According to Nikkei, Fujifilm Holdings is reportedly set to invest ¥100 billion ($640.5 million) by March 2027 to expand production capacities in the U.S., Japan, South Korea, and India. The main focus of the expansion is semiconductor materials, which are vital for the modern semiconductor supply chain. While the company has not officially confirmed the plan, it follows global efforts to straighten material supply chains as chipmakers ramp up the construction of cutting-edge fabs in these regions. The investment, doubling Fujifilm's semiconductor materials spending over the past three years, targets rising demand driven by new fabs from Intel, TSMC, Samsung, and SK Hynix, particularly for AI and HPC. Fujifilm, ranked fifth globally in photosensitive materials, is one of only five companies worldwide producing ultra-pure photoresists for extreme ultraviolet (EUV) lithography.

These photoresists must meet rigorous standards due to EUV's 13.5 nm wavelength, requiring precision in sensitivity, resolution, and compatibility with mask materials. Fujifilm strategically locates facilities near major hubs to strengthen partnerships with key clients. In Japan, a ¥13 billion ($83.27 million) plant in Shizuoka Prefecture is underway, while a South Korean site in Pyeongtaek will receive upgraded equipment by autumn. A Cheonan facility, set for spring 2027, aims to boost the output of chemical mechanical planarization (CMP) agents by 30%. The company also eyes India's emerging semiconductor sector, exploring partnerships or joint ventures to establish local production post-2027.