Apple's unannounced M4 MacBook Air family is likely reaching market availability status at some point next month. Last December, slimline notebook enthusiasts started hearing about an updated lineup; macOS's Sequoia 15.2 update reportedly referenced upcoming MacBook Air M4 13-inch and 15-inch models. An early sample unit—named "Mac16,12"—has participated in a Geekbench 6.4.0 (macOS AArch64) gauntlet; results appeared online yesterday. The alleged "MacBook Air 13" candidate posted an overall Metal score of 54,806, and an overall OpenCL tally of 36,305. The two separate Geekbench Browser entries confirm that the sampled device makes use of a 10-core M4 processor, with Cluster 1 containing four performance cores. Cluster 2 consists of six power efficiency-oriented cores. Base frequency is listed at 4.41 GHz; reportedly the highest recorded for an M4 SoC. Said chip accessed 24 GB of unified memory, during its macOS 15.2 (Build 24C2101)-based test session.

Notebookcheck and Wccftech compared the aforementioned data points with slightly older M4-equipped hardware, including a premium model. Both outlets observed a "measly" five percent performance difference. Elaborating on their findings, Notebookcheck stated: "as always, we would recommend taking early benchmark results with a healthy amount of skepticism for the time being. With that being said, the MacBook Air 13 benchmarked falls about 5% short of the median Geekbench OpenCL and Geekbench Metal results we achieved so far when benchmarking the M4 versions of Apple's Mac Mini and MacBook Pro 14." The rumored next-gen MacBook Air is expected to operate with a fan-less cooling system—press outlets reckon that the MacBook Pro's air-cooled operation puts it at a slight advantage (in benchmarks).

The $3,499 Apple Vision Pro AR/VR headset is certainly not the kind of device that Apple expects to be mass-adopted. Since its launch in 2023, the luxurious gadget is yet to witness a single hardware refresh. The gadget's aging M2 SoC paired with 16 GB of memory is almost three years old, but despite that, respected analyst Mark Gurman expects the device to soon sport Apple Intelligence features alongside the upcoming VisionOS 2.4 update that is scheduled for April. Considering that a hardware update is not expected to hit the scene for at least the rest of the year, a major software update is welcome news for the select few of us who have invested in the product.

The fact that the Vision Pro will support Apple Intelligence features is actually not much of a shocker, since Macs as old as the M1-generation also boast support for Apple's AI features. As such, the Vision Pro will soon receive support for Apple's writing tools with ChatGPT-integration, genmoji, image playground, as well as a bunch of other features with debatable efficacy. Moreover, the report also adds that the device will also get a new app for spatial experiences - which was undoubtedly one of the key selling points of the device. A 'revamped' guest mode is also on the cards, which will allow buyers to share the device with their family and friends - a factor that Apple considers important in order to drive sales. That said, the Vision Pro had abysmal sales to begin with, which indicates that a lower-end variant with a reasonable price tag might be the only way to make even the most ardent of Apple disciples to hop on the VR/AR hype train.

The wait is finally over - Apple has lifted the curtains off its widely anticipated budget iPhone, the iPhone 16e. The smartphone was previously rumored to arrive with the SE 4 moniker, but it appears that Apple wanted to give its entry-level budget smartphone a fresh naming scheme. This is not the first time that Apple has introduced a new name for a budget iPhone - the company famously introduced the iPhone XR in 2018, and never bothered to give it a refresh. With a starting price of $599, the iPhone 16e will start reaching customers on the 28th of February.

For those keeping up with the rumor mill, a major portion of the leaked information turned out to be accurate after all. For instance, the iPhone 16e is indeed called, well, the iPhone 16e, and boasts a binned A18 SoC with four GPU cores instead of five - likely paired with 8 GB of memory - to allow for Apple Intelligence support. As expected, the design is identical to the iPhone 13-era in many ways. At the front, a 6.1-inch OLED display with a pixel density of 460 sits beneath a 12 MP TrueDepth camera that brings FaceID support. The mute toggle switch is abandoned in favor of the Action Button. Moreover, the device also boasts Apple's first-ever 5G modem, the C1, which is said to bring substantial efficiency improvements.

According to a recent report by Joost van Dreunen - founder of SuperData research firm - the Nintendo Switch 2 is expected to boast a price tag roughly around $399. This would make the highly awaited gaming handheld $100 more expensive than its direct predecessor, and $50 more expensive than the OLED variant of OG Switch. According to van Dreunen, the pricing would allow Nintendo to have a net positive margin on its hardware, while also undercutting other handhelds in price that are 'distinctly' a few tiers above the Switch 2 in terms of performance, as well as capabilities. Of course, considering Nintendo's primary selling point for the Switch - the ecosystem of family-friendly Switch games - the pricing is unlikely to hold back customers who are already knee-deep in Switch games.

The Nintendo Switch 2 is almost confirmed to launch on the 2nd of April, with a larger display and improved magnetic, hall-effect Joy Cons. Like its predecessor, the Switch 2 does not intend to be a powerhouse, and will settle for an NVIDIA Tegra T239 SoC with an Ampere iGPU that should be good for up to 3.1 TFLOPS of raw performance. With the help of DLSS, the Switch 2 should be able to pull off a decent gaming experience at 1080p, or perhaps even at 4K. A fee patents and rumors have indicated that the Joy Cons will have some sort of mouse-like functionality, which was also hinted at by the device's trailer, although no confirmations exist for now. Of course, all of this is mere speculation at this point, but van Dreunen is a respected name in the industry, and his reasoning certainly does make sense.

AMD's openSIL project, aimed towards open CPU silicon initialization code, continues progressing despite a slight delay in its development timeline. The initiative, which will eventually replace the current AGESA system across AMD's client and server processors, received a new update. The company initially targeted the end of 2024 to release proof-of-concept code for Phoenix client SoCs and Turin server hardware. However, as we move through the first quarter of 2025, AMD has acknowledged a slight deviation from this schedule. In a recent statement, AMD representatives assured the developer community that work continues steadily on both Phoenix and Turin proof-of-concept releases.

"We are hard at work preparing the Phoenix and Turin POC's for public release," stated an AMD representative, emphasizing that these releases will serve as sample code previewing future production-worthy implementations. The company clarified that these initial releases are not intended for production environments. The delay has minimal impact on AMD's plan, as the primary goal remains focused on achieving full production readiness with the upcoming Zen 6 architecture. The openSIL project promises to enhance Coreboot support and provide developers with full access to low-level system components. Though limited to select reference motherboards, the proof-of-concept releases will serve as the first milestones in AMD's journey toward more open hardware solutions.

NVIDIA and its memory partners, SK Hynix, Samsung, and Micron, are preparing a new memory form factor called System on Chip Advanced Memory Module—SOCAMM shortly. This technology, adapting to the now well-known CAMM memory module standard, aims to bring additional memory density to NVIDIA systems. Taking inspiration from NVIDIA's Project DIGITS, it has now been developed independently by NVIDIA outside of any official memory consortium like JEDEC. Utilizing a detachable module design, SOCAMM delivers superior specifications compared to existing solutions, featuring 694 I/O ports (versus LPCAMM's 644 and traditional DRAM's 260), direct LPDDR5X memory substrate integration, and a more compact form factor.

For reference, current-generation Project DIGITS is using NVIDIA GB10 Grace Blackwell Superchip capable of delivering one PetaFLOP of FP4 compute, paired with 128 GB of LPDDR5X memory. This configuration limits the size of AI models that run locally on the device, resulting in up to 200 billion parameter models running on a single Project DIGITS AI PC. Two stacked Project DIGITS PCs are needed for models like Llama 3.1 405B with 405 billion parameters. Most interestingly, memory capacity is the primary limiting factor; hence, NVIDIA devotes its time to developing a more memory-dense SOCAMM standard. Being a replacement compatible with LPDDR5, it can use the same controller silicon IP with only the SoC substrate being modified to fit the new memory. With NVIDIA rumored to enter the consumer PC market this year, we could also see an early implementation in consumer PC products, but the next-generation Project DIGITS is the primary target.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

Retro tech lovers who have a knack for gaming handhelds will likely be rather pleased with Sugar Cubes' latest creation - the N97 Elite gaming handheld. As the name suggests, the handheld draws inspiration from the Nokia N97 of '09, and all of its sliding glory. The company has already started shipping out the device to customers, although it is China-only for the foreseeable future. Despite that, there is no denying that the N97 Elite handheld is an incredibly exciting looking gadget for those who miss the good old days of smartphones - that is, before the glass-slab trend took off.

At its core, the N97 Elite handheld packs a decent amount of computing horsepower. Powered by the Snapdragon 855 Plus - an SoC once found in Android flagships - paired with 12 GB of memory, the N97 Elite should be able to breeze through most emulation workloads. The compact handheld comes equipped with a 4.7-inch touch-enabled display, which slides out to reveal the controls. Speaking of which, the controls look pretty disappointing at first sight, although that would be hard to judge without trying the thing in real life. However, given the compact nature, the experience is unlikely to be a comfortable one, and the lack of an analog stick is understandable, but disappointing regardless. The system does have a built-in fan, which should help with sustained workloads.

Synopsys, Inc. today announced the expansion of its industry-leading hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems using the latest AMD Versal Premium VP1902 adaptive SoC. The next generation HAPS-200 prototyping and ZeBu-200 emulation systems deliver improved runtime performance, better compile time and improved debug productivity. They are built on new Synopsys Emulation and Prototyping (EP-Ready) Hardware that optimizes customer return on investment by enabling emulation and prototyping use cases via reconfiguration and optimized software. ZeBu Server 5 is enhanced to deliver industry-leading scalability beyond 60 billion gates (BG) to address the escalating hardware and software complexity in SoC and multi-die designs. It continues to offer industry-best density to optimize data center space utilization.

"With the industry approaching 100s of billions of gates per chip and 100s of millions of lines of software code in SoC and multi-die solutions, verification of advanced designs poses never-before seen challenges," said Ravi Subramanian, chief product management officer, Synopsys. "Continuing our strong partnership with AMD, our new systems deliver the highest HAV performance while offering the ultimate flexibility between prototyping and emulation use. Industry leaders are adopting Synopsys EP-Ready Hardware platforms for silicon to system verification and validation."

Qualcomm has announced its latest mid-range offering, dubbed the Snapdragon 6 Gen 4. Compared to its predecessor, the Snapdragon 6 Gen 3, the improvements on the CPU side are rather modest, with Qualcomm claiming an 11% improvement. The CPU, now based on TSMC N4, packs four ARMv9-based Cortex-A720 P-cores, along with four Cortex-A520 E-cores, making it an 8-core system as tradition. On the GPU side, however, a substantial 29% improvement has been asserted, although the specifics remain under wraps as of this writing.

The chipset can be paired with up to 16 GB of LPDDR5-3200 memory, and displays up to FHD+ at 144 Hz are supported. INT4 support is also present the new NPU, which should allow for decent on-device AI capabilities. Gaming performance should also witness a decent jump, thanks to the aforementioned GPU improvement, paired with Game Super Resolution (upscaling) and Frame Motion Engine (frame generation, every other frame). For connectivity, Wi-Fi 6E, Bluetooth 5.4, and 5G (mm Wave, sub-6 GHz) are present. Up to 200 MP single-camera systems are supported, with Snapdragon's LLV (Low Light Vision) technology, Of course, being a budget segment SoC, it would be futile to expect high-end photography capabilities. As for videography, 4k30 and 1080p120 are supported, along with HLG and HDR10.

Last October, Apple introduced its modernized range of MacBook Pro models; featuring the M4 family of chips. Ultra-thin notebook enthusiasts wondered whether the MacBook Air range series would receive similar treatment in the near future. Apple provided an answer around December-time, by accidentally publishing "Mac16,12" and "Mac16,13" machine listings within their macOS Sequoia 15.2 release. MacRumors believed that the referenced models are MacBook Air M4 13-inch and M4 15-inch products. At the time, industry moles suggested that Apple had settled on a possible April (2025) launch window. A fresh follow-up report points to an earlier than anticipated release—MacRumors reckons that a recent leak indicates an "imminent" launch.

Yesterday, the publication discovered intriguing information online; posted by an anonymous source on X. Based on said leak, MacRumors reports that the updated MacBook Air models: "will be equipped with Apple's T8132 chip." Apple's internal reference code points to both 13-inch and 15-inch models housing a 10-core M4 chipset (part number: APL1206). Mark Gurman—Bloomberg's resident technology guru—has picked up on signs of dwindling current-gen MacBook Air M3 stock. His weekend detective work suggests that successors are only weeks away from launch.

Ever since Apple graced the industry with its M-series chips, Windows enthusiasts have been holding out for a similar Arm-powered revolution for Windows laptops. Qualcomm attempted to do just that with its Snapdragon X Elite chip, advertising performance and efficiency that trades blows with Apple Silicon, while outpacing x86-based laptops in battery life. In reality, the X Elite SoC did bring impressive efficiency to the table, although its CPU performance and efficiency were soon bested by AMD's offerings, while the Adreno iGPU struggled to keep up with even last-gen counterparts since day-one.

Moreover, software compatibility was a major hurdle, making the X Elite systems borderline unusable for professionals with specific requirements that do not have Arm-native alternatives. As a result, the X Elite laptops had a sub 1% market share last fall - a daunting figure considering that Qualcomm had initially targeted 30 - 50% market share by 2029. That said, the story appears to be taking somewhat of a positive turn, with CEO Christiano Amon asserting that Snapdragon X-powered laptops accounted for over 10% of all $800+ laptops sold in December, in the US. Of course, the statement clearly addresses a very specific segment of the market, which makes the 10%+ number more modest that it may appear on paper.

As smartphone SoCs continue to get more powerful every single cycle, there seems to be a plethora of gaming-oriented smartphones entering the market. The pricey ASUS ROG Phone 9 lineup is perhaps the most well known in this regard, powered by the impressively potent Snapdragon 8 Elite SoC. However, the smartphone is well outside most people's budgets, and ASUS seems to have taken note of that. The company has now unveiled a more affordable version, dubbed the ROG Phone 9 FE. However, the smartphone is only available in Thailand for now, commanding a price tag of $890.

On paper, it appears that the only difference between the ROG Phone 9, and the 9 FE is the chipset. While the pricier sibling utilizes the Snapdragon 8 Elite SoC, the FE has to make do with the substantially inferior Snapdragon 8 Gen 3 chip. Apart from that, the ROG Phone 9 FE is almost identical to the vanilla Phone 9, sporting 12 GB of LPDDR5X memory, 256 GB storage, a 50 MP primary shooter, 13 MP wide-angle shooter, and a 5 MP macro camera. At the front, a 32 MP selfie camera sits above the 6.78-inch OLED display with a resolution of 1080 x 2400 and a maximum refresh rate of 165 Hz. In synthetic benchmarks, the Snapdragon 8 Elite leads the 8 Gen 3 by around 25-30% in CPU tests, and around 30-35% in GPU benchmarks, although it does consume more power, which is to be expected.

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.

At the end of January, Samsung Electronics released their financial results for the fourth quarter and the fiscal year 2024. Smartphone tech watchdogs paid close to attention to the South Korean giant's accompanying earnings call. The recently released Galaxy S25 smartphone family is, exclusively, powered by Qualcomm Snapdragon 8 Elite chipsets—insiders believe that Samsung opted out of utilizing proprietary chip designs (for this generation) due to missed production goals. Late last year, inside sources pointed to the foundry's allegedly problematic 3 nm Gate-All-Around (GAA) process node. Follow-up reports suggest that Samsung engineers have moved onto developing a 2 nm manufacturing process, possibly linked to a re-designed Exynos 2500 flagship mobile processor.

Brian Ma, a technology industry analyst, extracted relevant information from Samsung's recent earnings meeting—several press outlets have picked up on his brief social media post. The IDC employee stated: "Samsung System LSI just mentioned in its earnings call that it's optimizing Exynos 2500 and 'aiming' to secure design wins for mobile models scheduled for release in 2H" The rumor mill has proposed that new "Galaxy Z Flip 7 and Fold 7" smartphone models are currently in the development pipeline—coincidental timing indicates that the two devices could launch later in 2025, potentially with next-gen flagship Exynos SoCs onboard. Tipsters reckon that the Exynos 2500 is configured with a 10-core cluster, and its integrated graphics solution will be an AMD RDNA 3.5-enabled Xclipse 950 model.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

As evidenced in leaks from late last year, Qualcomm's Snapdragon 8 Elite mobile processor is no slouch in terms of gaming performance—to be more specific, it is surprisingly adept at emulating "AAA" titles in an Android OS environment. Past examples include test platforms—allegedly—hitting 60+ frames per second (FPS) in A Plague Tale: Innocence (2019), and an astounding 160 FPS in Red Dead Redemption's recent-ish PC conversion (originally a 2010 release on PS3 & Xbox 360). Earlier this week, NoI_Revenant's attention was drawn to intriguing camera footage that was freshly uploaded to Bilibili. Said video demonstrates the PC version (2019) of Red Dead Redemption 2 running on an unnamed mobile device equipped with Qualcomm's flagship SoC.

Follow-up posts and comments propose that the game was running via a specific (Android-based) emulation application: Winlator. Observers have pointed out that it is difficult to ascertain exact details regarding visual fidelity from an overly blurry video—the original uploader/leaker mentions that they implemented "low graphical settings." On-screen information shows measured frame rates hovering around the 60 FPS mark. Industry experts reckon that Qualcomm latest "game-changing" Adreno GPU is capable of surpassing AMD's omnipresent Radeon 780M—a popular integrated graphics solution, frequently found in Ryzen Z1 Extreme-equipped handheld gaming PCs.

Qualcomm's Snapdragon X2 processor family was outed last autumn—online sources revealed an Iceland-themed "Project Glymur" moniker, as well as the "SC8480XP" SKU codename. At the time, leakers suggested that Qualcomm engineers had started testing early samples around July/August—further speculation pointed to "Snapdragon X Elite Gen 2" chipsets being evaluated on desktop platforms.

Yesterday, Everest (aka Olrak29_) discovered another SKU—their social media post included an intriguing screenshot, extracted from a shipping manifest. The image's contents reveals the existence of an "Ultra Premium" model, with part number: X2-000-096. Qualcomm has publicly acknowledged that it is working on successors, for launch in 2025—its third generation of "Oryon" CPU cores are lined up for inclusion in the next-gen AI PC project. Second-gen "Oryon" cores are reserved for smartphone platforms. The leaked "Ultra Premium" chip could sit in a new product tier—possibly positioned above the already established high-end "Elite" range.

Last week, Samsung introduced its brand-new Galaxy S25 smartphone series—press material focused largely on various implementations of AI features, but industry watchdogs noted the crucial selection of Qualcomm-designed processors. A "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset" is the natural choice for this generation of Samsung flagship phones, given that proprietary Exynos designs have reportedly missed the mark (yet again). Samik Chatterjee—a J.P. Morgan analyst—believes that the latest collaboration will swell Qualcomm's revenues; he predicts a gain of $2 billion (USD). Snapdragon 8 Elite processors are utilized by the entire range of globally-released Galaxy S25 models.

The previous-gen S24 series featured a mix of Qualcomm-designed chips and Samsung Exynos silicon (for different regional markets)—market analysis estimates a total of 40 million unit shipments back in 2024. Previously, Qualcomm had a 70% share of Galaxy S24 chipsets—fast-forwarding to the present day, it becomes 100% with the rollout of Galaxy S25. Late last year, press outlets posited that the South Korean company's foundry division had moved on from a "problematic" 3 nm Gate-All-Around (GAA) process. Samsung's flagship-tier Exynos 2500 SoC was linked to this node, but insiders reckon that alternative external production avenues were explored—most notably with an arch-rival: TSMC. Industry moles reckon that Samsung's leadership has slashed foundry budgets for 2025—reports from last week suggest investments being halved, as teams move onto two nanometer processes.

Cadence today announced that MediaTek has adopted the AI-driven Cadence Virtuoso Studio and Spectre X Simulator on the NVIDIA accelerated computing platform for its 2 nm development. As design size and complexity continue to escalate, advanced-node technology development has become increasingly challenging for SoC providers. To meet the aggressive performance and turnaround time (TAT) requirements for its 2 nm high-speed analog IP, MediaTek is leveraging Cadence's proven custom/analog design solutions, enhanced by AI, to achieve a 30% productivity gain.

"As MediaTek continues to push technology boundaries for 2 nm development, we need a trusted design solution with strong AI-powered tools to achieve our goals," said Ching San Wu, corporate vice president at MediaTek. "Closely collaborating with Cadence, we have adopted the Cadence Virtuoso Studio and Spectre X Simulator, which deliver the performance and accuracy necessary to achieve our tight design turnaround time requirements. Cadence's comprehensive automation features enhance our throughput and efficiency, enabling our designers to be 30% more productive."

There are a substantial number of people who prefer to use an iPad for certain light-weight tasks over traditional laptops. For such folks, Apple's iPad lineup has always promised great performance and efficiency at reasonable prices, considering that they are willing to deal with the limitations of iPadOS. A plethora of recent reports have shed light on the expected release schedule for this year's iPads, including the entry-level budget iPad, the iPad Air, and the highest-end iPad Pro.

Of course, the iPad Pro is easily the most exciting among the bunch, although that does not seem to be the case this year. Multiple reports have pointed at a spec-bump for the iPad Pros, which will likely boast the Apple M5 SoC when it sees the light of day. Considering that the iPad got a major design overhaul just last year, no other major upgrades are anticipated for 2025. The entry-level iPad and iPad Air will witness a similar treatment, both getting an SoC upgrade to the A17 Pro and M3 respectively. This is particularly big deal for the entry-level iPad, which will now get to reap the benefits of 8 GB of memory, double that of the current generation, making the already budget-friendly iPad an even better value.

Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.

The rapid growth of AI workloads and AI Processor/GPUs are exacerbating the memory bottleneck caused by the slowing performance improvements and scalability of SRAM and DRAM - presenting a major obstacle to maximizing system performance. To overcome this, there is a pressing need for intelligent memory solutions that offer higher power efficiency and greater bandwidth, coupled with a reevaluation of traditional memory architectures.

Noted technology tipster, Kepler L2, believes that the Sony Interactive Entertainment (SIE) engineering team has finalized the design of a PlayStation 6 (PS6) system-on-chip (SoC)—insider information was shared on the NeoGAF forum (a popular computer game discussion board) late last week. It would be natural to assume that Sony's gaming division is deep into the process of developing a follow-up to its PlayStation 5 home console, but Kepler L2's fresh revelation points to surprisingly advanced progress. Insider sources point to the PS6's chip design being: "complete and in pre-silicon validation already, with A0 tapeout scheduled for late this year."

Industry experts have analyzed PlayStation development cycles of days past—history has demonstrated a pattern of the A0 tapeout phase reaching completion around two years before the rollout of finalized products at retail. Kepler L2 reckons that this pattern will be repeated—indicating a possible launch of PlayStation by 2027. The rumored PS6 chipset has been linked to AMD's "gfx13" target—everyone's favorite Team Red tipster posits that Sony engineers are working with a "fork" of this next-gen "UDNA" graphics technology. The rumor mill has generated additional PS6 SoC-related internet chatter—last Friday, Chiphell alleged a possible adoption of Team Red's X3 V-cache technology.

Yesterday, Nintendo officially unveiled its Switch 2 handheld via a first look video presentation. Featured content did not come as a surprise to many gaming enthusiasts—a steady flow of leaks have already revealed outer and inner workings. Earlier today, the Digital Foundry team has offered their collective opinion on Nintendo's formal announcement. Their roundtable discussion first focused on the Switch 2's physical appearance—mainly a showcased physical increase in size, when lined up against the preceding (standard) model. Conversation quickly moved onto technical matters—a topic that Nintendo normally avoids discussing. The video presentation included in-game footage of a next-gen Mario Kart title—Oliver Mackenzie (a contributing DF video producer/writer) was not impressed by this short demo's visual fidelity. He noted an absence of DLSS image enhancement—surprising, given that the rumored NVIDIA Tegra T239 SoC is capable of deploying this graphics technology.

John, Rich and Oliver then moved onto discussing recently leaked clock speeds and performance figures (in handheld and docked modes)—overall, they reckon that these numbers seem fitting for a hybrid system. They noticed that the handheld GPU clock was lower than expected—based on their judgement of the Switch 2's fairly capable integrated cooling solution. In the past, Digital Foundry theorized that the NVIDIA-designed Tegra T239 will be an 8 nanometer part—rumored to be built on Samsung 8 nm DUV foundry node. Newer gaming community-generated proposals have suggested a shift to Samsung's 5 nm EUV node—mostly based on the chipset's physical footprint. In sharp contrast, the Digital Foundry guys are sticking with their 8 nm theory. Richard Leadbetter (DF's founder) has previously attempted to simulate Switch 2-esque performance on readily available Ampere-based hardware—he could revisit and perform tests on a laptop that sports Team Green's GeForce RTX 2050 mobile GPU. He believes that the leaked CPU and GPU clocks (across both modes) present plausible evidence of 8 nm-level performance, cross-referenced with his team's past analysis of the system's PCB. Debates will inevitably rage on, but Rich insists that the end result will be an example of "Occam's razor." The Tegra T239's four (long alleged) Cortex A78 cores appeared to be running at a higher frequency in portable mode than in docked—suggesting some unknown factors; perhaps a switching on or off of cores (situation dependent). Leadbetter and Co. will be looking forward to getting a proper hands-on experience at Nintendo's April to June launch events.

Apple's top-end M4 Ultra desktop-class chipset is allegedly going to feature on upcoming Mac Pro and Mac Studio refreshes—new product unveilings could be on the company's schedule (WWDC 2025). Bloomberg's Mark Gurman has divulged intriguing M4-series information within his latest newsletter. The M4 Ultra SoC—codenamed "Hidra"—was previously believed to be the most powerful processor option available on both next-gen Mac Pro and Mac Studio platforms. Now, Gurman believes that Apple engineers have created a distinct custom chipset design—exclusively designed for the Mac Pro workstation product stack—that sits above their M4 Ultra SoC.

Somewhat confusingly he suggests that "Hidra" is the codename for this top-of-the-line processor. Rumors swirled last month about the cancellation of an alleged "Extreme" model, so there is a degree of uncertainty surrounding unannounced M4 SKUs. Potential customers could choose Apple's (potentially) more powerful "Hidra-equipped" Mac Pro workstation over the highest-end M4 Ultra-based Mac Studio model. Industry experts propose that "Hidra" will arrive with an increased number of CPU and GPU cores—exceeding the M4 Ultra's speculated makeup of a 32-core CPU and an 80-core GPU.