Shahram Mokhtari and Elizabeth Chamberlain—members of the iFixit Teardown Team—spent hands-on time with Framework's freshly introduced 4.5 liter Mini-ITX "Desktop" PC system. Official press material revealed cooling solution partnerships with Cooler Master and Noctua, but only a minority of "2nd Gen event" attendees were allowed to handle these pre-release modular parts. iFixit employees did not perform a full evaluation of Framework's new desktop model, since they were dealing with a prototype unit. A "repairability score" will be awarded once finalized hardware is delivered to iFixit's base of operations. In the meantime, their video team was hosted at Framework's Northern California office.

According to a follow-up report, Mokhtari and Chamberlain enjoyed their visit: "it's teardown time. Framework has been a beacon of repairability in the laptop space, and now they're bringing that ethos to desktops...Taking this thing apart was exactly as easy as we've come to expect from Framework. They brought us to their HQ to rip into it, and from the very first step, it was clear: this desktop was designed to be opened." Potential buyers—of Framework Desktop—are faced with many configurations, but a crucial choice will focus on available APU options. The highest-end builds will feature AMD's 16-core Ryzen AI Max+ 395 "Strix Halo" processor—iFixit's teardown did not reveal any major revelations in terms of the APU's physical appearance. Even Framework's own press release contains an exposed shot—hardcore processor design enthusiasts are better catered to with a more in-depth analysis of "Strix Halo."

Both pictures and videos of a partial teardown of Apple's recently launched Mac mini with the M4 SoC have appeared online courtesy of various Chinese sources. There are at least two interesting parts to these partial teardowns and they're related to storage and WiFi. On the storage front, Apple has moved away from having soldered NAND chips straight on the main PCB of the Mac mini, to instead having them on a custom PCB which is similar to M.2, but a custom Apple design. The PCB pictured contained a pair of 128 GB NAND chips and with the source of the teardown being from China, there's also a video showing a repair shop desoldering the two chips and replacing them with two 1 TB chips, or in other words, the SSD was upgraded from 256 GB to 2 TB.

The upgrade brought with it some extra performance as well, even if the write speed remained at a comparatively slow 2900 MB/s, the read speed went up from 2000 MB/s to 3300 MB/s which is a significant gain in performance. This is obviously not a consumer friendly upgrade path, but we'd expect to see third party upgrade options at some point in the future, assuming there's no black listing of third party storage modules. The NAND controller is still likely to be integrated into Apple's SoC, but the PCB that the NAND flash chips are mounted onto appears to have some kind of SPI flash on it as well, which might make third party upgrades a lot harder.

Earlier teardowns of 13-inch Apple M3 MacBook Air models revealed a pleasing storage performance upgrade. Popular American e-commerce watchdog, iFixit, has joined in on the fun—CEO Kyle Wiens has confirmed that the 15-inch M3 MacBook Air 256 GB base model also houses two 128 GB flash storage chips. A provisional repairability score of 5 out of 10 has been awarded—this verdict could change once iFixit staffers finish up in-depth investigations into Apple's latest thirteen and fifteen inch ultraslim notebooks. A revised figure might appear online once the site publishes its full how-to-guides.

iFixit's video teardown demonstrates that not much has changed when comparing the new models to Apple's M2 MacBook Air family of products. Tinkerers will face the usual obstacles, mainly dreaded pentalobe screw designs. The team discovered plastic pull-tabs during the removal of M3 MacBook Air batteries—a pleasing alternative to older (headache inducing) adhesive-fastened methods of securing power cells in place. The iFixit team had to deal with many fiddly screws and brackets during excavation efforts—they noted that Apple's interior design does not include any labelling, and the screws are not numbered. Framework's Laptop 16 was cited as a shining example of doing things correctly.

Apple introduced its new generation of MacBook Air subcompact laptops last week—their press material focused mostly on the "powerful M3 chip" and its more efficient Neural Engine. Storage options were not discussed deeply—you had to dive into the Air M3's configuration page or specification sheet to find out more. Media outlets have highlighted a pleasing upgrade for entry-level models, in the area of internal SSD transfer speeds. Apple has seemingly taken onboard feedback regarding the disappointing performance of its basic MacBook Air M2 model—its 256 GB storage solution houses a lone 3D NAND package. Max Tech's Vadim Yuryev was one of the first media personalities to discover the presence of two NAND flash chips within entry-level MacBook Air M3 systems—his channel's video teardown can be watched below.

The upgrade from a single chip to a twin configuration has granted higher read and write speeds—Yuryev shared Blackmagic SSD speed test results; screengrabs from his video coverage are attached to this article. M3 MacBook Air's 256 GB solution achieved write speeds of 2,108 MB/s, posting 33% faster performance when compared to an equivalent M2 MacBook Air configuration. The M3 model recorded read speeds of 2,880 MB/s—Wccftech was suitably impressed by this achievement: "making it a whopping 82 percent than its direct predecessor, making it quite an impressive result. The commendable part is that Apple does not require customers to upgrade to the 512 GB storage variants of the M3 MacBook Air to witness higher read and write speeds." Performance is still no match when lined up against "off-the-shelf" PCIe 3.0 x4 drives, and tech enthusiasts find the entry price point of $1099 laughable. Apple's lowest rung option nets a 13-inch model that packs non-upgradable 8 GB of RAM and 256 GB of storage. Early impressions have also put a spotlight on worrying thermal issues—Apple's fan-less cooling solution is reportedly struggling to temper their newly launched M3 mobile chipset.

ZOTAC debuted a massive flagship GeForce RTX 4090 24 GB custom design graphics card last summer—the Prime Gamer Force (PGF) OC edition model was released as a China exclusive product. ZOTAC's PGF shroud design remains the largest on the market—381 mm (L) x 154 mm (W) x 74 mm (D)—even with downgraded silicon beneath the surface. NVIDIA's China-specific GeForce RTX 4090D GPU was introduced last December, as a sanction conformant substitute for the full-fat version—naturally, ZOTAC has prepared a revised PGF model. This week, Expreview has published an in-depth review of the GeForce RTX 4090 D PGF OC edition graphics card. They found that ZOTAC's cooling system—three 11 cm fans and a vapor chamber—offered: "high-frequency stability...comparable to that of water-cooled (solutions)."

The Chinese publication reviewed the GALAX RTX 4090 D Metal Master model in January—at the time, software restrictions prevented the implementation of significant overclocks. It was theorized that future updates or community workarounds could bypass limitations, but the latest review—of ZOTAC's "super luxurious" PGF edition—indicates that this GeForce RTX 4090 D GPU's OC potential is still constricted. VideoCardz has pulled out essential details from the Expreview article: "(The PGF) has high maximum TGP (530 W) and a powerful 28-phase power PCB design. Despite the technological headroom, the card struggles to offer much of the overclocking potential. The team from Expreview only managed to squeeze 3.7% more performance from this card. That's despite 24.7% more power theoretically available." An underwhelming overclocking aspect is counterbalanced by the premium-tier card's impressive performance stability—the review also praised ZOTAC's quiet cooling solution and usage of high-end "heat dissipation materials."

iFixit has finally posted photos of the Apple Vision Pro's inner bits, following on from the release of a video teardown (uploaded last week)—the American e-commerce and how-to website spent plenty of hours exploring the expensive mixed reality headset's "creepy" features, before breaking seals and deconstructing the device's highly complex interior. The iFixit teardown team have often complained about Apple computer products being notoriously difficult to deal with—the Vision Pro is no exception, but they eventually managed to isolate the headset's logic board. The onboard M2 octa-core chipset is identified as a APL1109/339S01081E part, while its assistant R1 sensor co-processor sports an APL1W08/339S01186 identifier. Micron has supplied 8 GB of LPDDR5 SDRAM memory (MT62F1G64D8WT-031 XT), and Kioxia has Apple covered with its K5A4RC2097 256 GB NAND flash.

Tech experts have spent time poring over iFixit's latest set of snaps, as laid out in their teardown guide—one such enthusiast, Yining Karl Li, posted an intriguing Apple Vision Pro Logic Board observation to social media: "There's this interesting shot of the main logic board (in Step 1). The R1 chip (in the red box) has interesting lines all over it dividing the surface into sub-boxes. Is the R1 chip using a chiplet design?" A small debate erupted from this quick inspection—one commenter believes that the co-processor is not all that fancy: "(it is) likely sporting low-latency fan-out memory," citing the presence of very faint horizontal and vertical lines. As pointed out by Wccftech, Li also presented a chiplet design example (for comparison purposes)—a close-up shot of Intel's Ponte Vecchio Xe-HPC GPU. The lines are a lot more pronounced on Team Blue's chip design.