and reach 25.9 million units in shipment in 2021. In addition to being one of the most in-demand applications in the stay-at-home economy, this product category has long been a resource-intensive focus of monitor brands and panel suppliers alike.

Since lobbying is both legal and regulated in the US (an attempt to bring attempts of influencing political power by corporations under legal boundaries, as opposed to being done in the dark), it feels like it was only a matter of time before big tech attempted to join under one banner. As such, the Semiconductors in America Coalition (SIAC) has now been put together, and boasts of 64 members including Microsoft, Apple, TSMC, Intel, AMD, NVIDIA, Arm, and Samsung. It seems that all of these companies - which are often at odds with one another when it comes to competing for consumers' choice and money - have found enough similarities to get organized in an attempt to nudge political power in their favor.

SIAC said in a press release that its mission is to "advance federal policies that promote semiconductor manufacturing and research in the U.S. to strengthen America's economy, national security, and critical infrastructure." The first announcement from the SIAC following its foundation was its intention to support the CHIPS for America Act. The Act (supported by The Semiconductor Industry Association (SIA) and President Joe Biden) has already been approved by the House and the Senate as part of the National Defense Authorization Act for 2021 but has not yet been funded. It seems that SIAC's first mission is to get the government to open up its $50 billion-deep pockets.

Demand for DRAM exceeded expectations in 1Q21 as the proliferation of WFH and distance education resulted in high demand for notebook computers against market headwinds, according to TrendForce's latest investigations. Also contributing to the increased DRAM demand was Chinese smartphone brands' ramp-up of component procurement while these companies, including OPPO, Vivo, and Xiaomi, attempted to seize additional market shares after Huawei's inclusion on the Entity List. Finally, DRAM demand from server manufacturers also saw a gradual recovery. Taken together, these factors led to higher-than-expected shipments from various DRAM suppliers in 1Q21 despite the frequent shortage of such key components as IC and passive components. On the other hand, DRAM prices also entered an upward trajectory in 1Q21 in accordance with TrendForce's previous forecasts. In light of the increases in both shipments and quotes, all DRAM suppliers posted revenue growths in 1Q21, and overall DRAM revenue for the quarter reached US$19.2 billion, an 8.7% growth QoQ.

Demand for PC, mobile, graphics, and special DRAM remains healthy in 2Q21. Furthermore, after two to three quarters of inventory reduction during which their DRAM demand was relatively sluggish, some server manufacturers have now kicked off a new round of procurement as they expect a persistent increase in DRAM prices. TrendForce therefore forecasts a significant QoQ increase in DRAM ASP in 2Q21. In conjunction with increased bit shipment, this price hike will likely drive total DRAM revenue for 2Q21 to increase by more than 20% QoQ.

Samsung is readying a powerful Arm-based SoC rivaling Apple's groundbreaking M1 silicon, under its Exynos brand. This chip is being designed for thin-and-light notebooks, as well as premium tablets, essentially letting Samsung target Apple's MacBook (M1) and iPad Pro form-factors. Unlike Apple, Samsung won't be burdened with having to rally its ISV partners to develop specifically for its hardware; the company is preparing to launch notebooks in the second half of 2021 that are powered by a Windows 10 on Arm derivative. This would give the notebook access to all of the applications already developed for the OS, including Office and certain Adobe Creativity Suite apps. The M1-rivaling Exynos chip will pack the latest-generation 64-bit Arm CPU cores, as well as an integrated GPU designed by AMD.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry's first memory module supporting the new Compute Express Link (CXL) interconnect standard. Integrated with Samsung's Double Data Rate 5 (DDR5) technology, this CXL-based module will enable server systems to significantly scale memory capacity and bandwidth, accelerating artificial intelligence (AI) and high-performance computing (HPC) workloads in data centers.

The rise of AI and big data has been fueling the trend toward heterogeneous computing, where multiple processors work in parallel to process massive volumes of data. CXL—an open, industry-supported interconnect based on the PCI Express (PCIe) 5.0 interface—enables high-speed, low latency communication between the host processor and devices such as accelerators, memory buffers and smart I/O devices, while expanding memory capacity and bandwidth well beyond what is possible today. Samsung has been collaborating with several data center, server and chipset manufacturers to develop next-generation interface technology since the CXL consortium was formed in 2019.

TrendForce's investigations find that India has become the second largest market for smartphones since 2019. However, the recent worsening of the COVID-19 pandemic in the country has severely impaired India's domestic economy and subsequently dampened various smartphone brands' production volume and sales (sell-in) performances there. TrendForce is therefore revising the forecasted YoY growth in global smartphone production for 2021 from 9.4% down to 8.5%, with a yearly production volume of 1.36 billion units and potential for further decreases going forward.

TrendForce further indicates that the top five smartphone brands (Samsung, Apple, Xiaomi, OPPO, and Vivo) have either set up assembly plants in India or sought assistance from EMS providers with operations in the country. Hence, the share of made-in-India smartphones has been on the rise over the years, even though the majority of the domestically manufactured devices are still for meeting the demand of the home market. Judging from the current state of Indian smartphone manufacturing, TrendForce expects the second wave to reduce the country's smartphone production volume for 2Q21 and 3Q21 by a total of 12 million units, in turn resulting in a 7.5% YoY decrease in smartphone production in India for the whole year.

Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021. Furthermore, Ericsson and Samsung have agreed on technology cooperation projects to advance the mobile industry in open standardization and create valuable solutions for consumers and enterprises.

This settlement ends complaints filed by both companies before the United States International Trade Commission (USITC) as well as the ongoing lawsuits in several countries and confirms the value of the strong patent portfolios of both companies. The details of the agreement are confidential and will not be disclosed. Ericsson's IPR licensing revenues continue to be affected by several factors, mainly expired patent license agreements pending renewal, geopolitical impact on the handset market, technology shift from 4G to 5G, and possible currency effects going forward. In the second quarter 2021, IPR licensing revenues, including the new agreement covering sales from January 1, 2021, are expected to be SEK 2.0 b to 2.5 b.

Christina Petersson, Chief Intellectual Property Officer at Ericsson says: "We are delighted to sign a mutually beneficial agreement with Samsung. This important deal confirms the value of our patent portfolio and further illustrates Ericsson's commitment to FRAND principles."

Samsung Electronics is expected to regain the distinction of the top semiconductor supplier for the 2nd quarter of 2021, re-taking the lead from Intel, according to a report by market research firm IC Insights. Samsung's growth rides on the back of a resurgent memory market, as the company supplies both DRAM and NAND flash of various types. This is also helped by the fact that Intel's sales in are expected to remain flat around the same period of time. This would be Samsung's return to the top spot for the first time since 2018, when memory prices crashed, sending down production, in a bid to better allow the channel to digest existing inventory.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again. Samsung's I-CubeTM is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.

Samsung's new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.

Samsung Electronics today unveiled the Galaxy Book Pro and Galaxy Book Pro 360, the new generation of mobile computing devices that bring together powerful performance with the mobile DNA of a Samsung Galaxy smartphone. Based on the enhanced Galaxy ecosystem, Galaxy Book Pro and Book Pro 360 work seamlessly with your other Galaxy and IoT devices, making workflow and entertainment across devices smoother—and making life easier. As a staple for the Galaxy Book Pro series, Samsung embraced open collaboration, working with industry-leading partners Intel and Microsoft, to build a new approach to mobile computing, where smartphones and PCs work together flawlessly across operating systems and never sacrifice performance for portability.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced its launch of the industry's highest performing 24G SAS (SAS-4) SSD - the PM1653. Based on the latest SAS interface, the new drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is also the industry's first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities from 800 GB to 30.72 TB for advanced enterprise server systems.

"As the leading provider of SAS storage for a decade, Samsung has been offering the most advanced and reliable enterprise solutions in full support of the critical workloads of global server OEMs, governments and financial institutions. Samsung enterprise solutions are also accredited by the U.S. National Institute of Standards and Technology for the most powerful data security," said Kwangil Park, senior vice president of the Memory Product Planning Team at Samsung Electronics. "Like we have done with the PM1653, Samsung will continue to collaborate with our customers to accommodate the ever-growing demand of the enterprise server market for the most uncompromising offerings available."