AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

Apparently the AMD "Strix Halo" processor is real, and it's large. The chip is designed to square off against the likes of the Apple M3 Pro and M3 Max, in letting ultraportable notebooks have powerful graphics performance. A chiplet-based processor, not unlike the desktop socketed "Raphael," and mobile BGA "Dragon Range," the "Strix Halo" processor consists of one or two CCDs containing CPU cores, wired to a large die, that's technically the cIOD (client I/O die), but containing an oversized iGPU, and an NPU. The point behind "Strix Halo" is to eliminate the need for a performance-segment discrete GPU, and conserve its PCB footprint.

According to leaks by Harukaze5719, a reliable source with AMD leaks, "Strix Halo" comes in a BGA package dubbed FP11, measuring 37.5 mm x 45 mm, which is significantly larger than the 25 mm x 40 mm size of the FP8 BGA package that the regular "Strix Point," "Hawk Point," and "Phoenix" mobile processors are built on. It is larger in area than the 40 mm x 40 mm FL1 BGA package of "Dragon Range" and upcoming "Fire Range" gaming notebook processors. "Strix Halo" features one or two of the same 4 nm "Zen 5" CCDs featured on the "Granite Ridge" desktop and "Fire Range" mobile processors, but connected to a much larger I/O die, as we mentioned.

Technical specifications for ASUS TUF Gaming A16 (2024) laptops have appeared online, and sleuths were intrigued by the inclusion of a new entry in AMD's "Dragon Range" mobile processor series. The autumn 2023 rumor mill had a number of lower positioned Ryzen 7045 models lined up in Team Red's future release schedule. Chinese hardware channel—Golden Pig Upgrade—named the Ryzen 9 7940HX processor as a leaked prime candidate within this batch of unreleased SKUS; their prediction has emerged as accurate—thanks to 2024 TUF Gaming portable PCs appearing with this choice of Dragon Range chip.

Team Red's Ryzen 9 7940HX retains the usual characteristics of Dragon Range—Zen 4 architecture, 16 cores + 32 threads, and 64 MB of L3 cache—but arrives with a 200 MHz lower turbo clock speed (max. 5.2 GHz) when compared to the slightly more potent Ryzen 9 7945HX (max. 5.4 GHz). The ASUS TUF Gaming laptop specification sheets do not provide any information about the 7940HX's base clock. Various media outlets believe that a Ryzen 9 7840HX (12-core) processor could arrive alongside the 16-core model, but have expressed confusion over AMD's nomenclature for Dragon Range product launches in Q1 2024. Team Red's system (see below) suggests that "8940HX and 8840HX" would be more appropriate monikers—perhaps various delays have resulted in certain 2023 products being pushed into the new year.

With Windows 11 23H2 setting the stage for increased prevalence of AI in client PC use cases, the new hardware battleground between AMD and its rivals Intel, Apple, and Qualcomm, will be in equipping their mobile processors with sufficient AI acceleration performance. AMD already introduced accelerated AI with the current "Phoenix" processor that debuts Ryzen AI, and its Xilinx XDNA hardware backend that provides a performance of up to 16 TOPS. This will see a 2-3 fold increase with the company's 2024-25 mobile processor lineup, according to a roadmap leak by "Moore's Law is Dead."

At the very top of the pile, in a product segment called "ultimate compute," which consists of large gaming notebooks, mobile workstations, and desktop-replacements; the company's current Ryzen 7045 "Dragon Range" processor will continue throughout 2024. Essentially a non-socketed version of the desktop "Raphael" MCM, "Dragon Range" features up to two 5 nm "Zen 4" CCDs for up to 16 cores, and a 6 nm cIOD. This processor lacks any form of AI acceleration. In 2025, the processor will be succeeded with "Fire Range," a similar non-socketed, mobile-friendly MCM that's derived from "Granite Ridge," with up to two 4 nm "Zen 5" CCDs for up to 16 cores; and the 6 nm cIOD. What's interesting to note here, is that the quasi-roadmap makes no mention of AI acceleration for "Fire Range," which means "Granite Ridge" could miss out on Ryzen AI acceleration from the processor. Modern discrete GPUs from both NVIDIA and AMD support AI accelerators, so this must have been AMD's consideration to exclude an XDNA-based Ryzen AI accelerator on "Fire Range" and "Granite Ridge."

MINISFORUM today is launching their BD770i ITX "Mobile on Desktop" motherboard which comes equipped with AMD's 8-core "Zen 4" Ryzen 7 7745HX. Upon the CPU sits a custom "integrated advanced cooling system" which partially exhausts out of the I/O shield and supports installation of a 120 mm fan, which is not included. The board features dual actively cooled M.2 2280 PCI-E Gen 5 SSDs plus M.2 2230 E-Key for WLAN cards, 2.5G Ethernet, a pair of USB 2.0 ports, another pair of USB 3.2 Gen 1 ports, and a USB 3.2 Gen 2 Type-C port that also supports display out as DisplayPort 1.4. The BD770i also features dual SODIMM slots for up to DDR5-5200 DRAM, as well as a full length PCI-E Gen 5 x16 for dedicated graphics cards. A small detail we noticed in the product images is the silhouette of two more M.2 ports on the rear of the board that aren't in the specifications. On the product page there are mentions of a higher-end BD790i with the Ryzen 9 7945HX which does not seem to be available yet, so perhaps this higher end board will feature these extra ports.

Despite the AMD Ryzen 7 7745HX supporting overclocking features such as an unlocked multiplier, AMD EXPO, and Precision Boost Overdrive; MINISFORUM has chosen to not support those features on the BD770i. Perhaps the upcoming BD790i will include OC support and features, we'll have to wait and see. Pricing for the BD770i is currently set at $399 USD for early orders, however the price is expected to increase to $499 USD after the launch period promotion expires.

MSI, the global leading gaming brand, will participate in the Tokyo Game Show 2023 (TGS 2023) during Sept. 21st to 24th, held at the Makuhari Messe in Chiba, Japan. This year's TGS marks the full return of physical exhibitions and the removal of age restrictions for entry, providing exhibitors with more space to showcase their latest games and products. Players under the age of 12 can freely enter the venue, attracting more families to visit. Additionally, this year's TGS VR will have a game island theme, and after downloading the app, players can enter for free using a computer, VR equipment, or smartphones. This allows players who cannot attend in person to enjoy this immersive gaming event through virtual reality technology.

"As a global leader in gaming, MSI has always maintained close communication and interaction with fans and gamers. The full return of Tokyo Game Show 2023 provides us with a great opportunity to showcase our powerful product lineup and cutting-edge technology, delivering luxurious gaming experience to all gamers," said Sam Chern, MSI Marketing Vice President.

AMD today announced the Ryzen 9 7945X3D mobile processor, which it claims is the fastest notebook processor for gaming, faster than even Intel's Core i9-13980HX. The 7945X3D is a 16-core/32-thread processor that leverages AMD 3D Vertical Cache technology. Much like the desktop Ryzen 9 7950X3D, the 7945X3D features 64 MB of stacked 3D vertical cache memory on one of its two "Zen 4" CCDs, which gives it 96 MB of last-level cache. The second one is a regular "Zen 4" CCD with 32 MB of L3 cache—again, just like the desktop 7950X3D. The most interesting aspect has to be that AMD claims to have pulled off leadership gaming performance at a 55 W+ TDP.

The Ryzen 9 7945X3D is based on the "Dragon Range" multi-chip module. This is essentially a mobile-optimized BGA variant of the desktop "Raphael" MCM, with a higher degree of power optimization. The processor features 16 "Zen 4" CPU cores spread across two CCDs, each with 1 MB of L2 cache. The first CCD has 96 MB of L3 cache thanks to the 3DV cache, while the second CCD has 32 MB of it. Despite its power constrained form-factor, the 7945X3D has a maximum boost frequency of 5.40 GHz. Each of the two CCDs is built on the 5 nm EUV foundry node. The L3D (the die stacked on top of the first CCD) is built on 6 nm, as is the client I/O die (cIOD). The processor supports dual-channel DDR5, and has a 28-lane PCI-Express Gen 5 root complex. AMD claims that the Ryzen 9 7945X3D is on average 15% faster at gaming than its current flagship processor, the 16-core Ryzen 9 7945HX. This should mean that the processor is faster than the Intel Core i9-13980HX. The first notebook to debut the AMD Ryzen 9 7945X3D is the ASUS ROG Strix SCAR 17 X3D, which goes on sale on August 22, 2023.

Tipsters have noticed that ASUS is preparing a new high-end laptop with an unannounced AMD processor—the upcoming ROG Strix SCAR 17-inch model (G733PYV-LL046W,) will apparently sport a Ryzen 9 7945HX3D APU (with 128 MB of L3 cache). The inclusion of "X3D" in the processor's name has generated a lot of interest, given that Team Red's 3D V-Cache technology has existed mainly within mainstream desktop-oriented Ryzen 7000 and 5000 processor lineups. This leaked dual-CCD APU is probably being lined up to take on upper-echelon Intel Raptor Lake-HX processors, as well as refreshed variants.

The leak indicates that this APU will likely sit at the top of the Zen 4-based Dragon Range-H lineup—being a 5.4 GHz max. boost clock, 16-core/32-thread CPU, with a configurable TDP (between 55 W and 75 W) and Radeon 610M iGPU. The host ASUS ROG Strix SCAR 17 laptop is no slouch thanks to some very generous hardware specifications, including a mobile NVIDIA RTX 4090 GPU, 32 GB of DDR5 memory, 2 TB SSD, and a 17.3" 240 Hz IPS display. Listed at 5599 AUD (~$3800) on Computer Alliance, or £3904.79 (~$5000) chez Lamba-Tek, you would expect the best possible performance for those prices. The two online retailers have not confirmed any concrete release dates for the high-end ASUS laptop.

AMD has reportedly signed up with Samsung Electronics to shift some of its 4 nm processor silicon fabrication from TSMC. The apex Taiwan-based foundry is reportedly operating at capacity for its 4 nm-class nodes, with customers such as Apple and Qualcomm sourcing 4 nm mobile SoCs on the node, leaving AMD with limited allocation and/or bargaining power with TSMC. The company relies on 4 nm for its Ryzen 7040 series "Phoenix" mobile processors, and is in the process of adapting its design for Samsung's 4 nm-class nodes (of which there are five types for AMD to choose from).

Switching to Samsung probably gives AMD more scalability, particularly given that "Phoenix" has missed its release timeline, leaving AMD with the 5 nm + 6 nm Ryzen 7045 series "Dragon Range" MCM in the premium segments, and older 6 nm 7035 series "Rembrandt-R" in the mainstream and ultraportable segments, but nothing "apt" to compete against Intel "Raptor Lake-U" and "Raptor Lake-P." AMD has a limited window in which to ramp up "Phoenix," as Intel readies "Meteor Lake" for a 2H-2023 debut, with a focus on mobile variants.

When you buy a notebook powered by a Ryzen 7000 series mobile processor, you're either getting a cutting-edge chip powered by the company's latest "Zen 4" CPU cores, or one that has been rebadged from the company's previous-gen Ryzen 6000 "Zen 3+" or even Ryzen 5000 "Zen 3" (DDR4) processor series. The question on the tech buyer's mind will be "how to I spot a Ryzen 7000 series processor-powered notebook that actually gives me "Zen 4" CPU cores?"

AMD attempted to answer this with an exclusive new case badge for Ryzen 7000 series processors with "Zen 4" CPU cores. This new case badge looks not much different from the AMD Expo logo, in that the AMD Ryzen main branding is set against an orange backdrop. This bit is surrounded by a silver-metallic frame, with the 5/7/9 brand extension on its corner, along with "7000 series" marked. This case badge is only to be included with a Ryzen 7040 series "Phoenix" or Ryzen 7045 series "Dragon Range" processor present, and cannot be used with Ryzen 7035 series "Rembrandt Refresh" or Ryzen 7030 series "Barcelo Refresh," or Ryzen 7020 series "Mendocino."

The 12-core/24-thread AMD Ryzen 9 7845HX "Dragon Range" mobile processors for enthusiast-segment notebooks, are capable of performance that matches the desktop Ryzen 9 7900X, with an easy 130 W power limit enabled along with Precision Boost Overdrive 2 (PBO2), with the "Enhanced" performance mode set on certain ASUS ROG laptops. The 7845HX is capable of drawing up to 110 W of power in its stock settings, which sees it offer a single-threaded boost frequency of 5.25 GHz, and 4.70 GHz all-core, and around 25000 points in Cinebench R23 multi-threaded. The Enhanced mode, which can be set via software on ASUS ROG laptops, raises the power limits, which makes the 7845HX draw up to 130 W of power, hitting temperatures of up to 93 °C, vastly improving boost frequency residency.

The 7845HX is "unlocked," and the UEFI setup program of ASUS ROG laptops offer several manual overclocking controls on par with the desktop platform. Manual overclocking along with PBO2, Curve Optimizer, and Maximum Boost Technology, yields up to 5.45 GHz single-threaded boost, and 5.10 GHz multi-threaded boost, yielding a 14 percent improvement over the stock frequency Cinebench R23 score, hitting 28542 points, which is on-par with that of a desktop Ryzen 9 7900X—a processor with 170 W TDP and 230 W PPT.

AMD has announced the immediate availability of its Ryzen 7045 HX-series (Dragon Range) processors for high performance laptop devices. In a Youtube video released on March 10, AMD's Jason Banta has announced the availability of the world's most powerful mobile processor, the Ryzen 9 7945HX. He listed the OEM partners who have integrated the 7945HX into flagship level laptop models. He also declared that this range topping CPU is a competition beater. Gaming benchmark tests have demonstrated that the Ryzen 9 7945HX beats Intel's Raptor Lake Core i9-13950HX by an average margin of 10%.

There are two distinct developments in the client processor space for AMD—first, its Ryzen 7000X3D desktop processors have managed to retain gaming performance competitiveness against Intel's fastest 13th Gen Core "Raptor Lake" processors; and second, that its Ryzen 7045HX "Dragon Range" mobile processors are picking up interest in the enthusiast-segment notebook community, where its advanced 5 nm + 6 nm process is dealing damage to 13th Gen Core mobile processors in performance/Watt, and gaming performance. Can AMD dial things up a notch? Technically, yes.

It should technically be possible for AMD to build "Dragon Range" multi-chip modules using "Zen 4" + 3D Vertical Cache CCDs (CPU complex dies), much in the same way it did for the desktop product stack. Such a processor would either have one CCD with the 3DV cache for a CPU core-count of up to 8-core/16-thread; or a contraption similar to the desktop 7950X3D, wherein one of the CCDs has 3DV cache, while the other is a regular "Zen 4" CCD, for core-counts of up to 16-core/32-thread. But will AMD build such chips? A lot would depend on the volumes of L3Ds (the 6 nm dies with the 64 MB 3D Vertical cache memory that operates at 2.5 TB/s), the production of CCDs with 3DV cache; and whether AMD is able to achieve the right performance/Watt numbers against Intel's fastest 8P+16E "Raptor Lake" mobile processors.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

AMD is now TSMC's second largest customer for its 5 nanometer N5 silicon fabrication node, according to a DigiTimes report. The Taiwan-based semiconductor industry observer also reports that AMD is more resilient than Intel in facing any downturns in the PC industry, in the coming few months. PC sales are expected to slump by as much as 15 percent in the near future, but the lower market-share compared to Intel; and the flexibility for AMD to move its CPU chips over to enterprise product to feed the growth in server processor segment, means that the company can ride over a bumpy road in the near future. The lower market-share translates to "lesser pain" from a slump compared to Intel. The report also says that embracing TSMC for processors "just in time" means that AMD has a front-row seat with product performance, time-to-market, yields, and delivery.

AMD is on the anvil of two major product launches on 5 nm, the Ryzen 7000 series "Raphael" desktop processors on August 30 (according to the report), and EPYC "Genoa" server processors in November 2022. The company is planning to refresh its notebook processor lineup in the first half of 2023, with "Dragon Range," and "Phoenix Point" targeting distinct market segments among notebooks. "Dragon Range" is essentially "Raphael" (5 nm chiplet + 6 nm cIOD) on a mobile-optimized BGA package, letting AMD cram up to 16 "Zen 4" cores, and take on Intel's high core-count mobile processors. The iGPU of "Dragon Range" will be basic, since designs based on this chip are expected to use discrete GPUs. "Phoenix Point" is a purpose-built mobile processor with up to 8 "Zen 4" cores, and a powerful iGPU based the RDNA3 architecture.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

AMD has confirmed its revamped APU strategy will be delivered throughout three different APU line-ups come 2023. While Raphael will take care of AMD's hopes in the desktop space, the company is readying a new, "Dragon Range" lineup of "pinnacle gaming"-oriented APUs, leveraging the company's upcoming Zen 4 architecture, DDR5, and PCIe 5. Dragon Range APUs will feature the "highest core, thread, and cache ever for a mobile gaming CPU" - although AMD stopped just short of confirming exactly what "highest" translates to. To aid in its extreme gaming aspirations, TDP for Dragon Range is set at 55 W - they thus "largely exist in the space where gaming laptops are plugged in the majority of the time," according to AMD director of technical marketing Robert Hallock.

Another APU family, Phoenix, will be aimed at thin and lights with a penchant for gaming. Phoenix too will leverage AMD's Zen 4 core, DDR5 memory subsystem, and PCIe 5 interfaces. Being aimed at thin and lights, Phoenix APUs are set for a 35 W - 45 W operating range. Interestingly, AMD didn't share any other details - more crucially, the graphics architecture that's to be employed in these high-performance APUs.