Reports from supply chain partners suggests that Apple cut off production of their current generation M2 SoC lineup in the months of January and February following significantly decreased demand for Mac computers containing the chips. The details trace back to partners in Outsourced Semiconductor Package Test, or OSAT, which is many different companies in the supply chain that contribute to assembly and testing of the final packaged SoC. OSAT partners claim they received zero M2 wafers from TSMC during both months, and that shipments have only resumed at half of the previous capacity in the month of March. The breadth of this shutdown touched many different suppliers, from the packaging facilities in Korea, to the solder ball suppliers in Taiwan, the TIM suppliers in Germany, and die underfill material suppliers from Japan. Many of these parts can be specific to the type of chip being produced, as M2 features a different packaging method to Apple's normal A-Series mobile SoCs; a lack of M2 silicon led to a full shutdown of this supply chain. An industry insider for Amcona states, "It is impossible to do other packaging work on the M2 line, the so-called 'Apple line' installed in Amcona chip packs."

In their Q1 2023 earnings conference Apple reported a sharp revenue drop in Mac sales from $10.85B down to $7.74B. "The PC market is facing a very challenging situation," stated Tim Cook, Apple's CEO, "I think we have an advantage with silicon but it will be very difficult in the short term." Apple began production of M2 well over a year ago when demand for Apple silicon equipped MacBooks was still sky high, and likely had large reserves of finished chips and machines stockpiled for the launch of M2 Pro and M2 Max in January. With demand dipping up to the launch of the new MacBook models it would certainly justify slowing down production, but outright halting it for multiple months suggests demand far undershot Apple's expectation.

ASRock Industrial released iBOX fanless industrial PCs (IPCs) powered by 13th Gen Intel Core "Raptor Lake" processors. These are completely fanless, and are powered by mobile Intel Core "Raptor Lake" processors in the 15 W to 28 W power class. Their bodies are made of extruded aluminium ridges, which double up as heatsinks for the SoC. All the industrial connectivity essentials are covered, including dual 2.5 GbE wired LAN, provision for WLAN, a handful USB 3.x and USB 2.0 ports, RS232 COM, and some models even feature GPIO. Processor models on offer include the Core i3-1315UE, i5-1345UE, and i7-1375UE. Depending on the processor model and other features, these iBOX IPCs are priced anywhere between $800 to $1,300.

Benchmark results for Qualcomm's Snapdragon 8cx Gen 4 SoC appeared on Geekbench Browser early yesterday morning, under the designation Snapdragon 8cx Next Gen. This chipset is tipped to be a successor to the Snapdragon 8cx Gen 3, which was launched at the end of 2021 as the world's first 5 nm Arm-based SoC for Windows laptops. A tipster on Twitter has highlighted the very underwhelming results posted by the next gen chipset, and these figures would indicate that an engineering sample was the test subject, not final silicon. The 8-core Snapdragon 8cx Gen 3 is shown to outperform its supposed successor, and the clock frequencies for the latter appear to be lower than anticipated.

The Geekbench 5 database entry for Snapdragon 8cx Gen 4 also reveals details about its specifications - a 12-core configuration that is split into eight performance cores and four power-efficiency ones. The base core frequency is listed as being 2.38 GHz, and the benchmark was completed under a Balanced Power plan in Windows 11 Home Insider Preview. 16 GB of RAM was used in the test kit, although earlier leaks have indicated that the chipset can support up to a maximum of 64 GB LPDDR5 RAM.

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter. The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to ongoing problems with FinFET limitations.

The leakers have recently revealed more up-to-date A17 Bionic's Geekbench 6 scores, with single thread performance at 3019, and multi-thread at 7860. Various publications have been hyping the mobile SoC's single thread performance as matching that of desktop CPUs from Intel and AMD, more specifically 13th-gen Core i7 and 'high-end' Ryzen models. Naturally the A17 Bionic cannot compete with these CPUs in terms of multi-thread performance.

IBASE Technology Inc., a global leader in the manufacture of embedded computing products, has launched the new RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.

"The low cost, low power RM-QCS610 offers high performance for devices with edge AI capabilities that have grown in popularity in the last few years," explained Albert Lee, Executive Vice President at IBASE. "The module is our first Qualcomm-based platform. It provides flexible I/O interfaces and brings powerful visual edge computing to accelerate AI across devices with sensors or cameras to collect and process information, make decisions, and perform tasks in the same location in applications including traffic data collection and analysis, computer vision in manufacturing, and automated security validation."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled 'Exynos Connect', a new brand that consolidates its short-range wireless communication solutions, such as UWB, Bluetooth and Wi-Fi that are essential in facilitating an increasingly hyper-connected world.

"Our Exynos Connect U100 combines sophisticated ranging and positioning capabilities with strong security to enable hyper-connectivity between people and everyday objects, fueling a range of new applications in positioning and location tracking," said Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics. "Building on our technology leadership in communications technologies, we are committed to driving innovation in short-range communication solutions to transform the way we connect and relate to the world around us."

Intel has quietly canceled its Thunder Bay hybrid system-on-chip (SoC) that combines standard general-purpose CPU Cores and Movidius Vision Processing Unit (VPU) cores. Such chips were aimed at commercial and Internet-of-Things (IoT) applications that relied on computer vision acceleration and edge-computing applications. According to the latest report, it appears that Thunder Bay is canceled as Intel has released a set of patches that removed the Thunder Bay code from the Linux kernel.

Intel kept Thunder bay details well hidden and while earlier rumors pointed to a combination of Intel Xeon x86 CPU cores and Movidius VPU cores, the only Thunder Bay support in Linux patches where showing a combination of ARM Cortex-A53 low-power cores with the Movidius VPU. Intel acquired Movidius back in 2016 and while it is not something that Intel talks about often, there are several products based on Movidius VPUs, including Neural Compute Stick, Intel drones, the Intel RealSense Tracking Camera, and most recently, the Intel Movidius 3700VC VPU, formerly Keem Bay. In any case, it appears that Intel is abandoning an idea of combining general purpose x86 CPU cores and Movidius VPU cores.

It's been a busy week for embedded computers and SBCs with Embedded World 2023 going on. While a lot of larger brands have taken the focus during this time there has also been activity at the hobbyist level, specifically in the realm of Raspberry Pi clones. One of these that looks to be something of a novelty is the ThunderBERRY5 from French company MakeMyBOARD. This SBC claims to be, "the first Raspberry Pi-like SBC based on Qualcomm AI-CPU," and it features a combination of Qualcomm's 8-core QCS610 SoC and an RP2040 microcontroller. MakeMyBOARD's AI claims stem from the Qualcomm SoC's built-in Hexagon 685 DSP which supports dual vector extensions for their Neural Processing SDK and deep neural network models. The previously mentioned RP2040 fits to the board via the USB2 root and hosts the 40-pin HAT connector as well as an auxiliary debugging header.

Unlike most Pi clones on the market utilizing low-cost, lower performing processors, the ThunderBERRY5 looks like it may trounce the Pi 4 B in raw CPU power as the QCS610's Kryo 460 processor features a 2+6 core configuration: two "Gold" cores at 2.2 GHz and six "SIlver" cores at 1.8 GHz. On paper this looks to have quite the advantage over the aging Pi 4 B's 1.8 GHz quad-core Broadcom BCM2711. More important than beating the Pi 4 in performance would be beating it in availability as the tiny SBC is as hard to find in stock as it is ubiquitous even many years later. On this front there is little info from MakeMyBOARD as no availability date or price information has yet been released. Still, if you were hoping for a higher performance Pi-like SBC with AI acceleration capabilities and features, this may be something to keep an eye on.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

MaxLinear, Inc., a leader in home gateway solutions that unlock multi-gig home connectivity, today announced that its highly-integrated AnyWAN home gateway SoC has been certified for XGS-PON and G-PON as part of the Broadband Forum BBF.247 Optical Network Unit (ONU) Certification Program. scalable quad-core CPU, packet routing accelerator for up to 30 million packets per second, and all required high-speed interfaces for home gateways and home routers. The platform supports important WAN access technologies required by telco service providers and cable MSOs, making it one of the most scalable home gateway solutions on the market. With its XFI and PCIe gen4 interfaces and the embedded 2.5GE PHYs, AnyWAN is an ideal SoC for the next generation of fixed-wireless-access gateways with 5G WAN and Wi-Fi 7.

AnyWAN SoC variants with embedded 10G PON MAC support most 10G PON standards, including XGS-PON, G-PON, and NG-PON2. The chips are well suited for next-gen Wi-Fi 7 multi-gig fiber home gateways units (HGU). "Our innovation and investment in bringing AnyWAN to market provides all service providers and cable MSOs with a cost-efficient, quicker time-to-market choice when transitioning to 10G PON networks," said Will Torgerson, Vice President and General Manager, Broadband Group for MaxLinear. "While G-PON is the fiber technology with the largest installed based today, many customers are looking to XGS-PON as a technology option."

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).

A new Android tablet has launched today, courtesy of Chinese phone maker OnePlus. However, the name leaves a lot to be desired, as OnePlus decided to call its new tablet, the Pad. There were enough jokes going around when the iPad was launched and we can only guess the OnePlus Pad isn't going to fare much better, although, as it's a much smaller brand, they might get away with it. Regardless of the naff product name, the OnePlus Pad is powered by MediaTek's Dimensity 9000 SoC, which has been paired with 8 GB of RAM and 128 GB of UFS 3.1 flash memory.

The standout feature of the Pad is its 11.61-inch 2800 x 2000 pixel resolution IPS display, with a refresh rate of up to 144 Hz. The odd resolution means that it has a 7:5 aspect ratio, something never before seen in a tablet and it places it somewhere between a 3:2 and a 4:3 display in terms of the aspect ratio. The panel offers up to 500 nits brightness and a 1400:1 contrast ratio and the Pad is said to have an 88.14 percent screen-to-body ratio. The back of the Pad is home to a 13 Megapixel camera that can shoot 4K video and around the front is an 8 Megapixel camera with 1080p video support. OnePlus has kitted out the Pad with a 9,510 mAh battery which is said to be good for 14 and a half hours of usage and a full charge from empty takes only 80 minutes thanks to support for 67 W SuperVOOC charging. The housing is made of aluminium and OnePlus offers an optional magnetic keyboard and a stylus for the Pad. No pricing was announced.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

Qualcomm has been working on its Snapdragon SoCs for quite some time now, with massive success in the mobile phone space. However, the company's processors needed to be up to the task regarding laptops. For a user to not look at x86 offerings, the only remaining performant alternatives are Apple's M processors. In 2021 Qualcomm purchased the Nuvia team that was developing massively efficient and high-performance IP for laptops, similar to Apple M processors. Today, according to the insights from Kuba Wojciechowski (@Za_Raczke) on Twitter, we have some potential information about the upcoming Nuvia-powered SoC codenamed Hamoa.

According to the Twitter thread, Qualcomm's Hamoa processors are part of the Snapdragon 8xc Gen 4 compute platform and feature up to eight high-performance P-cores and four low-power E-cores, all based on Nuvia's IP. Allegedly the P-cores are being tested at 3.4 GHz, while the E-cores are tested at 2.5 GHz. The SoC splits CPU cores into blocks, each being a four-core group with 12 MB of shared L2 cache. There is also an 8 MB L3 cache structure; it needs to be clarified whether it is per core block or for the entire SoC. The chip employs 12 MB of system-level cache, with 4 MB of memory for graphics-related tasks handled by iGPU. The iGPU of choice is Adreno 740, with all modern APIs supported. Discrete graphics solutions are supported by the top-end SKUs, which allow eight PCIe 4.0 lanes to be directed toward dGPU, along with an additional four PCIe 4.0 lanes for NVMe SSD. For RAM, the chip uses up to 64 GBs of LPDDR5X eight-channel memory with up to 4.2 GHz speeds. Chip's media engines are structured to support decoding up to 4K120 and encode up to 4K60 with AV1.

AMD announced that its adaptive computing technology is powering leading mobility supplier DENSO Corporation's next-generation LiDAR platform. The new platform will enable over 20X1 improvement in resolution with extremely low latency for increased precision in detecting pedestrians, vehicles, free space and more. The DENSO LiDAR platform, targeted to begin shipping in 2025, will leverage the AMD Xilinx Automotive (XA) Zynq UltraScale+ adaptive SoC and its functional safety suite of developer tools to enable ISO 26262 ASIL-B certification.

DENSO is using the AMD XA Zynq UltraScale+ multi-processor system-on-a-chip (MPSoC) platform in its Single-Photon Avalanche Diode (SPAD) LiDAR system, which generates the highest point-cloud density level of any LiDAR system on the market today. Point-cloud density describes the number of points within a given area and is analogous to image resolution, where richer data ensures that crucial decision-making details are captured.

Back in February 2022 SiFive announced its partnership with Intel Foundry Services (IFS), to bring its "Horse Creek" SoC to market and now SiFive has announced that it's getting ready to launch its first development board on said SoC. This summer, SiFive will launch the HiFive Pro P550 development board, which will kick things up a serious notch when it comes to embedded SoC development boards, regardless of the CPU core the SoC is built around. The HiFive Pro P550 will be one of few microATX based embedded SoC development boards out there and so far, to our knowledge, the only one with a RISC-V based SoC. The Horse Creek SoC sports quad core, 2.2 GHz, 13-stage, triple-issue, out-of-order pipeline RISC-V RV64GBC CPU built on the Intel 4 node. The SoC also has a DDR5 5600 MHz memory interface, support for eight lanes of PCIe 5.0 and comes in a 19 x 19 mm FBGA package.

The HiFive Pro P550 will offer 16 GB of DDR5 memory, but based on the render of the motherboard, this is soldered to the board, rather than relying on standard DDR5 DIMMs. Furthermore, the board has two x16 PCIe 3.0 expansion slots, although it's unclear how many PCIe each slot features, as well as a PCIe 3.0 M.2 2280 M-key slot for NVMe SSDs and a PCIe 3.0 M.2 E-key slot for a WiFi/Bluetooth module. The board also sports multiple USB/USB 3.0 ports and even a pair of USB-C ports. The press release also mentions both Gigabit and 10 Gbps Ethernet support, as well as support for onboard graphics and remote system management, without going into any further details. It'll be interesting to see if the Horse Creek SoC can deliver on its expected performance target, especially as SiFive has a lot to prove, especially as the company calls the RISC-V architecture inevitable.

On the day of TSMC's celebration of the mass production start of its 3 nm node, news out of Taiwan suggests that all of its top 10 customers have cut their orders for 2023. However, the cuts are unlikely to affect its new node, but rather its existing nodes, with the 7 and 6 nm nodes said to be hit the hardest, by as much as a 50 percent utilisation reduction in the first quarter of 2023. The 28 nm and 5 and 4 nm nodes are also said to be affected, although it's unclear by how much at this point in time.

Revenue is expected to fall by at least 15 percent in the first quarter of 2023 for TSMC, based on numbers from DigiTimes. The fact that TSMC has increased its 2023 pricing by six percent should at least help offset some of the potential losses for the company, but it all depends on the demand for the rest of the year. Demand for mobile devices is down globally, which is part of the reason why so many of TSMC's customers have cut back their orders, as Apple, Qualcomm and Mediatek all produce their mobile SoCs at TSMC. Add to this that the demand for computers and new computer components are also down, largely due to the current pricing and TSMC is in for a tough time next year.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

CAES, a leader in advanced mission-critical electronics for aerospace and defense, has announced that its GR740 quad-core LEON4FT SPARC V8 Microprocessor has been launched onboard the Rashid Rover on December 11 and is now heading to the moon. The Rashid Rover was developed by the Mohammed Bin Rashid Space Center and is traveling to the moon onboard the Mission 1 lunar lander as part of the HAKUTO-R lunar exploration program. The mission of the four-wheel rover, weighing only 10 kilograms or 22 pounds, will last one lunar day, or 14 Earth days. Its objective is to study the properties of lunar soil, the petrography and geology of the moon, dust movement, and the lunar surface plasma condition and photoelectron sheath.

The GR740 Microprocessor is embedded in the Camera Interface Board (CIB) that is used to control the four cameras onboard the Rashid Rover through an embedded SpaceWire router switch. The GR740 board has been developed by CAES together with AAC Clyde Space. The CIB is connected to a Sirius TCM board, also developed by AAC Clyde Space, which stores and manages the captured and processed images before downloading them to ground.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today launched the TS-x62 NAS series. Powered by Intel Celeron dual-core processors, the series includes the 2-bay TS-262 and 4-bay TS-462 models. Both models feature a 2.5GbE port and two M.2 PCIe slots for SSD caching, enabling higher transfer speeds and faster data access to supercharge diverse storage applications. There is also a PCIe Gen 3 slot allowing users to expand NAS functionality with a range of QNAP PCIe cards. Multimedia stored on the TS-x62 can be streamed throughout the home, an enjoyed directly on a TV or monitor with the HDMI 2.1 output.

"We are pleased to have worked with QNAP to release the TS-x62 series which covers various use scenarios for home users, such as 4K media streaming, centralized storage, and efficient file backup. The Intel Celeron N4505 processor delivers attractive performance for home NAS models with its greater collaboration and multitasking capability," said Jason Ziller, General Manager, Client Connectivity Division at Intel Corporation.

According to TrendForce's research, the total revenue of the global top 10 foundries rose by 6% QoQ to US$35.21 billion for 3Q22 as the release of the new iPhone series during the second half of the year generated significant stock-up activities across Apple's supply chain. However, the global economy shows weak performances, and factors such as China's policy on containing COVID-19 outbreaks and high inflation continue to impact consumer confidence. As a result, peak-season demand in the second half of the year has been underwhelming, and inventory consumption is proceeding slower than anticipated. This situation has led to substantial downward corrections to foundry orders as well. For 4Q22, TrendForce forecasts that the total revenue of the global top 10 foundries will register a QoQ decline, thereby terminating the boom of the past two years—when there was an uninterrupted trend of QoQ revenue growth.

Regarding individual foundries' performances in 3Q22, the group of the top five was led by TSMC, followed by Samsung, UMC, GlobalFoundries, and SMIC. Their collective global market share (in revenue terms) came to 89.6%. Most foundries were directly impacted by clients slowing down their stock-up activities or significantly correcting down their orders. Only TSMC was able to make a notable gain due to Apple's strong stock-up demand for the SoCs deployed in this year's new iPhone models. TSMC saw its revenue rise by 11.1% QoQ to US$20.16 billion, and the corresponding market share expanded to 56.1%. The growth was mainly attributed to the ≤7 nm nodes, whose share in the foundry's revenue had kept climbing and reached 54% in the third quarter. Conversely, Samsung actually experienced a slight QoQ drop of 0.1% in foundry revenue even though it had also benefited from the component demand related to the new iPhone series. Partially impacted by the weakening of the Korean won, Samsung's market share fell to 15.5%.

According to TrendForce's latest research, global smartphone production totaled around 289 million units for 3Q22, showing a slight QoQ drop of 0.9% and a YoY drop of 11%. The smartphone market thus exhibited an extremely weak demand situation as the "iron law" of positive growth in the third quarter was broken after being in effect for years. The contraction of smartphone production during this year's peak season was mainly attributed to smartphone brands giving priority to consumption of channel inventory for whole devices and maintaining a fairly conservative production plan for 3Q22. Moreover, they had kept lowering their production targets due to strong global economic headwinds.

Regarding the performances of the major smartphone brands in 3Q22, Samsung posted around 64.2 million units in device production, showing a QoQ increase of just 3.9%. This was the result of the brand scaling back production since 2Q22 and maintaining a conservative outlook on the future market situation. Due to persistent inventory pressure, Samsung is expected to again post a QoQ decline for 4Q22. In the aspect of product development, Samsung has been the leader in foldable smartphones. This year, the global market share of foldable smartphones is estimated to reach 1.1%; and within this segment, Samsung is expected to hold a market share of almost 90%. As for 2023, the global market share of foldable smartphones is forecasted to climb to 1.5%, and Samsung is forecasted to retain a market share of almost 80% in the segment.