Monday, November 17th 2008
AMD Materializes Embedded Platform Core-Logic
AMD has taken steps towards providing its next embedded CPUs with the introduction of a core-logic platform that suits its thermal envelopes, while providing the kind of features essential to embedded platforms today. Its direct implementation could be the embedded low-power Athlon single and dual-core processors that could make it to UMPCs, nettops, and the likes.
The embedded processors will come in the ball-grid array package, and a reduced board footprint (package-size). At the heart of this core-logic is the AMD 780E northbridge. It is a reworked 780G chip with reduced thermal footprints. It will provide the CPU with a HyperTransport 3.0 (up to 5.6 GT/s) connection. This northbridge embeds a ATI Radeon HD 3300-class integrated graphics (IGP) which is AMD Sideport-capable. This adds the provision of adding DDR3 memory chips on the board to serve as video-memory. The northbridge provides an A-Link 2.0 connection (PCI-Express 2.0 x4) to the AMD SB7x0 class southbridge. The northbridge also features a native PCI-E multiplex to allow ATI CrossfireX with two PCI-E 2.0 x8 electrical connections. The SB7x0 southbridge provides up to six SATA II channels, 12 USB 2.0 connections, HD Audio, among others.
The approach AMD has towards the UMPC, nettop and other embedded platforms is simple: it will give you a better PC experience than its competitor at nearly the same price-point. The contest comes down to energy-efficiency versus features. AMD believes a basic PC experience should not be compromised for the sake of energy efficiency, which gets negated in nettop and other static platforms, while becoming a factor with mobile platforms. Details of this platform can be read here (PDF).
The embedded processors will come in the ball-grid array package, and a reduced board footprint (package-size). At the heart of this core-logic is the AMD 780E northbridge. It is a reworked 780G chip with reduced thermal footprints. It will provide the CPU with a HyperTransport 3.0 (up to 5.6 GT/s) connection. This northbridge embeds a ATI Radeon HD 3300-class integrated graphics (IGP) which is AMD Sideport-capable. This adds the provision of adding DDR3 memory chips on the board to serve as video-memory. The northbridge provides an A-Link 2.0 connection (PCI-Express 2.0 x4) to the AMD SB7x0 class southbridge. The northbridge also features a native PCI-E multiplex to allow ATI CrossfireX with two PCI-E 2.0 x8 electrical connections. The SB7x0 southbridge provides up to six SATA II channels, 12 USB 2.0 connections, HD Audio, among others.
11 Comments on AMD Materializes Embedded Platform Core-Logic
I'm really impressed by how fast you reacted to my message.
thanks
14 USB ports is overkill IMO for embedded! LOL
They should standardise display cache. It's one tiny and cheapish DDR3 chip. Since this is a 2D device, not 3D, they only need 64MB, but will make a big difference to performance. The "option" should be to go 128MB, but not that by default there is 0MB. There is nothing worse than slideshow windows or videos, or window drags that lag. Display cache fixes that.
Odd that they say this is designed for a low power footprint, BUT THEN THEY DONT SAY WHAT (WATT).
if this is true this will be better than the atom's package in performance (out of order processing, and total solution cpu+nb consuming less power)
But it will be awesome if AMD does that for the mobile platforms and reduce total power consumption including south bridge to < 10w.
Good work AMD.
So we can see BD laptops based on this to take along for long flights to India he he.
This certainly looks better to me than the others available now, more powerful and the power draw is similar. I share their idea of what a nettop should be in clear contrast of Intel's idea. I had my doubts between this and the one that Via-Nvidia suposedly were releasing, bt aparently they dropped the project so...
Looks like a decent performer from AMD. They surely are flexing their muscle, it just happens to be different than Intels ;)