Being on the forefront of technology adoption as far as its graphics products go, AMD will have a notebook platform with DirectX 11 compliant integrated GPUs ready by 2011, reveal company slides sourced by Expreview. The iGPU will be part of the company's "Accelerated Processing Unit" (APU) design approach to the PC's central processing. The APU draws parallels with Intel's upcoming processor designs where the CPU package holds both the CPU and northbridge dice in a multichip-module. One of the first AMD APUs, codenamed "Llano" will be part of the company's "Sabine" mobile platform. Typically consisting of the CPU, a DDR3 memory controller, a northbridge with integrated graphics processor, and the PCI-Express root complex, APU eliminates discrete northbridge from board design.

Slated for 2011, the Llano APU comes out at a time when DirectX 11 is expected to be an established API. The iGPU will also pack UVD 3.0, a next generation hardware-accelerated video decoder by AMD. It will be built on the 32 nm manufacturing process by AMD's foundry partner(s). It features up to 4 x86 processing cores, an iGPU, a memory controller supporting DDR3-1600 memory, 128-bit floating-point execution units (present even with current generation Phenom processors), and a BGA design with a low-TDP package. Llano will be accompanied by the SB9xxM series southbridge. This chip would make for most of the board's nucleated machinery apart from the APU. It will integrate the "DAC" (we interpret audio DAC), USB 3.0 hubs with 16 ports, a 6-port SATA controller, and clock-generator.

Symwave, a semiconductor supplier of high-performance analog/mixed-signal connectivity solutions for the PC, consumer and mobile devices, today announced collaboration with Seagate to demonstrate Symwave's USB 3.0 storage controller device designed to comply with the SuperSpeed (USB 3.0) specification revision 1.0. The technology demonstration is the world's first consumer product application of USB 3.0 and will take place at the International Consumer Electronics Show (CES) in Las Vegas, Nevada from January 8-11, 2009. The demonstration will showcase streaming data to and from a commercially available external storage device at speeds previously unattainable with legacy USB technology.

A major update and commercial introduction to the USB technology has been long overdue. While most devices such as printers, MFDs and other office automation equipment seem fairly comfortable with the bandwidth USB 2.0 offers, with storage solutions where large amounts of data transfer is involved, USB needs a facelift, so much so that companies are slowly gaining interest in technologies such as eSATA.

At the upcoming CES event, Symwave is planning a demo of an external storage solution based on the new USB 3.0 "SuperSpeed" technology. The device it plans to demo could be an external hard-drive or an enclosure with USB 3.0 compliancy. With 10 times the available bandwidth (4.8 Gbps or 600 MB/s), the new technology looks to provide devices with both performance and backwards compatibility with older USB standards. The Symwave storage solution will be one of first devices the technology kicks-off with.

The USB 3.0 Promoter Group today announced the completion of the USB 3.0 specification, the technical map for device manufacturers to deliver SuperSpeed USB technology to the market.

SuperSpeed USB brings significant power and performance enhancements to the popular USB standard while offering backward compatibility with billions of USB-enabled PCs and peripheral devices currently in use by consumers. Delivering data transfer rates up to ten times faster than Hi-Speed USB (USB 2.0) with optimized power efficiency, SuperSpeed USB is the next step in the continued evolution of USB technology.

USB 2.0 has been around for quite some time now, it's already become a serious bottleneck with storage devices where its "up to" 480 Mbps speed limits transfer-rate significantly compared to what today's devices demand. External-SATA had proven to eradicate that bottleneck by providing speeds for external storage devices on par with internal fixed drives. A newer standard of the USB is in the works, this newer interface on paper promises 10-times the amount of bandwidth USB 2.0 did, that's 4.8 Gbps, more than three times over that of e-SATA, 1.5 times over e-SATA II.

At the ongoing Intel Developer Forum (IDF) event, prototype USB 3.0 boards and cables were shown transferring at 307+ MB/s. The USB 3.0 coalition proclaims this is fast enough to transfer a 27 GB HD in just 60 to 70 seconds. This interface is backwards compatible with USB 2.0 (HiSpeed) and USB 1.1 (FullSpeed), and will be referred to as SuperSpeed. A representative from Ellisys said current flash memory and hard drive storage capacities are outstripping USB 2.0 transfer speeds.