Power Consumption and Temperatures

The ASRock X670E Taichi Carrara has a single large heatsink that connects both the chipset and CPU VRM. Inside said VRM heatsink is a small fan. Unfortunately, a closer inspection isn't possible due to the top being glued on. Removal could result in potential irreparable damage to the heatsink.



For the ASRock X670E Taichi Carrara thermal testing, one probe is placed along each bank of power stages. A probe is left out to log the ambient temperature. For temperature measurement, a Reed SD-947 4 channel Data Logging Thermometer is used, paired with four Omega Engineering SA1 self adhesive thermal couple probes. All temperatures are presented as Delta-T, which is the recorded temperature minus the ambient temperature as a base. The end result accounts for variation in ambient temperature, including changes over the course of a test.

Tests are conducted over a 30 minute period. For testing, the AMD Ryzen 9 7950X is use in a stock configuration. For the first 5-8 minutes, a fan is placed on the VRM heatsinks to simulate case airflow. If the heatsink has a internal fan, it is not disabled for these tests.


These VRM tests are split into multiple charts to give a wider understanding of the cooling prowess of the ASRock X670E Taichi Carrara, without changing any BIOS settings from a stock configuration. After the fan is removed around the 8 minute mark, VRM temps quickly shot up, but ended with only creeping along as the room temperature increased. A 65 °C value is a perfectly acceptable for long periods of load.


The second test was to see how the VRM heatsink may fare in games. Temperatures slowly increased throughout the test and eventually even out near the 24 minute mark.