Intel CEO Pat Gelsinger engaged with press/media representatives following the conclusion of his IFS Direct Connect 2024 keynote speech—when asked about Team Blue's ongoing relationship with TSMC, he confirmed that their manufacturing agreement has advanced from "5 nm to 3 nm." According to a China Times news article: "Gelsinger also confirmed the expansion of orders to TSMC, confirming that TSMC will hold orders for Intel's Arrow and Lunar Lake CPU, GPU, and NPU chips this year, and will produce them using the N3B process, officially ushering in the Intel notebook platform that the outside world has been waiting for many years." Past leaks have indicated that Intel's Arrow Lake processor family will have CPU tiles based on their in-house 20A process, while TSMC takes care of the GPU tile aspect with their 3 nm N3 process node.

That generation is expected to launch later this year—the now "officially confirmed" upgrade to 3 nm should produce pleasing performance and efficiency improvements. The current crop of Core Ultra "Meteor Lake" mobile processors has struggled with the latter, especially when compared to rivals. Lunar Lake is marked down for a 2025 launch window, so some aspects of its internal workings remain a mystery—Gelsinger has confirmed that TSMC's N3B is in the picture, but no official source has disclosed their in-house manufacturing choice(s) for LNL chips. Wccftech believes that Lunar Lake will: "utilize the same P-Core (Lion Cove) and brand-new E-Core (Skymont) core architecture which are expected to be fabricated on the 20A node. But that might also be limited to the CPU tile. The GPU tile will be a significant upgrade over the Meteor Lake and Arrow Lake CPUs since Lunar Lake ditches Alchemist and goes for the next-gen graphics architecture codenamed "Battlemage" (AKA Xe2-LPG)." Late January whispers pointed to Intel and TSMC partnering up on a 2 nanometer process for the "Nova Lake" processor generation—perhaps a very distant prospect (2026).

Last year, Arm introduced its Neoverse Compute Subsystem (CSS) for the N2 and V2 series of data center processors, providing a reference platform for the development of efficient Arm-based chips. Major cloud service providers like AWS with Graviton 4 and Trainuium 2, Microsoft with Cobalt 100 and Maia 100, and even NVIDIA with Grace CPU and Bluefield DPUs are already utilizing custom Arm server CPU and accelerator designs based on the CSS foundation in their data centers. The CSS allows hyperscalers to optimize Arm processor designs specifically for their workloads, focusing on efficiency rather than outright performance. Today, Arm has unveiled the next generation CSS N3 and V3 for even greater efficiency and AI inferencing capabilities. The N3 design provides up to 32 high-efficiency cores per die with improved branch prediction and larger caches to boost AI performance by 196%, while the V3 design scales up to 64 cores and is 50% faster overall than previous generations.

Both the N3 and V3 leverage advanced features like DDR5, PCIe 5.0, CXL 3.0, and chiplet architecture, continuing Arm's push to make chiplets the standard for data center and cloud architectures. The chiplet approach enables customers to connect their own accelerators and other chiplets to the Arm cores via UCIe interfaces, reducing costs and time-to-market. Looking ahead, Arm has a clear roadmap for its Neoverse platform. The upcoming CSS V4 "Adonis" and N4 "Dionysus" designs will build on the improvements in the N3 and V3, advancing Arm's goal of greater efficiency and performance using optimized chiplet architectures. As more major data center operators introduce custom Arm-based designs, the Neoverse CSS aims to provide a flexible, efficient foundation to power the next generation of cloud computing.

Japanese tech billionaire and founder of the SoftBank Group, Masayoshi Son, is embarking on a hugely ambitious new project to build an AI chip company that aims to rival NVIDIA, the current leader in AI semiconductor solutions. Codenamed "Izanagi" after the Japanese god of creation, Son aims to raise up to $100 billion in funding for the new venture. With his company SoftBank having recently scaled back investments in startups, Son is now setting his sights on the red-hot AI chip sector. Izanagi would leverage SoftBank's existing chip design firm, Arm, to develop advanced semiconductors tailored for artificial intelligence computing. The startup would use Arm's instruction set for the chip's processing elements. This could pit Izanagi directly against NVIDIA's leadership position in AI chips. Son has a chest of $41 billion in cash at SoftBank that he can deploy for Izanagi.

Additionally, he is courting sovereign wealth funds in the Middle East to contribute up to $70 billion in additional capital. In total, Son may be seeking up to $100 billion to bankroll Izanagi into a chip powerhouse. AI chips are seeing surging demand as machine learning and neural networks require specialized semiconductors that can process massive datasets. NVIDIA and other names like Intel, AMD, and select startups have capitalized on this trend. However, Son believes the market has room for another major player. Izanagi would focus squarely on developing bleeding-edge AI chip architectures to power the next generation of artificial intelligence applications. It is still unclear if this would be an AI training or AI inference project, but given that the training market is currently bigger as we are in the early buildout phase of AI infrastructure, the consensus might settle on training. With his track record of bold bets, Son is aiming very high with Izanagi. It's a hugely ambitious goal, but Son has defied expectations before. Project Izanagi will test the limits of even his vision and financial firepower.

Attention is now turning to the late February Mobile World Congress (WWC) 2024 trade show—following journos recovering from their recent CES gauntlet-esque ordeals. An exclusive Windows Report piece proposes that Lenovo representatives will be heading to Barcelona with a very special next generation laptop in hand. The publication has a outed a number of upcoming portable devices, two weeks prior to Lenovo's intended showcase (February 26 - 29)—we witnessed a similar occurrence last year with WinFuture leaking Microsoft's September Surface refreshes. Six notebook refreshes (ThinkPad and ThinkBook) are mentioned in the latest report, as well as Gen 2 version of Lenovo's ThinkVision M14T portable monitor.

The alleged headliner seems to be a concept model, that slides into the company's ThinkBook range—Windows Report has leaked heavily watermarked images, but little in the way of technical specifications: "Lenovo's transparent laptop features a bezel-less design, with the display being completely see-through. The deck also seems completely transparent, with the main components being housed in and under the chin, which is the area that's not transparent. There's also a non-transparent slim frame that surrounds the entire deck, probably housing the ports." An anonymous source reckons that the transparent OLED ThinkBook runs on Windows 11, and Lenovo's tried and trusted design language is very apparent (when in use).

Scientists and engineers have been experimenting with hafnium oxide over the past decade—many believe that this "elusive ferroelectric material" is best leveraged in next generation computing memory (due to its non-volatile properties), although this requires a major scientific breakthrough to get working in a practical manner. Hafnia's natural state is inherently non-ferroelectric, so it takes some effort to get it into a suitable state—a SciTechDaily article explores past efforts: "Scientists could only get hafnia to its metastable ferroelectric state when straining it as a thin, two-dimensional film of nanometer thickness." Research teams at the University of Rochester, New York and University of Tennessee, Knoxville have presented evidence of an exciting landmark development. Sobhit Singh, assistant professor at UoR's Department of Mechanical Engineering, believes that the joint effort has created a lane for the creation of bulk ferroelectric and antiferroelectric hafnia.

His "Proceedings of the National Academy of Sciences" study proposes an alternative material path: "Hafnia is a very exciting material because of its practical applications in computer technology, especially for data storage. Currently, to store data we use magnetic forms of memory that are slow, require a lot of energy to operate, and are not very efficient. Ferroelectric forms of memory are robust, ultra-fast, cheaper to produce, and more energy-efficient." Professor Janice Musfeldt's team at the University of Tennessee have managed to produce a ferroelectric form of hafnia—through an experimental high pressure process, based on Singh's exact calculations. The material remained in a metastable phase post-experiment, even in a pressure-relieved state. Musfeldt commented on the pleasing results: "This is as an excellent example of experimental-theoretical collaboration." Memory manufacturers are likely keeping an eye on Hafnia's breakthrough potential, but material costs are dampening expectations—Tom's Hardware cites shortages (going back to early 2023): "Hafnium (the key component in Hafnia) has seen a nearly fivefold price increase due to increased demand since 2021, raising its cost from about $1,000 per kilogram to about $5,000. Even at $1000 a kilogram, though, hafnium is by far more expensive than silicon, which measures in the tens of dollars per kilogram."

Phoronix head honcho, Michael Larabel, has noticed another set of interesting updates for AMD Graphics on Linux—albeit in preparation for next generation solutions: "engineers on Monday (February 5) posted a few new patch series for enabling some updated IP (intellectual property) blocks within their open-source AMDGPU Linux kernel graphics driver. This new IP is presumably part of the ongoing hardware enablement work for their next-gen RDNA 4 graphics." Team Red GitHub patches for "GFX12" targets appeared online last November, again highlighted by Larabel's investigative work—AMD engineers appear to be quite determined with their open-source software endeavors, as seen in LLVM-Project notes regarding GFX1200's enablement.

The new "IP block" updates included patches for the enabling ATHUB 4.1, LSDMA 7.0, IH 7.0, and HDP 7.0—presumably for next generation Radeon graphics solutions. Larabel provided a quick breakdown of these components: "ATHUB 4.1 is needed for clock-gating / power management features, LSDMA 7.0 is the latest IP for Light SDMA for general purpose System DMA (SDMA) on the GPU, IH 7.0 for the Interrupt Handler on the GPU, and HDP 7.0 for the Host Data Path support for CPU accessing the GPU device memory via the PCI BAR. As far as code changes, the big chunks of the work are from the auto-generated header files." He believes that AMD's engineers have largely moved on from current generation tasks: "The big version bumps for these IP blocks all the more are likely indicative of these bits being for next-gen RDNA 4 as opposed to further iterating on RDNA3 or similar." The patches could be merged into the upcoming Linux 6.9 release, possibly coinciding with a Radeon RX 8000 series rollout.

Qualcomm Incorporated has announced the appointment of Akash Palkhiwala to the expanded role of Chief Financial Officer and Chief Operating Officer. In addition to his CFO responsibilities, as COO, he will now have oversight for the global go-to-market organization and operations, and IT. Palkhiwala's appointment will be effective immediately and he will continue to report directly to Cristiano Amon, President and CEO of Qualcomm Incorporated. "I'm pleased to expand Akash's CFO role to include that of Chief Operating Officer as Qualcomm executes on its growth and diversification strategy," said Cristiano Amon, president and CEO of Qualcomm. "Akash has played a key role in the execution of our business strategy as Qualcomm has expanded into new end markets, and is ideally positioned to further align the company's operations to capture future growth opportunities. I am thrilled to congratulate Akash on this expanded role."

Palkhiwala has served as Chief Financial Officer since 2019. Previously, he was Senior Vice President and finance lead for QCT, Qualcomm's semiconductor business. Palkhiwala joined Qualcomm in 2001, and during this time has held several finance leadership roles including Treasurer, Financial Planning & Analysis, and Corporate Development. Palkhiwala holds an undergraduate degree in Mechanical Engineering from L.D. College of Engineering in India and an M.B.A from the University of Maryland.

Pat Gelsinger, CEO of Intel Corporation, has outlined future performance expectations for the company's Core range of processors. In a recent fourth quarter 2023 earnings call he declared: "The Core Ultra platform delivers leadership AI performance today with our next-generation platforms launching later this year, Lunar Lake and Arrow Lake tripling our AI performance. In 2025 with Panther Lake, we will grow AI performance up to an additional 2x." Team Blue's Intel Core Ultra "Meteor Lake" mobile processors arrived right at the tail end of last year, as a somewhat delayed answer to AMD's Ryzen 7040 "Phoenix" APU series—both leveraging their own AI-crunching NPU technologies. Gelsinger believes that the launch of Lunar Lake and Arrow Lake Core product lines will bring significant (3x) AI processing improvements over Meteor Lake. He seemed to confident in a delay-free release schedule for the new year and beyond: "We are first in the industry to have incorporated both gate-all-around and backside power delivery in a single process node, the latter unexpected two years ahead of our competition. Arrow Lake, our lead Intel 20A vehicle will launch this year."

He proceeded to gush about their next node advancement: "Intel 18A is expected to achieve manufacturing readiness in second half 2024, completing our five nodes in four year journey and bringing us back to process leadership. I am pleased to say that Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." Industry experts posit that Core "Panther Lake" parts could borrow elements from the next generation Xeon "Clearwater Forest" efficiency-focused family—possibly the latter's "Darkmont" E-cores, to accompany "Cougar Cove" P-cores. The Intel CEO is quite excited about the manufacturing outlay for 2025: "I'll just say, hey, we look at this every single day and we're scrutinizing carefully our progress on 18A. And obviously the great news that we just described those Clearwater Forest taping out, that gives us a lot of confidence that 18A is healthy. That's a major product for us. Panther Lake following that shortly."

Everest (@Olrak29_) has kept track of many AMD processor families over the past couple of years—his latest insight provides an early look at the alleged internal makeup of Team Red's "Kraken Point" APU series. The rumor mill has designated these next-gen mobile processors as 2025 follow-ups to the recently launched Ryzen 8040 "Hawk Point" family of mainstream laptop APUs. The tipster's initial social media post only mentioned the presence of both Zen 5 and Zen 5c cores within Kraken Point processors, but he later clarified that a total of eight cores would include four large units and four smaller types. TPU's past coverage of Kraken Point pointed to rumors of an 8-core, 16-thread configuration, but leaked slides (from late 2023) did not mention the integration of efficiency-tuned Zen 5c "Prometheus" cores, along with presumed Zen 5 "Nirvana" cores.

Everest's continuous flow of insider information reveals that "Kraken Point" shares many "Hawk Point" traits—four workgroup processors (WGP) could be present on final retail products, granting eight compute units (8 CUs in total). He responded to a query regarding AMD's choice of integrated graphics technology—the succinct answer being RDNA 3.5. Past leaks allege that XDNA 2 will drive the NPU side of things—offering a performance range of around 45 to 50 TOPS. The Kraken Point APU is believed to be sticking with a safe monolithic die design, manufactured on a non-specific 4 nm process. Team Red is rumored to be in TSMC's order books for all sorts of next generation silicon.

Starfield is the first new universe in over 25 years from the award-winning creators behind Skyrim and Fallout 4, Bethesda Game Studios. Gamers from around the world were excited to jump into this interstellar universe rich with adventure, peril, and excitement. But before anyone hops into space, they need something critical: a spacesuit. So, Xbox has partnered up with the European Space Agency (ESA) to give Starfield fans around the world a chance to win the spacesuit of their dreams, in real life, in addition to other incredible Xbox prizes. This is a physical, wearable, one-of-a-kind garment, fabricated for the most intrepid explorers.

Whether using a provided template as a base, or pushing their imagination to the limit with any creative format of their choice, fans will be asked to provide both a visual illustration of the suit from all sides—hand-drawn, 3D-rendered, or however their vision sees fit—as well as a description of the inspiration of the suit. More specifically, Xbox, Bethesda and the ESA want to know what you would wear in outer space - how would your spacesuit reflect your personal style, individuality and vision for space travel?

Samsung, SK hynix, and Micron are considered to be the top manufacturing sources of High Bandwidth Memory (HBM)—the HBM3 and HBM3E standards are becoming increasingly in demand, due to a widespread deployment of GPUs and accelerators by generative AI companies. Taiwan's Commercial Times proposes that there is an ongoing shortage of HBM components—but this presents a growth opportunity for smaller manufacturers in the region. Naturally, the big name producers are expected to dive in head first with the development of next generation models. The aforementioned financial news article cites research conducted by the Gartner group—they predict that the HBM market will hit an all-time high of $4.976 billion (USD) by 2025.

This estimate is almost double that of projected revenues (just over $2 billion) generated by the HBM market in 2023—the explosive growth of generative AI applications has "boosted" demand for the most performant memory standards. The Commercial Times report states that SK Hynix is the current HBM3E leader, with Micron and Samsung trailing behind—industry experts believe that stragglers will need to "expand HBM production capacity" in order to stay competitive. SK Hynix has shacked up with NVIDIA—the GH200 Grace Hopper platform was unveiled last summer; outfitted with the South Korean firm's HBM3e parts. In a similar timeframe, Samsung was named as AMD's preferred supplier of HBM3 packages—as featured within the recently launched Instinct MI300X accelerator. NVIDIA's HBM3E deal with SK Hynix is believed to extend to the internal makeup of Blackwell GB100 data-center GPUs. The HBM4 memory standard is expected to be the next major battleground for the industry's hardest hitters.

MediaTek revealed its (now current generation) flagship Dimensity 9300 flagship mobile processor last November, but we are already hearing about its successor's foundation. Digital Chat Station published some early insights on their Weibo micro-blog—the tipster appears to have an inside track at MediaTek's system-on-chip R&D department. The imaginatively named "Dimensity 9400" chipset is reportedly earmarked for mass production chez TSMC, with the foundry's second generation 3 Nm process being the favored node—this information aligns with official announcements as well as industry rumors from last autumn. MediaTek's Dimensity 9300 sports a "one-of-a-kind All Big Core design," with no provision for puny efficiency units—built on TSMC's third generation 4 nm process with four ARM Cortex-X4 cores (going up to 3.25 GHz) and four Cortex-A720 cores (maximum 2.0 GHz).

Digital Chat Station reckons that the 9300's All Big Core configuration will carryover to its next generation sibling, albeit with some major upgrades. MediaTek hardware engineers are alleged to have selected ARM's latest and greatest CPU and Mali GPU designs—the Cortex-X5 core could be a prime candidate in the first category. The rumor mill has the next batch of flagship Exynos SoCs utilizing ARM's fifth generation design. Digital Chat Station proposes that more smartphone manufacturers could adopt a top-flight Dimensity 2024 chip, if its performance can match the closest rivals. Industry experts posit both MediaTek and Qualcomm choosing TSMC's N3E process for their upcoming flagship chipsets—this node apparently "offers improved cost-effectiveness and superior yields" when compared to the first generation N3B process (as ordered by Apple for its latest M and B-series SoCs). Dimensity 9400 is expected to take on Snapdragon 8 Gen 4—this could be a tough fight, given that Qualcomm's offering is set to debut with custom Oryon cores.

Intel presented its next generation Xeon "Clearwater Forest" processor family during September's Innovation Event—their roadmap slide (see below) included other Birch Stream platform architecture options. Earlier this week, Team Blue's software engineers issued a Linux kernel patch that contains details pertaining to codenamed projects: Sierra Forest, Grand Ridge and the aforementioned Clearwater Forest. All E-Core Xeon "Sierra Forest" processors are expected to launch around the middle of 2024—this deployment of purely efficiency-oriented "Sierra Glen" (Atom Crestmont) cores in enterprise/server chip form will be a first for Intel. The Sierra Forest Xeon range has been delayed a couple of times; but some extra maturation time has granted a jump from an initial maximum 144 E-Core count up to 288. The latest patch notes provide an early look into Clearwater Forest's basic foundations—it seems to be Sierra Forest's direct successor.

The Intel Xeon "Granite Rapids" processor family is expected to hit retail just after a Sierra Forest product launch, but the former sports a very different internal configuration—an all "Redwood Cove" P-Core setup. Phoronix posits that Sierra Forest's groundwork is clearing the way for its natural successor: "Clearwater Forest is Intel's second generation E-core Xeon...Clearwater Forest should ship in 2025 while the open-source Intel Linux engineers begin in their driver support preparations and other hardware enablement well in advance of launch. With engineers already pushing Sierra Forest code into the Linux kernel and related key open-source projects like Clang and GCC since last year, their work on enabling Sierra Forest appears to be largely wrapping up and in turn the enablement is to begin for Clearwater Forest. Sent out...was the first Linux kernel patch for Sierra Forest. As usual, for the first patch it's quite basic and is just adding in the new model number for Clearwater Forest CPUs. Clear Water Forest has a model number of 0xDD (221). The patch also reaffirms that the 0xDD Clearwater Forest CPUs are using Atom Darkmont cores."

ASUS finalized its adoption of the Intel Next Unit of Computing (NUC) product lines at a special autumn 2023 handover event. A post-ceremony statement outlined the company's vision going forward: "ASUS kicked-off its NUC business and started to take orders for NUC 10th to 13th generation systems on September 1. The new business is generating a wide variety of exciting opportunities for the company and the transition has progressed smoothly for NUC customers. The vision of the newly established ASUS NUC BU is to provide the most impactive edge computing with comprehensive commercial and AIoT solutions that can sustain the industry and businesses." Just over a week ago, TechPowerUp was granted access to next generation NUC devices at CES 2024—including ROG NUC, as well as NUC 14 Pro and NUC 14 Pro+ models. Many folks in attendance noticed a complete absence of NUC Extreme products at the ASUS Las Vegas showroom.

Online publication, Fudzilla, has investigated this matter—Fuad Abazovic (Editor-in-Chief) managed to chase down an ASUS spokesperson. It seems that the Taiwanese manufacturer is integrating some if its best known branding into the NUC ecosystem, and Team Blue nomenclature is on the chopping block: "the company won't have an update to the NUC Extreme 7.5 liter device. The Raptor Canyon remains the last NUC of its kind, as ASUS has ROG Strix systems in the same ballpark. Fudzilla already covered the announcement of the NUC and NUC pro, and the ROG NUC. We were assured that the 2.5L ROG NUC will remain the fastest gaming-oriented device and that, at this plan, the company doesn't plan to develop the successor of NUC Extreme 7.5 liter. ASUS has announced ROG Strix G16CHR, its 7.5-liter desktop that comes with an air and water cooler and hosts up to Intel Core i7-14700KF Processor 3.4 GHz (33M Cache, up to 5.5 GHz, 20 cores), NVIDIA GeForce RTX 4080 16 GB GDDR6X 3x DP, 2x HDMI, and up to 64 GB RAM in 4x DDR5 U-DIMM slots."

Paradox Interactive and Double Eleven have announced Prison Architect 2, the 3D successor to their prison management simulator. The game offers deeper simulation, greater player control, an inhabitant behavior system and creative options to define the next generation of management gameplay. Prison Architect 2 launches on March 26 on Steam, Xbox Series X|S, and PlayStation 5 for a suggested retail price of $39.99 / £34.99 / €39.99. Enterprising Architects can pre-order Prison Architect 2 on PC today.

Prison Architect 2 offers advanced simulation systems, enabling players to construct intricate compounds with a high degree of creative freedom in a 3D environment. From building elaborate structures to managing inmates' needs while maintaining the facility's financial stability, Prison Architect 2 expands gameplay and creative tools across the board, for an engaging sandbox experience. The game also introduces a connection system between the prisoners, who will make friends or enemies with each other, impacting who they will hang out, partner or fight with. Prison Architect 2 brings prison construction and management gameplay to a new level by entering the third dimension and bringing deeper simulation than ever before.

Electronic Arts in Canada is actively recruiting for a VFX Director position at its Ripple Effect studio—the job listing implies that the ideal candidate will be set to work on the next mainline Battlefield title. EA has implemented a cross-studio development system, where multiple teams have helped to build AAA games, including their controversial plus troubled Battlefield 2042 entry—the popular online shooter series has been steered primarily by DICE in Stockholm, Sweden. Several satellite outfits assisted in producing BF 2042, including Ripple Effect (an "evolution" of DICE LA), but the multiplayer gaming community was disappointed to discover that EA's massive deployment of resources did not result in comprehensive environmental destruction within 2042's gargantuan maps.

Insider Gaming has been keeping tabs on recruitment drives at EA's miscellaneous "Battlefield 6" studios, in order to extract clues about the game's origins and progress. We know very little about the status of BF6, beyond Vince Zampella's declarations from Autumn 2023. His Los Angeles studio appears to be leading the charge; industry insiders believe that DICE Stockholm has been demoted in EA's studio hierarchy. The latest Ripple effect job advert provides a promising insight for Battlefield fans who enjoyed the "Levolution" aspect of Battlefield 4's changing environs: "We are looking for a Senior 3D Artist like you to help us create the most realistic and exciting destruction effects in the industry. You will report to our Art Line Manager, based in our studio in Los Angeles, CA. We are looking for candidates located in Vancouver with remote options." Zampella and Co. are likely having to up the ante, following the launch of "The Finals"—an Unreal 5 engine-powered shooter developed by former DICE veterans. Embark Studios have implemented some impressive destruction effects—serving as a key component of the game's mechanics.

Lexar previewed part of their CES lineup late last week—we got a quick briefing that outlined various upcoming portable SSDs, M.2 NVMe SSDs, and professional CFExpress cards. TPU staffers spent some quality time at the storage specialist's booth in Las Vegas—they have reported back that emphasis has been placed on Lexar's portable SSD products. The headliner appears to be the prominently placed ARMOR 700 Portable SSD—this boasts an extra rugged design, thus providing the level of on-the-go protection that is required by modern professionals.

The ARMOR 700 will be available in three capacities: 1 TB, 2 TB and 4 TB. Maximum read and write speeds of 2000 MB/s are advertised on Lexar's wall-mounted exhibit, with support for 6K RAW video files. The rugged and durable housing has been certified at IP65, with drop-resistant properties. The already released SL660 BLAZE Gaming Portable SSD was showcased at CES, but it was joined by a similar looking (non-RGB equipped) sibling—the new SL600 is a more sober looking option, aimed at professional types. The SL500 Portable SSD sports credentials for a wide range of purposes: mobile devices, laptops, cameras as well as gaming on current generation games consoles. Lexar states that the SL500 is powered by Silicon Motion Technology portable SSD controllers—with speeds up to 2000 MB/s read and 1800 MB/s write. Capacities noted on the exhibit wall are 1 TB, 2 TB and 4 TB—this applies to the SL600 specification as well.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

Apple today announced a new MacBook Pro lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max. With a next-generation GPU architecture and a faster CPU, the M3 family brings even more performance and remarkable new capabilities to MacBook Pro. The new 14‑inch MacBook Pro with M3 is not only great for everyday tasks, but also delivers phenomenal sustained performance in pro apps and games. Perfect for aspiring creatives, students, and entrepreneurs, it now starts at $1,599. The 14 and 16‑inch MacBook Pro with M3 Pro provides even greater performance and additional unified memory support, enabling more demanding workflows for users like coders, creatives, and researchers. The 14 and 16‑inch MacBook Pro with M3 Max delivers performance and capabilities that push the limits of computing. With a monster GPU and a powerful CPU, along with support for up to 128 GB of unified memory, MacBook Pro with M3 Max enables extreme workflows and multitasking across pro apps for users like machine learning programmers, 3D artists, and video editors. M3 Pro and M3 Max models also now come in space black, a gorgeous dark aluminium finish.

All MacBook Pro models feature a brilliant Liquid Retina XDR display with 20 percent brighter SDR content, a built-in 1080p camera, an immersive six-speaker sound system, and a wide array of connectivity options. With up to 22 hours of battery life, the lineup offers the ultimate in pro portability, delivering the same performance whether plugged in or on battery, so users can take their workflows anywhere. Customers can order the new MacBook Pro starting today, with availability beginning November 7.

Qualcomm Technologies, Inc. today announced two new spatial computing platforms - Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 - that will enable the next generation of mixed reality (MR), virtual reality (VR) devices and smart glasses. Snapdragon XR2 Gen 2 Platform: The platform brings premium MR and VR technology into a single chip architecture to unlock next level immersive experiences in thinner and more comfortable headsets, that don't require an external battery pack.

Engineered to deliver a lag free experience with breathtaking visuals and fully immersive sound, the platform allows users to blend virtual content with their physical surroundings and transition seamlessly between MR and VR experiences.

What's New: Intel today announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver data-centric applications.

"After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come."
-Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development

Microsoft has scheduled a special product announcement event for next week—Germany's WinFuture has likely spoiled all mystery ahead of time by revealing two next generation Surface devices. It was already speculated that Microsoft would exhibit a bunch of new portable Windows PCs at the upcoming September 21 New York City-based shindig, but this week's leak treats us to photos and initial specifications for the Laptop Studio 2 and Laptop Go 3. The former retains its predecessor's 14.4-inch 3:2 format display, with a 2400×1600 resolution and 120 Hz refresh rate. Under-the-hood improvements for the Surface Laptop Studio 2 include a jump up to 13th Gen Intel Core Raptor Lake CPUs (from 11th Gen Tiger Lake)—WinFuture reckons that two options are lined up: Core i7-13700H and and Core i7-13800H. The Surface Laptop Studio 2's discrete graphics solution is speculated to be a mobile NVIDIA GeForce RTX 4050 or RTX 4060 GPU.

A base model could rely on an iGPU based on Intel Iris Xe graphics architecture. 64 GB of LPDDR5X memory is believed to exist with some configurations, which is a nice upgrade (albeit probably a very pricey option) over the previous generation's 16 or 32 GB RAM offerings. The leaked photos indicate that a Micro-SD slot and USB Type-A connector are new additions for 2023's model. The WinFuture article presents some prices—€2249 (~$2400) for the basic iGPU model, mid-tier with RTX 4050: €2729 (~$2915), and €3199 (~$3415) for an almost top flight model sporting 32 GB RAM and RTX 4060. The Surface Laptop Go 3, meanwhile, looks a little less exciting—it is said to get a CPU bump up to Intel Core i5-1135G and Core i5-1235U processors. Otherwise it looks largely similar to its previous-gen sibling. The leak did not include images of a reported Surface Go 4, but WinFuture expects it to be presented next week, powered by an Intel N200 SoC.

In a recent interaction with the community on Chinese social platforms, Tony Yu, better known as Uncle Tony and serving as the General Manager of ASUS China, shed light on several questions concerning ASUS's products. One question that captured attention was about the ROG Z790 APEX motherboard, a premium offering from ASUS designed explicitly for overclocking. Tony clarified that the motherboard is currently out of production as ASUS gears up to unveil an updated version. This move is in line with industry trends, with rivals like Gigabyte and MSI also refreshing their respective Z790 lineups. The updated motherboards from ASUS are expected to align with Intel's next-generation Core series known as Raptor Lake Refresh, featuring incremental improvements such as WiFi-7 standard integration, new color options, enhanced power delivery mechanisms, and advancements in memory overclocking capabilities.

Launched initially in November of the previous year with a price tag of $699, the ROG MAXIMUS Z790 APEX motherboard stood out for its superior features aimed at overclocking enthusiasts. These include 24 power supply modules, dual 8Pin power connectors, AI-driven overclocking technology, and support for DDR5 memory with speeds exceeding 8000 MT/s. It also offers a plethora of connectivity options, like five M.2 interfaces, a 2.5G network card, WiFi 6E, and USB 3.2 Gen 2x2 Type-C, along with 60 W QC 4+ fast charging. This motherboard gained popularity in December when it was used to set a world record CPU frequency of 9008.82 MHz using an Intel i9-13900K processor. Looking forward, the next generation of Intel Core processors could enable even higher overclocking frequencies. Apart from this, Tony tantalizingly hinted that ASUS is experimenting with innovative design changes, such as introducing connectors on the reverse side of motherboards, although this feature may not debut in the APEX series.