As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Accidents happen, especially when you try to avoid them. But rest assured that ASRock's latest ATX sized OC Formula Series motherboards, including Z87 OC Formula/ac (with 802.11ac WiFi support) and Z87 OC Formula are protected by a special layer of Conformal Coating. As you've probably already heard, Conformal Coating protects the motherboards from conductive liquids, dust, corrosion and extreme temperatures*. And if you still feel skeptical about the lifespan of your overclocking oriented motherboards, fear not! ASRock guarantees 5 year warranty!

ASRock's Z87 OC Formula/ac and Z87 OC Formula are designed by the world famous overclocker Nick Shih. These two motherboards possess both hardware and software features for extreme overclocking, and they are also fully loaded with a set of lifestyle based features named A-Style. ASRock provides the five year warranty package as long as the malfunctions and defects occur under normal use conditions and aren't caused by misuse or abnormal operations**. If unfortunately the motherboard cannot be repaired, ASRock will replace the product with equivalent or next generation products.

At an industry event in Taipei today, Hermann Eul, general manager of Intel's Mobile and Communications Group, unveiled new details about the company's forthcoming Intel Atom processor-based SoC for tablets ("Bay Trail-T") due in market for holiday this year. Based on the new Silvermont microarchitecture, the next generation 22nm Intel technology for tablets and ultra-mobile devices will enable sleek designs with 8 or more hours of battery life2 and weeks of standby, as well as support Android* and Windows 8.1*.

Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia. "The mobile category is undergoing a tremendous amount of innovation and constant change," said Eul. "As we look at growing it, we continue to invest in and accelerate our efforts across all aspects of mobility with a focus on smartphones, tablets and wireless communications. Intel's unique assets will enable more compelling and differentiated products and experiences, while at the same time helping to shape and lead markets in the future."

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures. Production of the next generation 40nm eFlash MCUs will take place at different GLOBALFOUNDRIES sites, initially in Singapore with subsequent transfer to its site in Dresden, Germany.

"Next generation embedded Flash microcontrollers with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets," says Arunjai Mittal, Member of the Management Board of Infineon Technologies. "We trust in GLOBALFOUNDRIES with their excellent manufacturing background and sites on different continents to fulfill Infineon's stringent quality, infrastructure security and business continuity requirements."

Samsung Electronics America, Inc. today announced it will expand the ATIV brand to include all of its Windows based PCs. ATIV, previously the brand for the company's Windows based convertible PC devices, now unites all of Samsung's Windows devices under one cohesive brand, representing the convergence of PC and mobile technologies. The new product names under the ATIV brand will provide customers an easy way to understand the product segments across Samsung's PC portfolio. Samsung ATIV will also offer users a consistent and seamless computing experience across Samsung's diverse PC line.

"Samsung has been the fastest growing PC brand for the past three years1, in part because of our commitment to developing solutions that meet and exceed the ever-evolving needs of our customers," said Mike Abary, senior vice president of consumer IT product marketing at Samsung Electronics America. "Our expanded ATIV brand and the introduction of solutions like SideSync create the necessary synergy between our mobile and PC lines to create real ease of use for consumers. These synergies enable us to maintain our momentum and continue to offer our customers innovations that enhance the way they live and work."

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Havok, a leading provider of interactive 3D game technology, today announced the launch of a major new version of its industry-leading Havok Physics technology. The release is the culmination of more than 5 years of internal R&D effort. It features significant technical innovations in performance, memory utilization, usability and simulation quality, and represents a major leap forward in physics simulation for games.

Designed from the ground up for the computing architectures that will define games for the next decade, this release targets next-generation home consoles, mobile and PC while continuing to offer full support for current generation consoles.

LucidLogix (Lucid) today announced the next generation of its GPU Virtualization software, Virtu MVP 2.0, is now available for direct sale to all gamers, videophiles and PC enthusiasts who own Intel Sandy Bridge and Ivy Bridge motherboards, with an NVIDIA or AMD discrete graphic card, by download on the Lucid online shop.

"Virtu MVP allows our customers to get the maximum multimedia experience from their dual core system, while preserving energy consumption," said Offir Remez, president of Lucid. "With MVP 2.0, games simply look better and respond quickly, video encoding is faster and multi-screen computing is more manageable."

Patriot, a global pioneer in high-performance memory, NAND flash, storage, and mobile accessories today announces the next generation in its ecosystem of wireless storage solutions, the AERO wireless mobile hard drive.

Load up, go mobile, and share. With the ever expanding tablet and smartphone landscape, the AERO is the definitive mobile storage solution that allows you to take your full media collection on the go and stream to any tablet, smartphone, or laptop. The Patriot AERO truly lets you share content to your mobile devices like never before, even if you don't have access to the internet or cloud storage.

IPv6 may no longer be a protocol without a product line thanks to a growing number of manufacturers designing and tweaking their products to support the next generation Internet standard. As one of the most competitive providers of networking solutions, TP-LINK is carrying through with its plan to improve its routers to ensure compliance with IPv6. TP-LINK is ready with a family of new and established networking products that comply with IPv6 by default or through firmware upgrades.

With the increasing number of new devices being connected to the Internet, the number of available IP addresses using the original IPv4 standard has been depleted. In fact, all IPv4 addresses have been assigned and there are no new addresses left. The exhaustion of IPv4 addresses makes support for IPv6 essential to satisfy the growth of IP address users and also important for the next generation of Internet.

According to a new market research report, "Global Micro Servers Market (2013 - 2018), By Processor Type (Intel, Arm, Amd), Component (Hardware, Software, Operating System), Application (Media Storage, Data Centers, Analytics, Cloud Computing) & Geography (North America, Europe, Asia Pacific, Row)", published by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018.

In a simpler terminology, micro servers can be termed as servers that multiple mobile processor chips, consume low power, use less space and are specifically used by small to medium - sized businesses. Micro servers find their major application in media storage and internet data centre especially for applications like lightweight web serving, simple content delivery nodes and low end dedicated hosting. It was identified that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in the next five years it is expected to reach 25 to 30% per cent of the global server market.

Mushkin Inc., An industry-leading designer and manufacturer of high-performance and mission-critical computer products, unveils its latest and most exciting range of products ever at the world's largest consumer electronics show, CES 2013.

Mushkin will host meetings at their 1,800 square foot suite, where they will showcase their entire lineup of next generation products. On-site pr esentations will be held to introduce the new and coming product lines. Mushkin representatives from the product, sales, and global teams will be on hand to answer any questions regarding these new and upcoming products for the digital home, office, and beyond.

Intel's next-generation SSD 530 series, which sees a single product line covering 2.5-inch and compact form-factors, arrives in the second quarter of 2013. The new series is being designed to offer high-performance even at smaller card form-factors, which is particularly important for the ultra-thin/Ultrabook ecosystem. The drive has been pictured in the newer NGFF (next generation form-factor), which is designed to be even smaller than mSATA.

While mSATA drives typically measure 51 x 30 mm, NGFF measures 42 x 22 mm. NGFF is a single interface featuring pins for both SATA and PCI-Express x2 or x4, and cards designed around its specification can either be SATA SSDs, or other bandwidth-heavy devices (such as 802.11ac WLAN controllers). Cards can even be designed to have an SATA SSD subunit on one side, and a PCI-Express device on the other, saving swathes of PCB real-estate in the process. The form-factor even supports double-sided SSDs such as this one from Lite-On, which features an independent SSD subunit on each side, which is striped in RAID 0. The NGFF Intel SSD 530 family will be introduced in Q2-2013, in two capacities - 80 GB and 180 GB.

Adapted from technology that GE researchers originally developed for commercial jet engines, GE (NYSE: GE) has announced a major technology breakthrough, called DCJ, which adapts this technology for the cooling of consumer electronics. DCJ will support the next generation of thinner, quieter and more powerful tablets, laptops and other electronic devices.

GE's DCJ (Dual Piezoelectric Cooling Jets), behave as a micro-fluidic bellows that provide high-velocity jets of air to cool electronic components. The turbulent air flow of the DCJ increases the heat transfer rate to more than ten times that of natural convection.

Leading mainboard and graphics card maker MSI and the world's best system benchmarking software developer Futuremark have partnered up to jointly announce the newest version of the 3D benchmarking program 3DMark. The new version of this 3D benchmarking utility supports Windows, Windows RT, Android and iOS platforms, and has an all new user interface that will provide enthusiasts with a rich and novel user experience.

The 3DMark series has long been acclaimed among gamers for its original visual design and wide range of special effects. 3DMark 11 in particular has been the No.1 choice for testing graphics card performance since it was released in 2010, and remains the benchmarking utility of choice for enthusiasts today. Due to the previous successful cooperation on 3DMark 11, MSI has partnered with Futuremark again to release the next generation of the world renowned 3DMark benchmarking utility.

AMD today announced the SeaMicro SM15000 server, another computing innovation from its Data Center Server Solutions (DCSS) group that cements its position as the technology leader in the micro server category. AMD's SeaMicro SM15000 server revolutionizes computing with the invention of Freedom Fabric Storage, which extends its Freedom Fabric beyond the SeaMicro chassis to connect directly to massive disk arrays, enabling a single ten rack unit system to support more than five petabytes of low-cost, easy-to-install storage. The SM15000 server combines industry-leading density, power efficiency and bandwidth with a new generation of storage technology, enabling a single rack to contain thousands of cores, and petabytes of storage -- ideal for big data applications like Apache Hadoop and Cassandra for public and private cloud deployments.

AMD's SeaMicro SM15000 system is available today and currently supports the Intel Xeon Processor E3-1260L ("Sandy Bridge"). In November, it will support the next generation of AMD Opteron processors featuring the "Piledriver" core, as well as the newly announced Intel Xeon Processor E3-1265Lv2 ("Ivy Bridge"). In addition to these latest offerings, the AMD SeaMicro fabric technology continues to deliver a key building block for AMD's server partners to build extremely energy efficient micro servers for their customers.

IEEE, the world's largest professional organization advancing technology for humanity, today announced the approval of IEEE 802.3-2012 "Standard for Ethernet." IEEE 802.3 defines wired connectivity for Ethernet local area, access and metropolitan area networks around the world.

"'IEEE 802.3 technologies and the varied Ethernet networks that they enable are found everywhere, and the standard's application horizon continues to expand," said David Law, chair of the IEEE 802.3 Ethernet Working Group and distinguished engineer with HP Networking. "When Ethernet networking was conceived in the 1970s and the IEEE 802.3 standard was first published in 1985, its founders could not possibly have foreseen the global transformation that their ideas and efforts would ultimately set into motion. The standard has helped spawn whole new business models, industries and ways of life. And that cycle of innovation continues today."

IEEE, the world's largest professional association advancing technology for humanity, today announced the formation of the IEEE 802.3 Next-Generation BASE-T Study Group. The new group is designed to measure industry interest and needs in the next generation of the IEEE 802.3 BASE-T family of technologies for Ethernet transmission over twisted-pair cabling.

Widely deployed for physical-layer connectivity in data centers, IEEE 802.3 BASE-T represents the highest-volume Ethernet port type today. IEEE 802.3 BASE-T technologies typically utilize server-uplink data rates of Gigabit Ethernet and 10 Gigabit Ethernet today, but platform transitions and systems innovation on all fronts are driving new networking requirements.

External enclosures are a great way to have high capacity data storage on the go. Data can also be a critical factor for users in the media business or who work with data centers. Some of the top tier hard drive companies have made their own all in one enclosure with hard drive included. However, one of the known major causes of hard drive failure is due to excessive heat buildup caused by a lack of a proper cooling system.

Also, a majority of hard drive manufactures only allow a 1 year warranty on their all in one external hard drives. This can be fatal for someone who has just lost their data and has to spend a significant amount of money in order to recover their data. There are other external enclosures in the market that provide a cooling system to help prevent this, but the physical placement of the cooling system does not always allow for the optimal airflow to cool the hard drive. Going above and beyond, the MB080U3S-1SB Blizzard is the next generation of external enclosures dedicated for maximum performance in cooling.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.

MIPI Alliance and the USB 3.0 Promoter Group today announced the completion of the SuperSpeed USB Inter-Chip (SSIC) specification. The specification defines a chip-to-chip USB based internal interconnect for mobile devices as well as other platforms. SSIC offers MIPI Alliance's M-PHY high bandwidth and low power capabilities combined with SuperSpeed USB performance enhancements.

The M-PHYSM interface, a high speed serial interface, targets up to 2.9 Gbps per lane with scalability up to 5.8 Gbps per lane and offers a low pin count and exceptional power efficiency. SuperSpeed USB offers a 5 Gbps signaling rate, up to 10 times faster than Hi-Speed USB (USB 2.0), enhanced protocol and power management and backward compatibility with the existing USB device and software model.

NVIDIA today announced that its GPUs will be used by scientists at Germany's Forschungszentrum Jülich, which hosts the Jülich Supercomputing Centre, one of Europe's largest and most powerful supercomputing resources, to accelerate advanced neurological research targeted at unlocking secrets of the human brain.

NVIDIA also announced a new, multiyear collaboration with the center to drive the next generation of GPU-accelerated scientific research in neuroscience and a range of other fields, including astronomy, astrophysics, material science, particle physics, and protein folding. Together the two organizations are launching the "NVIDIA Application Lab," a jointly run and staffed resource for the European scientific community located at the center's facilities in Jülich.

Noctua's booth at last week's Computex Taipei not only hosted world's first public demonstration of a PC fan with integrated Active Noise Cancellation (ANC) but also gave a stage to upcoming Noctua products such as the new A-series fans, third generation NF-S12 fan and 37mm low profile CPU coolers. In addition to these upcoming products, Noctua also gave an exclusive insight on some of its current development projects for its D-, U-, C- and L-series heatsinks.

Firstly, Noctua has displayed its completely new A-series fans that feature a novel aerodynamic design measure called Flow Acceleration Channels to reduce boundary layer separation as well as Noctua's AAO (Advanced Acoustic Optimisation) frames. The new A-series fans are scheduled for launch in September/October and will come in square 140mm, round 140mm, slim 92mm plus 60 and 40mm sizes.

NETGEAR, Inc., a global networking company that delivers innovative products to consumers, businesses and service providers, today announced that it will showcase several innovative solutions for cable operators, including a groundbreaking DOCSIS3.0 gateway integrated with 802.11ac wireless technology, at the ANGA Cable show taking place June 12- 14 in Cologne, Germany. In addition, NETGEAR will also demonstrate its 24 x 8 channel bonded DOCSIS/Euro-DOCSIS gateway to support up to 1.2Gbps downstream and 320Mbps upstream data rate.

The NETGEAR 802.11ac DOCSIS3.0 gateway supports wireless connectivity that is up to three times faster than today's 802.11n routers. With multiple antennae and dual band WiFi, the cable gateway increases the coverage area for HD streaming in the home while enabling consumers to download web content from any device in the home significantly faster than it would take on a similar 802.11n device.