Gabriel Ferraz, maintainer of the TechPowerUp SSD database and content creator, recently published an article that shows the relationship between SLC (Single-Level Cell) cache technology and its performance impact on SSDs. Using a Pichau Aldrin Pro 2 TB SSD featuring an Innogrit IG5236 controller and YMTC 128-layer TLC NAND, Gabriel has uncovered both the advantages and potential drawbacks of this feature. The article reveals that with SLC cache enabled, which acts as a high-speed buffer, the SSD achieved remarkable write speeds of up to 6.5 GB/s, but only until 691 GB had been written. Beyond that, speeds dropped to 2.2 GB/s and then to 860 MB/s as the drive filled up.

Disabling the SLC cache delivers more consistent performance results that are 2.1 GB/s across the whole capacity of the SSD, but with lower peak performance. Testing also examined the impact on power consumption and efficiency. With the SLC cache active, the SSD consumed approximately 5 W of power while achieving over 3000 MB/s bandwidth. Disabling the cache reduced power consumption but at the cost of halving the bandwidth to around 1900 MB/s, resulting in lower overall efficiency. Maximum power consumption with cache enabled peaked at 7.3 W, compared to a lower figure when operating in constant TLC mode. Below, you can see some performance benchmarks published on The Overclock Page.

ATP Electronics, a global leader in specialized storage and memory solutions, proudly announces the launch of the N751Pi PCIe Gen 4 NVMe M.2 2280 SSDs, which set a new industry standard with unmatched endurance among industrial solid state drives (SSDs) configured with pseudo single-level cell (pSLC) NAND.

The groundbreaking 150K P/E cycling configuration of NAND was achieved, thanks to a combination of ATP's exceptional strengths — from the use of prime NAND package, stringent NAND integrated circuits (IC) characterization and 100% NAND screening and validation capabilities, to ATP's own-developed firmware, specialized hardware configurations, and technologies.

Exascend, a service-oriented provider of innovative storage and memory solutions, proudly announces the expansion of its 2.5-inch SATA SSD series - SA4, SI4, and SE4 - to an unprecedented 15.36 TB capacity. This advancement redefines the limits of SATA SSD storage, catering demanding applications like digital/network video recorders and media post-production.

The new 15.36 TB SSDs are engineered for efficiency across diverse environments. The SE4 series operates in standard temperatures from 0°C to 70°C, while the SA4 and SI4 series feature robust coatings for extreme temperatures ranging from -40°C to +85°C, ensuring reliability in both enterprise settings and harsh conditions.

A few months ago, we covered proof of overclocking an off-the-shelf 2.5-inch SATA III NAND Flash SSD thanks to Gabriel Ferraz, Computer Engineer and TechPowerUp's SSD database maintainer. Now, he is back with another equally interesting project of modifying a Quad-Level Cell (QLC) SATA III SSD into a Single-Level Cell (SLC) SATA III SSD. Using the Crucial BX500 512 GB SSD, he aimed at transforming the QLC drive into a more endurant and higher-performance SLC. Silicon Motion SM2259XT2 powers the drive of choice with a single-core ARC 32-bit CPU clocked at 550 MHz and two channels running at 800 MT/s (400 MHz) without a DRAM cache. This particular SSD uses four NAND Flash dies from Micron with NY240 part numbers. Two dies are controlled per channel. These NAND Flash dies were designed to operate at 1,600 MT/s (800 MHz) but are limited to only 525 MT/s in this drive in the real world.

The average endurance of these dies is 1,500 P/E cycles in NANDs FortisFlash and about 900 P/E cycles in Mediagrade. Transforming the same drive in the pSLC is bumping those numbers to 100,000 and 60,000, respectively. However, getting that to work is the tricky part. To achieve this, you have to download MPtools for the Silicon Motion SM2259XT2 controller from the USBdev.ru website and find the correct die used in the SSD. Then, the software is modified carefully, and a case-sensitive configuration file is modified to allow for SLC mode, which forces the die to run as a SLC NAND Flash die. Finally, firmware folder must be reached and files need to be moved arround in a way seen in the video.

Swissbit, a leading manufacturer of industrial-grade flash memory solutions, today announced the release of its new product line of SATA SSDs. The series X-73, X-75 and X-78 are powered by cutting-edge industrial 112-layer 3D NAND technology, bringing unprecedented reliability and extended lifespan to the world's most crucial networks. The latest portfolio is built with Swissbit's dedication to quality and innovation. The new portfolio not only offers reduced Total Cost of Ownership (TCO) thanks to its extended product life cycle, but also comes with powersafe SSDs - Swissbit's industry-leading power loss protection feature.

The expanded SSD product line includes M.2 2242, M.2 2280, Slim SATA MO-297, and 2.5" form factors, and offers a wide capacity range from 40 GB up to 1.92 TB. With an industry-leading 100k P/E cycles, the high endurance versions in pSLC mode are aimed at addressing the increasing market demand for durable and reliable data storage solutions.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces the N600Si/Sc Series CFexpress cards Type B, the latest NAND-flash based high-speed memory cards to adopt the NVMe protocol over PCIe interface. Using the PCIe 4.0 x2 interface, they deliver superior, high-speed performance compared with other cards using the PCIe 3.0 x2 interface.

N600Si/Sc Series CFexpress cards offer convenient portability with enhanced sequential read/write performance of up to 3,500/3,200 MB/s. These removable storage devices are backward-compatible with XQD. The N600Si/Sc Series CFexpress cards sport the Gen. 4 x2 interface and are also backward compatible with CFexpress Gen. 3 x2. They are suitable for convenient movement among different devices and provide dependable access in environments with little or no network availability.

Swissbit has expanded its product range with the launch of the M.2 SATA SSD X-78m2. The new series is designed for especially write-intensive applications, is ideal for audio, video, and data recording, as well as serving as a boot medium, and achieves 2.5 times the endurance of previous generations. At the same time, it meets the most stringent requirements for reliability, temperature stability, and longevity. This makes the SSD suitable for any application that requires high endurance without compromising on data retention or temperature profiles.

Typical target applications include industrial PCs, point-of-sale (PoS) systems, embedded and surveillance systems, as well as mission-critical applications in the transportation, medical, networking, and communications sectors. The X-78m2 series is based on the compact M.2 2242 form factor and is immediately available with storage capacities ranging from 40 GB to 320 GB.

ATP Electronics, the global leader in specialized storage and memory solutions, has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND. Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration options. ATP's new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.

The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.

OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC Docking Solutions, Network Attached Storage, and Performance Upgrade Kits, announces the OWC Atlas Pro series of high-performance media cards and reader. Like the Atlas rockets that powered the historic Mercury human spaceflights into full orbit, the OWC Atlas series will launch your creative capabilities into another world.

OWC has been safely protecting Mac and PC users' data with high-performance storage solutions since 1988. Drawing on our experience as a leading developer of flash storage since 2010, we've engineered OWC Atlas Pro media cards with advanced performance and data management technologies to maximize the capabilities of your DSLR, mirrorless, and video camera. The OWC Atlas Pro cards let you go from shooting to transferring RAW images and up to 8K video footage to your computer with the highest workflow efficiency. Whether you're an aspiring social media influencer, visual arts hobbyist, drone pilot, or accomplished creative professional, you can trust the OWC Atlas Pro media cards with your irreplaceable shots.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces the A750Pi and A650Si/Sc Series embedded SSDs built on 3D triple level cell (TLC) NAND flash. Manufactured using a new die package, the Serial ATA solid state drives (SATA SSDs) deliver 66% higher endurance in native TLC mode and 50% higher in pseudo single level cell (pSLC) mode, making them on par with drives built on multi-level cell (MLC) and SLC flash, respectively.

The new SSDs come in M.2 2280 and 2242 as well as 2.5" and mSATA form factors. A750Pi/A650Si SSDs support industrial temperature (I-Temp) ranges from -40°C to 85°C to perform reliably even when operating under extreme and harsh conditions. A650Sc SSDs can support commercial operating temperatures (C-Temp) from 0°C to 70°C. A650Si/Sc with native TLC NAND flash have capacities from 120 to 1920 GB, while A750Pi drives configured in pSLC offer 80 to 640 GB. Depending on project and specific part number request, ATP's new SATA embedded SSDs are also available as self-encrypting drives (SEDs) featuring AES-256 encryption and Opal TCG 2.0-compliant security.

At its simplest definition, embedded vision is the merging of computer vision with edge AI. Its implications, however, are far more reaching with the potential to launch wholly new applications and reshape the future of entire industries.

Integrating a camera and a processing board, an embedded vision system provides the benefits of compact size, light weight, low operational cost, and low energy consumption. They are typically built for executing specific applications, which makes the upfront cost relatively high due to customization. Once they are trained, they can perform various techniques such as image classification, object detection, object tracking, semantic segmentation, and instance segmentation to help a computer extract, analyze, and understand useful information from a single image or a set of images. This technology opens up entirely new possibilities.

SMART Modular Technologies, a SMART Global Holdings, Inc. company (Nasdaq: SGH) and a global leader in memory solutions, solid-state drives and hybrid storage products, today announced the new T5EN PCIe/NVMe M.2 2280 and U.2 flash drives for aerospace, defense and industrial applications that require durable, rugged, and secure memory storage.

Extending SMART Modular's T5E family of SSDs, the T5EN offers capacities up to 8 TB (M.2 up to 4 TB) Gen 3 x4 performance using 3D TLC flash with pSLC support. "With the growing trend toward NVMe in embedded systems, developing the T5EN was a natural progression and complement to our existing product line," explains Mike Guzzo, senior director of SMART Modular's RUGGED line of Flash products. Guzzo adds, "Fundamentally, the T5EN includes all of the existing advantages of the T5E, such as very high capacity, superior reliability for harsh environmental extremes, military erase algorithm support, as well as 256 bit encryption. These advantages equate to a higher level of protection for mission-critical data and instill confidence in the overall reliability of the data storage devices that support high-performing NVMe architectures."

ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe Gen3 x4 NVMe solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package. Complying with M.2 specifications, the M.2 Type 1620 HSBGA measures just 16 (L) x 20 (W) x 1.6 (H) mm, supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications. N700 Series SSDs are built with 3D triple-level cell (TLC) configured as pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

Embedded storage has gradually matured over its years of development. However, as technology has developed, market demands towards the stability of embedded storage products has also increased. Only by improving their products and technologies and pushing the boundaries of technology can storage enterprises weather the storm of the rapidly changing market.

In 2020, FORESEE, Longsys' embedded storage brand, launched a compact eMMC packaged in BGA 153, with dimensions of only 9.0 x 7.5 x 0.8 mm. This is in stark contrast to the standard dimensions of 11.5x13x1.2 mm. The operating temperature ranges from -25°C to 85°C, reaching the standards seen in industrial-grade products, and the maximum capacity can reach up to 64 GB. It meets all market requirements for high performance, low power consumption, slimness, and multiple capacities, and satisfies the needs of terminal equipment such as tablets, smart phones, smart speakers, dash cams, and smart watches.

Greenliant has secured major design wins with its EnduroSLC solid state drives (SSDs) in a wide range of demanding, extreme environment applications for customers that need best-in-class reliability and product longevity. Greenliant's proprietary EnduroSLC Technology substantially enhances data retention and extends the write endurance of 1-bit-per-cell SSDs with advanced hardware ECC capabilities and NAND flash management algorithms. EnduroSLC SSDs not only offer superior data retention capabilities under complex temperature conditions, but also support 50K, 100K and industry-leading, ultra high 250K+ program-erase (P/E) cycles, which are at least a 5x improvement over pseudo-SLC (pSLC) SSDs and a 50x improvement over MLC NAND-based products.

For systems that are in remote locations and costly to maintain-from satellite to subsea communications-customers recognize the value of EnduroSLC SSDs; they can reliably operate and retain data for long periods of time in harsh conditions. Long-life, write-intensive products, such as transportation black box recorders and industrial data loggers, have also benefitted from the enhanced features of EnduroSLC SSDs. EnduroSLC storage products are designed with Greenliant's advanced SATA, NVMe PCIe and eMMC controllers, operate at industrial temperatures (-40 to +85 degrees Celsius) and are backed by the company's Long-Term Availability program (http://bit.ly/SSD-LTA-program), providing an extra level of support.

TDK Corporation announces the sequential launch of the embedded SD ESRD4 series, the embedded SSD ESS1B series and the M.2 SSD Type 2280-D5-B-M SNS1B series. With the progress of IoT, the demand for micro storage for edge data is rapidly expanding. In particular, eMMC, which can be mounted on a surface, was expected to be potent, but the trend is shifting from eMMC to UFS, which is associated with the larger capacity of smartphones.

On the other hand, a reliable and appropriate storage capacity is required for I-IoT that usually uses a small capacity. TDK's embedded SD ESRD4 series is a SD card, equipped with a highly durable SLC/pSLC NAND flash that can be implemented on boards. It covers a wide range of capacities from 1GB to 32GB, suitable for storing a lightweight system such as Linux and RTOS.

Today TDK Corporation (President: Shigenao Ishiguro) announced the gradual launch of SD Memory cards (MMRD4 series) and microSD Memory cards (MURD4 series) from January 2018. Both series support UHS-I for industrial application. The rapid progression of IoT has increased demand for smaller SD/microSD Memory cards with low power consumption for the storage of sensor information. However, as SD/microSD Memory cards for general use adopt TLC and MLC type flash memory to reduce costs, they are largely unsuitable for industrial application in terms of durability and reliability.

The MMRD4 and MURD4 series consist of highly reliable SD/microSD Memory cards equipped with very durable SLC/pSLC flash memory as well as the newly developed SD controller, TDK GBDriverRD4. In addition to data retention capacity and durability, the cards feature robust data security in the event of power interruption, ensuring safe usage in IoT devices that are often turned off to conserve power.