Arm has officially unveiled its Accuracy Super Resolution (ASR) upscaling technology at Game Developer Conference 2025, delivering an open-source upscaling solution for mobile and low-power devices. Built upon AMD's FidelityFX Super Resolution 2 (FSR 2) framework, ASR promises up to 53% higher frame rates while reducing power consumption by 20% on devices utilizing the Immortalis-G720 GPU. This technology addresses a critical performance gap in the Android ecosystem, which has historically lagged behind Apple's MetalFX implementation. The temporal upscaling approach employed by ASR combines information from multiple frames to generate higher-quality images, offering superior visual fidelity compared to Qualcomm's Game Super Resolution (GSR), which relies on the older spatial-based FSR 1 technique. In benchmark testing with complex scenes, Arm demonstrated that ASR helps maintain stable device temperatures, preventing thermal throttling that can compromise user experience.

Collaboration with MediaTek confirmed significant power savings on Dimensity 9300 chipsets, directly addressing battery life concerns for mobile gamers. Arm plans to release pre-built plugins for Unity and Unreal Engine by year-end, streamlining integration for developers working with these widely-used game engines. During GDC demonstrations, Arm showcased the "Mori" demo running in Unreal Engine 5, where ASR delivered 30% performance improvements without visual compromises. Licensed under MIT open-source terms, ASR's accessibility extends across the entire Arm ecosystem, potentially benefiting smartphones running MediaTek Dimensity, Qualcomm Snapdragon, Samsung Exynos, and even Arm-powered laptops featuring Snapdragon X series SoCs.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

A mysterious HiSilicon Kirin X90 processor was included in a Chinese state report; the official assessment document seems to cover the topics of native CPU reliability and security. Jukanlosreve—a keen watcher of semiconductor industry inside tracks—highlighted the unannounced technology on social media. They alerted TP Huang (aka tphuang) to this discovery, possibly in reaction to the latter's reporting of a wholly Huawei-designed AI laptop. Last week, we heard about a speculated portable enterprise PC series powered by Kunpeng-920 mobile processors. HiSilicon is a Chinese fabless semiconductor firm, operating under Huawei ownership—normally, their Kirin processors are designated as smartphone-based solutions. Industry watchdogs believe that company leadership is paving the way for a new generation of personal and server processors—their current Kunpeng-900 series debuted back in 2019, so natural successors are very likely in the development pipeline. Early last year, insiders proposed that Huawei had prioritized its Ascend 910B AI accelerator chip—despite these rumors, Kirin-related leaks continued to trickle out.

According to industry moles, HiSilicon tends to spread its custom Arm-based Taishan core design across modern Kirin and Kunpeng processor families. Based on Jukanlosreve's initial detective work, Tom's Hardware proposed a plausible outlook for the (leaked) chip's future. Their report theorized: "Huawei's server and PC divisions have been relatively quiet, as evidenced by the lack of new Kunpeng SoC designs. The new Kirin X90, despite its name, could be a possible successor, considering that Huawei is reportedly launching a new 'AI PC' with HarmonyOS next month. It's likely to be fabricated using SMIC's 7 nm process featuring Taishan V120 cores based on either the Armv8 or Armv9 architectures, which are not subject to the US trade ban." Instead of using an old hat Kunpeng-920 SoC, Huawei's forthcoming next-gen "Qingyun" AI laptop could be equipped with a Kirin X90 APU—Tom's Hardware foresees an Apple MacBook-esque "integration of custom hardware and software" with the Chinese tech firm's fully in-house developed model.

Equal1 today unveils Bell-1, the first quantum system purpose-built for the HPC era. Unlike first-generation quantum computers that demand dedicated rooms, infrastructure, and complex cooling systems, Bell-1 is designed for direct deployment in HPC-class environments. As a rack-mountable quantum node, it integrates directly alongside classical compute—as compact as a GPU server, yet exponentially more powerful for the world's hardest problems. Bell-1 is engineered to eliminate the traditional barriers of cost, infrastructure, and complexity, setting a new benchmark for scalable quantum computing integration.

Bell-1 rewrites the rule book. While today's quantum computers demand specialized infrastructure, Bell-1 is a silicon-powered quantum computer that integrates seamlessly into existing HPC environments. Simply rack it, plug it in, and unlock quantum capabilities wherever your classical computers already operate. No new cooling systems. No extraordinary power demands. Just quantum computing that works in the real world, as easy to deploy as a high-end GPU server. It plugs into a standard power socket, operates at just 1600 W, and delivers on-demand quantum computing for computationally intensive workloads.

We dedicated a lot of our launch presentation of Framework Desktop to the Ryzen AI Max processor it uses, and for a good reason. These truly unique, ultra-high-performance parts are the culmination of decades of technology and architecture investments that AMD has made, going all the way back to their acquisition of ATI in 2006. For our first technical deep dive on Framework Desktop, we're going to go even deeper into Ryzen AI Max and what makes it a killer processor for gaming, workstation, and AI workloads.

What makes Ryzen AI Max special is a combination of three elements: full desktop-class Zen 5 CPU cores, a massive 40-CU Radeon RDNA 3.5 GPU, and a giant 256-bit LPDDR5x memory bus to feed the two, supporting up to 128 GB of memory. Chips and Cheese did an excellent technical overview of the processor with AMD that goes even deeper on this, and we'll pull out some of the highlights along with our own insights. We'll start with the CPUs. Ryzen AI Max supports up to 16 CPU cores split across two 4 nm FinFET dies that AMD calls CCDs. These dies are connected together using an extremely wide, low power, low latency bus across the package substrate. The CPUs are full Zen 5 cores with 512-bit FPUs and support for AVX-512, a vector processing instruction set otherwise only available on Intel's top end server CPUs. We're excited for you to see the multicore performance numbers these CPUs can do in our upcoming press review cycle!

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

Retroid, a popular brand of retro gaming handhelds, has finally revealed the specifications for its upcoming product - the Retro Pocket Classic. As the name suggests, the product will boast a compact form factor that screams retro vibes. The company has revealed multiple teasers for the device in the past, and has now shed light on the detailed specifications of the same. As teased, the Pocket Classic will boast a 3.92-inch AMOLED display with a peak brightness of 500 nits and a resolution of 1,240 x 1080 allowing for an impressive pixel density of 419.

Internally, an undisclosed 4 nm Qualcomm SoC will sit at the heart of the device, paired with 4 GB of LPDDR4X memory and 64 GB of eMMC storage. The product will boast an active cooling solution, which should allow for longer play times without any severe throttling issues. Speaking of longer play times, the Pocket Classic will boast a 5,000-mAh battery with 27-watt charging support. At just 13.8 x 8.9 x 2.6 cm, the Pocket Classic weighs in at just 223 grams. As for connectivity, a USB-C port, a 3.5 mm audio jack, as well as a TF card slot. Wireless communications will be taken care of by Bluetooth 5.0 and Wi-Fi 5. Pricing and availability details are under wraps for now, but when the time comes, the Pocket Classic will ship with Android 14 pre-installed.

Today at Embedded World, Altera Corporation, a leader in FPGA innovations, unveiled its latest programmable solutions tailored for embedded developers who are pushing the boundaries of innovation at the intelligent edge. Altera's latest Agilex FPGAs, Quartus Prime Pro software, and FPGA AI Suite enable the rapid development of highly customized embedded systems deployed across a broad range of edge applications, including robotics, factory automation systems, and medical equipment.

Altera's programmable solutions meet the stringent power, performance and size requirements of embedded and intelligent edge applications. These hardware solutions, along with Altera's FPGA AI Suite, enable machine learning engineers, software developers, and FPGA designers to create custom FPGA AI platforms using industry-standard frameworks such as TensorFlow and PyTorch, and development tools such as OpenVINO and Quartus Prime software.

Realtek Semiconductor will participate in the globally acclaimed top technology event—the Embedded World 2025 in Nuremberg, Germany, from March 11 to 13. Highlighted exhibits will include networking multimedia applications, Ethernet solutions for various transmission media, industrial Ethernet switch application solutions, as well as Bluetooth and Wi-Fi/IoT solutions. These exhibits will demonstrate Realtek's innovation in multimedia and communication networks, combined with AI-powered smart applications, providing customers with stable, reliable, and high-performance solutions.

Networked Multimedia Application
Realtek provides end customers with a highly secure, sustainably upgradeable, open-source, and shared Linux platform. Designed to meet the needs of SoCs, it leverages an advanced 12 nm process, a high-performance CPU/GPU, and Edge AI computing with NPU to fully support 4K video decoding and all HDMI 2.1 functions. It also enables audio and video transmission via DisplayPort. Additionally, the platform features high integration with multiple interfaces, including USB, PCIe, GPIO, UART, and SDIO. For system integration, Realtek incorporates its NICs (1G/2.5G/10 Gbps) and Wi-Fi/BT chips. SoCs are able to seamlessly connect to panels of various sizes via built-in MIPI or eDP, ensuring compatibility with networked multimedia applications.

Just recently, Apple somewhat stunned the industry with the introduction of its refreshed Mac Studio with the M4 Max and M3 Ultra SoCs. For whatever reason, the Cupertino giant decided to spec its most expensive Mac desktop with an Ultra SoC that is based on an older generation, M3, instead of the newer M4 family. However, the M3 Max, which the M3 Ultra is based on, was no slouch, indicating that the M3 Ultra will likely boast impressive performance. However, if a collection of recent benchmark runs are anything to go by, it appears that the M3 Ultra is a tad too closely matched with the M4 Max in CPU performance, which makes the $2000 premium between the two SoCs rather difficult to digest. Needless to say, a single benchmark is hardly representative of real-world performance, so accept this information with a grain of salt.

According to the recently spotted Geekbench result, the M3 Ultra managed a single-core score of 3,221, which is roughly 18% slower than the M4 Max. In multicore performance, one might expect the 32-core M3 Ultra to sweep the floor with the 16-core M4 Max, but that is not quite the case. With a score of 27,749, the M3 Ultra leads the M4 Max by an abysmal 8%. Of course, these are early runs, which may suggest that future scores will likely be higher. However, it is clear as day that the M3 Ultra and the M4 Max, at least in terms of CPU performance, will be close together in multithreaded performance, with the M4 Max continuing to be substantially faster than the far more expensive M3 Ultra variant in single-threaded performance. It does appear that the primary selling point for the M3 Ultra-equipped Mac Studio will be the massive 80-core GPU and up to 512 GB of unified memory shared by the CPU and the GPU, which should come in handy for running massive LLMs locally and other niche workloads.

Silicon Motion Technology Corporation, a global leader in NAND flash controllers for solid-state storage devices, today announced its participation in Embedded World 2025, taking place from March 11-13, 2025, in Nuremberg, Germany.

At the event, Silicon Motion will showcase its latest storage and display interface solutions, including PCIe NVMe Gen 4/5 SSD controllers, Ferri embedded storage solutions, and advanced display interface SoCs. These cutting-edge innovations are designed to maximize performance per watt, extend device longevity and power for the next generation of AI-driven industrial, embedded, automotive, and data center applications.

Samsung Electronics is taking a close look at its chip design and foundry operations. This action could lead to organizational restructuring, including executive reassignments and workforce reallocation. The initiative aims to strengthen Samsung's competitive position against industry leaders such as TSMC. In January, the company's executives initiated an in-depth evaluation of the System LSI division, which handles chip design. After that, the company plans to extend the review to its foundry business. Significant restructuring may occur within the System LSI division, one proposal involves transferring the Exynos system-on-chip (SoC) business to the Mobile Experience (MX) division to better align with Samsung's smartphone strategy.

Samsung is also evaluating the potential pause of investments in its Pyeongtaek (South Korea) and Taylor (US) manufacturing facilities for its foundry business. At the same time, the company is developing strategies to improve yield rates in its advanced manufacturing processes. Moreover, Samsung is also considering changes within its image sensor business, potentially shifting focus from high-resolution sensors toward products for autonomous vehicles and robotics applications. This action represents the first major internal assessment since Samsung established its management analysis department in November 2024. The primary objective is to revitalize underperforming business divisions.

On Monday (March 3), Qualcomm introduced its Dragonwing FWA Gen 4 Elite model—advertised as the world's first 5G Advanced-capable FWA platform. Inevitably, the company's brand-new Snapdragon X85 5G modem will be compared to a rival design—Apple's proprietary C1 chip launched last month; as featured in the A18 SoC-powered iPhone 16e series. The two companies were closely intertwined for a number of years; with a longer than anticipated co-development of 5G solutions for multiple iPhone product generations. Cristiano Amon—the CEO of Qualcomm—believes that his team's X85 5G design will end up as the victor, when pitched against Apple's C1. In a CNBC-conducted interview, he boasted: "it's the first modem that has so much AI, it actually increases the range of performance of the modem—so the modem can deal with weaker signals. What that will do will set a huge delta between the performance of premium Android devices, and iOS devices, when you compare what Qualcomm can do versus what Apple is doing."

Smartphone industry watchdogs reckon that Apple's C1 model will leverage superior power efficiency; courtesy of the contained modem and receiver being based on TSMC 4 nm and 7 nm processes (respectively). Qualcomm has not revealed the fundamental aspects of its new Snapdragon X85, so it is difficult to project its power consumption habits. Official press material concentrates on two big selling points: downlink speeds up to 12.5 Gbps, and 40 TOPS of NPU processing power. Insiders have posited that the in-house designed C1 modem will make its way into next-gen iPads and Apple wearables—additionally, the development of a successor is rumored. Despite doing less business with Apple, Amon thinks that the future is peachy: "if modem is relevant there's always a place for Qualcomm technology. In the age of AI, modems are going to be more important than they have ever been. And I think that's going to drive consumer preference about do they want the best possible modem in the computer that's in their hand all the time." Qualcomm's chief expects that the supply of Snapdragon 5G Modem‑RF Systems—to Apple—will end in 2027.

The refreshed Mac Studio is here, and it appears that Mark Gurman's reports were accurate once again. The system was updated with the M4 Max and the M3 Ultra SoCs - and once again, that is not a typo. For whatever reason, Apple refused to fit the Mac Studio with an M4-flavored Ultra SoC, instead settling for an undeniably confusing product lineup. The M4 Max, with up to 16 CPU cores and 40 GPU cores, will undoubtedly have the upper hand in single-core performance by as much as 30%, whereas the M3 Ultra will have superior multithreaded and GPU performance, courtesy of its 32 CPU cores and 80 GPU cores. Moreover, the price gap between the base M3 Ultra and M4 Max SKUs will remain the same, despite the former being based on an older generation.

However, the M3 Ultra will allow the system to be configured with up to a whopping 512 GB of unified memory, with memory bandwidth of 819 GB/s. While that number is not particularly mind-bending for a workstation-class system, the fact that the M3 Ultra's 80-core GPU will have access to over half a terabyte of fast-enough memory is a game changer for select few ultra-high-end workloads. Of course, this amount of VRAM is not intended for the average Joe, but the Ultra SoCs were always meant to be a halo product. The M3 Ultra variant can also be equipped with up to 16 TB of storage - at Apple's ridiculous pricing, of course. Needless to say, Apple's performance claims are as vague as always, and interested customers will have to wait for independent reviews and benchmarks to make sense of Apple's confusing SoC strategy with the new Mac Studio.

Apple's Mac Studio is in desperate need of a spec bump. The system is still powered by the M2-era SoCs, whereas the MacBook Pros are already two generations ahead. According to a fresh tidbit shared by comparatively reliable tipster Mark Gurman, Apple is set to announce a much-needed upgrade for the Mac Studio in the coming days, although the upgrade in question is sort of a confusing one. Basically, the report states that the Mac Studio will soon be available with the M4 Max, and the M3 Ultra SoCs - and that is not a typo. Apple apparently has not done the homework for an M4 Ultra chip, and will be shipping the Mac Studio with the M3 Ultra instead.

This is particularly confusing because the industry had widely believed that an M3 Ultra SoC never existed in the first place, and that Apple will be jumping straight to the M4 Ultra chip for the Mac Studio. What's even more confusing, is that Apple's 'Ultra' chips traditionally consisted of two 'Max' chips connected via the 'UltraFusion' die-to-die interconnect tech. However, the M3 Max simply does not have this feature, which means that whatever the M3 Ultra is set to be, it is likely that it won't be two M3 Max dies fused together. It will certainly be quite interesting to see how Apple manages to position the M3 Ultra, or whatever it is named, considering that the 'lower-tier' M4 Max SoC will undoubtedly have superior single-core performance. That said, the M4 Ultra is still in development, which, according to Mark Gurman, will be featured in the future Mac Pro revision, setting it apart from the Mac Studio.

The telecommunications industry is undergoing a major transformation as AI and 5G technologies reshape networks and connectivity. While operators are eager to modernize infrastructure, challenges remain, such as high capital expenditures, security concerns and integration with legacy systems. At MWC 2025, Intel - alongside more than 50 partners and customers - will showcase groundbreaking solutions that deliver high capacity and high efficiency performance with built-in AI integration, eliminating the need for costly additional hardware and delivering optimized total cost of ownership (TCO).

"By leveraging cloud technologies and fostering close collaborations with partners, we are helping operators virtualize both 5G core and radio access networks - proving that the most demanding, mission-critical workloads can run efficiently on general-purpose silicon," said Sachin Katti, senior vice president and general manager of the Network and Edge Group at Intel Corporation. "Through our Xeon 6 processors, we are enabling the future of AI-powered network modernization."

TSMC appears to be in for a competitive period, as sources close to Reuters note that both NVIDIA and Broadcom have tested Intel's 18A node with initial test chips. These tests are early indicators of whether Intel can successfully pivot into the contract manufacturing sector currently dominated by TSMC. Intel's 18A technology—featuring RibbonFET transistors and PowerVia backside power delivery—continues progressing through its development roadmap. The technology's performance characteristics reportedly sit between TSMC's current and next-generation nodes, creating a narrow window of competitive opportunity that Intel must capitalize on. What makes these particular tests significant is their positioning relative to actual production commitments. Chip designers typically run multiple test phases before allocating high-volume manufacturing contracts, with each progression reducing technical risk.

Reuters also reported that a six-month qualification delay for third-party IP blocks, which represents a critical vulnerability in Intel's foundry strategy, potentially undermining its ability to service smaller chip designers who rely on these standardized components. However, when this IP (PHY, controller, PCIe interface, etc.) is qualified for the 18A node, it is expected to go into many SoCs that will equal in millions of shipped chips. Additionally, the geopolitical dimensions of Intel's foundry efforts ease concerns of US-based chip designers as they gain a valuable manufacturing partner in their supply chain. Nonetheless, the 18A node is competitive with TSMC, and Intel plans only to evolve from here. Intel's current financial trajectory is the number one beneficiary if it proves good. With foundry revenues declining 60% year-over-year and profitability pushed beyond 2027, the company must demonstrate commercial viability to investors increasingly skeptical of its capital-intensive manufacturing strategy. Securing high-profile customers like NVIDIA could provide the market validation necessary to sustain continued investment in its foundry infrastructure.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, has demonstrated its first 2 nm silicon IP for next-generation AI and cloud infrastructure. Produced on TSMC's 2 nm process, the working silicon is part of the Marvell platform for developing custom XPUs, switches and other technology to help cloud service providers elevate the performance, efficiency, and economic potential of their worldwide operations.

Given a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the market for accelerated compute by 20281.

On February 27-28, the 2025 China RISC-V Ecosystem Conference was grandly held at the Zhongguancun International Innovation Center in Beijing. As a core promoter in the RISC-V field, SOPHGO was invited to deliver a speech and prominently launch a series of new products based on the SG2044 chip, sharing the company's cutting-edge practices in the heterogeneous fusion of AI and RISC-V, and contributing to the vigorous development of the global open-source instruction set ecosystem. During the conference, SOPHGO set up a distinctive exhibition area that attracted many attendees from the industry to stop and watch.

Focusing on AI Integration, Leading Breakthroughs in RISC-V Technology
At the main forum of the conference, the Vice President of SOPHGO RISC-V delivered a speech titled "RISC-V Breakthroughs Driven by AI: Integration + Heterogeneous Innovation," where he elaborated on SOPHGO's innovative achievements in the deep integration of RISC-V architecture and artificial intelligence technology. He pointed out that current AI technological innovations are driving market changes, and the emergence of DeepSeek has ignited a trillion-level computing power market. The innovation of technical paradigms and the penetration of large models into various sectors will lead to an explosive growth in inference demand, resulting in changes in the structure of computing power demand. This will also reshape the landscape of the computing power market, bringing significant business opportunities to domestic computing power enterprises, while RISC-V high-performance computing is entering a fast track of development driven by AI.

Apple's new budget-friendly iPhone 16e model was introduced earlier this month; potential buyers were eyeing a device (starting at $599) that houses a selectively "binned" A18 mobile chipset. The more expensive iPhone 16 and iPhone 16 Plus models were launched last September, with A18 chips on-board; featuring six CPU cores, and five GPU cores. Apple's brand-new 16E smartphone seems to utilize an A18 sub-variant—tech boffins have highlighted this package's reduced GPU core count: of four. The so-called "binned A18" reportedly posted inferior performance figures—15% slower—when lined up against its standard 5-core sibling (in Geekbench 6 Metal tests). The iPhone 16E was released at retail today (February 28), with review embargoes lifted earlier in the week.

A popular portable tech YouTuber—Dave2D (aka Dave Lee)—decided to pit his iPhone 16E sample unit against older technology; contained within the iPhone 15 (2023). The binned A18's 4-core iGPU competed with the A16 Bionic's 5-core integrated graphics solution in a 3DMark Wild Life Extreme Unlimited head-to-head. Respective tallies—of 2882 and 3170 points—were recorded for posterity's sake. The more mature chipset (from 2022) managed to surpass its younger sibling by ~10%, according to the scores presented on Dave2D's comparison chart. The video reviewer reckoned that the iPhone 16E's SoC offers "killer performance," despite reservations expressed about the device not offering great value for money. Other outlets have questioned the prowess of Apple's latest step down model. Referencing current-gen 3DMark benchmark results, Wccftech observed: "for those wanting to know the difference between the binned A18 and non-binned variant; the SoC with a 5-core GPU running in the iPhone 16 finishes the benchmark run with an impressive 4007 points, making it a massive 28.04 percent variation between the two (pieces of) silicon. It is an eye-opener to witness such a mammoth performance drop, which also explains why Apple resorted to chip-binning on the iPhone 16e as it would help bring the price down substantially."

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

Baya Systems, a leader in system IP technology that empowers the acceleration of intelligent compute, and Semidynamics, a provider of fully customizable high-bandwidth and high-performance RISC-V processor IP, today announced a collaboration to boost innovation in development of hyper-efficient, next-generation platforms for artificial intelligence (AI), machine learning (ML) and high-performance computing (HPC) applications.

The collaboration integrates Semidynamics' family of 64-bit RISC-V processor IP cores, known for their exceptional memory bandwidth and configurability, with Baya Systems' innovative WeaveIP Network on Chip (NoC) system IP. WeaveIP is engineered for ultra-efficient, high-bandwidth, and low-latency data transport, crucial for the demands of modern workloads. Complementing this is Baya Systems' software-driven WeaverPro platform, which enables rapid system-level optimization, ensuring that key performance indicators (KPIs) are met based on real-world workloads while providing unparalleled design flexibility for future advancements.

Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, today announced that its MG26 family of wireless SoCs is now generally available through Silicon Labs and its distribution partners. As the industry's most advanced, high-performance Matter and concurrent multiprotocol solution to date, the MG26 SoC features double the Flash and RAM of other Silicon Labs multiprotocol devices, advanced AI/ML processing, and best-in-class security to empower developers to design future-proof Matter applications.

"With MG26, we're not just setting a new standard in multiprotocol wireless performance for battery-based, low-power smart home applications—we're redefining what's possible for the future of IoT connectivity with Matter," said Jacob Alamat, Senior Vice President for the Home and Life business unit at Silicon Labs. "This device empowers developers to create smarter, safer, and more powerful solutions in an increasingly connected world."