Wednesday, October 7th 2020
Sony Shows Off PlayStation 5 Internals in the Latest Teardown Video
Sony has decided to post a teardown video of its latest, upcoming PlayStation 5 console. The video shows how to disassemble the console and what is inside it. The new console features a different design from the previous generation, and thus a different internal layout. What is perhaps the most exciting thing shown in the video is the new cooling solution Sony implements. The new design uses some pretty interesting solutions that combine good airflow generated by 120 mm wide, 45 mm thick blower fan cooling the vapor chamber heatsink. Under the heatsink, the silicon company has made is running at high clocks and is said to generate a lot of heat, so to manage it, the console uses liquid metal thermal interface material (TIM) instead of regular thermal paste for heat transfer. Combined with good airflow and good heatsink, heat management shouldn't be a problem on this console.You can check out the teardown video below:
74 Comments on Sony Shows Off PlayStation 5 Internals in the Latest Teardown Video
Seems strange that Sony wouldn't realize the effects of liquid metal on a heatsink.
Also, it's probably worth just changing the liquid metal for regular paste. Maybe there will be good cheap carbon thermal sheets by then.
I only see advantage by using LM. Your not supposed to spread it onto the caps around the CPU either because it's a product that will defenitly short it out.
Yeah, all it's good and beautiful on paper and FM land, let's see that thing on AM land 10 years later is all I'm saying. Not to mention is not like +10 years of service is what Sony is targeting, we are talking about conservation and collectors.
Perhaps going passive was a better "long term" sollution in regards to maintaince but that would require 4x or even more the amount of heatsink you see now.
Anything after that is fair game.
It's well known LM has a deteriorative effect on components such as a CPU lid, coolers and so on, I've seen the evidence from many others that's used it too many times before.
Many that have delidded CPU's and used it have seen the effects of it within the first 18 months of the application but normally it's more like just two to three years. After that temps will get noticably warmer over time, at least requiring a re-TIM regardless of what you go with.
I can promise you they didn't really check on how the stuff held up against such, only that the console worked to an expected degree of performance with the expectation it would probrably survive the warranty period.
Anyone can do as they will with it but for me, if I ever get one that will be the first thing I "Fix" - Warranty be damned over it.
1) Making the console "powerful" without catering to devs and making things easy for them.
2) Thinking that complete backcompat was an essential feature (I know this is anathema to us PC players, but Sony actually went as far as including a PS2 chip in every OG PS3, which contributed to an absurdly high price, like it was $600 and still lost Sony like $300-$400, all over a feature that Sony now knows that most console users don't really use).
I don't see them repeating either, in fact, I see this gen as more like the Xbox/PS2/Gamecube one, where no one made a really big fuck-up and most of them made bread. No lol. But PC people like us always underestimate how far consoles would go to try and make things easier for consumers that aren't used to or willing to DIY.