Intel did put a small spotlight on its upcoming 14th Gen Core "Raptor Lake Refresh" processor series at last week's Innovation event. This very brief aspect of their presentation has received only minor press coverage (in retrospect) since Team Blue did not do a great deal to publicize their "next-gen" release. In a pre-keynote segment on the second day of proceedings, an on-the-floor demonstration focused on AI-related virtual production methods. Craig Raymond, a Team Blue Technologist, showcased a workstation rig that deals with "meta-human" avatar plug-in for Unreal Engine.

Raymond pointed to a PC tower positioned under the work desk and introduced it as "running on our Raptor Lake Refresh right here," he continued: "so, we're showing off some of our brand new hardware for the first time, that is pre-launch, so we're giving everyone a first peek on what that really looks like." A grand total of 12 seconds was dedicated to 14th Gen Core during the second day livestream. They quickly moved onto previewing a Thunderbolt 5-equipped laptop that sat in the demo room. Intel is likely lining up a proper reveal of Raptor Lake Refresh SKUs closer to the expected October 17 launch of higher-end K and KF variants.

Andreas Schilling, editor at Hardwareluxx, noticed some interesting looking Intel Meteor Lake-related merchandise very recently—last week's Innovation event served as a proper public unveiling of the next generation mobile processor series, scheduled to launch on December 14. Team Blue showcased their new advanced disaggregated chiplet design during a keynote presentation, but did not provide a comprehensive breakdown of upcoming SKUs and feature sets. A couple of clues were presented in plain sight (see below)—Schilling reckons that some tongue-in-cheek marketing was in effect: "Intel is leaking with its own swag. We know there will be different configurations of the compute, I/O and graphics tiles with Meteor Lake. The GPU will use 8 or 4 Xe cores it seems."

Intel has hyped up Meteor Lake's integrated GPU chiplet as having "performance parallelism and throughput, ideal for AI infused in media, 3D applications and the render pipeline." VideoCardz had this to say about the Alchemist-derived setup: "This integration of Xe-LPG architecture is expected to deliver a 2x performance boost compared to the existing Xe-LP architecture found in Raptor Lake. Intel put a lot of emphasis on supporting 10 W gaming with this architecture, potentially opening a new competing front versus AMD RDNA 3 in handheld." The Meteor Lake "swag" hints that at least two different configurations are in the works, with 8 or 4 Xe-Cores (as printed on the two pieces of merch). Intel's Meteor Lake SKU hierarchy could consist of models with varying levels of iGPU potency, since the chiplet design provides a great deal of flexibility.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the brand-new H610MS and H610MHD D5 motherboards designed to supplement the needs of modern day professionals and home users seamlessly. Built based on Intel H610 single-chip architecture, ready for 12th and 13th Gen Intel Core Processors, these motherboards are ideal for the working professional, making tasks such as web browsing, emailing, and document management a breeze. For the home user, it delivers an unparalleled experience whether watching movies on Netflix, listening to music, gaming, or even for HTPC uses like streaming, live TV recording, and more.

The H610MS motherboard supports the robust DDR4 memory modules. Users can utilize 2 DIMM slots with a capacity of up to 64 GB. Meanwhile, the H610MHD D5 motherboard is designed to handle the latest DDR5 memory modules across a similar 2-DIMM configuration of up to 96 GB of Memory, ensuring users have a breadth of choices for their distinct build preferences. These motherboards are brimming with cutting-edge features tailored to modern computing demands. Each board seamlessly supports USB 3.2 Gen 1, ensuring rapid data transfers and connectivity. Additionally, they are primed for the future with support for both PCIe 4.0 and PCIe 3.0 interfaces, offering enhanced versatility for expansions. Furthermore, they are equipped to accommodate the blazing speeds of PCIe 3.0 M.2 drives with a bandwidth of 32 Gb/s, catering to users who seek swift storage solutions.

PC World's senior editor, Mark Hachman, managed to corner an important Team Blue staffer during this week's Innovation 2023 event, where Core Ultra "Meteor Lake" processors were presented in an official manner. This CPU family is set to arrive on December 14, but starting out only in mobile form—past leaks have yoyo-ed between rumored plans for desktop variants being alive or getting canned entirely. Michelle Johnston Holthaus—executive vice president and general manager of the Client Computing Group at Intel Corporation—confirmed to PC World in a video interview that Meteor Lake desktop SKUs are scheduled for launch next year. She elaborated on this slightly surprising declaration: "I want one processor family top to bottom for both segments, doesn't everybody?"

Exact details regarding release timings were not disclosed, but previous leaks have indicated that the rest of Intel's 14th Gen Core/Raptor Lake Refresh desktop lineup is due in early 2024—a product launch of 65 W TDP-rated SKUs could coincide with CES 2024. A "Meteor Lake-S" desktop CPU series is speculated to be placed mid-year, while the Arrow Lake generation is believed to be slated for late 2024. Reports have suggested that Meteor Lake has been delayed numerous times due to developmental setbacks—a leaked presentation slide seemed to show MTL-S SKUs (on socket LGA1851) being limited to 35 and 65 W TDPs, thus restricting the range to Core i3 and i5 product lines. Intel's new naming scheme—for the Meteor Lake generation—will assign "Core Ultra 5" instead of "Core i5" if new models land in the "Premium" processor bracket. We are not entirely sure where the future equivalent to "Core i3" will stick in the lower-end hierarchy, but the revised naming system suggests that it will only exist within Intel's "Mainstream" tier—so just a plain "Core 3," without any mention of Ultra performance or feature set.

Team Blue's marketing team has kicked into hype mode—Meteor Lake is launching at the tail end of 2023—with a shift in naming conventions comes another rebranding of internal technologies. The previously identified versatile processing unit (VPU) is now going under a different moniker: "Intel will usher in the age of the AI PC with the upcoming Intel Core Ultra processors, code-named Meteor Lake, featuring Intel's first integrated neural processing unit, or NPU, for power-efficient AI acceleration and local inference on the PC. Intel confirmed Core Ultra will launch Dec. 14." Michael Larabel, principal author at Phoronix, has noticed that newly updated versions of the Linux kernel have the "IVPU" accelerator driver bundled in. This will: "support Meteor Lake's VPU/NPU, while a patch is pending to extend that support for next-generation Arrow Lake processors."

In his opinion, there are some shared aspects across the two CPU generations: "Intel's Arrow Lake NPU appears very similar to that of Meteor Lake with the driver enablement coming down to adding new PCI IDs...(with) this patch adding the new Arrow Lake PCI IDs to the existing Meteor Lake driver code paths for this DRM accelerator driver is all that's needed to enable the VPU." Team Blue jumped two generations ahead at this week's Innovation event—Lunar Lake showed up in a live demo. Larabel believes that this late 2024 CPU family will revolve the dial to a greater degree: "The VPU/NPU with Lunar Lake brings more significant changes with the open-source driver changes already underway there. With Lunar Lake is the new VPU4 IP and the Linux 6.6 kernel with its updated IVPU driver already has initial support there."

YuuKi_AnS has brought renewed attention to an already leaked Intel "Emerald Rapids" processor—the 5th Gen Xeon Platinum 8580 CPU was identified with 60 cores and 120 threads in a previous post, but a follow up has appeared in the form of an engineering prototype (ES2-Q2SP-A0). Yuuki noted: "samples are for reference only, and the actual performance is subject to the official version." Team Blue has revealed a launch date—December 14 2023—for its 5th Gen Xeon Scalable processor lineup, so it is not surprising to see pre-release examples appear online a couple of months beforehand. This particular ES2 SKU (on A0 silicon) fields an all P-Core configuration consisting of Raptor Cove units, with a dual-chiplet design (30 cores per die). There is a significant bump up in cache sizes when compared to the current "Sapphire Rapids" generation—Wccftech outlines these allocations: "Each core comes with 2 MB of L2 cache for up to 120 MB of L2 cache. The whole chip also features 300 MB of L3 cache which combines to offer a total cache pool of 420 MB."

They bring in some of the competition for comparison: "That's a 2.6x increase in cache versus the existing Sapphire Rapids CPU lineup and while it still doesn't match the 480 MB L3 cache of standard (AMD) Genoa or the 1.5 GB cache pool of Genoa-X, it is a good start for Intel to catch up." Team Blue appears ready to take on AMD on many levels—this week's Innovation Event produced some intriguing announcements including "Sierra Forest vs. Bergamo" and plans to embrace 3D Stacked Cache technology. Yuuki's small batch of screenshots show the Xeon Platinum 8580 CPU's captured clock speeds are far from the finished article—just a touch over 2.0 GHz, so very likely limited to safe margins. An unnamed mainboard utilizing Intel's Eagle Stream platform was logged sporting a dual-socket setup—the test system was running a grand total of 120 cores and 240 threads!

The European Commission has re-imposed a fine of around €376.36 million on Intel for a previously established abuse of dominant position in the market for computer chips called x86 central processing units ('CPUs'). Intel engaged in a series of anticompetitive practices aimed at excluding competitors from the relevant market in breach of EU antitrust rules.

With today's decision, we are re-imposing a €376.36 million fine on Intel for having abused its dominant position in the computer chips market. Intel paid its customers to limit, delay or cancel the sale of products containing computer chips of its main rival. This is illegal under our competition rules. Our decision shows the Commission's commitment to ensure that very serious antitrust breaches do not go unsanctioned. - Commissioner Didier Reynders, in charge of competition policy

SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

Fans of Team Blue's Alchemist graphics architecture were slightly disappointed by no new discrete Arc GPU products showing up at this week's Innovation event—where product presentations focused heavily on the CPU-side of things. There was a small hope of Intel's Arc A580 GPU making an appearance at Intel's California gig, following alleged pre-release samples getting benchmarked over the summer. This was the first sign of activity in a year—the three other first generation Alchemist SKUs (A380, A750 and A770) have been released into the wild.

The whole series suffered numerous delays, and launched to a mixed reception late last year. Intel engineers have produced plenty of driver updates and software improvements at an admirable rate throughout 2023. We have not heard much about Alchemist+ since springtime—leaked presentation slides indicated that a refreshed generation was marked for launch around the third and fourth quarters of this year. Given that Team Blue did not showcase Arc "1.5" cards during their Innovation show, we can assume that deadlines have been missed yet again. Battlemage has been spotted most recently—in the form of a BMG G10 GPU sitting in plain sight during a press tour of Intel's Malaysian facility. It will be interesting to find out whether this fully next-generation series has been prioritized.

Intel is reportedly settling for 6P+4E as the CPU core configuration for its upcoming Core i5-14400 and i5-14400F desktop processors. That's 6 performance cores or P-cores, and 4 efficiency cores or E-cores. Two distinct engineering samples of the i5-14400 were spotted in the wild, one of which had a 6P+4E configuration, and the other believed to be with 6P+8E, like the rest of the 14th Gen Core i5 series. There are two distinct steppings of the i5-14400 among the engineering samples, besides the core-configuration, B0 and C0.

What differentiates B0 from C0 is the specific die they're based on. B0 is the larger "Raptor Lake-S" die that physically has 8 P-cores and 16 E-cores, which has been significantly cut down to achieve the 6P+4E configuration; whereas C0 is the die the "Alder Lake-S" top-spec processor models were based on, which physically have an 8P+8E configuration. Both B0 and C0 Core i5-14400/F processors have 6P+4E. The P-cores on both steppings, including B0, are configured with 1.25 MB of dedicated L2 cache, the E-core clusters on both each have 2 MB of L2 cache; and both get 20 MB of shared L3 cache, and 65 W of processor base power. The Core i5-14400 and i5-14400F succeed a long line of successful processor models for Intel, positioned around or below the $200 mark.

Durabook, an innovator in purpose-built, rugged computing solutions, today announced the launch of the next-generation S15 Semi-Rugged Laptop equipped with the latest Intel 12th Gen Alder Lake platform. The combination of this powerful CPU, coupled with a comprehensive set of connectivity options, security support, and its capability for further expandability makes this semi-rugged laptop with its large screen the perfect support for professional field services personnel running ever more sophisticated applications in challenging conditions.

The laptop's 15.6" Full HD display may be the first thing to turn the head of a field service professional, but the CPU performance of the S15 Semi-Rugged Laptop with Intel Core i7 and i5 processors that are up to 206% faster than previously is an eye-opener. Looking past the handsome rugged exterior, at the Intel Iris Xe Graphics package, ultra-reliable connectivity, and the ability to operate as a workstation configured with up to three storage drives, this is the ideal rugged laptop for field services workers.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is pleased to unveil the Pacific SW1 Plus CPU Water Block and the Pacific SF Fittings - Silver Black. The custom liquid cooling system provides considerable flexibility in design, allowing you to demonstrate your aesthetic sense. If you are an industrial chic enthusiast, the Pacific SW1 Plus and the Pacific SF Fittings, which feature a New Industrial Style, are the ideal components for leveling up your cooling system's appearance while ensuring thermal performance and installation compatibility.

Pacific SW1 Plus CPU Water Block
Designed with a modern industrial style, the Pacific SW1 Plus CPU Water Block comes in solid aluminium alloy with a screw design, displaying a beautiful glow of metals. The copper base is finished with anti-corrosive nickel plating, matching the overall industrial design and offering an outstanding heat transfer for the CPU. The central inlet design of the base enables the coolant to be distributed evenly through the 0.2 mm microchannels, achieving more effective heat dissipation. What's more, through the TT RGB Plus 2.0 software, you can simply monitor coolant temperature and customize the lighting effects of the water block's 12 addressable LEDs. To fit the latest CPUs, the Pacific SW1 Plus is also compatible with Intel LGA 1700 and AMD AM5 sockets and can be installed without additional brackets.

Intel at the 2023 InnovatiON event surprised audiences with a live demo of a reference notebook powered by a Core "Lunar Lake" processor. What's surprising about this is that "Lunar Lake" won't come out until 2025 (at least), and succeeds not just the upcoming "Meteor Lake" architecture, but also its succeeding "Arrow Lake," which debuts in 2024. Intel is expected to debut "Meteor Lake" some time later this year. What's also surprising is that Intel has proven that the Intel 18A foundry node works. The Compute tile of "Lunar Lake" is expected to be based on Intel 18A, which is four generations ahead of the current Intel 7, which will be succeeded by Intel 4, Intel 3, and Intel 20A along the way.

The demo focused on the generative AI capabilities of Intel's third generation NPU, the hardware backend of AI Boost. Using a local session of a tool similar to Stable Diffusion, the processor was made to generate the image of a giraffe wearing a hat; and a GPT program was made to pen the lyrics of a song in the genre of Taylor Swift from scratch. Both tasks were completed on stage using the chip's NPU, and in timeframes you'd normally expect from discrete AI accelerators or cloud-based services.

Intel at the 2023 InnovatiON event unveiled a 288-core extreme core-count variant of the Xeon "Sierra Forest" processor for high-density servers for scale-out, cloud-native environments. It succeeds the current 144-core model. "Sierra Forest" is a server processor based entirely on efficiency cores, or E-cores, based on the "Sierra Glen" core microarchitecture, a server-grade derivative of "Crestmont," Intel's second-generation E-core that's making a client debut with "Meteor Lake."

Xeon "Sierra Forest" is a chiplet-based processor, much like "Meteor Lake" and the upcoming "Emerald Rapids" server processor. It features a total of five tiles—two Compute tiles, two I/O tiles, and a base tile (interposer). Each of the two Compute tiles is built on the Intel 3 foundry node, a more advanced node than Intel 4, featuring higher-density libraries, and an undisclosed performance/Watt increase. Each tile has 36 "Sierra Glen" E-core clusters, 108 MB of shared L3 cache, 6-channel (12 sub-channel) DDR5 memory controllers, and Foveros tile-to-tile interfaces.

Intel CEO Pat Gelsinger, in the Q&A session of InnovatiON 2023 Day 1, confirmed that the company is developing 3D-stacked cache technology for its processors. The technology involves expanding the on-die last-level cache (L3 cache) of a processor with an additional SRAM die physically stacked on top, and bonded with the cache's high-bandwidth data fabric. The stacked cache operates at the same speed as the on-die cache, and so the combined cache size is visible to software as a single contiguous addressable block of cache memory.

AMD has used 3D-stacked cache to good effect on its processors. On client processors such as the Ryzen X3D series, the cache provides significant gaming performance uplifts as the larger L3 cache makes more of the game's rendering data immediately accessible to the CPU cores; while on server processors such as EPYC "Milan-X" and "Genoa-X," the added cache provides significant uplifts to memory intensive compute workloads. Intel's approach to 3D-stacked cache will be different at the hardware level compared to AMD's, Gelsinger stated in his response. AMD's tech has been collaboratively developed with TSMC, and hinges on a TSMC-made SoIC packaging tech that facilitates high-density die-to-die wiring between the CCD and cache chiplet. Intel uses its own fabs for processor dies, and will have to use its own IP.

As the world experiences a generational shift to artificial intelligence, each of us is participating in a new era of global expansion enabled by silicon. It's the "Siliconomy," where systems powered by AI are imbued with autonomy and agency, assisting us across both knowledge-based and physical-based tasks as part of our everyday environments.

At Intel Innovation, the company unveiled technologies to bring AI everywhere and to make it more accessible across all workloads - from client and edge to network and cloud. These include easy access to AI solutions in the cloud, better price performance for Intel data center AI accelerators than the competition offers, tens of millions of new AI-enabled Intel PCs shipping in 2024 and tools for securely powering AI deployments at the edge.

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

ASUS today announced ASUS ExpertCenter PB63, a compact 1.35-liter mini PC powered by up to a 13th Gen Intel Core processor with Intel UHD graphics and able to support 46-65 watt CPUs. Dual PCIe Gen 4 SSDs and DDR5-5600 MHz memory ensure tasks are seamlessly and efficiently executed. PB63 offers triple-display support by way of its two DisplayPort connections and configurable port (DP / COM / HDMI / VGA / LAN), with additional connectivity options via eight USB ports. Plus, the ability to accommodate up to three storage drives add to this mini PC's versatility. The compact chassis is available in Black or White, and includes Stackable Optical Drive Module Support to accommodate the varying needs of businesses.

Desktop-grade performance
ASUS ExpertCenter PB63 is powered by the latest 13th Gen Intel Core processors with Intel UHD graphics, enabling this mini PC to easily handle any business task. It is able to support 46-65 W CPUs, making it ideal for organizations looking for supreme efficiency or maximum performance.

Intel today updated its ARK listings with two new networking chipsets: Wi-Fi 7 BE200 and Wi-Fi 7 BE202. The company unveiled IEEE 802.11be (Wi-Fi 7) specification-based chipsets despite the standard still needing final ratification. The Wi-Fi 7 standard promises data rates as high as 40 Gbit/s, with Intel's BE200 chipset using 2x2 TX/RX streams with 2.4 GHz, 5 GHz, and 6 GHz bands. However, as demonstrated by the adapter's maximum speed of 5 Gbit/s, real-world implementations might not initially reach the theoretical maximum speed. Various motherboards, like the upcoming Gigabyte Aorus Z790 Master X, are already planning to integrate this technology, showing that the industry is getting ready for a Wi-Fi 7 world.

What makes Wi-Fi 7 especially interesting is its raw speed and underlying technology designed to improve efficiency and capacity. Features like Multi-User Multiple-Input Multiple-Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA), which were introduced in Wi-Fi 6 and 6E, are mandatory in Wi-Fi 7. These technologies aim to optimize the overall performance of wireless networks, making them more suitable for bandwidth-intensive tasks like AR and VR. While full certification for Wi-Fi 7 is not expected until 2024, with widespread adoption to follow, the technology looks poised to become a significant aspect of our wireless future.

An Intel Core i5-14600K processor has been benchmarked roughly a month before its expected rollout at retail—previous leaks have this particular model placed as the most wallet friendly offering within a range of 14th Gen Core "Raptor Lake Refresh" CPUs. A total of six SKUs, with K and KF variants, are anticipated to launch on October 17. An official unveiling of new processor product lineups is scheduled for tomorrow at Team Blue's Innovation event. China's ECSM has managed to acquire an engineering sample (ES) of the aforementioned i5-14600K model, and put it through the proverbial ringer in Cinebench R23, Cinebench 2024, and CPU-Z. The brief report did not disclose any details regarding exact testbench conditions, so some of the results could be less than reliable/accurate.

ECSM's screenshot from CPU-Z re-confirms the Core i5-14600K's already leaked specs—six high-performance Raptor Cove cores running at a 3.50 GHz base clock, going up to 5.30 GHz (a 200 MHz gain over its predecessor: Core i5-13600K). Eight efficiency-oriented Gracemont cores running up to 4.0 GHz—100 MHz more than on the predecessor. The Core i5-14600K and i5-13600K share the same designations of 24 MB L3 cache and 125 W PBP—the leaked engineering sample was shown to have a core voltage of 1.2 V. The previous gen CPU operates on 1.14 V. ECSM noted that CPU package power consumption reached 160 W, and: "currently, the burn-in voltage is still quite out of control, especially for the two 8P models, both of which are at 1.4 V+. However, there is still a lot of room for manual voltage reduction."

What's New: Intel today announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver data-centric applications.

"After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the QGD-1600 16-port Gigabit smart edge switch/cybersecurity switch and QGD-1602 8-port 2.5GbE and 8-port Gigabit smart edge switch/cybersecurity switch. Besides adopting Layer 2 network management and software defined features, the QGD-1600 and QGD-1602 supports running VMs to deploy VPN, firewalls, and network management functions. ADRA NDR software is also supported to provide the widest cybersecurity protection for all the connected LAN devices at the access switch layer.

"Our QGD smart edge switches innovatively integrate the functions of NAS and switches and have received positive feedback from our users," said Alex Shih, QNAP Product Manager, adding, "the addition of the affordable non-PoE models QGD-1600 and QGD-1602 provides a cost-effective all-in-one network solution with cybersecurity software for enhanced LAN security, or running VMs for more software applications."

Thanks to the latest report from Phoronix, we know that Intel is working on supporting the latest "Xe2" graphics architecture for their upcoming Lunar Lake processors. Today, the latest enablement comes in the Mesa Linux drivers. By employing a new technique that allows for importing prior-generation XML files within the Intel Mesa driver code, Intel engineers have managed to streamline the overall file size. This is significant not just for the efficiency it brings but also because it signifies the beginning of work on enabling Xe2 graphics support. It suggests a thoughtful approach to building upon existing architectures, making it easier to adapt and evolve the software support for each new generation of Intel graphics.

Even though we are at the early stage and Lunar Lake is far away, the progress on Xe2 doesn't stop at Mesa driver changes. There is already some work at the kernel level, and new merge requests for draft compiler changes and shader compiler patches have also been spotted. This proactive development strategy positions Intel well in offering robust open-source graphics support for Linux, and it sends a strong signal to the developer community about Intel's dedication to the platform. After the Linux kernel driver works, this Mesa driver will enable better OpenGL/Vulkan API compatibility, so Lunar Lake arrives with proper software support.

To address customers' growing needs, Intel expanded its Intel Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG) offerings to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower total cost of ownership (TCO) and more complete solutions. These new products and technologies will be the focus of Intel's FPGA Technology Day (IFTD) on Sept. 18, where hardware engineers, software developers and system architects can interact with Intel and partner experts.

FPGAs play an important role in Intel's portfolio by offering flexible and customizable platform capabilities for demanding applications and workloads. Intel FPGAs solve customer challenges from cloud to edge with AI capabilities across silicon, IP and software. Intel's latest announcements illustrate how the company's increased investment in its FPGA portfolio is unfolding. So far in 2023, Intel has released 11 of 15 expected new products - more new product introductions than ever in Intel's FPGA business. As disclosed in its second quarter 2023 earnings call, Intel reported that its PSG business unit delivered 35% revenue growth year-over-year, marking the third consecutive quarter of record revenue.

Today HP Inc. redefined versatility with the HP Spectre Foldable PC, a remarkable 3-in-1 device with a foldable screen that seamlessly integrates the best features of a laptop, tablet, and desktop for the ultimate hybrid experience. "Consumers are demanding greater flexibility to connect, work, and play for their hybrid lives beyond what the traditional laptop can provide," said Jo Tan, Senior Vice President & Division President of Personal Systems Consumer Solutions, HP Inc. "We are excited to introduce the HP Spectre Foldable PC, designed to seamlessly adapt to the various ways you want to work with its unique, durable form factor that pushes the boundaries of design and technology."

Designed for Tomorrow's Hybrid Flexibility
The Spectre Fold easily transitions between the three distinct form factors for a frictionless user experience. Effortlessly switch from a traditional laptop to a slim tablet with a continuous 17-inch screen, then to a powerful desktop with a sleek built-in kickstand. This is made possible with a foldable panel and integrated hinge, designed for durability and tested with the same requirements as traditional HP laptops.