AMD's latest flagship APU, the Ryzen AI MAX+ 395 "Strix Halo," demonstrates some impressive performance advantages over Intel's "Lunar Lake" processors in large language model (LLM) inference workloads, according to recent benchmarks on AMD's blog. Featuring 16 Zen 5 CPU cores, 40 RDNA 3.5 compute units, and over 50 AI TOPS via its XDNA 2 NPU, the processor achieves up to 12.2x faster response times than Intel's Core Ultra 258V in specific LLM scenarios. Notably, Intel's Lunar Lake has four E-cores and four P-cores, which in total is half of the Ryzen AI MAX+ 395 CPU core count, but the performance difference is much more pronounced than the 2x core gap. The performance delta becomes even more notable with model complexity, particularly with 14-billion parameter models approaching the limit of what standard 32 GB laptops can handle.

In LM Studio benchmarks using an ASUS ROG Flow Z13 with 64 GB unified memory, the integrated Radeon 8060S GPU delivered 2.2x higher token throughput than Intel's Arc 140V across various model architectures. Time-to-first-token metrics revealed a 4x advantage in smaller models like Llama 3.2 3B Instruct, expanding to 9.1x with 7-8B parameter models such as DeepSeek R1 Distill variants. AMD's architecture particularly excels in multimodal vision tasks, where the Ryzen AI MAX+ 395 processed complex visual inputs up to 7x faster in IBM Granite Vision 3.2 3B and 6x faster in Google Gemma 3 12B compared to Intel's offering. The platform's support for AMD Variable Graphics Memory allows allocating up to 96 GB as VRAM from systems equipped with 128 GB unified memory, enabling the deployment of state-of-the-art models like Google Gemma 3 27B Vision. The processor's performance advantages extend to practical AI applications, including medical image analysis and coding assistance via higher-precision 6-bit quantization in the DeepSeek R1 Distill Qwen 32B model.

Well, the wait is over and early reviews for AMD's Strix Halo APUs have finally dropped. For those who kept up with the leaks and rumors, the high-end RDNA 3.5 Radeon 8060S iGPU was repeatedly rumored to features up to 40 CUs, allowing for raw performance that keeps up with several discrete-class mobile GPUs. Now that we have concrete information, it appears that the Strix Halo iGPU does indeed trade blows with mid-range mobile GPUs, which is an undeniably impressive feat for an integrated unit. Some of the fastest x86 iGPUs - the Arc 140 V, Radeon 890M, are all left in the dust, although Apple's highest-end offerings are unsurprisingly well ahead.

Starting off with 3D Mark Time Spy, the 40-CU Radeon 8060S, housed in the 13-inch ROG Flow Z13, managed an impressive score of 10,200 points according to Notebookcheck. This puts the iGPU in close proximity to other RTX 4070-powered 14-inch gaming laptops, such as the Zephyrus G14 which managed to rake in around 10,300 points. Compared to the previous iteration of the ROG Flow Z13, which boasts a 65-watt RTX 4070, the Radeon 8060S-powered Z13 pulls ahead by around 5%. Laptops with more substantial power envelopes do race ahead significantly, such as the 140-watt RTX 4070 Laptop-powered Razer Blade 14 which managed over 13,000 points. In the Steel Nomad benchmark, however, the Radeon 8060S appears less impressive, trailing behind not only the RTX 4070 Laptop, but also systems with the RTX 4060 Laptop GPU (110 W).

Yesterday, the ASUS Chinese office announced a special event—on February 25—dedicated to launching a next-gen AMD APU-powered premium notebook model: "ROG Magic X (or Illusion X) is the first to be equipped with the Ryzen AI MAX+ three-in-one chip, which can efficiently coordinate multiple modes, provide combat power and computing power on demand, and can handle e-sports, creation and AI with one chip!" The manufacturer's Weibo post has generated plenty of buzz; industry insiders reckon that reviews could be published today (February 18)—HXL/9550pro informed VideoCardz with a not so cryptic message: "STX-Halo NDA: Feb 18th 2025."

Western press outlets point out that the ROG Magic X is a local variant of the familiar ROG Flow Z13 design; a 2025 refresh brings in AMD's much anticipated "Strix Halo" APU design. Team Red-authored marketing material and pre-release evaluation leaks have hinted about impressive integrated graphics solution performance; equalling or even exceeding that of previous-gen dGPUs. Well-known North American hardware review outlets have dropped hints (NDA permitting) about AMD's Ryzen Al Max+ 395 and Max 390 processors. Hardware Canucks could barely contain their excitement regarding the potent Zen 4 and RDNA 3.5 combo package; to the point of wish listing a potential direct successor: "Strix Halo is one of the most exciting things launched into the PC space in the last half decade. Full stop...AMD can't keep this as a one-off. If it's followed up with Zen 6 and RDNA 4 next year...watch out." Naturally, Team Red's cutting-edge mobile CPU technology is arriving in devices with high asking prices. The aforementioned ROG Flow Z13 2025 model—configured with top specs—is priced at $2699. Notebookcheck reckons that ASUS has tacked on an extra $500, since an announcement of initial pricing at CES 2025.

Late last month, an AMD "How to Sell" Ryzen AI MAX series guide appeared online—contents provided an early preview of the Radeon 8060S iGPU's prowess in 1080p gaming environments. Team Red seemed to have some swagger in their step; they claimed that their forthcoming "RDNA 3.5" integrated graphics solution was up to 68% faster than NVIDIA's discrete GeForce RTX 4070 Mobile GPU (subjected to thermal limits). Naturally, first-party/internal documentation should be treated with a degree of skepticism—the PC hardware community often relies on (truly) independent sources to form opinions. A Chinese leaker has procured a pre-release laptop that features a "Zen 5" AMD Ryzen AI Max+ 395 processor. By Wednesday evening, the tester presented benchmark results on the Tieba Baidu forums.

The leaker uploaded a screenshot from a 3DMark Time Spy session. No further insights were shared via written text. On-screen diagnostics pointed to a "Radeon 8050S" GPU, and the CPU being an "AMD Eng Sample: 100-000001243-50_Y." Wccftech double-checked this information; they believe that the OPN ID corresponds to a: "Ryzen AI MAX+ 395 with the Radeon 8060S, instead of the AMD Radeon 8050S iGPU...The difference between the two is that the Radeon 8060S packs the full 40 Compute Units while the Radeon 8050S is configured with 32 Compute Units. The CPU for each iGPU is also different and the one tested here packs 16 Zen 5 cores instead of the 12 Zen 5 cores featured on the Ryzen AI MAX 390." According to the NDA-busting screenshot, Team Red's Ryzen AI MAX+ 395 engineering sample racked up an overall score of 9006 in 3DMark Time Spy. Its graphics score tally came in at 10,106, while its CPU scored 5571 points. The alleged Radeon 8060S iGPU managed to pull in just under NVIDIA's GeForce RTX 4060 Mobile dGPU (average) score of 10,614. The plucky RDNA 3.5 40 CU iGPU seems to outperform a somewhat related sibling; the Radeon RX 7600M XT dGPU (with 32 RDNA 3 CUs) scored 8742 points. Radeon 8060S trails the desktop Radeon RX 7600 GPU by 884 points.

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

ASUS is working on a new line of NUC mini PCs powered by the AMD Ryzen AI MAX "Strix Halo" mobile processors that come with oversized iGPUs and CPU core counts as high as 16-core/32-thread "Zen 5." This was sniffed out in shipping manifests by Olrak29_ on its way to being tested by the BIS (Bureau of Indian Standards) for regulatory certification similar to CE, with the manifest describing the NUC model as the "NUC14LNS," meaning that this box is from the NUC 14 series. The manifest describes the NUC sample as featuring the top of the line Ryzen AI MAX+ 395.

The Ryzen AI MAX+ 395 maxes out everything on the silicon, featuring 16 "Zen 5" CPU cores across two CCDs with full 512-bit FPUs, with 80 MB of "total cache" (L3+L2) between them; a 50 TOPS-class NPU that can locally accelerate Microsoft Copilot+, and that large RDNA 3.5 iGPU with 40 compute units (2,560 stream processors), 80 AI accelerators, and 40 ray accelerators. What's interesting about this NUC is that it will not come with SO-DIMM slots, since the "Strix Halo" SoC features a 256-bit wide LPDDR5X memory interface. It will either have hardwired memory, or use a pair of LPCAMM2 modules (each with a 128-bit bus width), which is less likely. With all the rage about AI developers using M4-powered Mac minis to accelerate DeepSeek, is ASUS eying a slice of the AI market?

AMD has just published its "How to Sell" Ryzen AI MAX series guide—several news outlets have pored over the "claimed" gaming performance charts contained within this two-page document. Team Red appears to be in a boastful mood—their 1080p benchmark results reveal compelling numbers, as produced by their flagship Zen 5 "Strix Halo" processor (baseline 55 W TDP). According to Team Red's marketing guidelines, the Ryzen AI Max+ 395 APU: "competes with a GeForce RTX 4070 Mobile GPU at similar TDP and form factor." The first-party produced comparison points to their Radeon 8060S integrated graphics solution being up to 68% faster—in modern gaming environments at 1080p settings—than the competing Team Green dedicated laptop-oriented GPU, limited to 65 W TGP due to form factor restrictions. Overall, the AMD test unit does better by 23.2% on average (referring to Wccftech's calculations).

According to the document, AMD's reference system was lined up against an ASUS ROG Flow Z13 (2023) gaming laptop specced with an Intel Core i9-13900H processor, and a GeForce RTX 4070 mobile graphics card. The Ryzen AI Max+ 395's "massive iGPU" can unleash the full force of forty RDNA 3.5 compute units, paired with up to 96 GB of unified on-board memory (from a total pool of 128 GB). Non-gaming benchmarks place the flagship Team Red processor above Intel Core Ultra 9 288V and Apple M4 Pro (12-core) CPUs—as always, it is best to wait for verification from independent evaluators. Saying that, the "Strix Halo" APU family has generated a lot of excitement—even going back to early leaks—and the latest marketed performance could drum up further interest.

Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.

This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.

ASUS Republic of Gamers (ROG) today announced the arrival of the 2025 ROG Flow Z13, a powerful gaming tablet. This versatile 2-in-1 gaming machine now features the brand new ultra-powerful AMD Ryzen AI Max+ 395 with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

AMD at the 2025 International CES debuted the Ryzen AI Max 300 series of mobile processors. These chips are designed to go up against the Apple M4 Pro, or the chip that powers the Apple MacBook Pro. The idea behind it is to provide leadership CPU and graphics performance from a single package, minimizing the PCB footprint from having a discrete GPU. In stark contrast, the Intel Core Ultra 200V "Lunar Lake," is designed more to go against the Apple M4, or the chips that power the latest MacBook Air but not quite the MacBook Pro. What sets "Strix Halo" functionally apart from "Lunar Lake" or even the M4 Pro, is that the AMD chip doesn't have memory-on-package (MoP), it relies on discrete LPDDR5X memory chips.

The "Strix Halo" processor is "Fire Range" on steroids. There are one or two "Zen 5" CCDs, for up to a 16-core/32-thread core configuration. Each of these "Zen 5" cores are unlike the ones on "Strix Point," in that they feature a fully unlocked AVX512 hardware pipeline (512-bit FP). The CCD shares a lavish 32 MB of L3 cache among 8 "Zen 5" cores. This is hardly the star attraction. Unlike "Fire Range," which features the small 6 nm client I/O die from "Granite Ridge," The new "Strix Halo" features a massive SoC die built on the 5 nm EUV foundry node. This packs the star attraction of the processor, it's oversized iGPU that has a massive 40 compute units (2,560 stream processors).

AMD is at the 2025 International CES, and we join them for a brisk run of what they have in store for us through the year. We expect some important announcements, such as the next-gen Radeon RX gaming GPUs powered by RDNA 4, a new flagship desktop processor powered by 3D V-Cache technology, HX-segment Ryzen 9000 series processors for gaming notebooks and portable workstations, the fabled "Strix Halo" chip AMD plans to surprise Apple with; and a fleshing out of its mobile processor portfolio.19:02 UTC: The show is underway.19:02 UTC: Jack Huynh takes centerstage.

AMD fans are undoubtedly on their toes to witness the performance improvements that Strix Halo is ready to bring forth. Unlike Strix Point, which utilizes a combination of Zen 5c and full-fat Zen 5 cores, Strix Halo will do away with the small cores for a Zen 5 "only" setup, allowing for substantially better multicore performance. Moreover, it is also widely expected that Strix Halo will boast chunky iGPUs that will bring the heat to entry-level and even some mid-range mobile GPUs, allowing Strix Halo systems to not require discrete graphics at all, with a prime example being the upcoming ROG Flow Z13 tablet.

As per recent reports, the upcoming Ryzen AI Max+ Pro 395 APU will sport an RDNA 3.5-based iGPU with a whopping 40 CUs, and will likely be branded as the Radeon 8060S. In a leaked Geekbench Vulkan benchmark, the Radeon 8060S managed to outpace the RTX 4060 Laptop dGPU in performance. However, according to yet another leaked benchmark, Passmark, the Radeon 8060S and the 32-CU 8050S scored 16,454 and 16,663 respectively - and no, that is not a typo. The 8060S with 40 CUs is marginally slower than the 8050S with 32 CUs, clearly indicating that the numbers are far from final. That said, performance in this range puts the Strix Halo APUs well below the RTX 4070 laptop GPU, and roughly the same as the RTX 3080 Laptop. Not bad for an iGPU, although it is almost certain that actual performance of the retail units will be higher, judging by the abnormally small delta between the 8050S and the 8060S.

AMD's interim RDNA 3.5 architecture will power the Radeon RX 8000 series integrated graphics in "Strix Halo" mobile processors, while the more advanced RDNA 4 architecture is reserved for the higher-tier Radeon RX 9000 series of discrete graphics, according to @9550pro on X. We previously believed that AMD's Ryzen AI MAX 300 Strix Halo processors would carry an iGPU with Radeon 8000S branding. However, at the same time, we expected the Radeon RX 8000 series of desktop GPUs to have a similar branding while being powered by RDNA 4. The new Radeon naming scheme is now transparent, thanks to the latest leaks of the naming schemes and early glimpses of reference design.

The RDNA 4-based RX 9000 series will be powered by the Radeon RX 9070 XT, built on the Navi 48 silicon. This GPU represents AMD's new focus on the high-volume midrange performance segment rather than competing in the ultra-enthusiast high-end space. The architecture promises enhanced SIMD IPC performance and a specialized ray tracing solution that significantly reduces performance overhead compared to current offerings. According to All The Watts, the RX 9000 lineup is expected to include various SKUs across different performance tiers, including the RX 9060, 9050, and 9040 series. Meanwhile, the RDNA 3.5-powered RX 8000 series will serve as a refined iteration of the current RDNA 3 generation. Still, they will be exclusive to AMD's mobile segment in the form of iGPU, integrated inside Strix Halo APU. Both RDNA 4 GPUs and RDNA 3.5-based APUs are scheduled for the CES 2025 event unveiling in January.

Last week, we reported on a massive leak that gave us a glimpse at a surfeit of upcoming ROG gaming laptops from ASUS boasting Arrow Lake-HX and Strix Halo processors, along with RTX 50-series Laptop GPUs. The company has now gone ahead and officially teased its ROG Flow Z13 laptop and the ROG Strix 18 laptop, the videos for which were obtained by VideoCardz. Considering that these were just teasers, the details shared were sparse, but undoubtedly intriguing regardless.

The ROG Strix 18, will likely boast the Core Ultra 9 285HX and Core Ultra 9 275HX CPUs along with NVIDIA "Blackwell" Laptop GPUs, with up to an 175-watt RTX 5090 Laptop with 16 GB of GDDR7 VRAM. Multiple other GPU options will also be available, with the RTX 5070 Ti Laptop GPU being the entry-point as per the leaked listings. Clearly, the Strix 18 is poised to be a powerful and power-hungry desktop replacement-class laptop, along with a massive 18-inch mini LED screen with a speedy 240 Hz refresh rate. Needless to say, the G18 has no intention of being affordable.

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 "Strix Halo" APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill's latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

CES 2025 is less than a month away and leaks about AMD Strix Halo APUs are starting to emerge. Today we have confirmation via a leaked Geekbench Vulcan test that AMD will launch the Ryzen AI MAX+ PRO 395 w/ Radeon 8060S "Strix Halo" APU. Information reveals that this APU is equipped with 16 Zen 5 cores with 32 threads, a 3 GHz base frequency (4.4 GHz max), and a boost up to 5.1 GHz. It sports a 32 MB L3 cache per CCD for a total of 64 MB since it uses a dual CCD chip design. The TDP should be between 55-130 W. Moreover, the "PRO" in the product naming suggests that AMD could release non-PRO models at a later date.

The integrated Radeon 8060S iGPU adopts the RDNA 3.5 architecture with 40 computing units and was tested using an AMD reference board design codenamed AMD MAPLE-STXH and 64 GB of memory scoring 67,004 points in the Geekbench Vulkan test. This initial result is lower than AMD Radeon RX 7600 RDNA 3 discrete entry-level products (despite having more cores 40CU vs 32CU), and higher than NVIDIA GeForce RTX 3050. However, since the benchmark was run on an evaluation platform without optimized drivers and more likely using an early test sample product, we can expect the actual performance of the Radeon 8060S iGPU to be higher.

HWiNFO has been updated to version v8.16, which brings several new improvements and fixes, as well as adds enhanced support for next-generation AMD CPUs and APUs, as well as next-generation Intel GPUs. While it does not specify any models, it is clear that it gets support for AMD's upcoming Kraken Point and Strix Halo APUs, as well as Intel's upcoming Battlemage GPUs.

In addition, the new HWiNFO v8.16 also improves support for Intel Lunar Lake, adds reporting of number of NPU tiles, adds support for Cybenetics Powenetics PMD (Power Measurements Device), enhances sensor monitoring on MSI's Z890, B860, and H810 series motherboards, enhances reporting of CUDIMM CKD parameters, NGU clock, and drive letter, and improves reporting of V/F curve settings, among other things. You can check out the full release notes below.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

Apple's much awaited M4-based Mac Mini is finally here. As previously indicated by analysts, the Mac mini has received a massive redesign - its first in over a decade. With an amazingly compact chassis that is significantly smaller than before, the Mac mini boasts impressive computing horsepower thanks to the M4 and M4 Pro chipsets, now starting with 16 GB of unified memory.

We are already quite familiar with the M4, which made its debut in the OLED iPad Pro last May. However, the M4 Pro is all-new, boasting up to a 14-core CPU with 10 P-cores and 4 E-cores along with up to a 20-core GPU. The standard M4 packs only 4 P-cores by comparison, and manages to quash Intel's Core Ultra 9 288V in synthetic benchmarks by as much as 60% while trading blows with AMD's Strix Point APUs. The M4 Pro features more than twice the number of P-cores, making it a suitable competitor for Intel's upcoming Arrow Lake-H lineup as well as AMD's Strix Halo.

In case you missed it, AMD's new madcap enthusiast silicon engineering effort, the "Strix Halo," is real, and comes with the Ryzen AI Max 300 series branding. These are chiplet-based mobile processors with one or two "Zen 5" CCDs—same ones found in "Granite Ridge" desktop processors—paired with a large SoC die that has an oversized iGPU. This arrangement lets AMD give the processor up to 16 full-sized "Zen 5" CPU cores, and an iGPU with as many as 40 RDNA 3.5 compute units (2,560 stream processors), and a 256-bit LPDDR5/x memory interface for UMA.

"Strix Halo" is designed for ultraportable gaming notebooks or mobile workstations where low PCB footprint is of the essence, and discrete GPU is not an option. For enthusiast gaming notebooks with discrete GPUs, AMD is designing the "Fire Range" processor, which is essentially a mobile BGA version of "Granite Ridge," and a successor to the Ryzen 7045 series "Dragon Range." The Ryzen AI Max series has three models based on CPU and iGPU CU counts—the Ryzen AI Max 395+ (16-core/32-thread with 40 CU), the Ryzen AI Max 390 (12-core/24-thread with 40 CU), and the Ryzen AI Max 385 (8-core/16-thread, 32 CU). An alleged Ryzen AI Max 390 engineering sample surfaced on the Geekbench AI benchmark online database.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.