In a move that could "ruin a lot of people's Christmas," as TechEye puts it, it is learned that AMD is headed for executive layoffs. The company's new CEO, Rory Read apparently sees value in a leaner, more efficient organization. This, despite rather positive third quarter results, where AMD bagged $1.69 billion in revenue and $97 million in profit. The CEO is eying total restructuring, according to sources. As expected, AMD refused to comment.

HP today announced a new industry program comprising a new server development platform, customer discovery lab and partner ecosystem to help customers significantly reduce complexity, energy use and costs.

HP's new program, dubbed Project Moonshot, combines with HP Converged Infrastructure technology to allow the sharing of resources - including storage, networking, management, power and cooling - across thousands of servers. It paves the way to the future of low-energy computing for emerging web, cloud and massive scale environments.

HP today announced the HP Slate 2 Tablet PC with expanded touch capabilities, enhanced multitasking performance and embedded security, providing added flexibility to mobile business users. The company also announced a new notebook PC targeting business, education and government customers.

The HP Slate 2 Tablet PC provides instant deployment for business and vertical markets such as education, healthcare, government and retail, where jobs frequently take users away from a traditional desk. With a full-featured Microsoft Windows environment, the 1.5 pound HP Slate 2 Tablet PC provides professionals with the flexibility to create, edit and review content on one highly mobile and lightweight device.

In late September, S3 Graphics, still a subsidiary of VIA Technology and soon to be transferred to HTC, dragged Apple Inc. to court over charges of patent infringement related to graphics component IP of nearly all Apple products, including iPhone, iPad, iPod touch, and iMac. Last month, AMD, now a main supplier of graphics processors for Apple's Mac products, intervened with a counter lawsuit claiming it owned the patents that S3 has asserted against Apple, and sought an immediate halt to S3's patent case against Apple.

In an October 28 filing with the ITC, S3 says that a federal judge struck down a request for an immediate halt into S3's case, but the Commission is scheduled to release its final decision on November 15. The case struck down is (rather was) Advanced Micro Devices Inc. v. S3 Graphics Co., 11cv965, U.S. District Court for the District of Delaware (Wilmington).

AMD's third 8-core desktop processor model is available through OEMs such as HP. Called the AMD FX-8100, this chip is the most affordable among the available FX-8000 series chips (that's FX-8120 and FX-8150), and according to HP's component pricing, about $80 cheaper than the FX-8150. The AMD FX-8100 is a base model processor option for HP Pavilion HPE h8z desktop. It can be configured to have FX-8150 instead, for $80 over the base price of the desktop, of $830.

The FX-8100, like every other FX Series processor, features an unlocked base clock multiplier to help with overclocking. The chip is clocked at 2.80 GHz, with TurboCore technology, all eight cores can overclock themselves to 3.10 GHz. To handle tasks that aren't multi-threaded, the chip can overclock some of its cores (up to four of them), all the way up to 3.70 GHz. Like every other FX-8000 series chip, the FX-8100 packs 16 MB of total cache (8 MB total L2 + 8 MB L3), features an advanced instruction set of AVX, AES, XOP, SSE 4.2/4.1/4a, and a system interface of 5.2 GT/s with HyperTransport 3.1.

SAPPHIRE Technology has just announced a new model in its successful HD 6900 series of graphics cards - the HD 6970 2GB with a new super efficient Dual fan cooler and Dual BIOS giving users the choice of fast, quiet operation or performance tuning.

The new SAPPHIRE HD 6970 has the same internal architecture as the standard model, with 1536 stream processors and 96 texture processing units, and clock speeds are 880MHz for the core and 1375Mhz (5.5Gb/sec effective) for the 2GB of GDDR5 memory. This new design has two 90mm fans with thin impellers that can move the same amount of air at 10% lower rotation speeds than conventional fans, keeping noise low, and their special dust repelling bearings contribute to high reliability.

AMD today launched the AMD FirePro V4900, which delivers unequaled performance for Digital Content Creation (DCC) and Computer Aided Design (CAD) professionals at an entry-level price point. By leveraging AMD's most advanced graphics technology, including AMD Eyefinity technology, the AMD FirePro V4900 significantly improves application performance and drives efficiency in the workplace. In fact, the AMD FirePro V4900 more than doubled the performance of competitive offerings in many CAD and DCC application tests.

"The AMD FirePro V4900 stands in a league of its own and redefines entry-level professional graphics card capabilities," says Sandeep Gupte, general manager of Professional Graphics, AMD. "The AMD FirePro V4900 leverages AMD's most advanced graphics technology, which not only enhances user experience and boosts performance of professional applications, but also features AMD Eyefinity multi-display technology that supports up to six displays, increasing user productivity."

Acer is spreading holiday cheer this season with new all-in-one (AIO) desktops that combine the audio/visual excitement of HD with the fun and entertainment of a touch-screen display. The new models include the Acer AZ5 Series with an ample 23-inch HD monitor and the AZ3 Series, which features a more compact 21-inch HD screen to fit within tight areas. These new AIOs conserve space and make an appealing entertainment hub for the entire family to enjoy.

"A sophisticated appearance and practical design make our all-in-one form factor very popular with consumers," said Irene Chan, senior business manager of consumer desktops for Acer America. "Our newest all-in-one models feature an intuitive touch screen display for playing digital music, scrolling through images, browsing online recipes and viewing social networking sites. In addition, full HD performance heightens the visual excitement of movies and games."

The latest data from Jon Peddie Research, which is known for closely tracking the PC graphics hardware industry, claims that the PC graphics industry has stabilized and returned to a more predictable path in Q3 2011. Shipments have increased 16.7% sequentially, and 18.4% compared to Q3 2010 (year over year). Much of this is attributed to the market success of Intel "Sandy Bridge" Core processors, which has also worked to increase Intel's market share. Intel is the market leader in PC graphics, with AMD in the second place, and NVIDIA third.

Intel holds 60.4% of the market, a significant increase from the 54.8% it held in Q2 2011. It grew at the expense of both AMD and NVIDIA. AMD's share slipped a little, despite the introduction of new A-Series "Llano" accelerated processing units. AMD holds 23% of the market, down from the 24.4% it held in Q2. NVIDIA is in a bit of trouble. The green team holds 16.1% of the market, down from 20.1% it held in Q2. This is attributed to its exit from integrated graphics. Its discrete GPU business still sees growth.

AMD today released its latest official version of Catalyst, a software suite that provides drivers for AMD/ATI Radeon graphics processors, A-Series APUs, 7-series and 8-series integrated graphics, and related system software. Catalyst 11.10 WHQL launched today has essentially the same change log as the 11.10 Preview 3 driver, except that it's WHQL-signed. Catalyst 11.10 WHQL is the driver to have when playing some of the latest titles such as Battlefield 3 and Rage.

Catalyst 11.10 WHQL brings in a few new features, too, such as support for 5x1 Eyefinity, with maximum resolution increased to 16000 x 16000 pixels on Radeon HD 6000 series GPUs, and in DirectX 11 applications, and improved Vision Engine Control Center / Catalyst Control Center applications (VECC is installed for A-Series APUs and Chipset IGPs, CCC is installed for discrete Radeon GPUs).

DOWNLOAD: AMD Catalyst 11.10 WHQL for Windows 7 and Vista 64-bit | Windows 7 and Vista 32-bit

Thermaltake, being the industry pioneer brand in thermal solutions with the mission of "delivering the perfect user experience," carrying the corporate vision of "building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology, and lifestyle," featured the Contac CPU air cooling Series that aids in fulfilling various needs in the market as well as the corporate mission of "delivering the perfect user experience." This fall adding the shimmering Thermaltake Contac 39 and Contac 30 CPU air cooling to the series, providing a wider range of solution for bargain hunter who desire value and performance equally.

Intel started the trend of improving integrated graphics with their second generation LGA1155 socket Core i3, i5 & i7 line of processors. Depending on the model, these processors sport integrated HD2000 or HD3000 graphics right on the processor die, which nowadays give acceptable performance for low-end gaming and can play Full HD 1080p video perfectly. This trend is increasing with the upcoming Ivy Bridge processors, which will be able to support a massive 4096 x 4096 pixel display, as we reported here. AMD now also have equivalent products with their Llano-based A-series processors. So, where does this leave discrete graphics cards? Well, the low end market is certainly seeing reduced sales, as there really isn't enough of a performance difference nowadays to always warrant an upgrade from an IGP. As integrated graphics improve further, one can see how this will hurt sales of higher end graphics cards too. The problem is that the bulk of the profit comes not from the top-end powerhouse graphics cards, but from the low to mid-end cards which allow these companies to remain in business, so cannibalizing sales of these products to integrated graphics could make high-end graphics cards a much more niche product and crucially, much more expensive with to boot.

In mid-September, earlier this year, a team of overclockers sponsored by AMD set a new Guinness Record for clock speed by a silicon processor, setting an AMD FX-8150 processor to run at a staggering 8429.38 MHz. If anything, the coveted Guinness Record feat helped cement the general notion that AMD FX processors are good at overclocking. Sadly, AMD's record didn't last long, with renowned overclocker Andre Yang breaking it with his 8461.51 MHz feat. At this point we don't know if Andre had Guinness covering his feat to he could officially break AMD's record. AMD wouldn't mind it at all, because the new record was set using an AMD FX-8150, too. Andre did it single-handed, or at least he is the only person in the "Submitted by" field on the CPU-Z Validation page.

According to the validation page, 8461.51 MHz was achieved using a base clock speed of 272.95 MHz, with 31.0X multiplier, and a brutal core voltage of 1.992V (almost 2 volts!). As with AMD's record feat, an ASUS Crosshair V Formula motherboard was used. A single 2 GB Corsair-made memory module was used doing 909.8 MHz (1818.16 MHz DDR) with timings of 9-9-9-24T. Like with AMD's feat, only two out of the FX-8150's eight cores were enabled. More details are awaited.

AMD today announced revenue for the third quarter of 2011 of $1.69 billion, net income of $97 million, or $0.13 per share, and operating income of $138 million. The company reported non-GAAP net income of $110 million, or $0.15 per share, and non-GAAP operating income of $146 million.

"Strong adoption of AMD APUs drove a 35 percent sequential revenue increase in our mobile business," said Rory Read, AMD president and CEO. "Despite supply constraints, we saw double digit revenue and unit shipment growth in emerging markets like China and India as well as overall notebook share gains in retail at mainstream price points. Through disciplined execution and continued innovation we will look to accelerate our growth and refine our focus on lower power, emerging markets, and the cloud."

Gigabyte released its newest premium HTPC motherboard in the mini-ITX form-factor, the A75N-USB3. As the name might suggest, this is a socket FM1 motherboard based on the AMD A75 chipset, and features USB 3.0 connectivity. Despite its compact dimensions, the board crams in everything a HTPC can benefit from. First, the FM1 socket seats AMD A-Series accelerated processing units (APUs), which pack up to four x86-64 cores with up to 4 MB cache, dual-channel DDR3-1866 integrated memory controller, and more importantly, a very powerful integrated graphics processor in the Radeon HD 6500 class. The FM1 socket on this board is powered by a 3+1 phase VRM that makes use of driver-MOSFETs. Power is drawn by a 24-pin ATX and a 4-pin CPU power connector.

The lone expansion slot is a PCI-Express 2.0 x16. The CPU is wired to two full-length DDR3 DIMM slots, which can take in up to 32 GB (that's right, future 16 GB DIMMs are supported) of dual-channel DDR3-1866 MHz memory. The AMD A75 chipset gives out four internal SATA 6 Gb/s ports, and one eSATA 6 Gb/s port on the rear panel. Display outputs include HDMI 1.4a and DVI. Analog outputs are done away with. Audio is handled by a high-quality Realtek ALC889 HD audio codec. Although this codec supports 8+2 output channels, it is wired to a 5.1 channel shared audio jack cluster, apart from the internal HDA_FP header. Those needing 7.1 channel output can still use the TOSLINK connector, that supports 7.1 channel output with 24-bit, 192 kHz resolution and Dolby Home Theater support. If even that's not enough, the HDMI connector gives you 7.1 channel HDMI audio with Dolby Prologic support.

The high-end CPU-Cooler from the newcomer PHANTEKS is available immediately at Caseking.de. This cooler with the name "TC14PE" already managed to receive numerous awards for its excellent performance. PHANTEKS employs multiple features to achieve such extraordinary results: a patented surface at the nano-level, twin tower design and two high-performance 140 mm fans. For the perfect looks to go with the installed hardware, the cooler is available in blue, orange red or silver.

The young company PHANTEKS has invested more than two years into the development of the TC14PE CPU coolers, as their goal was not simply to produce a good CPU cooler, but to lead the performance charts. Instead of focusing on the best heat dissipation of an open test bench, PHANTEKS has made sure that the TC14PE performs best in its intended setting - a closed system.

EVGA released a teaser picture of its X79 FTW motherboard. This is EVGA's third LGA2011 motherboard, after the E-ATX Super Record 3 and XL-ATX X79 Classified. This board confines itself to the dimensions of a standard ATX form-factor motherboard (240 x 300 mm). It targets the gamer-overclocker market. The LGA2011 socket is powered by a 14-phase VRM, while the memory, 4-phase. EVGA completely did away with cylindrical conductive polymer capacitors, and used a 100% POSCAP capacitor design. Power is drawn in from a 24-pin ATX (angled) connector, 8-pin EPS, and a 4-pin Molex (for PCIe slot electrical stability). There are just four DDR3 DIMM slots, one per memory channel.

Expansion slots include four PCI-Express 3.0 x16 (two are x16 capable, all four are x8 capable), a PCI-Express 2.0 x16 (electrical x8), and one PCIe x1. NVIDIA 4-way SLI and AMD CrossFireX are supported. The only internal SATA ports on this board are the ones the X79 PCH gives out, two SATA 6 Gb/s and four SATA 3 Gb/s. There are two eSATA ports, driven by a third-party controller. There are as many as eight USB 3.0 ports on the rear-panel, and two via internal header. 8+2 channel HD audio, two GbE connections, a Bluetooth connection, and PCH-wired USB 2.0 ports (for keyboard/mouse) make for the rest of the standard connectors. There is an EVBot header on the rear-panel, that lets you connect to the EVBot monitoring/control module. The UEFI BIOS is stored in two separate EEPROMs, and a 2-way switch lets you manually switch between the two. Expect the X79 FTW to be a part of the company's first wave of LGA2011 motherboards.

Celebrating the launch of the much anticipated Battlefield 3 game, SAPPHIRE Technology is introducing the SAPPHIRE HD 6970 BF3 Special Edition - featuring two SAPPHIRE exclusive technologies, SAPPHIRE FleX and Vapor-X cooling as well as performance enhancing options for the enthusiast and access to a FREE copy of the full game!

The SAPPHIRE HD 6970 BF3 Special Edition is based on AMD's award winning second generation DX 11 graphics engine with the powerful configuration of 1536 stream processors and 96 texture processing units delivering smooth and detailed graphics to the latest generation of games and applications. SAPPHIRE FleX technology allows the direct connection of three DVI monitors in Eyefinity mode without the need for special adapters, making it the simplest solution to multi-screen enjoyment, and the highly efficient SAPPHIRE Vapor-X cooling enables performance to be maximised whilst keeping noise levels low.

AMD detailed its upcoming "Virgo" PC platform that consists of next-generation "Trinity" APU (accelerated processing unit), and current-generation AMD A75 "Hudson-D" chipset. A notable revelation here is that the next-gen APUs will be compatible with AMD A75, although it will be designed for a new socket called FM2. It remains to be seen if FM1 and FM2 are pin-compatible.

"Trinity" packs four x86-64 cores based on the next-generation "Piledriver" architecture, arranged in two Piledriver modules. A module is a closely-knit group of two cores, with certain shared and dedicated resources. Each Piledriver module has 2 MB of L2 cache shared between the two cores. In all, Trinity, with its two modules, has 4 MB of L2 cache without any L3 cache.

Thermaltake, the leader and pioneer in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with "delivering the perfect user experiences" as our mission and carrying the corporate vision of "building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology and lifestyle." This October, featuring the Thermaltake Frio Advanced CPU cooler - a CPU cooler that incorporated some of the most up-to-date CPU cooler technologies and persevered the greatnesses from its predecessors of Frio and Frio OCK which not only creating a new phenomenon for overclockers but also set another signature for the Frio Series.

TSMC today announced that its 28nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.

TSMC's 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

Cooler Master, an industry leading chassis, thermal solution, power supply, peripheral, and accessory manufacturer, today adds a new sibling to the Silencio 550, the Silencio 450.

The Silencio Series represents the best solution for sound absorption with system builds of all levels. Sound silencing foam padding seeks to severely reduce system noises produced by hard drives, numerous cooling fans, and other devices. Combine this with a solid-steel frame, vibration inhibiting rubber feet, two Cooler Master quiet-spinning fans and the Silencio 450 nearly becomes completely silent. Those that value a quiet computing space will immensely appreciate the Silencio Series.

AMD today announced an investment in BlueStacks, a venture-backed firm developing innovative software. BlueStacks has introduced a solution to enable Android applications to run fast and full-screen on Windows-based devices.

AMD and BlueStacks are collaborating to optimize the BlueStacks App Player for Windows software for use with tablet and notebook PCs powered by AMD APUs with AMD VISION technology. With this combination of BlueStacks software and AMD technology, consumers will be able to access their favorite Android apps on virtually any AMD-powered Windows-based device, including more than 200,000 apps currently available in the Android Market.

AMD (NYSE: AMD) announced today that Mark Papermaster, 50, has joined as the company's senior vice president and chief technology officer. He will report to President and Chief Executive Officer Rory Read and will oversee all of AMD's engineering, research and development (R&D), and product development functions as the head of the newly-formed Technology and Engineering Group. Papermaster, who was most recently vice president of Silicon Engineering at Cisco, will be responsible for establishing and executing the company's technology and product roadmaps, integrated hardware and software development, and overseeing the creation of all of AMD's products.

The advanced research and development team led by Senior Vice President of Research and Development Chekib Akrout, as well as the engineering teams residing in AMD's Products Group, will now report to Papermaster. Akrout, 53, will maintain responsibility for leading AMD's processor core development as well as system-on-a-chip (SoC) design methodology. In recognition of his ongoing technical and management contributions, Akrout will continue serving on AMD's senior leadership team responsible for key decision making and strategy setting.

MSI is readying a new LGA2011 HEDT (high-end desktop) motherboard based on the Intel X79 chipset, which features eight DDR3 DIMM slots, two per memory channel, letting you take advantage of the fast quad-channel DDR3 IMC of Sandy Bridge-E Core i7 processors, as well as not letting you fall short of memory expansion. The X79A-GD65 8D, as it's called, makes room for eight DIMM slots, four on either sides of the socket. The CPU is powered by a 5+2 phase VRM, and the memory by a 4-phase VRM.

Expansion slots include four PCI-Express x16, from which four are wired to the CPU socket, two are PCI-Express 3.0 x16 capable, four are PCI-E 3.0 x8 capable (depending on the way the slots are populated with add-on cards), one is PCI-E 2.0 x4 capable and is wired to the chipset. Then there's the lone PCI-E x1. NVIDIA 4-way SLI and AMD 4-way CrossFireX are supported.