A Look Inside & Component Analysis

Before reading this page, we strongly suggest a look at this article, which will help you understand the internal components of a PSU much better. Our main tool for the disassembly of the PSU is a Thermaltronics TMT-9000S soldering and rework station. It is of extreme quality and is equipped with a matching de-soldering gun. With such equipment in hand, breaking apart every PSU is like a walk in the park!


The big Gold Leadex unit is based on the same platform the Platinum Leadex units utilize, but efficiency was dropped to Gold since its high capacity didn't allow for Platinum. We are then pretty sure that this is a bolstered version of the 1200 W Platinum Leadex, but unfortunately haven't reviewed the latter to be absolutely certain.

There are several differences between the new and older Platinum SF platform. These increase the new platform's efficiency and performance. An LLC resonant converter in the primary side enables loss-less switching, while a synchronous design and two VRMs are used in the secondary side. The guts of the Leadex Gold 1300 W and EVGA SuperNOVA G2 1300 W we reviewed a while ago are nearly identical.


The transient filtering stage starts at the AC receptacle; however, there is only a single X cap here this time around. All other components are on the main PCB: two CM chokes, two X caps, two pairs of Y caps, and an MOV. We also found a Transient Voltage Suppression (TVS) diode, which completes the PSU's protections against spikes.


Two parallel bridge rectifiers feed the APFC circuit. Provided by Shindengen, their model number is U30K80R.


Three Infineon IPP50R140CP fets and a pair of C3D08060A boost diodes are used by the APFC converter. The two parallel hold-up caps are located right in front of the transient filter and are provided by Nippon Chemi-Con (400 V, 680 µF, 105°C, KMR series). The EVGA G2 1300 W unit uses a 680 µF and 560 µF cap instead, so its hold-up time is a tad lower.


We found an NTC thermistor that protects the unit against large inrush currents in the same spot on the PCB. A close-by electromagnetic relay isolates it from the circuit once it finishes its job.


A small, sealed PCB houses the APFC controller, an NCP1653A IC.


The standby PWM controller is an ICE3B0565 IC.


This proprietary IC with markings AA9013 is probably the LLC resonant controller.


Four Infineon IPP50R199CP fets are used as main switches. Right next to them is the, according to SF, specially designed main transformer.


The secondary side has three vertical heatsinks. Two of these host eight fets in total (4x IPP041N04N and 4x IPP023N04N). Among these heatsinks are six polymer and several electrolytic caps by Chemi-Con, which are used for ripple-filtering purposes.


Two DC-DC converters generate the minor rails. The polymer caps on these are provided by Chemi-Con.


The 5VSB rail is rectified by a Mospec S10C60C SBR (Schottky Barrier Rectifier), and the fan control board with an LM324ADC is installed right next to it.


At the front of the modular PCB are many polymer caps and several small electrolytic caps by CapXon. We should note here that caps in this area are not stressed significantly, so it doesn't matter whether these are made in Japan or China. Polymer caps also last for very long irregardless of their origin.


Soldering quality is quite good, although still not topnotch, at least for some areas of the PCB.


And here is the last of the two major differences to the EVGA G2 1300 W unit (the first was the combined capacity of the hold-up caps). SF chose a higher quality FDB fan by Globe Fan (model number RL4Z S1402512EH, 12 V, 0.6 A) instead of the double ball-bearings fan we found in EVGA's offering, which translates into a longer life cycle and less output noise at similar RPMs. SF apparently kept the best parts for their units or EVGA simply sought to lower the production cost to increase profit, or the ability to offer their stunning ten year warranty.