Silicon Power (SP) releases its first line of memory modules featuring the all-new, next-gen DDR5 technology. Designed for gaming, the XPOWER Zenith DDR5 UDIMM module is available in both RGB and non-RGB forms. Experience even faster frequencies, greater capacities, and lower voltages with the latest release in our Zenith Series, the XPOWER Zenith DDR5 UDIMM module. Take your gaming abilities to new high scores with turbo speeds ranging from 5200 MHz to 6000 MHz. It's available in 8 GB, 16 GB, and 32 GB module densities with double the banks and double the burst length compared to DDR4 to give hardcore gamers and overclockers the power to harness DDR5's game-changing performance.

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR5-UDIMM's 4800 MHz Memory Modules for PC's. It seems like DDR4 has ruled the roost forever. Finally, new motherboards and architectures have allowed memory to grow wings with the advent of DDR5. Improved clock speeds promise up to twice the bandwidth of DDR4, all with lower voltage for better efficiency. To further help with that last bit, DDR5 has on-board power management to reduce motherboard cost and complexity. Sabrent's new DDR5 kits simply plug and play, install your memory kits of choice, enter the BIOS and hit AUTO, and reboot. For those that want to OC these kits, there is plenty of headroom to advance speeds if you want.

Reliability has also been improved by the introduction of on-die error-correction technology. Memory availability is improved by splitting the internal 64-bit (72-bit with ECC) channel into two independent, 32-bit channels (40-bit with ECC) and the addition of the same bank refresh. Combined with other features, including those that allow for up to four times the module capacity with consumer DRAM, DDR5 ensures your multi-core CPU won't be memory starved.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

Silicon Power (SP) releases its newest UDIMM memory module with the latest, groundbreaking DDR5 technology. Read on to learn why it's time to ditch your DDR4 module and make the upgrade. Taking speed, capacity, and reliability even further, the cutting-edge technology of this DDR5 module gives that next-level edge for your system's performance. With aggressive speeds of 4800 MHz, it's 1.5x faster than standard 3200 MHz DDR4 to provide multi-core CPUs with extreme responsiveness and the power to multi-task seamlessly.

Even with all of its extra power, this DDR5 module improves upon its predecessor with on-module voltage regulation. A power management integrated circuit (PMIC) reduces the burden on the motherboard control and results in a lower voltage of 1.1 V versus 1.2 V for DDR4 for even less power consumption.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its forthcoming DDR5 UDIMMS have received Intel Platform Validation. This marks the first and arguably most important milestone in validating compatibility between Kingston DDR5 memory solutions and Intel platforms utilizing DDR5.

Kingston's introductory portfolio of DDR5 memory will be the first in a series of high performance, low to high capacity, multiple form factor solutions in support of DDR5 based platforms debuting over the next year. After developing the next generation of DDR memory, Kingston is providing over 10,000 DDR5 UDIMM samples to major motherboard manufacturers and technology partners in support of the platform launch. By supporting partners early, Kingston is doing its part to lay the foundation for a successful product launch.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

As a global memory leader with a long-term focus on industrial applications, TEAMGROUP has recognized the tremendous processing needs of the HPC market. To meet the demand for industrial memory can handle sustained high-speed data transmission with low latency, TEAMGROUP has utilized the in-house developed and patent-protected TRUST+ wide temperature technology to provide customers with high stability, durability and wide temperature industrial memory.

Applications for the first DDR5 UDIMM and SODIMM industrial wide temperature memory products include usage in edge computing, Internet of Vehicles, servers, AI, and embedded systems. In response to the stringent demands of efficient computing in the industrial control market, TEAMGROUP has been ready to launch the standard temperature DDR5 IST (TC: 0~85℃) memory series and the wide temperature DDR5 IWT (TA: -40~85℃) memory series. The latter features exclusive "Graphene-coated copper heatsink Technology" (U.S. Utility Patent US 11,051,392 B2), which helps maintain a case temperature (TC) of 85~86℃ under an ambient temperature (TA) of 85℃, ensuring low-latency high-speed computing. Without the heatsink, case temperatures (TC) can reach up to 89~90℃ or more, impairing the high performance of DDR5 and significantly reducing the life span of ICs.

TEAMGROUP's T-CREATE brand, which gives creators around the world the tools to express their creativity and inspiration, has updated its product lines again with today's launch of the EXPERT DDR4 OC10L desktop memory, CLASSIC PCIe 4.0 SSD, and CLASSIC DDR4 10L laptop memory. T-CREATE continues to launch diverse new products with improved specifications, producing powerful hardware to meet the needs of creators.

The T-CREATE EXPERT DESKTOP DDR4 OC10L not only has up to 32 GB of capacity per module but also an overclocking feature that automatically increases its frequency to 3600 MHz, providing worry-free overclocking with stable, high-frequency performance. It comes in a titanium grey finish that exudes the tasteful minimalism of the EXPERT product line. In addition, the memory uses a 10-layer PCB with a specialized anti-noise design for better processing capability, allowing creators to work on tasks simultaneously, whether it be producing animation, video editing, or converting large files. It substantially improves work efficiency and excels in multitasking during creative projects.

ASUSTOR Inc. has announced the release of the rack-mounted Lockerstor 12R Pro and Lockerstor 16R Pro equipped Intel's 9th Gen Xeon E-2224 3.40 GHz Quad-Core processor. The Lockerstor 12R Pro and 16R Pro come with 8 GB DDR4-2666 ECC UDIMM and supports a maximum of 128 GB, greatly improving computing power and system stability of virtual machines and Docker applications. In addition to the four Gigabit Ethernet ports, the Lockerstor 12R Pro and 16R Pro also provide three PCIe slots that support 10/25/40/50GbE network cards and SAS cards increasing speeds to unprecedented levels. The rich variety of I/O include six USB 3.2 Gen2 ports, of which four are Type-A and two are Type-C, and dual M.2 slots for SSD caching to enable the Lockerstor 12R Pro and 16R Pro take advantage of some of our fastest speeds ever.

The 80 Plus Platinum 550-watt dual redundant power supplies and four Gigabit Ethernet ports can be configured with failover to ensure the reliability of power supply and transmission, and also through high power conversion efficiency (up to 94%) Provide high-efficiency power supply and virtualized storage stability, allowing enterprises to control costs and protect the environment. The four Gigabit Ethernet ports combined provide up to 451 MB/s and 451 MB/s read and write speeds. The Lockerstor 12R Pro and 16R Pro support up to 192 TB and 256 TB respectively and the support for large amounts of storage space fully accommodates rapidly increasing storage needs, meeting the needs of the present and the future simultaneously.

Chenbro has launched the RB13804, a 1U rackmount server barebone designed for mission-critical, storage-focused applications for mixed deployments (Hyper-Converged Infrastructure) in Data Center and HPC Enterprise, that may either require maximum density of compute-to-storage capability or are limited by available rack space. The RB13804 is pre-integrated with an Intel Server Board S2600WFTR that supports up to two 2nd Generation Intel Xeon Scalable 'Cascade Lake' Processors, allowing cost and build flexibility in deployment.

The RB13804 is an easy-to-use barebones server solution that pre-integrates a 2-socket Intel Server Board to ensure a flexible, scalable design with mission-critical reliability. Notably, the RB13804 offers tri-mode storage with interchangeable backplane that enables universal drive bays that can switch between SAS, SATA and NVMe storage types, allowing a single server to upgrade according to the growing needs of the business.

ASRock Rack today unveiled a pair of Socket AM4 motherboards targeted at SFF workstation and compact server builds. Both boards are based on the AMD X570 chipset, and include the X570D4U-2L2T, and the X570D4I-2T. The larger X570D4U-2L2T is built in the Micro-ATX form-factor, and comes with support for 3rd Gen Ryzen "Matisse" and "Picasso" processors (for now). The board is designed with its components and heatsinks aligned for server rack airflow. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it for the CPU with a 6+2 phase VRM. The AM4 socket is wired to four DDR4 DIMM slots that supports both ECC and non-ECC UDIMMs. Expansion includes one PCI-Express 4.0 x16, a gen 4.0 x8, and a gen 4.0 x1.

Storage options on the X570D4U-2L2T include seven SATA 6 Gbps, from which one is high-powered to support DOMs; and two M.2-2280 slots with PCIe 4.0 x4 wiring, one of which even has SATA 6 Gbps wiring. Enterprise-relevant features include two 10 GbE networking interfaces driven by an Intel X550-AT2 controller, two 1 GbE interfaces handles by Intel i210-series controllers; an ASPEED IPMI+iKVM management chip that also puts out basic display; and various server-relevant legacy connectivity.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.

VIPER GAMING by PATRIOT, a trademarked brand of PATRIOT and a global leader in performance memory, solid-state drives, and flash storage solutions, is excited to announce the launch of their new 32 GB memory modules into the VIPER STEEL SERIES DDR4 PERFORMANCE MEMORY. The new 32 GB modules are available in both UDIMM and SODIMM. The frequencies from 3000 MHz to 3600 MHz are available for UDIMM and the frequencies from 2400 MHz to 3000 MHz for SODIMM. The new modules are built from rigorously tested memory chips and components on a ten-layer PCB for optimum performance in gaming desktops and laptops.

The VIPER STEEL provides extra gaming performance and stability for the most demanding desktop and laptop environments across the latest Intel and AMD platforms. The VIPER STEEL modules bring Intel XMP 2.0 performance to the next level by offering hardcore gamers and enthusiasts the possibility to upgrade their gaming systems with more DRAM memory capacity and further extending their potential.

HP unveiled its V8 RGB line of DDR4 memory modules targeted at the DIY market. The full-height UDIMM module is characterized by dark aluminium heatspreaders and an RGB LED silicone diffuser crown. The module comes in 8 GB single-rank, and 16 GB dual-rank densities, and speeds of DDR4-3000, DDR4-3200, DDR4-3466, and DDR4-3600. The lighting supports ARGB control through popular apps such as ASUS Aura, GIGABYTE RGB Fusion, MSI Mystic Light, and ASRock Polychrome. HP intends to sell the V8 RGB in single-module kits. The company didn't reveal pricing.

ASRock Rack, - the HPC and Workstation leading manufacturer ASRock Rack announces its new mATX workstation motherboard; the W480D4U, which supports the latest 10th Gen Intel Core and Intel Xeon W-1200 Series processors with single socket LGA1200. And the W480D4U is optimized with best compatibility and reliability by supporting the dual channel ECC-UDIMMs.

The W480D4U could be ideal candidate for light loading workstation solution by its small form factor. This compact motherboard provides 4x DDR4 ECC-UDIMMs, as well as two M.2 with PCIe3.0 x4 interface supporting Intel Optane Memory Module and Intel Rapid Storage Technology (Intel RST) in micro-ATX form factor. While having the HDMI supported by Intel CPU integrated Intel UHD Graphics, USB3.2 Gen2 and 8x SATA 6 Gb/s connections, W480D4U will also be the best choice as the light creation workstation for SOHO design studio and freelancers. Moreover, with the BMC AST2500 for IPMI remote management, W480D4U will be your new choice for entry level server solution.

PATRIOT , a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today has announced the release of their latest Signature Premium series line of DDR4 UDIMM memory, which are Non-ECC unbuffered memory designed to deliver outstanding quality, rock solid stability and great performance expected by today's mainstream PC builder.

Signature Premium DDR4 memory provides a wide range of capacities allowing the builder to choose from a variety of speeds and capacities starting with 4GB single modules up to 32GB dual channel kits. The minimalist heat spreader design offers great heat dissipation and is made from high-purity aluminum. Signature Premium DDR4 series modules offer reliability to those who upgrade or build systems for work or business and are cost effective too.

Advantech, a leading global flash storage and memory solutions provider in the embedded market, announces the industry's most comprehensive lineup of 32GB DDR4 unbuffered DIMM memory. Advantech SQRAM offers single 32GB DRAM modules in various DIMM types including SODIMM, UDIMM, ECC DIMM, and extremely robust Rugged DIMM with guaranteed wide temperature operation for high performance computing in applications such as networking and military.

As the global IoT market gradually embraces big data and edge computing, demand for high data and performance processing is increasing. SQRAM 32 GB unbuffered DIMM memory uses Samsung's 16 Gb 2666 MT/s IC chips for high reliability requirements in mission critical applications. SQRAM 32 GB wide temperature operation (-40~85 °C) Rugged DIMM offers extreme vibration resistance, plus ECC checking to ensure data accuracy.

Intel's 6-core "Coffee Lake" die was essentially a "Kaby Lake" die with two extra cores, and no physical changes to other components, such as iGPU or uncore. With its new 8-core "Coffee Lake" Refresh silicon, Intel has turned its attention to not just increasing the core-count, but also improving the processor's integrated memory controller, in addition to hardware fixes to certain security vulnerabilities. The 128-bit wide (dual-channel) integrated memory controller now supports up to 128 GB of memory. Intel's current DDR4-capable mainstream desktop processors only support up to 64 GB, as do rival AMD's Ryzen socket AM4 processors.

Support for up to 128 GB explains the emergence of off-spec memory standards such as ASUS' Double Capacity (DC) DIMMs. Samsung is ready with a JEDEC-compliant 32 GB dual-rank UDIMM memory module for client platforms. Introduction of 32 GB UDIMMs also comes amidst reports of DRAM pricing cool-off through 2019, which could make 32 GB dual-channel memory kits consisting of two 16 GB UDIMMs more affordable. The increase in maximum memory amount could also indicate Intel's seriousness to introduce 3D Xpoint-based Optane Persistent Memory modules as alternatives to DRAM-based main memory, with higher capacities compensating for worse latencies and data-rates compared to DRAM.

Samsung is ready with a 32 GB DDR4 UDIMM (unbuffered DIMMs) targeted at desktops. Dual-channel kits with these modules could let you max out the 64 GB memory limit of today's mainstream desktop processors, and 128 GB limits of Intel's Core X HEDT processors, with quad-channel kits. AMD's Ryzen Threadripper processors are advertised to support up to 2 TB of memory (including ECC support), so it should finally be possible to pack up to 256 GB of memory on Threadripper-powered machines.

The new M378A4G43MB1-CTD DDR4 UDIMM from Samsung is, unsurprisingly, a dual-rank module (x8 / x16 Organization or up to 2 ranks per DIMM and 2DPC configuration). It ticks at DDR4-2666 at a module voltage of 1.2 V. The module itself won't be much to look at, with a green PCB and bare-naked DRAM chips. It is is currently sampling to PC OEMs. It could also be possible for more popular memory manufacturers to get in touch with Samsung for the DRAM chips that make up this module. A single-rank variant of this module could finally make it possible for AMD Ryzen AM4 machines to have 32 GB of dual-channel memory at acceptably high memory clocks.

Silicon Power, a leading provider of memory storage solutions, today announces an upgraded addition to its breakthrough memory module lines. To meet the needs of evolving performance standards, SP introduces the DDR4 2666 SODIMM and UDIMM memory modules. Compatible with a range of upcoming platforms and motherboards, the two modules are an important upgrade for users in the months leading up to a DDR5 launch.

Perfecting An Already Great Product by Staying Current And Fast
Silicon Power released the DDR4 2666 SODIMM and UDIMM models to stay current and compatible with new releases that are revolutionizing the memory module industry.