The Financial Times this weekend has published details about an interesting development project that is currently in-the-works at British semiconductor specialist firm Arm Ltd. The article states that several executives in the industry have divulged (anonymously) that Arm's engineering team is designing a proprietary chip - these insider sources opine that this new creation could be one of the company's most advanced undertakings. The SoftBank-owned chipmaker is having a bumper year in terms of financial success and has invested in its future - it is speculated that their own semiconductor design will be showcased as a prototype product to potential new clients - with the main goal being to drum up more business and growth. Parent group SoftBank is likely pushing for maximum profit margins as it prepares Arm for an initial public offering (IPO) this year.

Arm's modus operandi involves partnering up with other chip manufacturers in order to license out its semiconductor intellectual properties. In turn these partners are expected to deal with the overall design and manufacturing processes of chips (plus sales of). Arm has teamed up with foundries TSMC and Samsung in the past to create prototypes for software testing purposes, but not much has been heard about those proofing projects in the following years. In an unusual turn (from certain industry perspectives) from its traditional working methodologies, it seems that Arm is embracing a different approach by producing its own compelling designs, with the hope of demonstrating greater potential to customers. FT's sources have provided evidence that Arm has expanded its operations and that a newly formed "solutions engineering" team is focused on prototyping new silicon for usage in mobile hardware and related devices.

Conflicting reports are flying around about Apple's next generation MacBook Air lineup, mostly surrounding suggestions of a firm release date or debut reveal at WWDC 2023. 9to5Mac claims that its insider sources have pointed to a new range of M3 chipset powered MacBook Air extra thin laptops offered up in two different screen sizes: 13-inch and 15-inch. An insider claimed last month that Apple's upcoming laptop lineup was in an advanced stage of production, and was far along enough to warrant an "imminent" launch window. A Taiwanese publication has presented new evidence this week, and it posits that Apple could drop M3 chipset-based laptops from announcement presentations organized for this year's Worldwide Developers Conference, which is set to take place from June 5 to 9.

According to the financial section of Taiwan's UDN news site, Apple's key decision makers could be in favor of fielding laptops based on its current generation M2 SoC, instead of an entry-level M3-based range, due to delays and changes in priority for the N3B node at TSMC foundries. This is seen as an odd move given reports from earlier this month of Apple requesting a reduction in factory output for its M2 chips, following a slump in demand. Apple could be changing its strategy with regards to the alleged surplus of M2 silicon - the article theorizes that the company will spend more time fitting the older generation chipsets into a new range of laptops and desktop computers. An M3-based product line could be delayed into late 2023, and it is alleged that TSMC has been instructed to concentrate mostly on manufacturing Apple's Bionix A17 mobile chipset via the cutting edge 3 nm FinFet technology process (N3B) - earmarked to debut on the iPhone 15 Pro in autumn 2023.

A technology tipster has been dropping multiple tidbits this week about Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset - this follows a leak (from a different source, going back to mid-April) about the next generation Adreno 750 GPU getting tuned up for a battle against Apple's Bionic A17 in terms of graphics benchmarks. The latest leak points to the GPU being clocked at 900 MHz, rather than the rumored higher figure of 1.0 GHz speed (garnered from tests at Qualcomm's labs). The focus has now turned to the next generation flagship Snapdragon's CPU aspect, with information emerging about core clock speeds and multiple cluster configurations.

Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.

TPU doesn't normally cover TVs, but at Touch Taiwan had a new gaming focused TV panel that might very well end up in some very high-end gaming "monitors" as well. The panel is a 65-inch model that supports 7680 x 4320 resolution at up to 120 Hz. However, the high-end specs don't stop there, as the panel has a 4,608 zone full array local dimming backlight, which gives it a typical brightness of 400 cd/m², but it can go up to 1,800 cd/m² at 10 percent areas in HDR mode.

As with the 4K display panel we wrote about earlier, this TB panel also features AUO's A.R.T. "reflectionless" feature, which should prevent it from being overly reflective in brightly lit areas. The demo panel was powered by MediaTek's Pentonic 2000 SoC, which is currently one of the highest-end 8K TV processors and potentially the only one with support for H.266 video decoding. Sadly we don't have any indication on which TV manufacturers will use the new display, but regardless of the brand, we expect the retail products to be very expensive.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.

Introducing the ZBOX Edge MI351, a compact low-profile mini PC that delivers the essential performance for everyday computing at home, office, or business. With its included VESA mounting bracket, the MI351 provides the flexibility needed to mount the system nearly anywhere. Powerful at its thinnest - At only 28 mm (1.12 inches) thin, the ZBOX Edge MI351 provides the performance while leaving a lot desk space left to use. Despite its compact size, the ZBOX Edge MI351 comes equipped with a versatile array of ports to take on a wide range of connectivity and add-ons.

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An online tipster, posting on the Chinese blog site Weibo, has let slip that Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset is touted to pack some hefty graphical capabilities. The suggested Adreno "750" smartphone and tablet GPU is touted to offer a 50% increase over the present generation Adreno 740 - as featured on the recently released and cutting-edge Snapdragon 8 Gen 2 chipset. The current generation top-of-the-range Snapdragon is no slouch when it comes to graphics benchmarks, where it outperforms Apple's prime contender - the Bionic A16 SoC.

The Snapdragon 8 Gen 3 SoC is expected to launch in the last quarter of 2023, but details of the flagship devices that it will power are non-existent at the time of writing. The tipster suggests that Qualcomm has decided to remain on TSMC's 4 nm process for its next generation mobile chipset - perhaps an all too safe decision when you consider that Apple has upped the stakes with the approach of its Bionic A17 SoC. It has been reported that the Cupertino, California-based company has chosen to fabricate via TSMC's 3 nm process, although the Taiwanese foundry is said to be struggling with its N3 production line. The engineers at Qualcomm's San Diego headquarters are alleged to be experimenting with increased clock speeds running on the next gen Adreno GPU - as high as 1.0 GHz - in order to eke out as much performance as possible, in anticipation of besting the Bionic A17 in graphics benchmarks. The tipster theorizes that Qualcomm will still have a hard time matching Apple in terms of pure CPU throughput, so the consolation prize will lie with a superior GPU getting rigged onto the Snapdragon 8 Gen 3.

ASUS Republic of Gamers (ROG) today announced the all-new ROG Phone 7 series of gaming smartphones at its For Those Who Dare virtual launch event. The ROG Phone 7 series includes the ROG Phone 7 and ROG Phone 7 Ultimate models and is the latest step in the high-performance evolution of the world's greatest gaming phone. This futuristically-styled phone—which sports a new two-tone design—combines the game-winning power of the flagship Snapdragon 8 Gen 2 Mobile Platform with the advanced GameCool 7 thermal system and special ROG tuning to deliver a truly breathtaking mobile gaming experience—and impressively low power consumption. The key to this power efficiency is the revolutionary new rapid-cycle vapor chamber design, which increases heat dissipation efficiency by up to 168%, allowing the ROG Phone 7 series to run games at full speed while maintaining low temperatures.

To make ROG Phone 7 a powerful and portable theater, we've increased the effective volume of the ROG Phone 7 series' speakers by 50% and tuned the system in cooperation with audio specialists Dirac. ROG Phone 7 series now delivers amazing 2.1-channel sound when the new AeroActive Cooler 7 accessory—which houses a powerful subwoofer—is attached.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

Personal computers (PCs) based on Arm architecture will grow in popularity and their market share will almost double from 14% now to 25% by 2027, according to Counterpoint Research's latest projections. The ability of Arm-based hardware to run Mac OS has allowed Apple to capture 90% of the Arm-based notebook computer market. However, the full support of Windows and Office365 and the speed of native Arm-based app adoption are also critical factors in determining the Arm SoC penetration rate in PCs. Once these factors are addressed, Arm-based PCs will become a viable option for both daily users and businesses.

As more existing PC OEMs/ODMs and smartphone manufacturers enter the market, they will bring their expertise in Arm-based hardware and software, which will further boost the popularity of Arm-based PCs. The availability of more native Arm-based apps will also increase user comfort and familiarity with the platform. Overall, the trend towards Arm-based PCs is expected to continue and their market share will likely increase significantly in the coming years.

The Meteor Lake codename has been linked to the fourteenth generation of Intel's Core lineup for a while, following several significant leaks in 2022 and 2023. According to newly unearthed internal documentation and benchmark data, Intel has confirmed that the Meteor Lake family of CPUs will form its upcoming 14th Gen Core lineup - with laptop variations expected to arrive mid-2023 and heavily speculated desktop units in the fourth quarter, although a middle of the year refresh of Raptor Lake could push the entire Meteor Lake range's release window into 2024.

Meteor Lake is anticipated to be Intel's debuting of a "disaggregated" design - the most advanced laptop CPU variant features a top-of-the-line 6P+8E core configuration. Intel is solely responsible for fabrication of an IOE (I/O) tile (the company's own term for a chiplet) with PCIe 5.0 plus Thunderbolt 4, as well as an SoC tile. The GPU part of the design is rumored to be based on their own Arc Alchemist architecture, and TSMC has been contracted to manufacture this graphics tile - not a big surprise since Intel has also placed substantial manufacturing orders for discrete Arc cards with the Taiwanese foundry.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and AMD today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimized power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience.

"Together with AMD, Samsung has been revolutionizing mobile graphics, including our recent collaboration that brought ray tracing capability to mobile processors for the first time in the industry," said Seogjun Lee, executive vice president of Application Processor (AP) Development at Samsung Electronics. "Drawing on our technological know-how in designing ultra-low-power solutions, we will continue to drive ongoing innovation in the mobile graphics space."

Reports from supply chain partners suggests that Apple cut off production of their current generation M2 SoC lineup in the months of January and February following significantly decreased demand for Mac computers containing the chips. The details trace back to partners in Outsourced Semiconductor Package Test, or OSAT, which is many different companies in the supply chain that contribute to assembly and testing of the final packaged SoC. OSAT partners claim they received zero M2 wafers from TSMC during both months, and that shipments have only resumed at half of the previous capacity in the month of March. The breadth of this shutdown touched many different suppliers, from the packaging facilities in Korea, to the solder ball suppliers in Taiwan, the TIM suppliers in Germany, and die underfill material suppliers from Japan. Many of these parts can be specific to the type of chip being produced, as M2 features a different packaging method to Apple's normal A-Series mobile SoCs; a lack of M2 silicon led to a full shutdown of this supply chain. An industry insider for Amcona states, "It is impossible to do other packaging work on the M2 line, the so-called 'Apple line' installed in Amcona chip packs."

In their Q1 2023 earnings conference Apple reported a sharp revenue drop in Mac sales from $10.85B down to $7.74B. "The PC market is facing a very challenging situation," stated Tim Cook, Apple's CEO, "I think we have an advantage with silicon but it will be very difficult in the short term." Apple began production of M2 well over a year ago when demand for Apple silicon equipped MacBooks was still sky high, and likely had large reserves of finished chips and machines stockpiled for the launch of M2 Pro and M2 Max in January. With demand dipping up to the launch of the new MacBook models it would certainly justify slowing down production, but outright halting it for multiple months suggests demand far undershot Apple's expectation.

ASRock Industrial released iBOX fanless industrial PCs (IPCs) powered by 13th Gen Intel Core "Raptor Lake" processors. These are completely fanless, and are powered by mobile Intel Core "Raptor Lake" processors in the 15 W to 28 W power class. Their bodies are made of extruded aluminium ridges, which double up as heatsinks for the SoC. All the industrial connectivity essentials are covered, including dual 2.5 GbE wired LAN, provision for WLAN, a handful USB 3.x and USB 2.0 ports, RS232 COM, and some models even feature GPIO. Processor models on offer include the Core i3-1315UE, i5-1345UE, and i7-1375UE. Depending on the processor model and other features, these iBOX IPCs are priced anywhere between $800 to $1,300.

Benchmark results for Qualcomm's Snapdragon 8cx Gen 4 SoC appeared on Geekbench Browser early yesterday morning, under the designation Snapdragon 8cx Next Gen. This chipset is tipped to be a successor to the Snapdragon 8cx Gen 3, which was launched at the end of 2021 as the world's first 5 nm Arm-based SoC for Windows laptops. A tipster on Twitter has highlighted the very underwhelming results posted by the next gen chipset, and these figures would indicate that an engineering sample was the test subject, not final silicon. The 8-core Snapdragon 8cx Gen 3 is shown to outperform its supposed successor, and the clock frequencies for the latter appear to be lower than anticipated.

The Geekbench 5 database entry for Snapdragon 8cx Gen 4 also reveals details about its specifications - a 12-core configuration that is split into eight performance cores and four power-efficiency ones. The base core frequency is listed as being 2.38 GHz, and the benchmark was completed under a Balanced Power plan in Windows 11 Home Insider Preview. 16 GB of RAM was used in the test kit, although earlier leaks have indicated that the chipset can support up to a maximum of 64 GB LPDDR5 RAM.

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter. The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to ongoing problems with FinFET limitations.

The leakers have recently revealed more up-to-date A17 Bionic's Geekbench 6 scores, with single thread performance at 3019, and multi-thread at 7860. Various publications have been hyping the mobile SoC's single thread performance as matching that of desktop CPUs from Intel and AMD, more specifically 13th-gen Core i7 and 'high-end' Ryzen models. Naturally the A17 Bionic cannot compete with these CPUs in terms of multi-thread performance.

IBASE Technology Inc., a global leader in the manufacture of embedded computing products, has launched the new RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.

"The low cost, low power RM-QCS610 offers high performance for devices with edge AI capabilities that have grown in popularity in the last few years," explained Albert Lee, Executive Vice President at IBASE. "The module is our first Qualcomm-based platform. It provides flexible I/O interfaces and brings powerful visual edge computing to accelerate AI across devices with sensors or cameras to collect and process information, make decisions, and perform tasks in the same location in applications including traffic data collection and analysis, computer vision in manufacturing, and automated security validation."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled 'Exynos Connect', a new brand that consolidates its short-range wireless communication solutions, such as UWB, Bluetooth and Wi-Fi that are essential in facilitating an increasingly hyper-connected world.

"Our Exynos Connect U100 combines sophisticated ranging and positioning capabilities with strong security to enable hyper-connectivity between people and everyday objects, fueling a range of new applications in positioning and location tracking," said Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics. "Building on our technology leadership in communications technologies, we are committed to driving innovation in short-range communication solutions to transform the way we connect and relate to the world around us."

Intel has quietly canceled its Thunder Bay hybrid system-on-chip (SoC) that combines standard general-purpose CPU Cores and Movidius Vision Processing Unit (VPU) cores. Such chips were aimed at commercial and Internet-of-Things (IoT) applications that relied on computer vision acceleration and edge-computing applications. According to the latest report, it appears that Thunder Bay is canceled as Intel has released a set of patches that removed the Thunder Bay code from the Linux kernel.

Intel kept Thunder bay details well hidden and while earlier rumors pointed to a combination of Intel Xeon x86 CPU cores and Movidius VPU cores, the only Thunder Bay support in Linux patches where showing a combination of ARM Cortex-A53 low-power cores with the Movidius VPU. Intel acquired Movidius back in 2016 and while it is not something that Intel talks about often, there are several products based on Movidius VPUs, including Neural Compute Stick, Intel drones, the Intel RealSense Tracking Camera, and most recently, the Intel Movidius 3700VC VPU, formerly Keem Bay. In any case, it appears that Intel is abandoning an idea of combining general purpose x86 CPU cores and Movidius VPU cores.

It's been a busy week for embedded computers and SBCs with Embedded World 2023 going on. While a lot of larger brands have taken the focus during this time there has also been activity at the hobbyist level, specifically in the realm of Raspberry Pi clones. One of these that looks to be something of a novelty is the ThunderBERRY5 from French company MakeMyBOARD. This SBC claims to be, "the first Raspberry Pi-like SBC based on Qualcomm AI-CPU," and it features a combination of Qualcomm's 8-core QCS610 SoC and an RP2040 microcontroller. MakeMyBOARD's AI claims stem from the Qualcomm SoC's built-in Hexagon 685 DSP which supports dual vector extensions for their Neural Processing SDK and deep neural network models. The previously mentioned RP2040 fits to the board via the USB2 root and hosts the 40-pin HAT connector as well as an auxiliary debugging header.

Unlike most Pi clones on the market utilizing low-cost, lower performing processors, the ThunderBERRY5 looks like it may trounce the Pi 4 B in raw CPU power as the QCS610's Kryo 460 processor features a 2+6 core configuration: two "Gold" cores at 2.2 GHz and six "SIlver" cores at 1.8 GHz. On paper this looks to have quite the advantage over the aging Pi 4 B's 1.8 GHz quad-core Broadcom BCM2711. More important than beating the Pi 4 in performance would be beating it in availability as the tiny SBC is as hard to find in stock as it is ubiquitous even many years later. On this front there is little info from MakeMyBOARD as no availability date or price information has yet been released. Still, if you were hoping for a higher performance Pi-like SBC with AI acceleration capabilities and features, this may be something to keep an eye on.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

MaxLinear, Inc., a leader in home gateway solutions that unlock multi-gig home connectivity, today announced that its highly-integrated AnyWAN home gateway SoC has been certified for XGS-PON and G-PON as part of the Broadband Forum BBF.247 Optical Network Unit (ONU) Certification Program. scalable quad-core CPU, packet routing accelerator for up to 30 million packets per second, and all required high-speed interfaces for home gateways and home routers. The platform supports important WAN access technologies required by telco service providers and cable MSOs, making it one of the most scalable home gateway solutions on the market. With its XFI and PCIe gen4 interfaces and the embedded 2.5GE PHYs, AnyWAN is an ideal SoC for the next generation of fixed-wireless-access gateways with 5G WAN and Wi-Fi 7.

AnyWAN SoC variants with embedded 10G PON MAC support most 10G PON standards, including XGS-PON, G-PON, and NG-PON2. The chips are well suited for next-gen Wi-Fi 7 multi-gig fiber home gateways units (HGU). "Our innovation and investment in bringing AnyWAN to market provides all service providers and cable MSOs with a cost-efficient, quicker time-to-market choice when transitioning to 10G PON networks," said Will Torgerson, Vice President and General Manager, Broadband Group for MaxLinear. "While G-PON is the fiber technology with the largest installed based today, many customers are looking to XGS-PON as a technology option."