Thermaltake, a leading PC DIY brand for premium hardware solutions, launches The Tower 250 Mini Tower Chassis, the latest Mini-ITX case in The Tower Series, featuring incredible hardware compatibility, an iconic vertical body design with an octagonal prism shape, and LCD customization. Available in Black, Snow, Matcha Green and Hydrangea Blue finishes, The Tower 250 is built for optimized cooling performance and enhanced capabilities.

Compatible with a wide range of hardware gadgets, The Tower 250 can house a 360 mm high-end GPU, a 360 mm AIO radiator and a standard ATX or SFX power supply up to 200 mm, along with eight 120 mm or five 140 mm fans. Additionally, this Mini-ITX case excels in thermal efficiency with two CT120 fans pre-installed on the top of the case, and room for a 360 mm/280 mm all-in-one CPU cooler on the right. Behind the motherboard tray, two 2.5" SSDs or one 3.5" HDD can be installed, offering maximum storage support.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive Lineup for AI and HPC Success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that are powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

QSAN Technology Inc., a leading provider of innovative storage solutions, is thrilled to announce the latest update to its enterprise NAS product line with enterprise unified storage manager - QSM 4, designed to set new standards for performance and management. The XN8100R and XN5100R series (single controller models) now deliver significantly enhanced capabilities for today's data-intensive business environments.

Enhanced Performance for Greater Efficiency with Enterprise NAS
QSAN's XCubeNAS models with the newly developed QFS (QSAN File System) demonstrate up to 10x faster data access than QSM 3 models. The high-core models of the XN8100R series work with SD4 NVMe SSD to further optimize latency and IOPS, delivering exceptional responsiveness and high-speed data access.

HighPoint's RocketAIC 6542AWW has established a new milestone for turnkey NVMe Storage. Despite the external RAID solution's tidy dimensions (it stands only 4.84 inches tall, 8.27 inches deep, and 9.25 inches in length), it is equipped with eight of Solidigm's D5-P5336 NVMe SSDs, and provides an astonishing 491.52 TB of enterprise storage capable of delivering 28GBs of real-world transfer speed; ideal for Edge Applications that demand fast, high-density storage solutions with small hardware footprint.

The compact external storage chassis' integrated power supply and powerful cooling system enable the NVMe media to be completely isolated from the host hardware platform. Not only does this free up interior space for the host server or workstation, it can significantly improve reliability and efficiency by offsetting power consumption and ensuring that waste heat generated by the SSDs never enters the computing environment.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive line-up for AI and HPC success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

Other World Computing (OWC), a trusted leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, today announced the general availability launch of the latest addition to its OWC Atlas Pro family of memory cards - the 240 GB OWC Atlas Pro CFexpress 4.0 Type A Card. Based on popular demand, this new capacity option combines the rocket-fast speeds users expect from OWC with a more accessible price point, making it the ideal choice for Sony users who require professional-grade performance without the need for maximum capacity.

OWC CFexpress 4.0 Type A Atlas Pro cards are perfect for pro filmmakers and extreme action photographers who want to dramatically speed up their offloads while retaining full compatibility with existing devices. Users experience double the speeds of CFexpress 2.0 cards with 1850 MB/s read speeds through OWC Atlas USB4 CFexpress 4.0 card reader while providing 1700 MB/s write speed for current and future cameras that can take advantage of such performances. OWC's Atlas CFexpress 4.0 Type A cards are VPG200 certified, ensuring they work seamlessly with all existing Sony camera modes.

Huawei is advancing archive storage technology with the development of a new solution called the Magneto-Electric Disk (MED). Aiming to provide an alternative to traditional hard drives, this storage device merges tape and SSD technologies to deliver high capacity and low power consumption. The first-generation MED can hold up to 72 TB of data in a compact 7-inch housing and uses significantly less energy than standard HDDs. The MED was developed as part of Huawei's efforts to mitigate potential supply shortages of conventional hard drives, particularly given the US export restrictions to China. By combining tape storage, traditionally slow but reliable, with a high-speed SSD, Huawei has designed a hybrid storage solution that addresses both speed and efficiency needs.

Data is initially recorded on the SSD for quick access and is then written to the tape in sequential blocks for long-term storage. Frequently accessed data, or "warm" data, stays on the SSD for faster retrieval, while "cold" data, accessed less often, is stored on the tape. According to early specifications, a MED rack can store over 10 petabytes and consumes under 2,000 watts of power, significantly less than HDD-based storage. This efficiency could redefine data archiving, especially for large-scale data centers. Data throughput on the MED is projected to reach 8 GB/s, highlighting its potential to handle high-demand environments. The MED is expected to launch in 2025, with a second, more compact generation targeting a 3.5-inch form factor in 2026 or 2027.

Micron Technology, Inc., today announced it has begun qualification of the 6550 ION NVMe SSD with customers. The Micron 6550 ION is the world's fastest 60 TB data center SSD and the industry's first E3.S and PCIe Gen 5 60 TB SSD. It follows the success of the award-winning 6500 ION and is engineered to provide best-in-class performance, energy efficiency, endurance, security, and rack density for exascale data center deployments. The 6550 ION excels in high-capacity NVMe workloads such as networked AI data lakes, ingest, data preparation and check pointing, file and object storage, public cloud storage, analytic databases, and content delivery.

"The Micron 6550 ION achieves a remarkable 12 GB/s while using just 20 watts of power, setting a new standard in data center performance and energy efficiency," said Alvaro Toledo, vice president and general manager of Micron's Data Center Storage Group. "Featuring a first-to-market 60 TB capacity in an E3.S form factor and up to 20% better energy efficiency than competitive drives, the Micron 6550 ION is a game-changer for high-capacity storage solutions to address the insatiable capacity and power demands of AI workloads."

Both pictures and videos of a partial teardown of Apple's recently launched Mac mini with the M4 SoC have appeared online courtesy of various Chinese sources. There are at least two interesting parts to these partial teardowns and they're related to storage and WiFi. On the storage front, Apple has moved away from having soldered NAND chips straight on the main PCB of the Mac mini, to instead having them on a custom PCB which is similar to M.2, but a custom Apple design. The PCB pictured contained a pair of 128 GB NAND chips and with the source of the teardown being from China, there's also a video showing a repair shop desoldering the two chips and replacing them with two 1 TB chips, or in other words, the SSD was upgraded from 256 GB to 2 TB.

The upgrade brought with it some extra performance as well, even if the write speed remained at a comparatively slow 2900 MB/s, the read speed went up from 2000 MB/s to 3300 MB/s which is a significant gain in performance. This is obviously not a consumer friendly upgrade path, but we'd expect to see third party upgrade options at some point in the future, assuming there's no black listing of third party storage modules. The NAND controller is still likely to be integrated into Apple's SoC, but the PCB that the NAND flash chips are mounted onto appears to have some kind of SPI flash on it as well, which might make third party upgrades a lot harder.

As AI accelerates data expansion, enterprises face increasing challenges in managing large volumes of data effectively. Tiered storage solutions have emerged as the preferred approach for balancing performance and costs. Solid State Drives (SSDs), with their fast read and write speeds, low latency and high power efficiency, are becoming the dominant storage selection for data centers and AI servers. Among SSD techniques, QLC SSDs offer unique advantages in costs and storage density, making them particularly suited for read-intensive AI applications. Therefore, high-capacity SSDs, such as 32 TB and 64 TB models, are gaining traction as a new storage solution in the market.

Read-Intensive Applications: Mainstream Enterprise SSD Use Cases
According to the latest research from FI (Forward Insight), up to 91% of current PCIe SSDs deployments are used in applications with DWPD of less than 1, and the share is expected to reach 99% by 2028. this shift underscores the increasing prevalence of read-intensive applications and data centers, a space where QLC SSDs excel.

Polish desktop memory and storage brand IRDM introduces the revolutionary IRDM PRO GEN 5 SSD. This device, based on the latest PCIe 5.0 interface, meets the rapidly growing demands of gamers and professionals who expect maximum performance in the most demanding tasks. The SSD combines cutting-edge technologies, including the innovative Graphreeze cooling system based on graphene. This ensures both exceptional performance and stability under extreme operating conditions.

Incredible PCIe 5.0 speed and performance
The IRDM PRO GEN 5 represents a true revolution in data transfer speeds. With a read speed of up to 12,000 MB/s, the drive almost doubles the numbers of PCIe 4.0 standard, making it the ideal solution for demanding users. These parameters ensure that gamers can enjoy lightning-fast game load times and smooth transitions between sequences. Meanwhile, video editors working with high-resolution content (4K and 8K) or those who have to handle with large databases will appreciate reduction in time needed for large file operations.

KIOXIA America, Inc. today announced that it has begun mass production of the industry's first Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

QLC UFS offers a higher bit density than traditional TLC UFS, making it suitable for mobile applications that require higher storage capacities. Advancements in controller technology and error correction have enabled QLC technology to achieve this while maintaining competitive performance. KIOXIA's new 512 gigabyte (GB) QLC UFS achieves sequential read speeds of up to 4,200 megabytes per second (MB/s) and sequential write speeds of up to 3,200 MB/s, taking full advantage of the UFS 4.0 interface speed.

Micron Technology, Inc., today announced that its 9550 PCIe Gen 5 E1.S data center SSDs have been added to the NVIDIA recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and its derivatives. The GB200 NVL72 uses the GB200 Grace Blackwell Superchip to deliver rack-scale, energy-efficient AI infrastructure. The enablement of PCIe Gen 5 storage in the system makes the Micron 9550 SSD an ideal fit for optimizing performance and power efficiency in AI workloads like large-scale training of AI models, real-time trillion-parameter language model inference and high-performance computing (HPC) tasks.

Micron 9550 delivers world-class AI workload performance and power efficiency:
Compared with other industry offerings, the 9550 SSD delivers up to 34% higher throughput for NVIDIA Magnum IO GPUDirect (GDS) and up to 33% faster workload completion times in graph neural network (GNN) training with Big Accelerator Memory (BaM). The Micron 9550 SSD saves energy and sets new sustainability benchmarks by consuming 81% less SSD energy per 1 TB transferred than other SSD offerings with NVIDIA Magnum IO GDS and up to 43% lower SSD power in GNN training with BaM.

Solid State Storage Technology Corporation (SSSTC) launches the EJ5 series PCIe 5.0 SSD, specifically designed for enterprise applications focusing on AI, data centers, and high-performance computing (HPC) fields. This SSD aims to provide exceptional performance and reliability, particularly designed for enterprise-grade servers, rugged devices, and high-intensity workloads for mixed-use applications with U.2 and E3.S specifications.

The EJ5 series SSD is well-suited for high-intensity applications such as AI and machine learning (ML) processing, virtualization, and real-time data analysis, as well as large database management. This series adopts PCIe 5.0 and NVMe 2.0 technology, with maximum sequential read and write speeds of up to 14 GB/s and 7.5 GB/s, and random read and write speeds reaching 2500K IOPS and 670K IOPS, respectively. Even under varying workloads and intense read/write operations, the QoS performance remains highly consistent, ensuring stable performance across different applications. In addition to ultra-high performance and stability, the EJ5 series features ultra-low latency, with random write latency as low as 14μs, providing rapid and stable data processing capabilities for AI applications.

MSI is excited to announce the launch of the DATAMAG 20 Gbps, a magnetic portable SSD designed for fast, reliable, and convenient data storage. Available in 1 TB, 2 TB, and 4 TB capacities, the DATAMAG offers SuperSpeed USB 20 Gbps transfer rates and a unique magnetic attachment system, making it an ideal choice for users who need both speed and portability.

With read/write speeds up to 1,600/1,500 MB/s, the DATAMAG 20 Gbps is built to handle demanding tasks such as ProRes 4K video recording and large file transfers. Whether you're a creative professional working on high-resolution video projects or someone who needs reliable storage on the go, this SSD provides the performance needed to keep your workflow efficient and smooth and supports the highest ProRes formats for video recording on iPhone 16 / 15 Pro (Max).

Kioxia Corporation, a world leader in memory solutions, today announced that the company's research papers have been accepted for presentation at IEEE International Electron Devices Meeting (IEDM) 2024, a prestigious international conference to be held in San Francisco, USA, from December 7th to 11th.

Kioxia is committed to the research and development of semiconductor memory, which is indispensable for the advancement of AI and the digital transformation of society. Beyond its state-of-the-art three-dimensional (3D) flash memory technology BiCS FLASH, Kioxia excels at research in emerging memory solutions. The company is constantly striving to meet the needs for future computing and storage systems with innovative memory products.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is launching a new optimized storage system for high performance AI training, inference and HPC workloads. This JBOF (Just a Bunch of Flash) system utilizes up to four NVIDIA BlueField-3 data processing units (DPUs) in a 2U form factor to run software-defined storage workloads. Each BlueField-3 DPU features 400 Gb Ethernet or InfiniBand networking and hardware acceleration for high computation storage and networking workloads such as encryption, compression and erasure coding, as well as AI storage expansion. The state-of-the-art, dual port JBOF architecture enables active-active clustering ensuring high availability for scale up mission critical storage applications as well as scale-out storage such as object storage and parallel file systems.

"Supermicro's new high performance JBOF Storage System is designed using our Building Block approach which enables support for either E3.S or U.2 form-factor SSDs and the latest PCIe Gen 5 connectivity for the SSDs and the DPU networking and storage platform," said Charles Liang, president and CEO of Supermicro. "Supermicro's system design supports 24 or 36 SSD's enabling up to 1.105PB of raw capacity using 30.71 TB SSDs. Our balanced network and storage I/O design can saturate the full 400 Gb/s BlueField-3 line-rate realizing more than 250 GB/s bandwidth of the Gen 5 SSDs."

More than just storage, Western Digital HDDs are key enablers for businesses looking to optimize their infrastructure, lower TCO and future-proof their data strategies. Constantly innovating to meet the needs of our data-driven world, Western Digital (NASDAQ: WDC) today announced that it is now shipping the world's highest capacity UltraSMR HDD with up to 32 TB leveraging the time-tested, reliable energy-assisted PMR (ePMR) recording technology for hyperscalers, CSPs and enterprises. For those who want a drop-in ready HDD for today's data-intensive workloads, the company is also now shipping the world's highest-capacity ePMR CMR HDD with up to 26 TB for enterprise and channel customers. With the world's first commercially available 11-disk design and field-proven technology, these new drives reinforce Western Digital's commitment to delivering HDD technology that raises the bar on capacity, reliability and innovation.

The AI Data Cycle has emerged as a growth driver for the storage industry. As AI systems become more sophisticated, they process and generate vast amounts of data that must be stored efficiently. HDDs play a crucial role in this ecosystem, handling both the input side, where data is gathered, ingested and stored, and the output side, where AI content is generated and preserved. This dual role positions HDDs as a linchpin in the AI Data Cycle, ensuring that data is available when needed and stored with the lowest TCO.

Western Digital Corp. today announced that its PCIe Gen 5 DC SN861 E.1S enterprise-class NVMe SSDs have been certified to support the NVIDIA GB200 NVL72 rack-scale system.

The rapid rise of AI, ML, and large language models (LLMs) is creating a challenge for companies with two opposing forces. Data generation and consumption are accelerating, while organizations face pressure to quickly derive value from this data. Performance, scalability, and efficiency are essential for AI technology stacks as storage demands rise. Certified to be compatible with the GB200 NVL72 system, Western Digital's enterprise SSD addresses the growing needs of the AI market for high-speed accelerated computing combined with low latency to serve compute-intensive AI environments.

KIOXIA America, Inc. today announced the availability of its new KIOXIA XD8 Series PCIe 5.0 Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S SSDs. The new drives are the third generation of E1.S SSDs from KIOXIA and are compliant with PCIe 5.0 (32 GT/s x 4) and NVMe 2.0 specifications, and support the Open Compute Project (OCP) Datacenter NVMe SSD v2.5 specification.

Designed for cloud and hyperscale environments, the KIOXIA XD8 Series meets the growing demand for higher performance, enhanced efficiency, and greater scalability in data centers. The new drives empower cloud providers and hyperscalers to optimize their infrastructure, delivering superior performance while maintaining operational efficiency.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces the launch of a new series of servers, GPU-accelerated systems, and storage servers featuring the AMD EPYC 9005 Series processors and AMD Instinct MI325X GPUs. The new H14 product line represents one of the most extensive server families in the industry, including Supermicro's Hyper systems, the Twin multi-node servers, and AI inferencing GPU systems, all available with air or liquid cooling options. The new "Zen 5" processor core architecture implements full data path AVX-512 vector instructions for CPU-based AI inference and provides 17% better instructions per cycle (IPC) than the previous 4th generation EPYC processor, enabling more performance per core.

Supermicro's new H14 family uses the latest 5th Gen AMD EPYC processors which enable up to 192 cores per CPU with up to 500 W TDP (thermal design power). Supermicro has designed new H14 systems including the Hyper and FlexTwin systems which can accommodate the higher thermal requirements. The H14 family also includes three systems for AI training and inference workloads supporting up to 10 GPUs which feature the AMD EPYC 9005 Series CPU as the host processor and two which support the AMD Instinct MI325X GPU.

MSI, a leading global provider of high-performance server solutions, today introduced its latest AMD EPYC 9005 Series CPU-based server boards and platforms, engineered to tackle the most demanding data center workloads with leadership performance and efficiency.

Featuring AMD EPYC 9005 Series processors with up to 192 cores and 384 threads, MSI's new server platforms deliver breakthrough compute power, unparalleled density, and exceptional energy efficiency, making them ideal for handling AI-enabled, cloud-native, and business-critical workloads in modern data centers.

In the past 13 years, global data production has surged, increasing an estimated 74 times. (1) Looking forward, McKinsey projects AI to spur 35% annual growth in enterprise SSD capacity demand, from 181 Exabytes (EB) in 2024 to 1,078EB in 2030. (2) To address this growing demand, ScaleFlux, a leader in data storage and memory technology, is announcing a significant expansion of its product portfolio. The company is introducing cutting-edge controllers for both NVMe SSDs and Compute Express Link (CXL) modules, reinforcing its leadership in innovative technology for the data pipeline. "With the release of three new ASIC controllers and key updates to its existing lineup, ScaleFlux continues to push the boundaries of SSD and memory performance, power efficiency, and data integrity," points out Hao Zhong, CEO and Co-Founder of the company.

Three New SoC Controllers to Transform Data Center Storage
ScaleFlux is proud to unveil three new SoC controllers designed to enhance data center, AI and enterprise infrastructure:

Super Micro Computer, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces the launch of a new, versatile, high-density infrastructure platform optimized for AI inferencing at the network edge. As companies seek to embrace complex large language models (LLM) in their daily operations, there is a need for new hardware capable of inferencing high volumes of data in edge locations with minimal latency. Supermicro's innovative system combines versatility, performance, and thermal efficiency to deliver up to 10 double-width GPUs in a single system capable of running in traditional air-cooled environments.

"Owing to the system's optimized thermal design, Supermicro can deliver all this performance in a high-density 3U 20 PCIe system with 256 cores that can be deployed in edge data centers," said Charles Liang, president and CEO of Supermicro. "As the AI market is growing exponentially, customers need a powerful, versatile solution to inference data to run LLM-based applications on-premises, close to where the data is generated. Our new 3U Edge AI system enables them to run innovative solutions with minimal latency."

Recent reports from South China Morning Post unveil developments in China's semiconductor industry, with significant progress in two critical areas: advanced memory chips and silicon photonics. These breakthroughs mark important steps in the country's pursuit of technological self-reliance amid global trade tensions. In Wuhan, a startup called Numemory has unveiled a new storage-class memory (SCM) chip. The "NM101" chip boasts an impressive 64 GB capacity, far surpassing the megabyte-range offerings currently dominating the market. This novel chip blends the strengths of traditional DRAM and NAND flash storage, delivering rapid, non-volatile, persistent memory ideal for server and data center applications. The NM101's design prioritizes high capacity, density, and bandwidth while maintaining low latency. These characteristics make it particularly well-suited for data centers and cloud computing infrastructures. Initial reports suggest that storage devices incorporating this SCM technology can write an entire 10 GB high-definition video file in a mere second.

Concurrently, another Wuhan-based institution, JFS Laboratory, has achieved a milestone in silicon photonics research. The state-backed facility successfully merged a laser light source with a silicon chip, a feat previously unrealized in China. This innovation in silicon photonics leverages light signals for data transmission, potentially circumventing the looming physical constraints of traditional electric signal-based chip designs. This accomplishment is viewed as addressing a crucial gap in China's optoelectronics capabilities, which used to lag behind Western chip designers and startups. Using silicon photonics, infrastructure scale-out can be sustained on a much larger scale without significant power consumption increase. While these developments represent significant progress, it's important to note that bridging the gap between laboratory breakthroughs and mass-produced, commercially viable products remains a substantial challenge. The path from research success to market dominance is often long and complex, requiring sustained investment and further technological refinement.