JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-6, the latest Low Power Double Data Rate 6 (LPDDR6) standard. JESD209-6 is designed to significantly boost memory speed and efficiency for a variety of uses including mobile devices and AI. The new JESD209-6 LPDDR6 standard represents a significant advancement in memory technology, offering enhanced performance, power efficiency, and security.

High Performance
To enable AI applications and other high-performance workloads, LPDDR6 employs a dual sub-channel architecture that allows for flexible operation while maintaining a small access granularity of 32 bytes. In addition, LPDDR6 key features offer:

• 2 sub-channels per die, 12 data signal lines (DQs) per sub-channel to optimize channel performance capabilities
• Each sub-channel includes 4 command/address (CA) signals, optimized to reduce ball count and improve data access speed
• Static efficiency mode designed to support high-capacity memory configurations and maximize bank resource utilization
• Flexible data access, on-the-fly burst length control to support 32B & 64B access
• Dynamic write NT-ODT (non-target on-die termination) enables the memory to adjust ODT based on workload demands, improving signal integrity

Samsung Display today announced that the company has earned Marketing Claim Verification from global safety science company UL Solutions for claims related to perceived brightness. This marks the first time UL Solutions has issued a Marketing Claim Verification for a technology that leverages PCL calculations.

To achieve UL Solutions' Marketing Claim Verification, Samsung's True Bright, which is a distinction Samsung gives to displays that provides greater perceived brightness when compared to LCDs of the same PCL score, was evaluated for Perceptual Contrast Length (PCL) to quantify the brightness of the black of a display. PCL, which has been adopted as an industry standard by SEMI, refers to the brightness of a display specifically as perceived by the human eye. This metric acknowledges that perceived brightness is influenced not only by the physical light emitted by the panel but also by its contrast ratio. OLED displays typically have a contrast ratio of 1,000,000:1—over a thousand times that of standard LCDs. The enhanced contrast of OLEDs ensures that the same image is perceived as brighter when compared to LCD displays.

The UALink Consortium today announced the ratification of the UALink 200G 1.0 Specification, which defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. The UALink 1.0 Specification enables 200G per lane scale-up connection for up to 1,024 accelerators within an AI computing pod, delivering the open standard interconnect for next-generation AI cluster performance.

"As the demand for AI compute grows, we are delighted to deliver an essential, open industry standard technology that enables next-generation AI/ML applications to the market," said Kurtis Bowman, UALink Consortium Board Chair. "UALink is the only memory semantic solution for scale-up AI optimized for lower power, latency and cost while increasing effective bandwidth. The groundbreaking performance made possible with the UALink 200G 1.0 Specification will revolutionize how Cloud Service Providers, System OEMs, and IP/Silicon Providers approach AI workloads."

Customers evaluating AI infrastructure today rely on a combination of industry-standard benchmarks and real-world model performance metrics—such as those from Llama 3.1 405B, DeepSeek-R1, and other leading open-source models—to guide their GPU purchase decisions. At AMD, we believe that delivering value across both dimensions is essential to driving broader AI adoption and real-world deployment at scale. That's why we take a holistic approach—optimizing performance for rigorous industry benchmarks like MLperf while also enabling Day 0 support and rapid tuning for the models most widely used in production by our customers.

This strategy helps ensure AMD Instinct GPUs deliver not only strong, standardized performance, but also high-throughput, scalable AI inferencing across the latest generative and language models used by customers. We will explore how AMD's continued investment in benchmarking, open model enablement, software and ecosystem tools helps unlock greater value for customers—from MLPerf Inference 5.0 results to Llama 3.1 405B and DeepSeek-R1 performance, ROCm software advances, and beyond.

Intel's Vision 2025 conference ended yesterday—since then, media outlets have spent time poring over a multitude of announcements made during the two-day Las Vegas, Nevada event. Notably, Team Blue leadership confirmed that their Core Ultra 300 "Panther Lake" processor series is built to scale (on) 18A, and is on track for production later this year." Prominently-displayed presentation material indicated a roadmapped 2026 launch of "Panther Lake" client chips. The success of this next-gen mobile processor family is intertwined with Intel's Foundry service making marked progress. As summarized by the company's social media account, production teams are celebrating another milestone: "Intel 18A has entered risk production. This final stage is about stress-testing volume manufacturing before scaling up to high volume in the second half of 2025."

Under Pat Gelsinger's command, Team Blue set off on a "five nodes in four years" (5N4Y) adventure around mid-2021. This plan is set to conclude with the finalization of 18A, at some point this year, under a newly refreshed regime—with Lip-Bu Tan recently established as CEO. During an on-stage Intel Vision 2025 session, Kevin O'Buckley—Senior VP of Foundry Services—explained the meaning of: "risk production, while it sounds scary, is actually an industry standard terminology, and the importance of risk production is we've gotten the technology to a point where we're freezing it...Our customers have validated that; 'Yep, 18A is good enough for my product.' And we have to now do the 'risk' part, which is to scale it from making hundreds of units per day to thousands, tens of thousands, and then hundreds of thousands. So risk production..is scaling our manufacturing up and ensuring that we can meet not just the capabilities of the technology, but the capabilities at scale." By original "5N4Y" decree, top brass demanded that process nodes be (fully) available for production, rather than be stuck in a (not quite there) final high volume manufacturing (HVM) phase.

At Xbox, our mission is clear: bring the joy and community of gaming to everyone on the planet. We believe that gamers should be able to play the games they want, with the people they want, anywhere they want. Central to this vision is empowering game creators to deliver exceptional content across all platforms seamlessly. Our goal is simple: to make every screen in the world an Xbox.

Since the original Xbox debuted as the first game console equipped with a built-in hard drive, this kernel of innovation has been at the core of our identity. With Xbox Live, we reshaped multiplayer gaming, establishing an industry standard for online connectivity, community building, and digital distribution. Furthering our commitment to accessibility and choice, Xbox Game Pass introduced a subscription model that redefined how players discover and engage with games, creating new opportunities for developers to connect with audiences worldwide. Since our earliest explorations in the console space, we're proud to have led the way in ensuring that hardware and services can best meet the changing needs of the gaming audience.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, has demonstrated its first 2 nm silicon IP for next-generation AI and cloud infrastructure. Produced on TSMC's 2 nm process, the working silicon is part of the Marvell platform for developing custom XPUs, switches and other technology to help cloud service providers elevate the performance, efficiency, and economic potential of their worldwide operations.

Given a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the market for accelerated compute by 20281.

Ultra Accelerator Link Consortium (UALink) has announced the expansion of its Board of Directors with the election of Alibaba Cloud Computing Ltd., Apple Inc., and Synopsys Inc. The new Board members will leverage their industry knowledge to advance development and industry adoption of UALink - a high-speed, scale-up interconnect for next-generation AI cluster performance.

"Alibaba Cloud believes that driving AI computing accelerator scale-up interconnection technology by defining core needs and solutions from the perspective of cloud computing and applications has significant value in building the competitiveness of intelligent computing supernodes," said Qiang Liu, VP of Alibaba Cloud, GM of Alibaba Cloud Server Infrastructure. "The UALink consortium, as a leader in the interconnect field of AI accelerators, has brought together key members from the AI infrastructure industry to work together to define interconnect protocol which is natively designed for AI accelerators, driving innovation in AI infrastructure. This will strongly promote the innovation of AI infrastructure and improve the execution efficiency of AI workloads, contributing to the establishment of an open and innovative industry ecosystem."

The CXL Consortium, an industry standard body advancing coherent connectivity, announces the release of its Compute Express Link (CXL) 3.2 Specification. The 3.2 Specification optimizes CXL Memory Device monitoring and management, enhances functionality of CXL Memory Devices for OS and Applications, and extends security with the Trusted Security Protocol (TSP).

"We are excited to announce the release of the CXL 3.2 Specification to advance the CXL ecosystem by providing enhancements to security, compliance, and functionality of CXL Memory Devices," said Larrie Carr, CXL Consortium President. "The Consortium continues to develop an open, coherent interconnect and enable an interoperable ecosystem for heterogeneous memory and computing solutions."

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard. JESD230G introduces speeds of up to 4800 MT/s, as compared to 400 MT/s in the first version of JESD230 published in 2011. Also, JESD230G adds a separate Command/Address Bus Protocol (SCA), delivering enhanced throughput and efficiency by allowing hosts and NAND devices to take maximum advantage of the latest interface speeds. JESD230G is available for free download from the JEDEC website.

"JEDEC is excited to release JESD230G," said David Landsman, Distinguished Engineer at Western Digital and Chair of the JEDEC NAND TG. He added, "This version of JESD230 further advances the capabilities of NAND flash devices to meet the growing demands of their expanding range of applications and continues the JEDEC tradition of building interoperable ecosystems through open industry standards."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of PS-007A LPDDR5 CAMM2 Connector Performance Standard. The connector, referred to as "LP5CAMM2," is designed to offer a standardized modular LPDDR5 solution with ecosystem support, unlike the traditional LPDDR5 memory-down approach. Developed by JEDEC's JC-11 Committee for Mechanical Standardization, PS-007A is available for free download from the JEDEC website.

As compared to a DDR5 SODIMM connector, benefits of the LP5CAMM2 connector include:

• Better signal integrity (SI) and improved radio frequency interference (RFI)
• To enable a module solution with lower power consumption and increased battery life
• 50% form factor reduction with the similar Z height

AMD continually sets the industry standard with its EPYC Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors.

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering exceptional performance for high-demand workloads while maximizing power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability. Engineered to excel in the most demanding embedded environments, the AMD EPYC Embedded 8004 Series is perfectly suited for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring seamless handling of dynamic workloads.

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is announcing the all-new FlexTwin family of systems which has been designed to address the needs of scientists, researchers, governments, and enterprises undertaking the world's most complex and demanding computing tasks. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is purpose-built to support demanding HPC workloads including financial services, scientific research, and complex modeling. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results. Up to 90% of the server generated heat is removed with the liquid cooling solution, saving significant amounts of energy and enabling higher compute performance."

The Bluetooth Special Interest Group (SIG), the organization that oversees Bluetooth technology, announced the release of Bluetooth Channel Sounding, a new secure, fine-ranging feature that promises to enhance the convenience, safety, and security of Bluetooth connected devices. By enabling true distance awareness in billions of everyday devices, Bluetooth Channel Sounding opens countless possibilities for developers and users alike.

"Bluetooth technology has become an ingredient of everyday life," said Neville Meijers, CEO, Bluetooth Special Interest Group. "When connected devices are distance-aware, a range of new possibilities emerge. Adding true distance awareness to Bluetooth technology exemplifies the ongoing commitment of the Bluetooth SIG community to continuously enhance our connection with our devices, one another, and the world around us."

OPENEDGES Technology, Inc., the leading provider of memory subsystem intellectual property (IP), today announced the launch of the Universal Chiplet Interconnect Express (UCIe) Controller IP, named OUC. UCIe is an open industry standard for a die-to-die interconnect, and co-developed by industry giants including AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, and Samsung. UCIe is becoming a new trend in the semiconductor industry due to its advantages, such as increased semiconductor circuit integration, reduced production costs, and higher yields. OPENEDGES is contributing to UCIe consortium as a contributing member.

The OUC, deriving its name from OPENEDGES UCIe Controller, is tailored for highly customizable, package-level integration, facilitating die-to-die interconnect and protocol connections. It creates an interoperable, multi-vendor ecosystem set to revolutionize chip integration methodologies across the industry.

IBM has announced the official opening of the new IBM X-Force Cyber Range in Washington, DC. The range includes new custom training exercises specifically designed to help U.S. federal agencies, their suppliers and critical infrastructure organizations more effectively respond to persistent and disruptive cyberattacks, and threats posed by AI. The state-of-the-art facility is designed to help everyone from legal and mission-critical leaders, to the C-Suite and technical security leaders prepare for a real-world cyber incident. According to IBM's 2023 Cost of a Data Breach report the global average cost of a data breach reached $4.45 million, with the US facing the highest breach costs across all regions. Organizations that formed an incident response (IR) team and tested their IR plan experienced faster incident response times and lower costs than organizations that did neither. In fact, the report found that high levels of IR planning and testing saved industry and government nearly $1.5 million in breach costs and 54 days from the data breach lifecycle.

"From national security threats to supply chain disruptions impacting the goods and services we rely on every day, cyberattacks on government and critical infrastructure can have ramifications that go far beyond the balance sheet," said Alice Fakir, Partner, Lead of Cybersecurity Services, US Federal Market for IBM Consulting. "The elite and highly customizable cyber response training we provide at our new DC range helps organizations and federal agencies better defend against existing and emerging threats, and also addresses federal mandates like those in the Biden Administration's Executive Order 14028 focused on improving the nation's cybersecurity."

Today, The Khronos Group, an open consortium of industry-leading companies creating advanced interoperability standards, announced the latest roadmap milestone for Vulkan, the cross-platform 3D graphics and compute API. The Vulkan roadmap targets the "immersive graphics" market, made up of mid- to high-end smartphones, tablets, laptops, consoles, and desktop devices. The Vulkan Roadmap 2024 milestone captures a set of capabilities that are expected to be supported in new products for that market, beginning in 2024. The roadmap specification provides a significant increase in functionality for the targeted devices and sets the evolutionary direction of the API, including both new hardware capabilities and improvements to the programming model for Vulkan developers.

Vulkan Roadmap 2024 is the second milestone release on the Vulkan Roadmap. Products that support it must be Vulkan 1.3 conformant and support the extensions and capabilities defined in both the 2022 and 2024 Roadmap specifications. Vulkan roadmap specifications use the Vulkan Profile mechanism to help developers build portable Vulkan applications; roadmap requirements are expressed in machine-readable JSON files, and tooling in the Vulkan SDK auto-generates code that makes it easy for developers to query for and enable profile support in their applications.

Farming Simulator 22 now supports AMD FSR 3 on PC, so you can enjoy even smoother farming. Download game update 1.13.1.1, and activate FSR plus Frame Generation to boost your frame rate on supported graphics cards! Wait, what's FSR? AMD FidelityFX Super Resolution (in short: AMD FSR) uses upscaling technologies that aim to increase the frame rate. In simplified terms, it first renders Farming Simulator 22 at a lower resolution, but then upscales it using a variety of (very smart & efficient) techniques. Without sacrificing image quality, you can significantly increase the performance of Farming Simulator 22, especially when demanding settings are enabled. Try it!

What's new in FSR 3?
AMD FSR 3 improves upon FSR 2's upscaling and adds Frame Generation. This feature can be activated separately in the graphics settings of Farming Simulator 22. It generates additional frames to increase the frame rate. Imagine one new frame being inserted in between two existing frames. In some, ideal situations, depending on your hardware and individual settings, FSR 3 with activated Frame Generation can straight up double your displayed FPS to guarantee some extra-smooth farming! Please note: AMD FSR 3 Frame Generation is recommended to be used with a minimum of 60 FPS before FG-activation!

Ayar Labs, a leader in silicon photonics for chip-to-chip connectivity, will showcase its in-package optical I/O solution integrated with Intel's industry-leading Agilex Field-Programmable Gate Array (FPGA) technology. In demonstrating 5x current industry bandwidth at 5x lower power and 20x lower latency, the optical FPGA - packaged in a common PCIe card form factor - has the potential to transform the high performance computing (HPC) landscape for data-intensive workloads such as generative artificial intelligence (AI), machine learning, and support novel new disaggregated compute and memory architectures and more.

"We're on the cusp of a new era in high performance computing as optical I/O becomes a 'must have' building block for meeting the exponentially growing, data-intensive demands of emerging technologies like generative AI," said Charles Wuischpard, CEO of Ayar Labs. "Showcasing the integration of Ayar Labs' silicon photonics and Intel's cutting-edge FPGA technology at Supercomputing is a concrete demonstration that optical I/O has the maturity and manufacturability needed to meet these critical demands."

Phison Electronics, a global leader in NAND controllers and storage solutions, announced today that the company has expanded its portfolio of PCIe 5.0 high-speed transmission solutions with PCIe 5.0, CXL 2.0 compatible redriver and retimer data signal conditioning IC products. Leveraging the company's deep expertise in PCIe engineering, Phison is the only signal conditioners provider that offers the widest portfolio of multi-channel PCIe 5.0 redriver and retimer solutions and PCIe 5.0 storage solutions designed specifically to meet the data infrastructure demands of artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and other data-intensive, next-gen applications. At the 2023 Open Compute Project Global Summit, the Phison team is showcasing its expansive PCIe 5.0 portfolio, demonstrating the redriver and retimer technologies alongside other enterprise NAND flash, illustrating a holistic vision for a PCIe 5.0 data ecosystem to address the most demanding applications of the AI-everywhere era.

"Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase," said Michael Wu, President & General Manager, Phison US. "Phison's accumulated experience in high-speed signaling enables our team to deliver retimer and redriver design solutions that are optimized for top signal integration, low power usage, and high temperature endurance, to deliver interface speeds for the most challenging compute environments."

SiMa.ai, the machine learning company delivering solutions for the embedded edge, today announced the results of its second MLPerf submission, outperforming industry ML leader, NVIDIA's Orin NX and AGX Orin in the Closed Edge power category in the MLCommons ML Perf 3.1 benchmark. SiMa.ai participated in the MLPerf Inference 3.1 closed, edge, power division of this benchmarking process, focusing on the image classification benchmark Resnet50. Since the company's prior submission in April 2023, SiMa.ai achieved a 20 percent improvement in its results for Single Stream Resnet50 for performance and power, while exhibiting up to 85 percent greater Resnet50 MultiStream efficiency compared to NVIDIA. With frames per second per watt as the defacto performance standard for edge AI and ML, these results demonstrate SiMa.ai's pushbutton approach drives continued leadership in unrivaled power efficiency that does not compromise performance.

"Outperforming the industry leader not only once, but again for a second time is great validation for our technology. Our team at SiMa.ai will persistently pursue performance per watt leadership and new standards in ease of use for the embedded edge market as part of our core DNA," said Krishna Rangasayee, CEO and founder, SiMa.ai. "We are proud of the SiMa.ai team's leadership in the latest MLPerf benchmark and excited to extend these latest improvements to our customers' real-world needs and use cases."

NVIDIA joined Pixar, Adobe, Apple and Autodesk today to found the Alliance for OpenUSD, a major leap toward unlocking the next era of 3D graphics, design and simulation. The group will standardize and extend OpenUSD, the open-source Universal Scene Description framework that's the foundation of interoperable 3D applications and projects ranging from visual effects to industrial digital twins.

Several leading companies in the 3D ecosystem already signed on as the alliance's first general members—Cesium, Epic Games, Foundry, Hexagon, IKEA, SideFX and Unity. Standardizing OpenUSD will accelerate its adoption, creating a foundational technology that will help today's 2D internet evolve into a 3D web. Many companies are already working with NVIDIA to pioneer this future.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.