Monday, May 1st 2023
AMD to Shift Some of its 4 nm CPU Silicon-fabrication to Samsung from TSMC
AMD has reportedly signed up with Samsung Electronics to shift some of its 4 nm processor silicon fabrication from TSMC. The apex Taiwan-based foundry is reportedly operating at capacity for its 4 nm-class nodes, with customers such as Apple and Qualcomm sourcing 4 nm mobile SoCs on the node, leaving AMD with limited allocation and/or bargaining power with TSMC. The company relies on 4 nm for its Ryzen 7040 series "Phoenix" mobile processors, and is in the process of adapting its design for Samsung's 4 nm-class nodes (of which there are five types for AMD to choose from).
Switching to Samsung probably gives AMD more scalability, particularly given that "Phoenix" has missed its release timeline, leaving AMD with the 5 nm + 6 nm Ryzen 7045 series "Dragon Range" MCM in the premium segments, and older 6 nm 7035 series "Rembrandt-R" in the mainstream and ultraportable segments, but nothing "apt" to compete against Intel "Raptor Lake-U" and "Raptor Lake-P." AMD has a limited window in which to ramp up "Phoenix," as Intel readies "Meteor Lake" for a 2H-2023 debut, with a focus on mobile variants.
Sources:
Wccftech, OreXda (Twitter)
Switching to Samsung probably gives AMD more scalability, particularly given that "Phoenix" has missed its release timeline, leaving AMD with the 5 nm + 6 nm Ryzen 7045 series "Dragon Range" MCM in the premium segments, and older 6 nm 7035 series "Rembrandt-R" in the mainstream and ultraportable segments, but nothing "apt" to compete against Intel "Raptor Lake-U" and "Raptor Lake-P." AMD has a limited window in which to ramp up "Phoenix," as Intel readies "Meteor Lake" for a 2H-2023 debut, with a focus on mobile variants.
44 Comments on AMD to Shift Some of its 4 nm CPU Silicon-fabrication to Samsung from TSMC
www.tomshardware.com/news/iphone-6s-a9-samsung-vs-tsmc,30306.html
Hopefully the differences between the two sources end up minimal for consumers.
Pat: “World say hello to Intel 7 available now for fab customers.”
World: …cricket sounds…
Pity they can't move the low-end RDNA3 parts there, instead of TSMC 6nm.
IIRC, the K7 (Slot A / Socket 462/A) Athlon XP era had multiple fabs making "the same chip", but they physically were different packages, and had different OCing qualities. I think I've ran across this w/ older nVidia GPUs as well (diff fabs, on diff processes, making the same gen uArch dies; with different dimensional and clocking qualities)
I recall that besides RDNA IP, Samsung might be working with the Xilinx half to help improve their Exynos after repeated failures, and there was some speculation of maybe involving AMD on a joint chip design to basically redesign Exynos from the ground up.
www.digitimes.com/news/a20230118PD216/5nm-tsmc.html
Laptop chips also downclock incredibly quickly so there's that.
(To be clear, I'm not saying that a single design can simply be copied to another stack of floppies and mailed to Korea; I'm saying AMD has had enough time to prepare.)
if the can push idle power to an absolute minimum they would make nice stb and nas processors even if they can’t reach super high clocks.