TSMC is reportedly negotiating with NVIDIA to manufacture advanced "Blackwell" GPUs in its Arizona facility. First reported by Reuters, this partnership could mark another major shift in AI chip production toward US soil. The discussion centers around TSMC's Fab 21 in Phoenix, Arizona, specializing in 4 nm and 5 nm chip production. NVIDIA's Blackwell GPUs utilize TSMC's 4NP process technology, making the Arizona facility a technically viable production site. However, the proposed arrangement faces several logistical challenges. A key issue is the absence of advanced packaging facilities in the United States. There is Amkor that planned to do advanced packaging, but it's only scheduled to begin packaging in 2027. TSMC's sophisticated CoWoS packaging technology is currently available only in Taiwan. This means that chips manufactured in Arizona would need to be shipped back to Taiwan for final assembly, potentially increasing production costs.

While alternative solutions exist, such as redesigning the chips to use Intel's packaging technology or focusing on gaming GPU production in Arizona, these options present their own complications. Intel's packaging methods would likely increase costs, and the current absence of graphics card manufacturing infrastructure in the US makes domestic gaming GPU production less practical. Both TSMC and NVIDIA have declined to comment on the ongoing negotiations, as this is confidential information unknown to the public. Interestingly, TSMC's Arizona facility has already attracted a few more US firms for domestic manufacturing, like Apple, rumored to manufacture its A16 Bionic chip and AMD with high-performance designs, likely either EPYC or Instinct MI chips.

The American semiconductor landscape reached a significant milestone as TSMC's new Arizona manufacturing facility demonstrated remarkable production efficiency, exceeding its Taiwanese counterparts by 4% in yield rates. This achievement, revealed at a recent industry webinar by the company's US division chief, represents a major step forward in America's push to strengthen domestic chip manufacturing capabilities. Since initiating its 4 nm node production operations this spring, the Phoenix-based facility has demonstrated impressive technical proficiency, achieving production standards that match and surpass TSMC's established Taiwanese facilities. The project, backed by substantial federal support, including $11.6 billion in combined grants and loans plus significant tax incentives, aims to establish three cutting-edge manufacturing plants in Arizona.

The company's global leadership praised the facility's performance, noting its strategic importance in demonstrating TSMC's ability to maintain exceptional manufacturing standards across international locations. This success carries particular weight given the project's earlier hurdles, which included workforce challenges and timeline adjustments that shifted the entire production schedule by approximately one year. This development gains additional significance against industry-wide challenges, particularly as competitors like Intel and Samsung face operational and financial obstacles. The semiconductor giant's plans now extend to potential further expansion, with the Phoenix site capable of hosting up to six manufacturing facilities. Future growth prospects could be enhanced by proposed additional government initiatives supporting domestic chip production.

The second generation of AMD Ryzen Z-series processors for handheld gaming consoles, will be led by the Ryzen Z2 Extreme. There will also be an affordable Ryzen Z2 (non-Extreme). We've known for some time that the Z2 Extreme is based on the 4 nm "Strix Point" monolithic silicon, with some optimization (the highest bins to facilitate the best energy efficiency); but now we have a few more details thanks to a leak by Golden Pig Upgrade. AMD's engineering effort with the Z2 Extreme will be to give the console the most generational performance uplift from the iGPU, rather than the CPU.

The "Strix Point" silicon features a significantly updated iGPU from the previous-generation "Phoenix." It's based on the more efficient RDNA 3.5 graphics architecture, which is better optimized for LPDDR5 memory; and comes with 16 compute units (CU), compared to 12 on the "Phoenix." The Ryzen Z2 Extreme will come with all 16 CU enabled. The CPU is where some interesting changes are planned. The "Strix Point" silicon features a dual-CCX CPU, one of these contains four "Zen 5" CPU cores sharing a 16 MB L3 cache, while the other features eight "Zen 5c" cores sharing an 8 MB L3 cache. For the Ryzen Z2 Extreme, AMD is going with an odd 3+5 core configuration. What this means is that the Ryzen Z2 Extreme will have 3 "Zen 5" cores, and 5 "Zen 5c" cores. The L3 cache on the CCX with "Zen 5" cores has been reduced to 8 MB in size. On paper, this is still an 8-core/16-thread CPU with 16 MB of L3 cache (same as "Phoenix,") but now you know that there's more going on.

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TSMC has reportedly managed to produce yields at its Arizona facility that are on par with yields back home in Taiwan, making its expansion efforts successful. According to Bloomberg, TSMC did a trial production, a multi-month effort, to produce N4 node wafers with low defect rates. With wafers now in TSMC's labs for testing, it is reported that Arizona facility yields have achieved parity with their Taiwanese facilities back home. This indicates that TSMC's efforts to expand in the US are so far considered a success, as advanced chipmaking is a very complex process that is only done by a few makers and in very few locations. With TSMC expanding in the US now and proving that its technology can work on US soil, the company has a green light to start volume production in the first half of 2025.

However, this is only the beginning of TSMC's Arizona expansion. The Taiwanese giant plans to have a second fab operational by 2028 and produce 2 nm and 3 nm chips in the state. Additionally, there will be a third facility for 2 nm and more advanced nodes in Phoenix, bringing the total value of TSMC's US expansion efforts to $65 billion, with $6.6 billion from the CHIPS Act grants and $5 billion in loans from the US government. If upcoming fabs follow the lead of the first facility, US-based production needs will possibly be satisfied.

TechPowerUp has released version 2.60.0 of GPU-Z, a popular graphics sub-system information, monitoring, and diagnostic utility. This latest update brings significant enhancements, including full support for the Arm64 architecture and Qualcomm Snapdragon X Elite GPUs. The release also adds support for AMD Zen 5 CPU temperature monitoring and a wide range of new GPUs from NVIDIA, AMD, and Intel. Notable additions include the NVIDIA 4070 Ti Super (AD102), RTX 4070 (AD103), RTX 4060 Ti (AD104), RTX 4060 (AD106), as well as AMD Zen 5 (Strix Point and Granite Ridge), and Intel Raptor Lake U SKUs and Meteor Lake Intel Arc Graphics.

In addition to expanded hardware support, GPU-Z 2.60.0 addresses several important issues. The update fixes NVIDIA driver version reporting for some pre-2015 versions, resolves an installer problem that prevented closing running instances of GPU-Z, and corrects the "0 MHz" memory clock display on certain AMD RDNA GPUs without overclocking support. Other improvements include a small handle leak fix, added support for the Monster Notebook subvendor ID, and compatibility with new VMWare virtual GPU IDs. The installer now requires Windows 7 or newer, with appropriate messaging for unsupported systems. Users can download the latest version of TechPowerUp GPU-Z from the official TechPowerUp website to access these new features and improvements.

DOWNLOAD: TechPowerUp GPU-Z 2.60.0

The first die shot of AMD's new 4 nm "Strix Point" mobile processor surfaced, thanks to an enthusiast on Chinese social media. "Strix Point" is a significantly larger die than "Phoenix." It measures 12.06 mm x 18.71 mm (L x W), compared to the 9.06 mm x 15.01 mm of "Phoenix." Much of this die size increase comes from the larger CPU, iGPU, and NPU. The process has been improved from TSMC N4 on "Phoenix" and its derivative "Hawk Point," to the newer TSMC N4P node.

Nemez (GPUsAreMagic) annotated the die shot in great detail. The CPU now has 12 cores spread across two CCX, one of which contains four "Zen 5" cores sharing a 16 MB L3 cache; and the other with eight "Zen 5c" cores sharing an 8 MB L3 cache. The two CCXs connect to the rest of the chip over Infinity Fabric. The rather large iGPU takes up the central region of the die. It is based on the RDNA 3.5 graphics architecture, and features 8 workgroup processors (WGPs), or 16 compute units (CU) worth 1,024 stream processors. Other key components include four render backends worth 16 ROPs, and control logic. The GPU has its own 2 MB of L2 cache that cushions transfers to the Infinity Fabric.

AMD is about give the new "Zen 5" microarchitecture a near-simultaneous launch across both its client segments—desktop and mobile. The desktop front is held by the Ryzen 9000 "Granite Ridge" Socket AM5 processors; while Ryzen AI 300 "Strix Point" powers the company's crucial effort to capture Microsoft Copilot+ AI PC market share. We recently did a technical deep-dive on the two. HardwareLuxx.de scored two important bits of specs for both processors in its Q&A interaction with AMD—die sizes and transistor counts.

To begin with, "Strix Point" is a monolithic silicon, which is confirmed to be built on the TSMC N4P foundry node (4 nm). This is a slight upgrade over the N4 node that the company built its previous generation "Phoenix" and "Hawk Point" processors on. The "Strix Point" silicon measures 232.5 mm² in area, which is significantly larger than the 178 mm² of "Hawk Point" and "Phoenix." The added die area comes from there being 12 CPU cores instead of 8, and 16 iGPU compute units instead of 12; and a larger NPU. There are many other factors, such as the larger 24 MB CPU L3 cache; and the sizes of the "Zen 5" and "Zen 5c" cores themselves.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

Handheld gaming devices are a dime a dozen these days and more and more companies are joining the fray on almost a weekly basis. At Computex, XPG was showing its upcoming handheld gaming device—currently known as the NIA—and it has several interesting features that most of their competitors haven't mentioned so far. The potentially most interesting feature that XPG has implemented is an LPCAMM2 module with support for up to 64 GB of LPDDR5x memory. XPG didn't list how much RAM the NIA will ship with, but 16 or 32 GB seems like the logical choices.

The device will be powered by AMD's Phoenix APU, but no details were given. XPG has implemented support for foveated rendering, which the company claims is an exclusive feature. This is courtesy of a front-facing camera with eye tracking, but it's unclear how exactly it'll work, since it won't be exactly the same as in a VR headset. The NIA will ship with an XPG Gammix S55 SSD, which is an M.2 2230 PCIe 4.0 NVMe drive with sizes of up to 2 TB. XPG also claims that the NIA is built for a "circular computing product lifecycle" whatever that means, but we're guessing it has something to do with using recycled materials and being recyclable. The screen size of the 1080p, 120 Hz display wasn't mentioned, but the screen can be tilted for better ergonomics and is supposed to deliver up to 500 nits brightness. The NIA also has a built-in kickstand.

AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

Enthusiasts on the ChipHell forum scored an alleged image of AMD's upcoming "Strix Halo" mobile processor, and set out to create some highly plausible schematic slides. These are speculative. While "Strix Point" is the mobile processor that succeeds the current "Hawk Point" and "Phoenix" processors; "Strix Halo" is in a category of its own—to offer gaming experiences comparable to discrete GPUs in the ultraportable form-factor where powerful discrete GPUs are generally not possible. "Strix Halo" also goes head on against Apple's M3 Max and M3 Pro processors powering the latest crop of MacBook Pros. It has the same advantages as a single-chip solution, as the M3 Max.

The "Strix Halo" silicon is a chiplet-based processor, although very different from "Fire Range". The "Fire Range" processor is essentially a BGA version of the desktop "Granite Ridge" processor—it's the same combination of one or two "Zen 5" CCDs that talk to a client I/O die, and is meant for performance-thru-enthusiast segment notebooks. "Strix Halo," on the other hand, use the same one or two "Zen 5" CCDs, but with a large SoC die featuring an oversized iGPU, and 256-bit LPDDR5X memory controllers not found on the cIOD. This is key to what AMD is trying to achieve—CPU and graphics performance in the league of the M3 Pro and M3 Max at comparable PCB and power footprints.

The Orange Pi Neo handheld gaming PC was first exhibited in Europe earlier in the year—where the Manjaro Linux team handed out demo units to attendees of FOSDEM. The initial batch of Orange Pi Neo handhelds were specced with AMD's ubiquitous Ryzen 7 7840U "Phoenix" mobile APU, but a recent official launch event—in China—revealed a new-gen alternative. The Manjaro Linux social media account summarized this weekend presentation: "we launched Orange Pi Neo in Shenzhen. The Ryzen 7 7840U model (16 GB/512 GB) will be 4099 CNY / 499 USD and Ryzen 7 8840U (16 GB/512 GB) model starts at 4499 CNY / 599 USD."

The newly unveiled price points have been deemed quite reasonable and competitive—when lined up against the nearest competition. The Manjaro Linux distribution could be a sticking point for more discerning OS-heads, but alternative operating routes could be outlined by online communities in the near future. The $599 AMD "Hawk Point" Ryzen 7 8840U-based option seems to be slightly overpriced, when you consider the marginal performance improvements it levies when compared to the very similarly appointed Ryzen 7 7840U APU. The "modernized" processor nets you a more potent XDNA NPU, but both product generations house Team Red's Radeon 780M iGPU. Orange Pi and Manjaro are likely testing the waters with an initial Chinese market launch—we hope to see a wider global rollout in the coming months.

AMD's first generation XDNA-based Neural Processing Unit (NPU) arrived last year, as an onboard aspect of their "Phoenix" Ryzen 7040 mobile processor series, followed many months later by Intel's similarly NPU-laden Core Ultra "Meteor Lake" generation. It was recently revealed that a Windows 11 DirectML preview grants preliminary support for Core Ultra NPUs—Microsoft's software engineering department seems to be prioritizing Intel AI tech. Team Red has already released XDNA on desktop platforms—with its Ryzen 8000G APU family—and the "Hawk Point" 8040 series is nearing a retail launch, but these processors (plus 7040) remain unsupported by Microsoft's DirectML API. An interesting AMD community blog entry was posted two weeks—news outlets have been slow to pick up on its relevance.

Intel NPU activity can be monitored in Windows Task Manager (see screenshot below), and an upcoming update will add competing AMD parts to the mix. Joel Hruska's Team Red community blog post reveals that NPU monitoring for Ryzen 8040 series processors is due soon: " As AI PCs become more popular, there's a growing need for system monitoring tools that can track the performance of the new NPUs (Neural Processing Units) available on select Ryzen 8040 Series mobile processors. A neural processing unit - also sometimes referred to an integrated or on-die AI engine -- can improve battery life by offloading AI tasks that would otherwise be performed on the CPU or GPU. AMD has been working with Microsoft to enable MCDM (Microsoft Compute Driver Model) infrastructure on the AMD NPU (Neural Processing Unit)-enabled Ryzen 8040 Series of mobile processors. MCDM is a derivative of Windows Display Driver Model (WDDM) that is targeting non-GPU, compute devices, such as the NPU. MCDM enables NPUs to make use of the existing GPU device management infrastructure, including scheduling, power management, memory management, and performance debugging with tools such as the Task Manager. MCDM serves as a fundamental layer, ensuring the smooth execution of AI workloads on NPU devices."

We already know about AMD Ryzen 7 8700G APU's enjoyment of overclocked memory—early reviews demonstrated the graphical benefits granted by fiddling with "iGPU engine clock and the processor's memory frequency." While gamers can enjoy a boosted integrated graphics solution that is comparable in performance 1080p stakes to a discrete Radeon RX 6500 XT GPU, AI enthusiasts are eager to experiment with the "Hawk Point" pat's Radeon 780M IGP and Neural Processing Unit (NPU)—the first generation Ryzen XDNA inference engine can unleash up to 16 AI TOPs. One individual, chi11eddog, posted their findings through social media channels earlier today, coinciding with the official launch of Ryzen 8000G processors. The initial set of results concentrated on the Radeon 780M aspect; NPU-centric data may arrive at a later date.

They performed quick tests on AMD's freshly released Ryzen 7 8700G desktop processor, combined with an MSI B650 Gaming Plus WiFi motherboard and two sticks of 16 GB DDR5-4800 memory. The MSI exclusive "Memory Try It" feature was deployed further up in the tables—this assisted in achieving and gauging several "higher system RAM frequency" settings. Here is chi11eddog's succinct interpretation of benchmark results: "7600 MT/s is 15% faster than 4800 MT/s in UL Procyon AI Inference Benchmark and 4% faster in GIMP with Stable Diffusion." The processor's default memory state is capable of producing 210 Float32 TOPs, according to chi11eddog's inference chart. The 6000 MT/s setting produces a 7% improvement over baseline, while 7200 MT/s drives proceedings to 11%—the flagship APU's Radeon 780M iGPU appears to be quite dependent on bandwidth. Their GIMP w/ Stable Diffusion benchmarks also taxed the integrated RDNA 3 graphics solution—again, it was deemed to be fairly bandwidth hungry.

AMD's Ryzen 7040 "Phoenix" mobile APUs debuted last year with Ryzen AI capabilities (via onboard Xilinx IP), thanks to the fitting of an on-board NPU—Team Red's first generation XDNA AI Engine received immediate support on Windows platforms. Naturally, Linux users expressed frustration about being left out in the cold—later on in the year, AMD put some feelers out (as reported by Phoronix), and gauged interest in a potential Linux deployment of Ryzen AI. Fast forward to January 2024, we see movement with an initial release on open platforms—according to Michael Larabel's latest article: "More than 1,000 requests for Linux support were logged following that October statement and since then I've been hearing quietly of AMD working on Linux support... Well, there's now an open-source but currently out-of-tree driver available. "

AMD's GitHub has been updated with the "first public code drop of the XDNA Linux driver." According to System Requirements, the entry point "to run AI applications (test machine) on an Ryzen AI processor" is Phoenix silicon, as expected. Ryzen 8040 "Hawk Point" is presumably on the support list, since it shares the same basic underpinnings—albeit with greater NPU performance. One of AMD's GitHub authors has teased that "Strix" will also be supported in the future—second generation XDNA NPUs are expected to drop later this year. Targets for GFX1150 and GFX1151 were uncovered earlier this week—"Strix Point" and "Strix Point Halo" (respectively) are codenames for next generation Team Red APUs.

As one of the leading brands in the mini PC industry, GEEKOM has released lots of premium products in the last couple of years. The latest addition to their incredibly diverse lineup is the GEEKOM A7, a 4x4 PC system that features a powerful AMD Phoenix Ryzen 7040 chip, a PCIe Gen 4 SSD, DDR5-5600 MHz RAM, and many other cutting-edge technologies.

The GEEKOM A7's unibody aluminium housing measures only 112.4*112.4*37 mm (0.47 liters). The rounded corners and matte silver coating give the mini PC a soft but gorgeous look, making it particularly attractive to female users. With a footprint smaller than a book, the A7 easily fits into all kinds of desktop arrangement and can be conveniently transported from one place to another.

GPD has disclosed to ITHome that a specification refresh of its Win Max 2 handheld/mini-laptop gaming PC is incoming—this model debuted last year with Ryzen 7040 "Phoenix" APUs sitting in the driver's seat. A company representative provided a sneak peek of an upgraded device that sports a Team Red Ryzen 8040 series "Hawk Point" mobile processor, and a larger pool of system memory (32 GB versus the 2023 model's 16 GB). The refreshed GPD Win Max 2's Ryzen 7 8840U APU was compared to the predecessor's Ryzen 7 7840U in CPU-Z benchmarks (standard and AX-512)—the results demonstrate a very slight difference in performance between generations.

The 8040 and 7040 APUs share the same "Phoenix" basic CPU design (8-cores + 16-threads) based on the prevalent "Zen 4" microarchitecture, plus an integration of AMD's Radeon 780M GPU. The former's main upgrade lies in its AI-crunching capabilities—a deployment of Team Red's XDNA AI engine. Ryzen 8040's: "NPU performance has been increased to 16 TOPS, compared to 10 TOPS of the NPU on the 'Phoenix' silicon. AMD is taking a whole-of-silicon approach to AI acceleration, which includes not just the NPU, but also the 'Zen 4' CPU cores that support the AVX-512 VNNI instruction set that's relevant to AI; and the iGPU based on the RDNA 3 graphics architecture, with each of its compute unit featuring two AI accelerators, components that make the SIMD cores crunch matrix math. The whole-of-silicon performance figures for "Phoenix" is 33 TOPS; while 'Hawk Point' boasts of 39 TOPS. In benchmarks by AMD, 'Hawk Point' is shown delivering a 40% improvement in vision models, and Llama 2, over the Ryzen 7040 "Phoenix" series."

Yesterday's CPU-Z update—now version 2.09—brings support for unreleased next generation Intel and AMD processors. PC hardware sleuths have combed through the freeware app's mid-January changelog—we first see "improved support" for Intel's recently launched 14th Generation Meteor Lake mobile CPU series, while the same line also mentions "preliminary support" for Team Blue's Arrow Lake desktop processor family. The latter is hotly anticipated to launch at the tail-end of 2024, so it is intriguing to see CPU-Z's development team getting familiar with Intel's mainstream 15th gen microarchitecture.

The main competition also makes an appearance further down—AMD's "Hawk Point and Hawk Point 2 (Zen 4/Zen 4c)" CPU families are present, although the changelog does not clarify whether this is preliminary support (or full blown). "Hawk Point" seems to be a very light refresh of their proceeding "Phoenix" product line, with some extra NPU "oomph" sprinkled in. The rumor mill has Team Red's Ryzen 8040 Series of mobile parts marked down for a first quarter 2024 launch. Version 2.09 also adds support for NVIDIA GeForce RTX 4070 SUPER (AD104-350-A1) GPUs. We expect to see the higher-up models joining in on the fun, with upcoming CPU-Z updates.

Hot on the heels of yesterday's leak revealing that the Ryzen 5 8600G Socket AM5 desktop APU features a Radeon 760M iGPU with 8 CU, we're getting to know that the top of the line Ryzen 7 8700G comes with the maxed out Radeon 780M. The 8700G is a Socket AM5 APU based on the 4 nm "Hawk Point" or "Phoenix" silicon (unclear at this point).

The Ryzen 7 8700G features an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a base frequency of 4.20 GHz, and a maximum boost frequency of 5.10 GHz. Each of the 8 CPU cores features a 1 MB L2 cache, and they share a 16 MB L3 cache. The Radeon 780M iGPU features 12 compute units (CU), amounting to 768 stream processors. The iGPU engine clock boosts up to 2.90 GHz. While all Ryzen 7000 desktop processors come with integrated graphics, AMD does not consider them to be APUs—processors with overpowered iGPUs that can be used for entry-level gaming besides high-resolution entertainment.

GIGABYTE released UEFI firmware (BIOS) updates for its Socket AM5 motherboards encapsulating the AMD AGESA ComboAM5 PI 1.1.0.1a microcode. This latest version of AGESA has sparked speculation that some of AMD's upcoming Ryzen 8000G desktop APUs are in fact based on the newer "Hawk Point" silicon, and not "Phoenix." AMD released its Ryzen 8040 series "Hawk Point" mobile processors earlier this month, with a faster NPU that results in an up to 40% increase in AI interference performance over that of "Phoenix." "Hawk Point" is essentially identical to "Phoenix," including its first generation XDNA architecture based NPU, however the NPU's clock speed has been dialed up. If AMD is building some of its Ryzen 8000G desktop APU models on "Hawk Point" instead of "Phoenix," then we have our first solid hint that AMD is bringing Ryzen AI to the desktop platform, and that the Ryzen 8000G will end up being the first desktop processors with an NPU.

AMD is expected to be building at least two APU models based on the "Hawk Point" silicon, the Ryzen 7 8700G, and the Ryzen 5 8600G. The lower models, namely the 8500G and Ryzen 3 8300G, are expected to be based on the smaller "Phoenix 2" silicon, with a hybrid CPU that combines two "Zen 4" cores with up to four "Zen 4c" cores. The "Zen 4c" cores may feature an identical instruction set architecture (ISA) and IPC to the regular "Zen 4" cores, but have tighter Vcore limits, and operate at lower clock speeds. This makes the two available "Zen 4" cores the de facto "performance" cores, and AMD flags them as UEFI CPPC "preferred cores," ensuring the OS guides a bulk of its processing traffic to them. Both "Phoenix" and "Hawk Point" feature an identical CPU setup, with up to eight "Zen 4" cores.

Here is our first look at the higher end of AMD's Ryzen 8000G series Socket AM5 desktop APU lineup. The company is planning to bring its 4 nm "Phoenix" and "Phoenix 2" monolithic silicon to the socketed desktop platform, to cover two distinct markets. Models based on the larger "Phoenix" silicon cater to the market that wants a sufficiently powerful CPU, but with a powerful iGPU that's fit for entry-level gaming, or graphics-intensive productivity tasks; whereas the smaller "Phoenix 2" silicon ties up the lower end of AMD's AM5 desktop processor stack, as it probably has a lower bill of materials than a "Raphael" multi-chip module.

The lineup is led by the Ryzen 7 8700G, a direct successor to the Ryzen 7 5700G "Cezanne." This chip gets the full 8-core/16-thread "Zen 4" CPU, along with its 16 MB shared L3 cache; and the full featured Radeon 780M iGPU with its 12 compute units worth 768 stream processors. The CPU features a maximum boost frequency of 4.20 GHz. This is followed by the Ryzen 5 8600G, which is based on the same "Phoenix" silicon as the 8700G, but with 6 out of 8 "Zen 4" cores enabled, and a maximum CPU boost frequency of 4.35 GHz, and the 16 MB L3 cache left untouched. It's likely that the Radeon 780M is unchanged from the 8700G.Update 13:59 UTC: A CPU-Z screenshot of the Ryzen 7 8700G surfaced, which confirms that it features the maxed out Radeon 780M iGPU

Intel on Wednesday held a pre-launch round-table with HotHardware, in which it made several performance disclosures of its upcoming Core "Meteor Lake" mobile processor, comparing it with the current U-segment chips based on the 13th Gen Core "Raptor Lake," and competing AMD Ryzen 7040 "Phoenix." In these, the company is claiming that its next-generation iGPU based on the Xe-LPG graphics architecture, armed with 128 EU, is significantly outperforming the Radeon 780M RDNA3 iGPU of the Ryzen 7040, while its CPU is ahead in multi-threaded performance.

In its comparison, the company picked the Core Ultra 7 165H, a middle-of-the-market performance segment part in the 28 W class. This is compared to the Core i7-1370P "Raptor Lake," and the AMD Ryzen 7 7840U. The company also dropped in the fastest Windows-ready Arm chip in the market, the Qualcomm 8cx Gen 3. In the 33 games that the 165H was compared to the 7840U, the Intel iGPU is shown posting performance leads ranging between 3% to 70% over the Radeon 780M, in 23 out of 33 games. In one of the games, the two perform on par with each other. In 9 out of 33 games, the Radeon 780M beats the Intel Xe-LPG by 2% to 18%. The iGPU of the 165H packs 8 Xe cores, or 128 EU (1,024 unified shaders). The Radeon 780M is powered by 12 RDNA3 compute units (768 stream processors).

ASUS began rolling out beta UEFI firmware updates for its Socket AM5 motherboards that contain the latest AMD AGESA 1.1.0.1 microcode. If you recall, ASRock had recently released its own firmware updates last month that feature AGESA 1.1.0.0. This would be the first widely released firmware from ASUS to support the upcoming Ryzen 8000G "Phoenix" and "Phoenix 2" desktop APUs; and the 4th AGESA release to do so. Version ComboAM5PI 1.1.0.1 contains a newer version of the system management unit (SMU) for "Phoenix" and "Phoenix 2," with SMU version 76.75.0, compared to version 76.72.0 with the older ComboAM5PI 1.1.0.0 that ASRock released in November.

The UEFI firmware updates by ASUS containing AGESA ComboAM5PI 1.1.0.1 are only being released for AMD B650/E and X670/E chipset motherboards, and only spanning the company's ROG, ROG Strix, TUF Gaming, and ProArt product lines, we haven't come across one for the Prime series, yet. It's important to reiterate here, that these are beta updates, and those with Ryzen 7000 "Raphael" processors don't stand to benefit from them, as the SMU for "Raphael" hasn't changed since ComboAM5PI 1.0.8.0. Check for the firmware updates in the Support section of the product pages of your motherboard on the ASUS website.

The market for mini PCs has been blooming recently, and GEEKOM has been working to put themselves at the forefront with exceptionally well priced and decently performing machines mainly benefiting from their partnership with ASUS. We don't have much info about this upcoming mini PC except that it will offer configurations based on either the Ryzen 7 7840HS or Ryzen 9 7940HS and departs from the ASUS PN series styling for an aluminium chassis that takes clear inspiration from Apple's Mac Mini. Whether this is due to a vendor change or the efforts of internal R&D we'll likely learn when it launches. Aside from the rounded corners, bead blasted aluminium finish, and rear I/O laid out on a black accent fascia plate little else about the machine compares to the Mini except the tiny size at a mere 112.4 x 112.4 mm (4.43 in). Despite this tiny frame the I/O compliment is decent; three 10 Gbps USB 3.2 Gen 2 Type A ports, a 5 Gbps USB 3.2 Gen 1 Type A, a 40 Gbps and a 10 Gbps Type C that can each handle DisplayPort out, two HDMI ports, a 2.5G Ethernet jack, SD Card reader on the side, and one 3.5 mm combo audio jack at the front.

GEEKOM is expected to launch this new mini PC model in Asia within the next month. Worldwide availability should follow soon after. Competitor offerings with similar hardware configurations have been available for a few months by now and have been seen discounted down to around $600 USD in recent weeks, with barebone unit prices going even lower. GEEKOM has quite the challenge ahead of them to offer competitive value.