G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the achievement of DDR5-7000 CL40-40-40-76 32 GB (2x16 GB) extreme speed, passing the Memtest stability test. 7000MT/s memory speed is an exciting milestone, as it was only seen under liquid nitrogen sub-zero temperature cooling not long ago in overclocking records. Accomplished with high-performance Samsung DDR5 components, this extreme speed memory is truly worthy of the G.SKILL flagship Trident Z5 family classification.

G.SKILL has been dedicated to develop the fastest possible DDR5 memory on the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards. Today, G.SKILL is proud to announce the feat of reaching DDR5-7000 extreme speed, while maintaining an ultra-low CAS latency timing of CL40-40-40-76. The memory modules that reached this monumental achievement is built with high-performance Samsung DDR5 components, and has shown to be stable under Memtest. Please refer to the screenshot below.

While the global electronics supply chain experienced a chip shortage, the corresponding shortage of foundry capacities also led various foundries to raise their quotes, resulting in an over 20% YoY increase in the total annual revenues of the top 10 foundries for both 2020 and 2021, according to TrendForce's latest investigations. The top 10 foundries' annual revenue for 2021 is now expected to surpass US$100 billion. As TSMC leads yet another round of price hikes across the industry, annual foundry revenue for 2022 will likely reach US$117.69 billion, a 13.3% YoY increase.

TrendForce indicates that the combined CAPEX of the top 10 foundries surpassed US$50 billion in 2021, a 43% YoY increase. As new fab constructions and equipment move-ins gradually conclude next year, their combined CAPEX for 2022 is expected to undergo a 15% YoY increase and fall within the US$50-60 billion range. In addition, now that TSMC has officially announced the establishment of a new fab in Japan, total foundry CAPEX will likely increase further next year. TrendForce expects the foundry industry's total 8-inch and 12-inch wafer capacities to increase by 6% YoY and 14% YoY next year, respectively.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5A DDR5 SDRAM standard. This update to the JEDEC DDR5 SDRAM standard includes features designed to enhance reliability and performance in a wide range of applications involving client systems and high-performance servers. JESD79-5A is now available for download from the JEDEC website.

Added features designed to meet industry demand for improved system reliability include bounded fault error-correction support, Soft Post-Package Repair (sPPR) undo and lock, Memory Built-In Self-Test Post Package Repair (MBIST and mPPR), Adaptive RFM, and an MR4 extension. JESD79-5A expands the timing definition and transfer speed of DDR5 up to 6400 MT/s for DRAM core timings and 5600 MT/s for IO AC timings to enable the industry to build an ecosystem up to 5600 MT/s. The nomenclature for core timing parameters and their respective definitions has been revamped to closely align with the upcoming JEDEC JESD400-5 DDR5 Serial Presence Detect (SPD) Contents V1.0 standard. The document can be accessed here.

Samsung Electronics America, Inc. today announced the availability of three new Galaxy Book PC portfolio products in the U.S.: Galaxy Book, Galaxy Book Odyssey, and Galaxy Book Pro 360 5G. Galaxy Book is available starting today, while both Galaxy Book Odyssey and Galaxy Book Pro 360 5G will be available on November 11. With every laptop, users get a take-anywhere, do-anything premium PC, thanks to brilliant displays, 11th Generation Intel powered performance, and seamless continuity with the Galaxy ecosystem.

Each new Galaxy Book sports a unique design to meet a wide range of tastes - from Galaxy Book Pro 360 5G's ultra-thin body, to Galaxy Book's refined classic look, to Galaxy Book Odyssey's rugged beveled style. All three PCs also come with Windows 11, offering a fresh, new and modern feel and tools to bring you closer to what you love, empower productivity and inspire creativity.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest DDR5 memory kit at an extreme speed and low latency of DDR5-6600 CL36-36-36-76 32 GB (2x 16 GB). This is the world's first DDR5 memory kit to reach such high level of frequency speed and extremely efficient low timings, achieved with high-performance Samsung DDR5 ICs.

In the never-ending quest for memory performance, G.SKILL is proud to reveal the latest addition of ultra-high DDR5 frequency to the flagship Trident Z5 family. While reaching an extreme frequency speed of DDR5-6600, this memory kit specification is also created with an ultra-low timing at CL36-36-36, compared to the typical CL40-40-40 timing of DDR5, making this the ultimate performance choice for gamers, enthusiasts, and overclockers. The screenshot below shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs.

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

Samsung's flagship client M.2 NVMe SSD, the 980 PRO, finally has a stock heatsink in new SKUs. Its design calls for what appears to be an aluminium monoblock with ridges for fins that join at the top. This heatsink is held in place by a metal shroud that covers the sides and back of the drive. The drive comes with its own retail SKUs and name—"980 PRO with Heatsink," much like how Western Digital segregates SKUs with or without heatsinks for its flagship WD Black SN850 drives. Retail channel availability of these variants remains to be seen, as The Verge reports that these drives will be sold as PlayStation 5-compatible drives. When they come out on October 29, the 1 TB variant is expected to be priced at $250, with the 2 TB variant going for $450.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company's shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today's finest, most advanced DRAM process for its DDR5 solutions.

"We have led the DRAM market for nearly three decades by pioneering key patterning technology innovations," said Jooyoung Lee, Senior Vice President and Head of DRAM Product & Technology at Samsung Electronics. "Today, Samsung is setting another technology milestone with multi-layer EUV that has enabled extreme miniaturization at 14 nm—a feat not possible with the conventional argon fluoride (ArF) process. Building on this advancement, we will continue to provide the most differentiated memory solutions by fully addressing the need for greater performance and capacity in the data-driven world of 5G, AI and the metaverse."

In an interview with the BBC, Intel CEO Pat Gelsinger said that the company is no longer considering the UK as a site for a chip fab, due to Brexit, something the company had apparently done prior to Brexit. Now the company is looking for a location in another EU country for a US$95 billion investment for a new semiconductor plant, as well as upgrades to its current plants in Ireland.

Although Intel had not made any firm decisions on a site location prior to Brexit, Gelsinger is quoted as saying "I have no idea whether we would have had a superior site from the UK, but we now have about 70 proposals for sites across Europe from maybe 10 different countries." He continues "We're hopeful that we'll get to agreement on a site, as well as support from the EU... before the end of this year."

Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled plans for continuous process technology migration to 3- and 2-nanometer (nm) based on the company's Gate-All-Around (GAA) transistor structure at its 5th annual Samsung Foundry Forum (SFF) 2021. With a theme of "Adding One More Dimension," the multi-day virtual event is expected to draw over 2,000 global customers and partners. At this year's event, Samsung will share its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.

"We will increase our overall production capacity and lead the most advanced technologies while taking silicon scaling a step further and continuing technological innovation by application," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "Amid further digitalization prompted by the COVID-19 pandemic, our customers and partners will discover the limitless potential of silicon implementation for delivering the right technology at the right time."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced the first open-source software solution, the Scalable Memory Development Kit (SMDK), that has been specially designed to support the Compute Express Link (CXL) memory platform. In May, Samsung unveiled the industry's first CXL memory expander that allows memory capacity and bandwidth to scale to levels far exceeding what is possible in today's server systems. Now, the company's CXL platform is being extended beyond hardware to offer easy-to-integrate software tools, making CXL memory much more accessible to data center system developers for emerging artificial intelligence (AI), machine learning (ML) and 5G-edge markets.

The CXL interconnect is an open, industry-backed standard that enables different types of devices such as accelerators, memory expanders and smart I/O devices to work more efficiently when processing high-performance computational workloads. "In order for data center and enterprise systems to smoothly run next-generation memory solutions like CXL, development of corresponding software is a necessity," said Cheolmin Park, vice president of the Memory Product Planning Team at Samsung Electronics. "Today, Samsung is reinforcing its commitment toward delivering a total memory solution that encompasses hardware and software, so that IT OEMs can incorporate new technologies into their systems much more effectively."

If you're looking at getting your hands on some DDR5 memory for your new Alder Lake build once it launches, a leak of validated RAM has popped up on Twitter, that should give you an idea of what to expect. The list is only a couple of weeks old and it's not what we'd call a long list, as it only covers five companies, out of which three are actual DRAM manufacturers and one is a subsidiary of one of those companies, there are no real surprises here.

All the DDR5 modules tested are rated at 4800 MHz and are either 8, 16 or 32 GB in size, with all modules using 16 Gbit chips. All modules were tested with timings of 40-39-39 at 1.1 V. Kingston is the only outlier here, since they're not a DRAM manufacturer, unlike SK hynix, Samsung and Micron/Crucial. Intel is listing all the modules as non ECC, which should put an end to the claims of all DDR5 being ECC memory.

Samsung appears to be in a hurry to beat Apple and Qualcomm at bringing real-time ray tracing to the smartphone space, with its next-generation Exynos 2200 "Pamir" SoC. The chip integrates a graphics processor based on the AMD RDNA2 architecture, codenamed "Voyager." Samsung all but confirmed that the compute units of this will feature Ray Accelerators, the hardware component that performs ray-intersection calculations. The "Voyager" iGPU, as implemented on the Exynos 2200 SoC, physically features six RDNA2 compute units (384 stream processors), and hence six Ray Accelerators.

Built on the 4 nm EUV silicon fabrication process, Exynos 2200 will feature not two, but three kinds of CPU cores—four lightweight efficiency cores, three mid-tier cores, and one ultra high-performance core. Each of these three operate in unique performance/Watt bands, giving software finer-grained control over the kinds of hardware resources they want. Samsung is expected to debut the Exynos 2200 with its next-generation Galaxy S and Galaxy Note devices.

As growing vaccination rates worldwide starting in July lead to a gradual easing of lockdowns, the overall demand for notebook computers has also experienced a corresponding slowdown, with Chromebook demand dropping by as much as 50%, according to TrendForce's latest investigations. However, factors such as a wave of replacement demand for commercial notebooks in Europe and North America due to the return to physical workplaces, as well as brands' aggressive efforts to rush out their 4Q21 shipments ahead of time due to global port congestions, became the primary drivers of notebook demand in 3Q21. Hence, annual notebook shipment for 2021 will likely reach 240 million units, a 16.4% YoY increase.

TrendForce further indicates that 4Q21 will welcome both the gradual release of new models equipped with Intel's next-gen CPUs and a wave of replacement demand for notebooks featuring Windows 11. Even so, overall notebook shipment in 4Q21 will depend on the status of the COVID-19 pandemic and the demand for commercial notebooks. As vaccinations become even more widespread in 2022, pandemic-related spending is expected to decline as a result. TrendForce therefore expects global notebook shipment to decline by 7-8% YoY next year and reach approximately 220 million units, although this still represents a growth of 60 million units over the shipment volume for 2019, prior to the emergence of the pandemic.

Samsung is by far Samsung's largest foundry customers and this is no secret, but now it seems like the company wants to gain more customers to help pay for the costs of operating a cutting edge foundry. A little over a decade ago, Samsung was part of the Common Platform technology alliance together with GlobalFoundries and IBM, which allowed companies to almost pick either foundry based on a common design kit and common process technologies. It made Samsung an attractive foundry option, but the alliance didn't last.

As we know, Nvidia gave Samsung a try with Ampere and there were a lot of reports of yield issues and what not early on. This seems to have persuaded Nvidia to move back to TSMC for Lovelace and Hopper, which is a big loss for Samsung. However, it seems this was also something of a wakeup call for Samsung, as the company is apparently looking at making some internal changes to its customer structure so it can handle third party customers in a better way.

Following the peak period of production in 3Q21, the supply of DRAM will likely begin to outpace demand in 4Q21, according to TrendForce's latest investigations (the surplus of DRAM supply is henceforth referred to as "sufficiency ratio", expressed as a percentage). In addition, while DRAM suppliers are generally carrying a healthy level of inventory, most of their clients in the end-product markets are carrying a higher level of DRAM inventory than what is considered healthy, meaning these clients will be less willing to procure additional DRAM going forward. TrendForce therefore forecasts a downward trajectory for DRAM ASP in 4Q21. More specifically, DRAM products that are currently in oversupply may experience price drops of more than 5% QoQ, and the overall DRAM ASP will likely decline by about 3-8% QoQ in 4Q21.

Although WFH and distance learning applications previously generated high demand for notebook computers, increasingly widespread vaccinations in Europe and North America have now weakened this demand, particularly for Chromebooks. As a result, global production of notebooks is expected to decline in 4Q21, in turn propelling the sufficiency ratio of PC DRAM to 1.38%, which indicates that PC DRAM will no longer be in short supply in 4Q21. However, PC DRAM accounts for a relatively low share of DRAM manufacturers' DRAM supply bits, since these suppliers have allocated more production capacities to server DRAM, which is in relatively high demand. Hence, there will unlikely be a severe surplus of PC DRAM in 4Q21. It should also be pointed out that, on average, the current spot prices of PC DRAM modules are far lower than their contract prices for 3Q21. TrendForce therefore expects an imminent 5-10% QoQ decline in PC DRAM contract prices for 4Q21, with potential for declines that are even greater than 10% for certain transactions, as PC OEMs anticipate further price drops in PC DRAM prices in the future.

Samsung Electronics today unveiled its latest monitor, the 24-inch Webcam Monitor S4, designed to suit the needs of hybrid workers. With a built-in webcam, speakers and microphone, the monitor helps users connect and collaborate with ease. With a 2.0-megapixel FHD camera and an infrared camera, the S4 meets the specifications required to join a conference or attend virtual meetings. The pop-up camera is revealed by pushing it down into the monitor to make it spring up, creating a simple and seamless experience when video conferencing and connecting with others virtually.

To increase login speeds and user convenience, the S4 is 'Windows Hello' certified, which means that users can log into or unlock their computer within as little as 2 seconds. Biometric sensors activate and scan a user's face, and there is no need to provide a password to get access to the user's Windows 10 devices, apps and websites, making the access quick, secure and efficient.

NVIDIA is rumored to be giving its GeForce RTX 30-series "Ampere" graphics card family a mid-term refresh by the 2022 International CES, in January; the company is also targeting Q4-2022, specifically October, to debut its next-generation RTX 40-series. The Q1 refresh will include "SUPER" branded SKUs taking over key price-points for NVIDIA, as it lands up with enough silicon that can be fully unlocked. This leak comes from Greymon55, a reliable source on NVIDIA leaks. It also aligns with the most recent pattern followed by NVIDIA to keep its GeForce product-stack updated. The company had recently released "Ti" updates to certain higher-end price-points, in response to competition from the Radeon RX 6000 "RDNA2" series.

NVIDIA's next-generation will be powered by the "Lovelace" graphics architecture that sees even more hardware acceleration for the RTX feature-set, more raytraced effects, and preparation for future APIs. It also marks NVIDIA's return to TSMC, with the architecture reportedly being designed for the 5 nm (N5) silicon fabrication node. The current-gen GeForce "Ampere" chips are being products on an 8 nm foundry node by Samsung.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that four of its System LSI products received product carbon footprint label certification from the Carbon Trust, the first of Samsung's logic chips to do so. Having received the semiconductor industry's first carbon footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now broadened its ESG (Environmental, Social, and Governance) spectrum with this global recognition of 'eco-friendly' logic chips. Samsung also grabbed the industry's first triple Carbon Trust Standard for Carbon, Water and Waste in June 2021.

The Carbon Trust is an independent and expert partner of organizations around the world that advises businesses on their opportunities in a sustainable, low carbon world. The Carbon Trust also measures and certifies the environmental footprint of organizations, supply chains and products. Of the various certification categories of the Carbon Trust, Samsung's System LSI products received the CO2 Measured product carbon footprint label. The label certifies the chip's carbon footprint, which informs consumers of the impact that the product and its manufacturing process have on the environment. Receiving the CO₂ Measured label is a critical first step for carbon reduction, since it verifies the current carbon emissions of the product with globally recognized specifications (PAS 2050), which Samsung can use as a benchmark to measure future carbon reductions.

Samsung Electronics, the world leader in advanced memory technology, today unveiled its new PRO Plus microSD and a redesigned and enhanced EVO Plus microSD card. Samsung provides customers a comprehensive offering for day-to-day and professional storage needs with a new lineup of microSDs that offer lightning-fast read and write speeds, increased durability and a wide variety of capacity options. The new microSD cards are ideal for expanded mobile device storage and capturing high-quality photos, 4K Ultra HD (UHD) video and other content on action cameras and drones - even in extreme conditions.

Samsung's newest microSDs offer improved six-proof protection, two more layers of protection than the previous generation, making them able to withstand water, extreme temperatures, x-ray, wear out, drops and magnetic impact. Offered with a 10-year limited warranty, the PRO Plus and EVO Plus microSDs thus enable users to store data without the worry of lack of space, while also providing confidence that the content is well protected.

IBM (NYSE: IBM) today announced the new IBM Power E1080 server, the first in a new family of servers based on the new IBM Power10 processor, designed specifically for hybrid cloud environments. The IBM Power10-equipped E1080 server is engineered to be one of the most secured server platforms and is designed to help clients operate a secured, frictionless hybrid cloud experience across their entire IT infrastructure.

The IBM Power E1080 server is launching at a critical time for IT. As organizations around the world continue to adapt to unpredictable changes in consumer behaviors and needs, they need a platform that can deliver their applications and insights securely where and when they need them. The IBM Institute of Business Value's 2021 CEO Study found that, of the 3,000 CEOs surveyed, 56% emphasized the need to enhance operational agility and flexibility when asked what they'll most aggressively pursue over the next two to three years.

The panic buying of chips persisted in 2Q21 owing to factors such as post-pandemic demand, industry-wide shift to 5G telecom technology, geopolitical tensions, and chronic chip shortages, according to TrendForce's latest investigations. Chip demand from ODMs/OEMs remained high, as they were unable to meet shipment targets for various end-products due to the shortage of foundry capacities. In addition, wafers inputted in 1Q21 underwent a price hike and were subsequently outputted in 2Q21. Foundry revenue for the quarter reached US$24.407 billion, representing a 6.2% QoQ increase and yet another record high for the eighth consecutive quarter since 3Q19.

NVIDIA today released the latest GeForce Game Ready drivers. Version 471.96 WHQL doesn't come with any new game optimizations tied to a game launch, but adds support for 6 new G-SYNC compatible displays, and adds 24 new titles to the GeForce Experience "Optimal" settings. The drivers also update scaling resolution in NVIDIA Image Sharpening feature. A handful bugs were also fixed. DPC latency being higher on 8 bpc color than 10 bpc color has been fixed. A problem detecting supported resolutions on Samsung Odyssey G9 has been fixed. A BSOD noticed when two of these displays are connected at 240 Hz, has also been fixed. NVDisplay.Container.exe constantly writing data to a ProgramData location has been fixed. Discrete NVIDIA GPUs frequently waiting up on notebooks with Windows 11, has been fixed. Topaz Denoise stability issues on "Turing" and "Volta" GPUs has been fixed. Grab the drivers from the link below.

DOWNLOAD: NVIDIA GeForce 471.96 WHQL

A number of manufacturers have been caught red-handed, so to speak, by changing components on their SSD products without as much as a product specifications change. This has happened in the past with ADATA, Patriot, and more recently with Western Digital and its WD Blue SN550; now, it's Samsung that's being on the receiving end of a more attentive look at their recent batches of the 970 EVO SSD - particularly its 1 TB configuration.

According to Computerbase, a YouTube channel in Asia seems to have first noticed the difference. They've tested the older version of Samsung's 970 Evo Plus 1 TB (product number MZVLB1T0HBLR, April 2021 production date, a Phoenix controller [S4LR020] and 96-layer 3D TLC NAND) against the newer (product number MZVL21T0HBLU and is equipped with an Elpis controller [S4LV003] and 3D-NAND with the identifier K9DUGY8J5B-CCK0), which likely features different packaging and density for the same 96-layer 3D TLC NAND.

NAND Flash suppliers' Clients in the data center segment were gradually stepping up enterprise SSD procurement after finishing inventory adjustments, according to TrendForce's latest investigations. Moreover, the adoption rate of 4/8 TB products in the enterprise SSD market increased substantially on account of the releases and adoption of the new server processor platforms from Intel and AMD. Although the recent wave of COVID-19 outbreaks that struck Southeast Asia weakened smartphone sales in 2Q21, the quarterly total NAND Flash bit shipments rose by nearly 9% QoQ, as PC OEMs still had plenty of component orders in 2Q21 due to the fairly robust notebook demand during the period. On the other hand, the shortage of controller ICs became more severe during the period, and the winter storm that battered Texas this February affected the operation of Samsung's foundry fab Line S2 in Austin. As demand for NAND Flash products rose, the overall ASP also rose by nearly 7% QoQ, and the quarterly total NAND Flash revenue rose by 10.8% QoQ to US$16.4 billion in 2Q21.