Team Group G50 2 TB Review 18

Team Group G50 2 TB Review

Test Setup »

Packaging

Package Front
Package Back


The Drive

SSD Front
SSD Back

The drive is designed for the M.2 2280 form factor, which makes it 22 mm wide and 80 mm long.

SSD Interface Connector

PCI-Express 4.0 x4 is used as the host interface to the rest of the system, which is pretty much the standard these days, it doubles the theoretical bandwidth compared to PCIe 3.0 x4.

SSD Teardown PCB Front
SSD Teardown PCB Back

On the PCB you'll find the SSD controller and four flash chips. A DRAM cache is not available.


Team Group includes a heat spreader foil with their drive. While it's not a full-blown heatsink, it does help a little bit as our thermal measurements show.


Do note that the controller is lower in Z-Height than the flash chip next to it, so you have to press the foil down a bit. Do make sure to fully cover the (small) controller chip, as that's the main heat source of the SSD.

Chip Component Analysis

SSD Controller

The Innogrit IG5220 RainierQX controller is an older controller design that's optimized for low-cost Gen 4 drives without DRAM and manufactured on a 12 nanometer production process.

SSD Flash Chips

The four flash chips are YMTC 128-layer 3D TLC NAND. Each chip has a capacity of 512 GB.
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Oct 8th, 2024 10:16 EDT change timezone

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