Qualcomm Technologies, Inc. today announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is the world's first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial device launches in 2021. Snapdragon X65 is the Company's biggest leap in 5G solutions since the commercialization of its first modem-RF system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.

Leading global memory brand TEAMGROUP continues to make its mark on the next generation of DDR5 memory. At the end of last year, the company announced that it had entered the validation phase with the collaboration of major motherboard manufacturers. In early 2021, it has made another breakthrough. Paying attention to the needs of not only desktop but also notebook and mini PC users, TEAMGROUP has successfully created DDR5 SO-DIMM and is expected to be the first to take Intel and AMD's new platform validation tests.

Specifications of the DDR5 SO-DIMM at the early stage of development resemble those of the U-DIMM version. A single module has a capacity of 16 GB and a frequency of 4800 MHz, and both versions run at the lowered voltage of 1.1 V. For notebooks that need to stay mobile for a long period of time, this can noticeably reduce power consumption and extend standby time. DDR5 SO-DIMM also supports on-die ECC, a feature that self-corrects single-bit errors, greatly improving system stability. Users can look forward to the convenience and peace of mind that DDR5 will bring to notebooks, mini PCs, NAS, and more.

European Union has today processed a declaration that was signed by 17 member states about the development of a 2 nm semiconductor node and an advanced low-power processor. The declaration signed today proposes that the EU puts away 145 billion Euros for the development of the technologies needed to manufacture a 2 nm semiconductor manufacturing process, along with the development of a custom, low-power embedded processor designed for industrial applications. The 17 member countries include Belgium, France, Germany, Croatia, Estonia, Italy, Greece, Malta, Spain, The Netherlands, Portugal, Austria, Slovenia, Slovakia, Romania, Finland, and Cyprus. All of the countries listed are going to join the development of these technologies and will have the funds to do it over the next 2-3 years.

EU DeclarationTo ensure Europe's technology sovereignty and competitiveness, as well as our capacity to address key environmental and societal challenges and new emerging mass markets, we need to strengthen Europe's capacity to develop the next generation of processors and semiconductors. This includes chips and embedded systems that offer the best performance for specific applications across a wide range of sectors as well as leading-edge manufacturing progressively advancing towards 2 nm nodes for processor technology. Using connectivity, where Europe enjoys global lead, as a major use case driver for developing such capacity enables Europe to set the right level of ambition. This will require a collective effort to pool investment and to coordinate actions, by both public and private stakeholders.

Today, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company, announced that Arm, a global leader in semiconductor design and silicon intellectual property development and licensing, will leverage AWS for its cloud use, including the vast majority of its electronic design automation (EDA) workloads. Arm is migrating EDA workloads to AWS, leveraging AWS Graviton2-based instances (powered by Arm Neoverse cores), and leading the way for transformation of the semiconductor industry, which has traditionally used on-premises data centers for the computationally intensive work of verifying semiconductor designs.

To carry out verification more efficiently, Arm uses the cloud to run simulations of real-world compute scenarios, taking advantage of AWS's virtually unlimited storage and high-performance computing infrastructure to scale the number of simulations it can run in parallel. Since beginning its AWS cloud migration, Arm has realized a 6x improvement in performance time for EDA workflows on AWS. In addition, by running telemetry (the collection and integration of data from remote sources) and analysis on AWS, Arm is generating more powerful engineering, business, and operational insights that help increase workflow efficiency and optimize costs and resources across the company. Arm ultimately plans to reduce its global datacenter footprint by at least 45% and its on-premises compute by 80% as it completes its migration to AWS.

During the first day of the Snapdragon Tech Summit Digital, Qualcomm Incorporated President, Cristiano Amon took the virtual stage with global industry leaders to highlight the critical role Qualcomm Snapdragon 8-Series mobile platforms have played to drive experiences forward for the next generation of devices. Qualcomm Technologies' innovation in the premium tier, coupled with the evolution of 5G, is accelerating and continuing to redefine immersive consumer experiences. The proliferation of these premium tier experiences has and will continue to enrich the lives of billions of smartphone users around the world.

"Creating premium experiences takes a relentless focus on innovation. It takes long term commitment, even in the face of immense uncertainty," said Cristiano Amon, president, Qualcomm Incorporated. "It takes an organization that's focused on tomorrow, to continue to deliver the technologies that redefine premium experiences."

As a world leader in computer memory, TEAMGROUP understands the importance of getting ahead in the next generation of DDR technology, hence it will be releasing ELITE series DDR5 memory in 2021. With over 20 years of experience developing DDR3 and DDR4 products, the company has dazzled the world with its advanced R&D capabilities and excellent product quality. After the JEDEC announced the DDR5 memory standard, TEAMGROUP has been actively designing and working together with our IC manufacturing partners to pioneer and prepare for this new generation.

TEAMGROUP is leading the way with its first DDR5 memory under its global top-selling ELITE memory product line. It plans to release a 16 GB 4800 MHz module operating at 1.1 V, down from the 1.2 V of the previous generation. The data transfer rate is increased to 4,800-5,200 Mbps, an increase of up to 1.6 times while reducing power consumption by 10%. Today's DDR4 memory with error correction code (ECC) requires an additional chip installed on the PCB, whereas DDR5 supports on-die ECC, a feature that self-corrects single-bit errors, greatly improving system stability. Anticipation is high for the efficiency improvements brought by the new generation, which can be utilized for big data and AI computing and other related applications.

AMD is launching their next-generation RX 6800 series of graphics cards on November 18th, these will be the first cards from AMD featuring the new RDNA 2 architecture. To coincide with the launch of RDNA 2 in consumer graphics cards AMD is launching a new tech demo titled "Hangar 21", the new demonstration will highlight the power of RDNA 2 with real-time raytracing effects enabled by AMD FidelityFX and Microsoft DirectX 12 Ultimate. The "Hangar 21" tech demo will be launching on November 19th and you can view a short trailer of the tech demo down below.

AMDComing November 19, the "Hangar 21" Technology Demo Video will let you see the breakthrough AMD RDNA 2 gaming architecture in action, the foundation of the AMD Radeon RX 6000 Series graphics cards that power the next generation of gaming with mind-blowing visuals featuring realistic lighting, shadows, and reflections enabled by AMD FidelityFX and Microsoft DirectX 12 Ultimate.

NVIDIA today introduced the next generation of NVIDIA Mellanox 400G InfiniBand, giving AI developers and scientific researchers the fastest networking performance available to take on the world's most challenging problems.

As computing requirements continue to grow exponentially in areas such as drug discovery, climate research and genomics, NVIDIA Mellanox 400G InfiniBand is accelerating this work through a dramatic leap in performance offered on the world's only fully offloadable, in-network computing platform. The seventh generation of Mellanox InfiniBand provides ultra-low latency and doubles data throughput with NDR 400 Gb/s and adds new NVIDIA In-Network Computing engines to provide additional acceleration.

During its Q3 earnings call, Samsung Electronics has provided everyone with an update on its foundry and node production development. In the past year or so, Samsung's foundry has been a producer of a 7 nm LPP (Low Power Performance) node as its smallest node. That is now changed as Samsung has started the production of the 5 nm LPE (Low Power Early) semiconductor manufacturing node. In the past, we have reported that the company struggled with yields of its 5 nm process, however, that seems to be ironed out and now the node is in full production. To contribute to the statement that the new node is doing well, we also recently reported that Samsung will be the sole manufacturer of Qualcomm Snapdragon 875 5G SoC.

The new 5 nm semiconductor node is a marginal improvement over the past 7 nm node. It features a 10% performance improvement that is taking the same power and chip complexity or a 20% power reduction of the same processor clocks and design. When it comes to density, the company advertises the node with x1.33 times increase in transistor density compared to the previous node. The 5LPE node is manufactured using the Extreme Ultra-Violet (EUV) methodology and its FinFET transistors feature new characteristics like Smart Difusion Break isolation, flexible contact placement, and single-fin devices for low power applications. The node is design-rule compatible with the previous 7 nm LPP node, so the existing IP can be used and manufactured on this new process. That means that this is not a brand new process but rather an enhancement. First products are set to arrive with the next generation of smartphone SoCs, like the aforementioned Qualcomm Snapdragon 875.

ASUS today announced the Republic of Gamers (ROG) Crosshair VIII Dark Hero, TUF Gaming X570 Pro (WiFi) and ROG Strix B550-XE Gaming WiFi—three gaming motherboards designed for gaming builds featuring the latest-generation AMD Ryzen Zen 3 architecture processors. In addition to the latest X570 and B550 motherboards, all ASUS 500 series motherboards (X570, B550 and A520) are ready for AMD Ryzen Zen 3 architecture processors.

ROG Crosshair VIII Dark Hero
The AMD X570 platform features extensive PCI Express 4.0 connectivity ripe for the latest graphics cards and SSDs. The chipset's copious bandwidth necessitates a robust cooling solution to deliver sustained performance, and that challenge is typically tackled by neatly pairing a heatsink with an embedded fan that spins up on demand. ROG Crosshair VIII Dark Hero is the first ASUS X570 board to implement a completely passive cooling design, featuring a sizeable heatsink that extends from the chipset zone to the space between the PCIe slots. The additional surface area helps keep thermals under control even when the motherboard is loaded with a full complement of hardware, laying a compelling foundation for enthusiast PC builds.

The global leading motherboard manufacturer, ASRock, announces its AMD X570/B550/A520 motherboards series will support next generation AMD Ryzen 5000 Series processors via BIOS update. The next generation processors come with a full suite of technologies designed to elevate your PC's processing power. Update to the latest BIOS and get ready for the unmatched performance as well as latest technologies with AMD Ryzen 5000 series processors.

Look for the following BIOS version numbers in the downloads section of the product page of your motherboard on the ASRock website.

In a report by Phoronix, we have the latest information about Intel's efforts to prepare the next generation of hardware for launch sometime in the future. In the latest Linux kernel patches prepared to go mainline soon, Intel has been adding support for its "Meteor Lake" processor architecture manufactured on Intel's most advanced 7 nm node. While there are no official patches in the mainline kernel yet, the first signs of Meteor Lake are expected to show up in the version 5.10, where we will be seeing the mentions of it. This way Intel is ensuring that the Meteor Lake platform will see the best software support, even though it is a few years away from the launch.

Meteor Lake is expected to debut in late 2022 or 2023, which will replace the Alder Lake platform coming soon. In a similar way to Alder Lake, Meteor Lake will use a hybrid core technology where it will combine small and big cores. The Meteor Lake platform will use the new big "Ocean Cove" design paired with small "Gracemont" cores that will be powering the CPU. This processor is going to be manufactured on Intel's 7 nm node that will be the first 7 nm design from Intel. With all the delays to the node, we are in for an interesting period to see how the company copes with it and how the design IPs turn out.

GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, announced today at its Global Technology Conference the next generation of its FDXTM platform, 22FDX+, to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices. GF's industry-leading 22FDX (22 nm FD-SOI) platform has realized $4.5 billion in design wins, with more than 350 million chips shipped to customers around the world.

GF's new 22FDX+ builds on the company's 22FDX platform, offering a broader set of features that provide high performance, ultra-low power, and specialty features and capabilities for the newest generation of designs. The differentiated offering will further empower customers to create chips that are specifically optimized for Internet of Things (IoT), 5G, automotive, and satellite communications applications.

NUVIA, a leading-edge silicon design company, today announced the close of its Series B funding round, raising $240M. The funding round was led by Mithril Capital in partnership with Sehat Sutardja and Weili Dai (founders of Marvell Technology Group), funds and accounts managed by BlackRock, Fidelity Management & Research Company LLC., and Temasek, with additional participation from Atlantic Bridge, Redline Capital, Capricorn Investment Group, Dell Technologies Capital, Mayfield, Nepenthe LLC and WRVI Capital. The closure of NUVIA's Series B round builds on a $53M Series A round, raised in November 2019. NUVIA was founded in February 2019 by John Bruno, Manu Gulati and Gerard Williams, with the vision to create the world's leading server processor.

Introducing the Z490 DARK K|NGP|N Edition, now the premier motherboard in EVGA's Z490 lineup. The Z490 DARK K|NGP|N is a limited-edition motherboard that features validated support for memory speeds at 5000 MHz+ (OC), and a collectable retail box hand-signed by K|NGP|N himself.

The EVGA Z490 DARK K|NGP|N is also packaged with an 18-phase power design, right-angled connectors, and an Intel 2.5 GbE NIC to ensure that the only limitation of your Z490 DARK K|NGP|N is your imagination. The Z490 DARK K|NGP|N is a masterwork of design and engineering, bringing the best performance and stability available on the Z490 chipset.

NETGEAR, Inc., the leading provider of networking products that power businesses both large and small, today announces the addition of WiFi 6 to the Orbi Pro portfolio. The Orbi Pro WiFi 6 (SXK80) Tri-band Mesh System is an industry leading tri-band WiFi 6 (802.11ax) multi-node mesh system designed to grow with small businesses and home offices as the need to expand their area of network coverage increases. It is comprised of a single router and a single satellite, and can expand to support up to 6 satellites (wireless nodes).

The Orbi Pro WiFi 6 Tri-band Mesh System provides the latest generation of WiFi technology to deliver increased capacity, advanced security and enhanced speed for employees, customers and guests of small businesses and small office environments. In an era where business is widely being conducted remotely while other members of the household are also dependent on connectivity, this new addition to the Orbi Pro family can also address the demand for separate and secure WiFi networks when working from home. Featuring the latest WiFi data security standard, WPA3, along with 4 SSIDs and VLAN support, the Orbi Pro WiFi 6 Mesh System provides a secure network while also isolating connections for separate activities, making it the ideal solution for today's work from home paradigm.

NVIDIA just announced its new generation GeForce "Ampere" graphics card series. The company is taking a top-to-down approach with this generation, much like "Turing," by launching its two top-end products, the GeForce RTX 3090 24 GB, and the GeForce RTX 3080 10 GB graphics cards. Both cards are based on the 8 nm "GA102" silicon. Join us as we live blog the pre-recorded stream by NVIDIA, hosted by CEO Jen-Hsun Huang.

IBM today revealed the next generation of its IBM POWER central processing unit (CPU) family: IBM POWER10. Designed to offer a platform to meet the unique needs of enterprise hybrid cloud computing, the IBM POWER10 processor uses a design focused on energy efficiency and performance in a 7 nm form factor with an expected improvement of up to 3x greater processor energy efficiency, workload capacity, and container density than the IBM POWER9 processor.

Designed over five years with hundreds of new and pending patents, the IBM POWER10 processor is an important evolution in IBM's roadmap for POWER. Systems taking advantage of IBM POWER10 are expected to be available in the second half of 2021. Some of the new processor innovations include:

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the widely-anticipated JESD79-5 DDR5 SDRAM standard. The standard addresses demand requirements being driven by intensive cloud and enterprise data center applications, providing developers with twice the performance and much improved power efficiency. JESD79-5 DDR5 is now available for download from the JEDEC website.

DDR5 was designed to meet increasing needs for efficient performance in a wide range of applications including client systems and high-performance servers. DDR5 incorporates memory technology that leverages and extends industry know-how and experience developing previous DDR memories. The standard is architected to enable scaling memory performance without degrading channel efficiency at higher speeds, which has been achieved by doubling the burst-length to BL16 and bank-count to 32 from 16. This revolutionary architecture provides better channel efficiency and higher application level performance that will enable the continued evolution of next-generation computing systems. In addition, the DDR5 DIMM has two 40-bit fully independent sub-channels on the same module for efficiency and improved reliability.

New features, such as DFE (Decision Feedback Equalization), enable IO speed scalability for higher bandwidth and improved performance. DDR5 supports double the bandwidth as compared to its predecessor, DDR4, and is expected to be launched at 4.8 Gbps (50% higher than DDR4's end of life speed of 3.2 Gbps).

Researchers at the Samsung Advanced Institute of Technology (SAIT) have unveiled the discovery of a new material, called amorphous boron nitride (a-BN), in collaboration with Ulsan National Institute of Science and Technology (UNIST) and the University of Cambridge. Published in the journal Nature, the study has the potential to accelerate the advent of the next generation of semiconductors.

Recently, SAIT has been working on the research and development of two-dimensional (2D) materials - crystalline materials with a single layer of atoms. Specifically, the institute has been working on the research and development of graphene, and has achieved groundbreaking research outcomes in this area such as the development of a new graphene transistor as well as a novel method of producing large-area, single-crystal wafer-scale graphene. In addition to researching and developing graphene, SAIT has been working to accelerate the material's commercialization.

Square Enix and Marvel have partnered to bring gamers from all around the world a perfect combination - science fiction movies and the ability to play one as a game. Together, Square Enix and Marvel have made a game called Avengers, based off of the Avengers movie trilogy. Today, Square Enix will be hosting a live stream at 10 AM PT time, to show off the gameplay, showcase missions and co-op abilities, and much more. You can join the live stream once it starts here. Besides the live stream, the company has announced that it will offer a free upgrade to the next generation of consoles, for anyone who buys the game for the current generation. That means that if you purchase the game for your current Xbox One or PS4 console, you will get a free upgrade for PS5 or Xbox Series X consoles. The game is going to launch on September 4th.

XRSPACE, the company pioneering the next generation of social reality, has today announced the launch of the world's first social VR platform designed for mass market users, combined with the first 5G mobile VR headset, delivering on the promise of a true social VR experience for all.

XRSPACE aims to create the social reality of the future - a world where people can interact both physically and virtually in a way that is contextual, familiar, immersive, interactive and personal. At a time when face-to-face interaction is restricted due to social distancing measures, XRSPACE is aiming to bring people together in a virtual world that is powered by cutting edge XR, AI, and computer vision technology, creating a new experience through 5G which is meaningful, anytime, anywhere.

As revealed during Microsoft's Inside Xbox show, Codemasters is delighted to announce DIRT 5, launching from October 2020 on Xbox Series X, PlayStation 5, Windows PC (via Steam) and the current generation of Xbox and PlayStation consoles. A Google Stadia version will be released in early 2021. Whilst respecting the heritage and retaining the DNA of the franchise, DIRT 5 writes a new chapter in the legacy of DIRT - bolder and braver than ever before. DIRT 5 is more than relentless rallying, more than suspension-shaking jumps, more than hairpins and handbrakes. Join an energised world of off-road racing, and be part of a vibe that delivers big on epic action, pure expression, and unbridled style.

EA has confirmed that it's existing games for Xbox One and Playstation 4 will receive free patches to upgrade them for next-generation consoles. The PS5 and Xbox Series X both feature ways to play current-generation games, both consoles will attempt to automatically boost games up to 4k resolution. While these options ensure broad inter-generation compatibility issues can arise from game limitations, this is where manual patches come in allowing developers to take advantage of the extra performance and radically overhaul their games.

Electronic Arts CFO Blake Jorgensen confirmed in a recent earnings call that EA would not charge consumers for these patches. "As usual, we have presented the quarterly phasing of our net bookings in our earnings presentation. Note that this year, the phasing includes the effect of revenue recognition from the games we are launching for the current generation of consoles that can also be upgraded free for the next generation."

According to the report of DigiTimes, which talked about TSMC's 5 nm silicon manufacturing node, they have reported that NVIDIA is also going to be a customer for it and they could use it in the near future. And that is very interesting information, knowing that these chips will not go in the next generation of GPUs. Why is that? Because we know that NVIDIA will utilize both TSMC and Samsung for their 7 nm manufacturing nodes for its next-generation Ampere GPUs that will end up in designs like GeForce RTX 3070 and RTX 3080 graphics cards. These designs are not what NVIDIA needs 5 nm for.

Being that NVIDIA already has a product in its pipeline that will satisfy the demand for the high-performance graphics market, maybe they are planning something that will end up being a surprise to everyone. No one knows what it is, however, the speculation (which you should take with a huge grain of salt) would be that NVIDIA is updating its Tegra SoC with the latest node. That Tegra SoC could be used in a range of mobile devices, like the Nintendo Switch, so could NVIDIA be preparing a new chip for Nintendo Switch 2?