Wednesday, October 7th 2020
Sony Shows Off PlayStation 5 Internals in the Latest Teardown Video
Sony has decided to post a teardown video of its latest, upcoming PlayStation 5 console. The video shows how to disassemble the console and what is inside it. The new console features a different design from the previous generation, and thus a different internal layout. What is perhaps the most exciting thing shown in the video is the new cooling solution Sony implements. The new design uses some pretty interesting solutions that combine good airflow generated by 120 mm wide, 45 mm thick blower fan cooling the vapor chamber heatsink. Under the heatsink, the silicon company has made is running at high clocks and is said to generate a lot of heat, so to manage it, the console uses liquid metal thermal interface material (TIM) instead of regular thermal paste for heat transfer. Combined with good airflow and good heatsink, heat management shouldn't be a problem on this console.You can check out the teardown video below:
74 Comments on Sony Shows Off PlayStation 5 Internals in the Latest Teardown Video
I think that's a secondary processor because the PS4 had one for handling some background stuff, and that chip has another one nearby that looks a bit like a Serial Flash memory, normally used for firmware. The PS4 also had the firmware chip close to the ARM processor.
I imagine the console will come with their own variant of BSoD or at least some sort of helpful message saying that you need to send the device to a Sony authorized repair shop or something.
And the playstation certified requirement for PS5 may not matter either. I suspect people will try other SSDs that haven't been given Sony's grace and they will work.
Also still doesn't change the fact that Nvme 4.0 drives aren't cheap
Proprietary or not Xbox solution is plug and play, hot swappable, and user friendly
Right now the prices are similar, but M.2s will go down in price over time as the market options proliferate (because of higher scale of demand given that m.2 is a shared form factors amongst billions of computers worldwide), I don't foresee this happening with a closed standard that Microsoft alone controls and licenses with a very limited use case.
Everything is cool. It's the post PS3 Sony which I lost trust in, all PS4 games are nothing like the original PS2/PS3 era, which had superb titles (Killzone, Ninja Gaiden, God of War, Wipeout and tons of more..) and no political b.s in them (thanks to the SIE/SCE HQ in CA getting the western impact of PC culture). I miss that era, it's all TLoU2 type of crap nowdays and that overrated HZD from Sony. And there's no backwards compat with PS3 games, either in Physical disc nor the Digital, that PSN GaaS is not the one which it should have. PS4 games are barely any worth since majority of them are on PC, barring a few - Gravity Rush, Bloodborne, God of War III Remastered, Shadow of Colossus as Nioh is there on PC, FF7R, Nioh2 will come to PC.
Also that XMB UI of PS3 is really top class, superb looking feel and UX. Getting a Jailbreak supported PS3 for that XMB alone is worth tbh..
Sony could simply push an update to the console telling it to only accept drives with specific model designations (for example MZ-V7S2T0). And since all the drives would be certified by Sony, they would have the list on-hand already. Would it have to, though? I imagine they could do an Apple and have essential recovery tools stored in the firmware chip that could download the OS onto the external drive. Granted, it wouldn't be great, but at the very least you could get by to back stuff up or whatever.
It will be interesting to see if they allow it or not.
Yes that fans MASSIVE, should allow it to run slower.
I also call into question whether there will be any other partners except Seagate. It's what you'd say now, but there isn't going to be this huge market for almost-as-expensive-as-the-Xbox-Series-S add-on's for the Series X, so maybe Microsoft THINKS partners will show up, but when Seagate's sales are low, they'll quietly cancel those. Meanwhile, all Sony has to do is put a drive test into the PS5 and bam, every drive is tested by the PS5 at the time you add it in. No need for certifications and as economies of scale get better, so will the option of adding a new drive.
Again, exactly the same problem Microsoft had with the Xbox 360. This generation is really reminding me a lot of that generation, too. Sony's also making similar mistakes, emphasizing the wrong technological areas while giving Microsoft the superior experience crown for no good reason.
Radial fans are better then axial for a heatsink application. In general a radial fan will generate a more concentrated flow and greater pressure but at less volume. Generally radial fans are quieter in the hvac world because the air that gets pushed is less turbulent.
Why people hate gpus with squirrel cage fans is because you get a smaller heatsink and that's where you lose out on cooling.
Although one can argue that you're getting a smaller heatsink because of the space the radial fan is taking up.
In a compact closed off case where you want actually directed airflow without recirculation a radial fan is the right fan all else ignored.
LM is well known for deteriorating stuff it comes in contact with, it's like they are trying to recreate an issue like the PS3 has with the chips needed to be reflowed/resoldered after a few years.
That could still happen since they like using lead-free solder on everything anyway and I doubt they've changed a thing regarding all that.
I can also see storage issues with the build-in SSD stuff too.
Since Zen took most high-speed stuff off the SB, all that's left in it is Supper I/O and secure processor. Just look up 33C3 presentation from fail0verflow. There's lots of info on this topic in it. Especially the fact that they ditched PSP in favor of their own implementation, which was handled exactly by that chip.
Even though PS4 was eventually hacked, it took awhile. That's probably why Sony decided to improve on their previous work and simply stick with what's already working.