British semiconductor specialist firm, Arm Ltd., has has confirmed that it will be offering its clients the option to license "SoC solutions," as opposed to the usual model of paying for intellectual properties. A new Bloomberg article reaffirms previous claims that Arm's engineering department was beavering away on reference chip designs. An IPO filing, registered with the SEC, reveals that various system-on-chip designs are in the pipeline—likely targeting fast-growing tech markets.

An Arm statement explained: "More recently, we have invested in a holistic, solution-focused approach to design, expanding beyond individual design IP elements to providing a more complete system. By delivering SoC solutions optimized for specific use cases, we can ensure that the entire system works together seamlessly to provide maximum performance and efficiency. At the same time, by designing an increasingly greater portion of the overall chip design, we are further reducing incremental development investment and risk borne by our customers while also enabling us to capture more value per device." Arm is probably keen to boost its profit margins, and become more attractive in the eyes of potential investors—lately their designs have been implemented in more expensive product segments, namely automotive, client PCs, and cloud data center solutions.

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3 nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

"We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek. "TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market."

QuickLogic Corporation, a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI/ML solutions, and YorChip, a pioneering startup specializing in UCIe-compatible IP, have formed a strategic partnership to revolutionize the world of FPGA chiplets. The collaboration will result in a groundbreaking lineup of FPGA chiplets optimized for low power consumption and low cost, opening new possibilities for a wide range of applications, including the fast-growing edge IoT and AI/ML markets.

According to Yole Group, a market research company, by 2023, they expect chiplet adoption will lead to a TAM of chiplet-based integrated circuits in excess of $200B, across the consumer, automotive defense, aerospace, industrial, and medical markets. Since discrete FPGAs are already prevalent in those same markets, wide adoption of eFPGA-based UCIe (Unified Chiplet Interconnect Express) enabled chiplets is expected, and QuickLogic and YorChip are well-positioned to capitalize on this growth opportunity.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

The escalating challenges in acquiring high-performance x86 servers have prompted Chinese data center companies to accelerate the shift to Arm-based system-on-chips (SoCs). Investment banking firm Bernstein reports that approximately 40% of all Arm-powered servers globally are currently being used in China. While most servers operate on x86 processors from AMD and Intel, there's a growing preference for Arm-based SoCs, especially in the Chinese market. Several global tech giants, including AWS, Ampere, Google, Fujitsu, Microsoft, and Nvidia, have already adopted or developed Arm-powered SoCs. However, Arm-based SoCs are increasingly favorable for Chinese firms, given the difficulty in consistently sourcing Intel's Xeon or AMD's EPYC. Chinese companies like Alibaba, Huawei, and Phytium are pioneering the development of these Arm-based SoCs for client and data center processors.

However, the US government's restrictions present some challenges. Both Huawei and Phytium, blacklisted by the US, cannot access TSMC's cutting-edge process technologies, limiting their ability to produce competitive processors. Although Alibaba's T-Head can leverage TSMC's latest innovations, it can't license Arm's high-performance computing Neoverse V-series CPU cores due to various export control rules. Despite these challenges, many chip designers are considering alternatives such as RISC-V, an unrestricted, rapidly evolving open-source instruction set architecture (ISA) suitable for designing highly customized general-purpose cores for specific workloads. Still, with the backing of influential firms like AWS, Google, Nvidia, Microsoft, Qualcomm, and Samsung, the Armv8 and Armv9 instruction set architectures continue to hold an edge over RISC-V. These companies' support ensures that the software ecosystem remains compatible with their CPUs, which will likely continue to drive the adoption of Arm in the data center space.

Based on details posted on Twitter/X by a pair of well known leakers, AMD appears to be working on a pair of different Ryzen 8000-series mobile processors. The previously known Strix Point is said to get up to four Zen 5 cores and eight Zen 5c cores, whereas the Strix Halo is said to get 16 Zen 5 cores, according to @Olrak29_. This is something that was posted by Moore's Law is Dead back in April as well, who claimed the chip will launch sometime at the end of 2024. MLID also suggested that the Strix Halo will feature a 40 CU GPU and a 256-bit LPDDR5X memory interface, making it a very different proposition from your average APU from AMD.

@kopite7kimi chimes in on Twitter to point out that "Strix Halo looks like a desktop Zen 5 with a different IOD." This is definitely something that would be possible for AMD to do and if we look at the MLID information, the Strix Halo processor appears to have something called a Mall Cache, which seems to be something of a catch all cache for the various components inside the chip, such as the AI Engine and the GPU. Time will tell if AMD delivers on Strix Halo or not, but this might be the first notebook processor that can handle gaming at a decent resolution without needing a discrete GPU. Then again, with a rumoured peak TDP of 120 W, this chip is also going to run hotter and draw more power than most mobile processors to date.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2023. The Company posted KRW 60.01 trillion in consolidated revenue, a 6% decline from the previous quarter, mainly due to a decline in smartphone shipments despite a slight recovery in revenue of the DS (Device Solutions) Division. Operating profit rose sequentially to KRW 0.67 trillion as the DS Division posted a narrower loss, while Samsung Display Corporation (SDC) and the Digital Appliances Business saw improved profitability.

The Memory Business saw results improve from the previous quarter as its focus on High Bandwidth Memory (HBM) and DDR5 products in anticipation of robust demand for AI applications led to higher-than-guided DRAM shipments. System semiconductors posted a decline in profit due to lower utilization rates on weak demand from major applications.

AYANEO, an Asian manufacturer known for its mobile handhelds, has introduced a new device, the AYANEO Kun. The Kun is powered by the latest AMD Ryzen 7 7840U mobile processor from the Ryzen 7040 series. This SoC includes eight Zen 4 cores and an integrated graphics unit based on the RDNA 3 architecture with 12 compute units. The console's dimensions stand at 312 x 133 x 21.9 mm, making it slightly wider but slimmer than ASUS's ROG Ally, with the exact weight yet to be disclosed. Kun's battery capacity is rated for 75Wh, as compared to other handhelds' 40 Wh, potentially indicating a longer battery life.

The AYANEO Kun's other notable features include its 8.4-inch display with an IPS panel and resolution of 1,920 x 1,200 pixels. For controls, the device utilizes a D-Pad and two Hall sensor-equipped joysticks for gaming. The shoulder buttons also employ Hall sensor technology. There are touchpads on either side of the display, along with other function keys and the A/B/X/Y keys. For the first time, AYANEO has integrated buttons at the back of the device, offering customizable functions. The device provides two Type-C (likely USB4), one USB Type-A, and one 3.5 mm jack connection. More comprehensive technical details, model variants, and pricing information are to be released during the official unveiling of the AYANEO Kun scheduled for August.

A new entry has appeared on the Geekbench Browser database—very early this morning—apparently pointing to the lowest model sitting within the ranks of Intel's Alder Lake-N CPU series. According to leaked Geekbench 6.1 test results, as spotted by Benchleaks, the evaluated system was running on an "Intel N50" processor. This truly entry-point 6 W TDP SoC seems to feature two Gracemont efficiency cores with a 997 MHz base clock and a boost capability of 3.4 GHz. You are not getting any hyper-threading here. The integrated GPU is reported to sport 16 Execution Units—the more powerful N200, Core i3-N305 and Core i3-N300 Alder Lake-N siblings have double that count (32 EUs).

The benchmarked N50 system achieved overall scores of 1054 (single core) and 1388 (multi-threaded). Geekbench Browser states that the tested build had 8 GB of RAM (single channel), with the OS being Microsoft Windows 10 IoT Enterprise LTSC (64-bit) on a balanced power plan. VideoCardz was somewhat impressed with the plucky 6 W TDP chip offering comparable performance to decade old CPUs, albeit with a much lower power draw. The N50's single core result positions it closer to Intel fourth Gen Core Haswell mobile processors or first generation Ryzen CPUs, but the multi-core score is a bit of letdown—perhaps comparable to Intel Core 2 and AMD FX series models.

Today, U.S. Deputy National Security Advisor Anne Neuberger, Chairwoman of the Federal Communications Commission (FCC) Jessica Rosenworcel, and Laurie Locascio, Director of the National Institute of Standards and Technology (NIST) unveiled the U.S. national IoT security label at the White House.

Infineon Technologies AG supports this action to address the growing need for IoT security. The new label supports the IoT security requirements under NISTIR 8425, which resulted from an Executive Order to improve the nation's cybersecurity. This label will recognize products that meet these requirements by permitting them to display a U.S. government label and be listed in a registry indicating that these products meet U.S. cybersecurity standards.

Team Pandory has tested the gaming potential of an Intel Alder-Lake-N SoC—not many outlets have bothered to give the N100 much coverage in this aspect, since the chip's makeup is E-core only and it only offers single-channel memory support. Team Blue has emphasized power efficiency rather than raw performance with its super low budget 2022 successor to old Pentium and Celeron processor product lines. The utilization of modern Gracemount CPU cores does it some favors—notably granting L3 cache support, but the chip has been designed with entry-level productivity in mind.

Naturally, in-game testing focuses attention on the N100's integrated GPU, based on Team Blue's Xe-LP architecture—it features 24 execution units (EUs), support for AV1 decode capabilities, and 8K 60 FPS video playback. Arc Alchemist offers roughly double the performance when compared to the Xe-LP iGPU, so we are not expecting a big "wow factor" to be delivered by the plucky Alder-Lake-N SoC (6 W TDP). Team Pandory benchmarked a laptop sporting a single stick of 8 GB DDR5 RAM and the N100 quad E-core CPU (capable of 3.4 GHz turbo boosting), with 6 MB of L3 cache. The ultra portable device was able to hit 60 FPS in a couple of older games, but the majority of tested titles ran at 20 to 30 20 FPS (on average). Graphics settings were universally set to minimum, with a resolution of 1280 x 720 (720p) across ten games: CS:GO, Dota 2, Forza Horizon 4, Genshin Impact, GTA V, Grid Autosport, Minecraft, Resident Evil 5, Skyrim, and Sleeping Dogs.

China electric vehicle maker XPENG Motors has announced its new G6 coupe SUV—featuring an NVIDIA-powered intelligent advanced driver assistance system—is now available to the China market. The G6 is XPENG's first model featuring the company's proprietary Smart Electric Platform Architecture (SEPA) 2.0, which aims to reduce development and manufacturing costs and shorten R&D cycles since the modular architecture will be compatible with future models.

The electric SUV also features the XPENG Navigation Guided Pilot (XNGP), a full scenario-based intelligent assisted driving system. It's powered by the cutting-edge NVIDIA DRIVE Orin compute and XPENG's full-stack software developed in-house. The XNGP system first made its debut in the EV maker's flagship G9 SUV, touting a safe, reliable, advanced driving experience behind the wheel.

Qualcomm Technologies, Inc. has announced the new Snapdragon 4 Gen 2 Mobile Platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography and videography, plus speedy 5G and Wi-Fi for reliable connections.

"Snapdragon - at its core - is driving innovation while meeting the demands of OEMs and the broader industry," said Matthew Lopatka, director of product management, Qualcomm Technologies, Inc. "With this generational advancement in the Snapdragon 4-series, consumers will have greater access to the most popular and relevant mobile features and capabilities. We optimized every aspect of the platform in order to maximize the experiences for users."

Tachyum announced today it will cease taking orders for its Prodigy Universal Processor Field Programmable Gate Array (FPGA) emulation system boards effective immediately. The company releases the final Prodigy build for tape-out. New partners and customers who wish to work with Prodigy FPGAs for product evaluation, performance measurements, software development, debugging and compatibility testing can arrange for private testing in Tachyum's facility. As these are shared systems, they can't be used for classified or proprietary data or data subject to regulatory governance.

The Prodigy hardware emulator consists of multiple FPGA and IO boards connected by cables in a rack. A single board with four FPGAs emulates eight Prodigy processor cores (a small fraction of the final Prodigy product design, which consists of 128 cores) including vector and matrix fixed and floating-point processing units. Deploying more FPGAs will improve test cycles by orders of magnitudes to achieve target quality, a risk reduction mechanism for early adopters.

AMD today announced the AMD Versal Premium VP1902 adaptive system-on-chip (SoC), the world's largest adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Offering 2X the capacity over the prior generation, designers can confidently innovate and validate application-specific integrated circuits (ASICs) and SoC designs to help bring next generation technologies to market faster.

AI workloads are driving increased complexity in chipmaking, requiring next-generation solutions to develop the chips of tomorrow. FPGA-based emulation and prototyping provides the highest level of performance, allowing faster silicon verification and enabling developers to shift left in the design cycle and begin software development well before silicon tape-out. AMD, through Xilinx, brings over 17 years of leadership and six generations of the industry's highest capacity emulation devices, which have nearly doubled in capacity each generation.

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

A few weeks ago, we spotted an Intel Core Ultra 7 1003H Meteor Lake-P processor in the wild, running a PugetBench set of benchmarks. Today, we are in luck as there is another Meteor Lake-P processor running in the wild, spotted by @InstLatX64 on Twitter. Called Intel Core Ultra 7 1002H, the CPU represents a similar SKU to the previously discovered 1003. Also, having 16 cores in total, they are split into two categories: 6 Performance cores, and ten Efficient cores, two of which are on the SoC die, divided from the remaining eight on the compute die. Interestingly, only P-cores feature 2-way hyperthreaded, so 12 threads from P-cores and ten threads from E-cores combine into 22 threads.

What we don't know is the frequency of this chip and the position it plays in the Meteor Lake-P family of processors. The screenshot states a potential base clock of 3000 MHz; however, it could be an early engineering sample chip, so we have to wait for the final design. With 1003H having exactly the same core/thread number, we expect that the newly discovered 1002H has potentially lower clocks and TDP to match.

Apple today announced M2 Ultra, a new system on a chip (SoC) that delivers huge performance increases to the Mac and completes the M2 family. M2 Ultra is the largest and most capable chip Apple has ever created, and it makes the new Mac Studio and Mac Pro the most powerful Mac desktops ever made. M2 Ultra is built using a second-generation 5-nanometer process and uses Apple's groundbreaking UltraFusion technology to connect the die of two M2 Max chips, doubling the performance. M2 Ultra consists of 134 billion transistors—20 billion more than M1 Ultra. Its unified memory architecture supports up to a breakthrough 192 GB of memory capacity, which is 50 percent more than M1 Ultra, and features 800 GB/s of memory bandwidth—twice that of M2 Max. M2 Ultra features a more powerful CPU that's 20 percent faster than M1 Ultra, a larger GPU that's up to 30 percent faster, and a Neural Engine that's up to 40 percent faster. It also features a media engine with twice the capabilities of M2 Max for blazing ProRes acceleration. With all these advancements, M2 Ultra takes Mac performance to a whole new level yet again.

"M2 Ultra delivers astonishing performance and capabilities for our pro users' most demanding workflows, while maintaining Apple silicon's industry-leading power efficiency," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With huge performance gains in the CPU, GPU, and Neural Engine, combined with massive memory bandwidth in a single SoC, M2 Ultra is the world's most powerful chip ever created for a personal computer."

Considering all the buzz around WiFi 7, there weren't many live demos at Computex, but Realtek had a demo running in its suite at the show. Realtek will offer both client and router/AP solutions, with their client product which goes under the RTL8922AE model name, coming in M.2 2230 and 1620 formats, where the latter is a solder down module. To simulate a real world scenario, Realtek was running a second radio to cause some additional interference, but the RTL8922AE test setup was still capable of delivering between 1,750 and 1,950 Mbps, which is almost twice as fast as WiFi 6, using a similar 2x2 antenna setup. This was obviously over a fairly short distance, so the question is how well WiFi 7 will work over longer distances.

The RTL8922AE has a claimed maximum sync speed of 2800 Mbps when connected to the 5 GHz and 6 GHz bands simultaneously and combining the bandwidth of both bands. However, it is limited to a 160 MHz channel bandwidth, whereas WiFi 7 can go up to a 320 MHz wide channel, but it's unclear if competing first gen clients will support this. The RTL8922AE also incorporates support for Bluetooth 5.4 and is as far as we're aware one of the first WiFi chips to support the upcoming standard that mostly focuses on improving BLE Audio and Auracast support. The RTL8922AE should launch sometime in the fourth quarter this year to Realtek's customers, so it might not appear on the market until early 2024.

Shenzhen based Milk-V has been busy announcing some very high performance RISC-V based platforms, and has now added another to a rapidly growing list. The Milk-V Mars is a new hobbiest grade RISC-V SBC that intentionally mimics the footprint and layout of the Raspberry Pi 3 Model B, so much so that existing cases and accessories will fit. The credit-card sized Mars packs a very competent array of features, starting with the StarFive JH7110 SoC. The JH7110 contains four 64-bit SiFive U74 RISC-V cores clocked as high as 1.5 GHz as well as an integrated Imagination Technologies IMG BXE-2-32 graphics engine with support for Vulkan 1.3, OpenGL ES 3.x, OpenCL 3.0, and Android NN HAL. This SoC should be the perfect choice for an SBC in this form factor, as it has proven to be on the similarly sized PINE64 Star64 as well as StarFive's VisionFive 2. Surrounding the SoC is a single LPDDR4 module, configurable at purchase up to 8 GB, the traditional 40-pin GPIO header row, a M.2 E-Key for WiFi/BT expansion, a MIPI display serial interface with 4K30 output and H.264/H.265 4K60 decoding, MIPI camera serial interface, HDMI, a USB-C for 5 V power input, a 3.5 mm audio jack, and finally the rear I/O block which consists of three USB 3.0 Type-A, a single USB 2.0 Type-A, and the RJ-45 for Gigabit Ethernet as well as PoE. Storage is expandable with both eMMC and microSD cards. The last tiny header is for powering a fan, which many R Pi cases opt to include, but is not included with the Mars. Availability of the Milk-V Mars is listed as "Coming Soon" and prices have not yet been announced. However to compete with the other options on the market we hope, and expect, that it does not exceed $75 USD. Unlike the Milk-V Pioneer there hasn't been any word on whether the Mars will be as open-source friendly, but it would behoove them to consider the option for this type of hobbyist oriented device.

MediaTek, a leading innovator in connectivity and multimedia, is teaming with NVIDIA to bring drivers and passengers new experiences inside the car. The partnership was announced today at a COMPUTEX press conference with MediaTek CEO Rick Tsai and NVIDIA founder and CEO Jensen Huang.

"NVIDIA is a world-renowned pioneer and industry leader in AI and computing. With this partnership, our collaborative vision is to provide a global one-stop shop for the automotive industry, designing the next generation of intelligent, always-connected vehicles," said Tsai. "Through this special collaboration with NVIDIA, we will together be able to offer a truly unique platform for the compute-intensive, software-defined vehicle of the future."

"AI and accelerated computing are fueling the transformation of the entire auto industry," said Huang. "The combination of MediaTek's industry-leading system-on-chip plus NVIDIA's GPU and AI software technologies will enable new user experiences, enhanced safety and new connected services for all vehicle segments, from luxury to entry-level."

Mobile devices touch every aspect of our digital lives. In the palm of your hand is the ability to both create and consume increasingly immersive, AI-accelerated experiences that continue to drive the need for more compute. Arm is at the heart of many of these, bringing unlimited delight, productivity and success to more people than ever. Every year we build foundational platforms designed to meet these increasing compute demands, with a relentless focus on high performance and efficiency. Working closely with our broader ecosystem, we're delivering the performance, efficiency and intelligence needed on every generation of consumer device to expand our digital lifestyles.

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system. This includes a new world-class Arm Immortalis GPU based on our brand-new 5th Generation GPU architecture for ultimate visual experiences, a new cluster of Armv9 CPUs that continue our performance leadership for next-gen artificial intelligence (AI), and new enhancements to deliver more accessible software for the millions of Arm developers.

UDOO, known for embedded and single-board computing, has launched a pair of x86 equipped SBCs utilizing Intel's Apollo Lake SoCs and aimed at the low-power machine learning and edge AI markets. The UDOO VISION line of SBCs come in two distinct flavors at launch: VISION X5 and VISION X7. As the names imply, the VISION X5 comes equipped with an Intel Atom x5-E3940, while the VISION X7 has an Intel Atom x7-E3950. Neither of these SoCs is particularly fresh, with the designs dating back to 2014, however for the intended use case they should provide ample performance. UDOO states,"The UDOO VISION is the ultimate choice for computer vision projects thanks to the excellent performance of the Intel Apollo Lake SoC [System on Chip] and the Intel distribution of OpenVINO framework ready to be installed."

Aside from the processor differences the VISION X5 comes with 4 GB of LPDDR4 DRAM and 32 GB of eMMC storage, while the higher spec VISION X7 comes with 8 GB of LPDDR4 and 64 GB eMMC. Both models include an ATmega32U4 microcontroller, a 26-pin Arduino Leonardo's pinout for modularity, a COM port supporting RS232/RS422/RS485, two USB 2.0 headers, two USB 3.0 ports, dual Gigabit Ethernet LAN, M.2 E-Key for WLAN/Bluetooth expansion, M.2 B-Key for SATA SSD expansion, RTC, infrared, one mini DisplayPort, one eDP connector, and a fan header for the bundled full-cover active heatsink. UDOO lists the VISION X5 at $349 USD, and the VISION X7 at $419 USD.

Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption in autonomous driving. As more sensors are needed for autonomy, there are increasing needs for faster signal processing, reduced device costs and smaller form factors. Functional safety is also critical for many of these autonomous applications.

To address these market needs, we're introducing two additions to our AMD Automotive XA Artix UltraScale+ family: the XA AU10P and XA AU15P cost-optimized processors, which are automotive-qualified and optimized for use in advanced driver-assistance systems (ADAS) sensor applications. The Artix UltraScale+ devices extend the AMD portfolio of automotive-grade, functional-safety proven and highly scalable FPGA and adaptive SoCs, joining the automotive-grade Spartan 7, Zynq 7000 and Zynq UltraScale+ product families.