Wednesday, September 28th 2022

Latest PlayStation 5 Hardware Revision Receives 6 nm "Oberon Plus" SoC to shed 6% Weight

The latest CFI-1202 series hardware revisions of the Sony PlayStation 5 entertainment system receive new "Oberon Plus" SoCs built on the TSMC N6 (6 nm) silicon fabrication node, and could include several new power-management features of the kind seen in AMD Ryzen 6000 mobile-processors, which could bring down the overall weight of the console as it could shed anywhere between 200-300 grams (6.25-6.5 percent) compared to older 2021 models. The CFI-1202B is the Digital-only variant that lacks an optical drive; while the CFI-1202A is the slightly heavier model that comes with a Blu-ray ROM drive. The 6% reduction in weight may not seem like much to the end-user, but has a cumulative effect for Sony to ship them by the thousands.
Sources: Angstronomics, Tweaktown
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15 Comments on Latest PlayStation 5 Hardware Revision Receives 6 nm "Oberon Plus" SoC to shed 6% Weight

#1
Arkz
Interested to see the power draw difference.
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#2
ModEl4
plus the noise output difference!
Posted on Reply
#3
Unregistered
By the time it becomes available we'll have slim models.
#4
nguyen
Yet PS5 price increased LOL
Posted on Reply
#5
AsRock
TPU addict
Xex360By the time it becomes available we'll have slim models.
Might be what it's for.
Posted on Reply
#6
GeorgeMan
AsRockMight be what it's for.
It's already in current production units.
Posted on Reply
#7
watzupken
A reduction in weight is not meaningful for most people since the console is generally left on a table or TV console. Since they have been aggressively cutting down on the cooler size and likely a smaller PSU is required, I think it should be about time they consider a smaller console so that it does not take up too much real estate.
ModEl4plus the noise output difference!
Don't think the fan noise will differ much. While a supposed die shrink should reduce power consumption, Sony also aggressively shrunk the heatsink. The lack of surface area will still need high airflow to cool. I guess Sony should have their internal validation to try and not make the noise worst.
Posted on Reply
#8
Denver
This should also result in 15-20% more working chips per wafer. Somehow the price went up instead of down...
Posted on Reply
#9
ARF
Comparison:

Posted on Reply
#10
ModEl4
watzupkenA reduction in weight is not meaningful for most people since the console is generally left on a table or TV console. Since they have been aggressively cutting down on the cooler size and likely a smaller PSU is required, I think it should be about time they consider a smaller console so that it does not take up too much real estate.


Don't think the fan noise will differ much. While a supposed die shrink should reduce power consumption, Sony also aggressively shrunk the heatsink. The lack of surface area will still need high airflow to cool. I guess Sony should have their internal validation to try and not make the noise worst.
Yeah, I watched the video back then but it's only one source and Sony is using also different fan manufacturers for the same model, I'm going to wait for another review just in case (a DF collaboration with GanersNexus again would be great but i guess Steve will have his hands full till Raptor Lake)
Posted on Reply
#11
Chomiq
ARFComparison:

This guy again...
Posted on Reply
#12
ARF
watzupkenA reduction in weight is not meaningful for most people since the console is generally left on a table or TV console. Since they have been aggressively cutting down on the cooler size and likely a smaller PSU is required, I think it should be about time they consider a smaller console so that it does not take up too much real estate.


Don't think the fan noise will differ much. While a supposed die shrink should reduce power consumption, Sony also aggressively shrunk the heatsink. The lack of surface area will still need high airflow to cool. I guess Sony should have their internal validation to try and not make the noise worst.
The weight itself just shows how much metal is used to cool that power-hungry box down.
So much waste of metals and why - because they don't want to produce an efficient, light and silent box with TDP max 50 watts.

Look at the wall measurement - this sucks power like no-tomorrow.

Posted on Reply
#13
Steevo
ChomiqThis guy again...
Barf is the guy you learn to ignore or put on your ignore list.
Posted on Reply
#14
ARF
SteevoBarf is the guy you learn to ignore or put on your ignore list.
This is a passive hate speech and if I were a moderator, I would give you a long holiday to a banana republic.
Posted on Reply
#15
Chomiq
SteevoBarf is the guy you learn to ignore or put on your ignore list.
I'm talking about Austin Punchface.
ARFThe weight itself just shows how much metal is used to cool that power-hungry box down.
So much waste of metals and why - because they don't want to produce an efficient, light and silent box with TDP max 50 watts.

Look at the wall measurement - this sucks power like no-tomorrow.


200-220 W, "Wow, this new PS5 is better!"

This dork still uses FLIR on the exhaust to measure temps...
Posted on Reply
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