Here are some of the first pictures of HDPlex H3 V2 fan-less HTPC chassis. The H3 sits between the tiny H1 and deck-sized H5. It has the height of the H5 and the width of the H1. The case measures 270 mm x 264 mm x 93 mm (WxDxH), weighing in at 5.5 kg. Its main chamber can house mini-ITX motherboards, and a half-height add-on card that's no more than 1-slot thick. As with most fan-less cases, the chunky, ridged aluminium body of the H3 V2 doubles up as heatsink for the CPU/SoC, and can handle thermal loads of up to 80W. The CPU block uses eight 6 mm-thick copper heat pipes to transport heat to the body. The case also has room for up to four 7 mm-thick 2.5-inch drives. Available now, it is priced at USD $240.