Tuesday, February 3rd 2009
Rambus Implements XDR Memory Interface in Ultra Low-Cost Package
Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announces the implementation of its award-winning XDR memory architecture using an ultra low-cost LQFP package. In a paper to be presented at DesignCon, Rambus will discuss the benefits of differential signaling delivering high memory bandwidth in a cost-effective package, ideal for consumer electronics such as set-top boxes and HDTVs.
"Today's consumer electronics require high bandwidth and low-cost manufacturability," said Martin Scott, senior vice president of Research and Technology Development at Rambus. "Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging."
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
Source:
Rambus
"Today's consumer electronics require high bandwidth and low-cost manufacturability," said Martin Scott, senior vice president of Research and Technology Development at Rambus. "Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging."
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
14 Comments on Rambus Implements XDR Memory Interface in Ultra Low-Cost Package
I don't want to wait for that. XD
I was joking. It was quite a saga back then in 2000 year with Intel's 820 Chipset (and not pleasant one, if I may add).
but put that aside, intel and amd are not the whole computer world.
rambus done an excellent job with xdr, in fact so good that micron and others used their ideas in ddr2/3..4 chips. (and federal curt looks favorably in this kind of industrial espionage i wonder what ati would say 2-3 from now about their secrets gone to envidia by that stanford runaway dally)
and after all as small memory market player they targeting consumer electronics where lower cost and smaller number of modules make a big difference. in fact it wouldn't be too much of surprise that tegra2 use xdr interface instead ddr2. it's simply more power efficient and as it came out more bang for buck when small size matters.