Samsung Electronics, a global leader in the gaming monitor industry, announced the global availability of the 2022 Odyssey G85NB, G75NB and G40B gaming monitor lineup, further reinforcing the Odyssey's industry-leading position in delivering the most immersive and lifelike gaming experience available on the market. The G85NB — the world's first 240 Hz 4K gaming monitor — is available in a 32-inch format, offering super-realistic picture quality, rapid response times and premium performance.

"Samsung is excited to unveil the world's fastest 4K gaming monitor to unlock even more opportunities and deliver innovation to the market, creating a new and incredibly immersive experience," said Hyesung Ha, Executive Vice President of Visual Display Business at Samsung Electronics. "Gamers ultimately desire that immersive experience in unity with their character and scene, and the Odyssey enables this with superior features and lifelike picture quality to give players a thrill."

Intel's revamped IDM 2.0 strategy has seen the company revise its stance in both in-house and outsourced silicon fabrication. While we're already seeing the fruits of Intel's collaboration with TSMC (albeit at the relatively slow pace of introduction for Intel's Arc Alchemist graphics), it seems that Intel is willing to go much farther than just TSMC as a source of chips for its product portfolio.

That's the backdrop to which Intel CEO Pat Gelsinger recently took a trip to South Korea's capital of Seoul. According to the Korea Herald, Gelsinger met several key Samsung executives, including Samsung Electronics Vice Chairman Lee Jae-yong, co-CEO and chip business boss Kyung Kye-hyun, and head of Samsung Mobile Roh Tae-moon. More than enough executive grunt to ignite talks of a deepening collaboration between both companies. While the reporting source doesn't provide any quotes or actionable intel from the meeting, Samsung remains one of the key semiconductor manufacturers alongside Intel itself and TSMC, with a particularly strong portfolio in memory-related technologies.

According to TrendForce research, North American data centers saw an improvement in components supply after February, driving a recovery in purchase order volume. As Server brands returned to normal in-office work following the pandemic, the increase in capital expenditures on related information equipment has also boosted order growth. The addition of Kioxia's raw material contamination incident led to an increase in the pricing of certain rush orders, pushing up overall Enterprise SSD revenue in 1Q22 to US$5.58 billion, or 14.1% growth QoQ.

According to TrendForce, Samsung and SK hynix (including Solidigm) were the top two players in 1Q22. At the beginning of the year, demand from hyperscale data centers resulted in high inventory levels due to component mismatches, leading Samsung's order growth missing expectations. However, as repercussions from the WDC and Kioxia contamination incident hit NAND Flash production capacity in 1Q22, server customers quickly turned to Samsung for additional orders, driving the company's 1Q22 revenue to US$2.77 billion, up 14.8% QoQ.

Samsung Electronics and Red Hat today announced a broad collaboration on software technologies for next-generation memory solutions. The partnership will focus on the development and validation of open source software for existing and emerging memory and storage products, including NVMe SSDs; CXL memory; computational memory/storage (HBM-PIM, Smart SSDs) and fabrics — in building an expansive ecosystem for closely integrated memory hardware and software. The exponential growth of data driven by AI, AR and the fast-approaching metaverse is bringing disruptive changes to memory designs, requiring more sophisticated software technologies that better link with the latest hardware advancements.

"Samsung and Red Hat will make a concerted effort to define and standardize memory software solutions that embrace evolving server and memory hardware, while building a more robust memory ecosystem," said Yongcheol Bae, Executive Vice President and Head of the Memory Application Engineering Team at Samsung Electronics. "We will invite partners from across the IT industry to join us in expanding the software-hardware memory ecosystem to create greater customer value."

According to TrendForce research, as manufacturers actively shifted production capacity to 128 layer products, the market turned to oversupply, resulting in a drop in contract prices in 1Q22, among which the decline in consumer-grade products was more pronounced. Although enterprise SSD purchase order volume has grown, demand for smart phone bits has weakened due to the Russian-Ukrainian war, the traditional off-season, and rising inflation. Client inventories have increased significantly, so it remains challenging for overall bit shipment volume to offset potential decline. In 1Q22, NAND Flash bit shipments and average selling prices fell by 0.5% and 2.3%, respectively, resulting in a 3.0% quarterly decrease in overall industry revenue to US$17.92 billion.

Although China's smartphone stocking momentum was marginally weak considering the off-season, due to sluggish supply on the part of Kioxia and WDC, Samsung's 1Q22 client SSD shipment bit growth was driven up by an influx of rush orders and North American enterprise SSD client orders also recovered significantly in March. Overall bit shipments increased by 9% QoQ and ASP decreased by 2% QoQ. In 1Q22, the NAND Flash portion of Samsung's electronics business posted revenue of US$6.32 billion, up 3.4% QoQ.

AMD has historically thrown brute memory bus width at solving memory-management problems in its graphics architectures, but the Infinity Cache technology launched with RDNA2 proved to be a game changer, as GPUs with narrow 256-bit memory interfaces could compete with NVIDIA's offerings that have 384-bit wide memory interfaces and faster GDDR6X memory types. It looks like the competition between NVIDIA "Ada" and AMD RDNA3 graphics architectures is about to heat up, as rumors are emerging of AMD giving its biggest next-gen ASIC, the "Navi 31," a 384-bit wide memory interface.

This 50 percent increase in memory bus width, runs in concert with two associated rumors—one, that the company will use faster 20 Gbps GDDR6 memory chips; and two, that AMD may increase the size of the on-die Infinity Cache memory. Samsung is already mass-producing 20 Gbps and 24 Gbps GDDR6 memory chips. These are regular GDDR6 memory chips with JEDEC-standard signaling, and not GDDR6X, an exclusive memory type innovated by NVIDIA and Micron Technology, which leverages PAM4 signaling to increase data-rates. A theoretical "Navi 31" with 20 Gbps GDDR6 memory speeds would enjoy 960 GB/s of memory bandwidth, a massive 87.5 percent bandwidth increase over the RX 6900 XT. The on-die Infinity Cache operates at speeds measured in several TB/s. The increased bus width could also signal an increase in memory sizes, with the RX 6950 XT successor featuring at least 24 GB of memory.

Earlier this week, news about TSMC increasing prices in 2023 made its way online and now Samsung Foundry is said to be discussing price hikes with its customers to make up for the increased costs in materials. TSMC already increased its prices by around 20 percent at the end of 2021 and now it looks like Samsung Foundry is set to follow suit with a similar price hike. Depending on the node, the company is said to be looking at increases of between 15 to 20 percent. The somewhat peculiar thing in the case of Samsung Foundry, is that the company is looking at asking for more money on older, legacy nodes, than it will for its cutting edge nodes.

The price increases are said to come into effect sometime in the second half of 2022, so more than six months after TSMC's price hike. The company is still in negotiation with some of its customers, while others have already come to an agreement with Samsung Foundries. The costs to produce chips are said to be increasing by 20 to 30 percent across the board, no matter if we're talking materials needed to produce integrated circuits, or building new factories, according to Bloomberg. Samsung Foundries have also managed to secure long-term orders for the next five years, with a combined value of around eight times that of previous year's revenue, according to its EVP, Kang Moon-soo. The company is hoping to overtake TSMC in the future and invested more than US$36 billion in 2021 alone to expand its foundry business with new fabs and EUV machines. The good news is that Samsung Foundry claims to be back on track when it comes to yield on its 4 nm node and mass production of its 3 nm node is said to start this quarter.

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

Samsung Electronics is showcasing the future of Micro LED technology at Integrated Systems Europe (ISE) 2022 in Barcelona, with three new models of its state-of-the-art display technology, The Wall. At ISE this year, Samsung will unveil its 2022 model of The Wall an innovative modular Micro LED display that delivers immersive viewing experiences in a high-resolution, large screen format. The IWB will be available in 0.63 and 0.94 pixel pitches, with 0.63 being the slimmest ever pixel pitch in The Wall lineup. The new display is now available to pre-order globally.

The micro pitch feature of the IWB demonstrates Samsung's most detailed picture and dynamic range expansion with the screen's 120 Hz frame rate, HDR10/10+ and LED HDR. Following installation, The Wall provides a variety of screen sizes, accommodating 4K movies for 110-inch and up to incredible 8K quality for 220-inch to meet any consumer or business needs. This resolution capability is enhanced by the powerful Micro AI (Artificial Intelligence) Processor, which analyzes every second of content instantly and optimizes picture quality while removing noise.

Samsung Electronics, the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems. Since introducing the industry's first CXL DRAM prototype with a field-programmable gate array (FPGA) controller in May 2021, Samsung has been working closely with data center, enterprise server and chipset companies to develop an improved, customizable CXL device.

The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512 GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering. "CXL DRAM will become a critical turning point for future computing structures by substantially advancing artificial intelligence (AI) and big data services, as we aggressively expand its usage in next-generation memory architectures including software-defined memory (SDM)," said Cheolmin Park, Vice President of Memory Global Sales & Marketing at Samsung Electronics, and Director of the CXL Consortium. "Samsung will continue to collaborate across the industry to develop and standardize CXL memory solutions, while fostering an increasingly solid ecosystem."

Samsung Electronics, the world leader in advanced memory technology, today announced its new microSD card, the Samsung PRO Endurance. Uniquely designed to meet the rigorous demands of surveillance cameras, dashboard cameras, doorbell cameras, body cameras and more, the card offers improved endurance and outstanding performance for smooth and reliable continuous capture and playback.

"From CCTV to doorbell cameras, the need for long-lasting and high-performing video surveillance solutions is continuing to increase, and the PRO Endurance has been designed to support that demand," said KyuYoung Lee, Vice President of the Memory Brand Product Biz Team at Samsung Electronics. "Both consumers and enterprise users can rest assured that our new memory card will ensure continuous recording at high resolution even under extreme conditions." Built with Samsung's highly reliable enterprise-grade NAND flash memory, the PRO Endurance card can deliver up to 16 years (140,160 hours) of continuous recording time to ensure every critical moment is captured. This means a single PRO Endurance card can last as long as up to 33 typical speed-focused cards, saving frequent replacement costs and providing greater reliability for always-on video monitoring.

Samsung has announced the implementation of the latest JEDEC standard specification with the adoption of UFS (Universal Flash Storage) standard 4.0. The new standard offers a number of improvements over the previous UFS 3.1 specification related to either performance or power savings. The new standard increases speeds of up to 23.2 Gbps per lane, double that of the previous UFS 3.1 standard. Additionally, UFS 4.0 unlocks sequential read speeds as high as 6.0 MB/s per mA - a 46% improvement over the previous spec, promising decreased battery drain even as workload time is reduced.

Samsung's UFS 4.0 implementation will leverage the company's 7th Gen V-NAND alongside a proprietary controller, which should ultimately enable speeds of up to 4,200 MB/s. Sequential write speeds are nothing to scoff at either, promising up to 2,800 MB/s. The improved performance doesn't translate to increased package sizes, however, as UFS 4.0 will be distributed in compact packages with a maximum dimension of 11 mm x 13 mm x 1 mm for more effective space utilization and design convenience - with capacities reaching the 1 TB per package. Mass production is expected in 3Q2022. Samsung expects its new UFS 4.0-based products to deliver new experiences with increased data throughput of 5G smartphones, future automotive applications, and even AR and VR.

Despite rumours of both production issues and node delays, Samsung has assured its shareholders during its first quarter conference call, that the company is on track. Its yield rate from its 5 nm node was said to have entered maturity, meaning that yields have entered Samsung's expected levels. However, Samsung did admit that its 4 nm node had seen some delays with the ramp up, but it has now entered the expected yield rate curve. The company is also working on an new R&D line for its upcoming 3 nm node, but didn't go into any further details.

As for Samsung's DRAM products, there were rumours that its 12 nm 1b process node had hit some snags and that the company was going to skip ahead to its 1c node, something the company denied. Samsung added that the development of 1b was proceeding stably and that the 1c node is expected to be done on schedule. The company also said that media reports of issues at Samsung's foundry business were overblown and that order books are full, which is why some of its customers have had to produce additional parts with TSMC. Samsung's foundry business reportedly saw an increase in operating profit of 50 percent compared to last year, as well as an increase in revenue of 19 percent.

Samsung Electronics today announced the release of its latest external storage device, the T7 Shield Portable Solid State Drive (PSSD), bringing exceptional performance and reliability in a durable, credit card size design. The T7 Shield is the newest addition to the Samsung T7 Portable SSD family that includes the T7, a daily driver that provides incredibly fast speeds in a sleek design, and the T7 Touch, a CES award-winning PSSD with a built-in fingerprint sensor for enhanced data protection. "Creative professionals and consumers want durable, high-performance and reliable SSDs with the assurance their data will remain safeguarded, even when dropped, exposed to water or used outdoors," said KyuYoung Lee, Vice President of Memory Brand Product Biz Team at Samsung Electronics. "The T7 Shield offers extensive compatibility, enabling consumers to use the new SSD on multiple devices including PC, android smartphone and game console."

The T7 Shield is Samsung's most durable PSSD to date, making it ideal for outdoor content creators or travelers who need data-rich experience without having to worry about data loss from exposure to the elements or life's mishaps. Carefully engineered by Samsung from the inside out, the T7 Shield is shock-resistant from drops of up to three meters, while being IP65-certified as dustproof and water resistant. Despite the new rugged design, the T7 Shield is compact and lightweight, weighing a mere 98 grams.

At the end of 2021, there was quite a lot of noise when it came to India's homegrown semiconductor fab initiative, where the nation was trying to win over Intel, as well as some other semiconductor manufacturers. It would appear that the Indian government has stepped up its efforts and is now actively pitching to Intel, GlobalFoundries and TSMC. The main person behind this is said to be Rajeev Chandrasekhar, the minister of state for technology and entrepreneurship and a former Intel engineer. So far it seems like Chandrasekhar hasn't gotten very far according to the article The Economic Times, where he states that "We're meeting the CEOs, talking to them, making presentations."

On the other hand, recent news has suggested that Foxconn is interested in setting up some kind of foundry in India, in a partnership with local Vedanta Group. It's unclear what kind of semiconductors this would be for though, especially as Vedanta is mostly in the mining industry. The various Indian states are said to be very keen on the other hand, both in terms of getting new industry, but also in getting new investments. Earlier this month, during his tour of several Asian countries, Intel's CEO, Pat Gelsinger had a meeting with the Indian Prime Minister, Narendra Modi, but what came of that meeting is unclear. India is hoping to be able to reproduce the success it has had when it comes to manufacturing smartphones locally, with Samsung, Nokia and Xiaomi producing locally, as well as Taiwanese Foxconn, Wistron and Pegatron, who contract manufacture Apple devices. However, semiconductors are far more complex to make than smartphones, so if India isn't willing to play the long game, it's unlikely much will come of its attempts to attract semiconductor foundries.

The recently announced Intel Arc A350M mobile graphics card is now shipping with it's recent debut in the South-Korean exclusive Samsung Galaxy Book2 Pro laptop. The A350M is the entry-level Arc Alchemist skew from Intel featuring an ACM-G11 GPU with 768 shaders and 4 GB of GDDR6 video memory. This specific Samsung Galaxy Book2 Pro model is also equipped with an Intel Core i5-1240P Alder Lake processor and 16 GB of LPDDR5 memory. The Intel video drivers (30.0.101.132) included with the laptop appear to have issues correctly identifying the card however newer versions are available which should address this.

The laptop was tested in various synthetic and gaming scenarios with the Arc A350M (30 W) performing anywhere from 40% to 60% faster than the NVIDIA MX450 (25 W). The Intel A350M reached a maximum boost clock of 2.2 GHz during gaming with the card offering adequate performance in eSports and older titles. The Galaxy Book2 Pro model with 32 GB of memory and a 1 TB SSD (NT950XEE-XD72S) is currently available to purchase directly from Samsung Korea for 2,520,000 KRW (2,054 USD). Intel has noted that more laptops featuring Arc Alchemist mobile graphics should be launching worldwide in the coming weeks.

Intel in March 2022 kicked off its ambitious campaign to grab a slice of the consumer graphics market, with its Arc "Alchemist" line of discrete GPUs, based on the Xe-HPG graphics architecture. The announcement mentioned an immediate availability of at least the entry-level Arc 3-series GPU models in notebooks generally available. These GPU models include the Arc A350M and Arc A370M. People on social media are beginning to ask Intel why these notebooks are nowhere in sight, and the company responded.

In response to one such query by a user, Intel Support stated that laptops with Arc will be available "by the end of the second quarter of 2022." This would put general availability in June 2022, two months from now. Interestingly, this hasn't stopped laptop manufacturers from raking in pre-orders, with the likes of the Acer Swift X and Samsung Galaxy Book2 Pro up for "grabs." You can "purchase" the Swift X, but shipping dates are stated to be as late as May 23 (now pushed to June 13).

The global smartphone applications processor (AP) market grew 23 percent to $30.8 billion in 2021, according to Strategy Analytics' Handset Component Technologies (HCT) service report. According to this Strategy Analytics' Handset Component Technologies (HCT) research report, " Smartphone Apps Processor Market Share Tracker Q4 2021: Qualcomm Increases Revenue Share Lead", Qualcomm, MediaTek, Apple, Samsung LSI and Unisoc grabbed the top-five revenue share ranking spots in the smartphone applications processor (AP) market in 2021.

Sravan Kundojjala, author of the report and Director of Handset Component Technologies service at Strategy Analytics, commented, "For the first time on an annual basis, MediaTek overtook Qualcomm in units and established over 75 million unit-lead in smartphone APs 2021. MediaTek capitalized on Qualcomm's defocus on mid and low tier 4G LTE APs and gained volume share. Despite the loss of unit share crown, Qualcomm exited 2021 with over 43% higher revenue than MediaTek, thanks to an increased mix of higher-priced premium and high-tier APs. Both companies performed well in the 5G AP segment and posted a 13-year high in their AP average selling prices (ASPs)."

Samsung and Western Digital today signed a memorandum of understanding (MOU) that implies that the two companies will join their efforts to create next-generation data placement, processing, and fabrics (D2PF) storage technologies. The MOU states that the two companies will collaborate on creating Zoned Storage devices, including ZNS (Zoned Namespaces) SSDs and SMR (Shingled Magnetic Recording) HDDs. The ZNS SSD initiative is a challenge of creating entirely new SSDs that work on the ZNS principle instead of traditional block-based drives. Opposite to data in traditional SSDs written in blocks, ZNS SSDs will place data into zones and have software understand where each bit of information is written without excessive read/write action. Another benefit of ZNS is that managing data allows less garbage collection, thus higher efficiency.

Software adoption for ZNS makes it hard, and Samsung's conjoined efforts with Western Digital aim to simplify it. Western Digital notes that "In addition, this collaboration is expected to serve as a starting point to expand zone-based (e.g. ZNS, SMR) device interfaces, as well as future-generation, high-capacity storage devices with enhanced data placement and processing technologies. At a later stage, these initiatives will be expanded to include other emerging D2PF technologies such as computational storage and storage fabrics including NVMe over Fabrics (NVMe-oF)." So, with further development of ZNS, Samsung and Western Digital will collab on more advanced storage options as well.

MPEG LA announced today that enforcement actions have been brought in Landgericht Düsseldorf, Germany against Samsung Electronics GmbH ("Samsung") for infringement of patents in MPEG LA's HEVC Patent Portfolio License. The patents are essential to the HEVC (also known as H.265 and MPEG-H Part 2) digital video coding standard used in products that encode and decode video for Internet, television and mobile transmission, reception and use.

According to the complaints, Samsung Electronics GmbH's parent Samsung Electronics Co. Ltd. was both Licensor and Licensee to MPEG LA's HEVC Patent Portfolio License from Fall 2014 until terminating in March 2020, but Samsung has continued to offer products including smartphones, tablets and televisions in Germany that use patent protected HEVC methods without license since termination. The enforcement actions seeking injunctions, monetary damages and expenses were prepared by a team of lawyers led by Axel Verhauwen of Krieger Mes & Graf v. der Groeben and Gottfried Schüll of Cohausz & Florack.

According to TrendForce forecasts, average overall DRAM pricing in 2Q22 will drop by approximately 0~5%, due to marginally higher buyer and seller inventories coupled with the demand for products such as PCs, laptops, and smart phones being influenced in the short-term by the Russian-Ukrainian war and high inflation weakening consumer purchasing power. At present, the only remaining source of demand is on the server side, so overall DRAM stocks will remain oversupplied in 2Q22.

In terms of PC DRAM, PC OEMs are adopting a conservative stocking strategy for orders in 2Q22 due to the Russian-Ukrainian war, which may continue affecting orders during peak season in 2H22, and revising 2022 shipment targets downwards. Additionally, the overall supply of bits is still growing, so the PC DRAM price slump in 2Q22 will further expand to 3~8% and may continue to deteriorate.

Samsung Electronics today announced its latest Smart Monitor series, the M8, featuring an upgraded, stylish design. The versatile new M8 delivers Samsung's iconic slim design in four new colors — Warm White, Sunset Pink, Daylight Blue and Spring Green — available in 32-inches with UHD resolution and a SlimFit Cam.

First launched in November 2020, Samsung's Smart Monitor series is a family of world's first do-it-all screens designed for modern day users who demand a product that offers both functionality and entertainment at home. Not only being a traditional monitor, but the M8 also allows users to enjoy a variety of OTT services, including Netflix, Amazon Prime Video, Disney+ and Apple TV via Wi-Fi without having to connect to a PC or TV.

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

While there's a lot of talk about cutting edge nodes, Samsung Foundries are looking at alternative options to find new business and are said to be eyeing legacy nodes for future expansions. At the same time, Samsung is looking at setting up its own chip testing and packaging factory, to be able to better serve customers who are looking for a full-service partner. It's not clear which legacy nodes Samsung are eyeing, but the story by Business Korea states that at least some of it will focus on CMOS imaging sensors, since there is apparently a shortage of those too.

Samsung is said to have plans for no less than 300 new customers by 2026 for its foundry business, across all nodes. However, this doesn't mean Samsung will stop developing new, cutting edge nodes, as Samsung is still planning to kick off volume production on its 3 nm node in the first half of this year, with 2 nm said to start volume production in 2025. After its dealings with Nvidia and Qualcomm that haven't been what you'd call successful, the question is who will be willing to partner with Samsung Foundry on its cutting edge nodes in the future.

The output value of the world's top 10 foundries in 4Q21 reached US$29.55 billion, or 8.3% growth QoQ, according to TrendForce's research. This is due to the interaction of two major factors. One is limited growth in overall production capacity. At present, the shortage of certain components for TVs and laptops has eased but there are other peripheral materials derived from mature process such as PMIC, Wi-Fi, and MCU that are still in short supply, precipitating continued fully loaded foundry capacity. Second is rising average selling price (ASP). In the fourth quarter, more expensive wafers were produced in succession led by TSMC and foundries continued to adjust their product mix to increase ASP. In terms of changes in this quarter's top 10 ranking, Nexchip overtook incumbent DB Hitek to clinch 10th place.

TrendForce believes that the output value of the world's top ten foundries will maintain a growth trend in 1Q22 but appreciation in ASP will still be the primary driver of said growth. However, since there are fewer first quarter working days in the Greater China Area due to the Lunar New Year holiday and this is the time when some foundries schedule an annual maintenance period, 1Q22 growth rate will be down slightly compared to 4Q21.