AOKZOE is trying to drum up interest for its latest handheld gaming console - the A1 Pro - with a countdown to a type of early bird sale starting tomorrow. Early adopters will be offered a special starter price of just $799 for the baseline version, and that cost of entry will climb to $999 later on at retail. AOKZOE boasts that the A1 Pro is the first handheld gaming device to pack an AMD 7 7840U APU - a customized version of this SoC (AMD Z1 processor series) is set to debut as part of the ASUS ROG Ally handheld system. The current AOKZOE A1 model is powered by an older AMD Ryzen 7 6800U APU, which sat at the heart of various laptops and mobile gaming devices in 2022. This year's A1 Pro models are powerful enough to take on Valve's Steam Deck (and the previously mentioned ROG Ally) thanks to impressive internal specifications - AOKZOE reckons that the Pro upgrade offer a 20% performance leap over previous gen devices (6800U).

The Zen 4-based Ryzen 7 7840U APU, part of the "Phoenix" range of mobile processors, is available in all configurations of the A1 Pro - the base model gets 32 GB of memory and 512 GB of storage, and the headliner has 64 GB of memory and 2 TB of storage. AOKZOE states that the A1 Pro utilizes the LPDDR5-6400 RAM and PCIe 3.0 x4 standards - their handheld system is also capable of running M.2 2280 PCIe 4.0 drives. The A1 Pro features an 8-inch FHD (1920 x 1200) IPS display - its nearest rivals have smaller 7-inch screens. Hardcore game controller enthusiasts will be happy to discover that hall effect sensor technology has been integrated into the new handheld's pair of analog sticks.

An intriguing entry has appeared on the Geekbench Browser site, the information was uploaded with a timestamp from this morning (11:07 am on April 20 to be specific) pointing to a mobile ASUS device that was tested in GeekBench 5. The archived info dump reveals that the subject matter of the benchmark was the ASUS ROG Ally handheld gaming console, which has received a lot of attention in recent weeks - with it being touted as a very serious alternative to Valve's Steam Deck, a handheld gaming PC that is quite popular with enthusiasts. The ROG Ally will need to offer a potent hardware package if it stands to compete directly with the Steam Deck, and the latest information confirms that this new contender is very promising in that department. Geekbench 5 awarded an impressive OpenCL score of 35498 to the RC71L variant of the ROG Ally, an RC71X-assigned model is known to exist but details of its exact nature have not been revealed. This particular ROG Alloy unit was running Windows 11 Home (64-bit) under the operating system's performance power plan.

The new entry on Geekbench Browser shows that the Ally is packing an AMD Ryzen Z1 Extreme APU, which appears to be a customized version of the Ryzen 7 7840U APU mobile platform chipset - previous rumors have indicated that the latter would be in the driving seat. Both Phoenix range SoCs share the basic 8 cores and 16 thread makeup, but the Z1 Extreme is capable of boosting up to 5.062 GHz from a base frequency of 3.30 GHz. AMD's Radeon 780M iGPU (RDNA 3) is expected to deal with the Ally's graphical aspect, but the benchmark info dump only provides scant details about the GPU (codenamed "gfx1103") - most notably the presence of six computer units, an 800 MHz max frequency, and access to 8.20 GB of video memory. Number crunching boffins have calculated that the Ally could field 768 FP32 cores, courtesy of the dual issue SIMD design inherent to RDNA 3.

According to the latest information, it appears that first laptops with AMD Ryzen 7040 series APUs, code name Phoenix, will launch in late April, with U-series coming in May. AMD has previously delayed the Phoenix APUs in order to "align with platform readiness and ensure the best possible user experience," the first notebooks powered by Ryzen 7040HS series processors are expected in April.

According to Golden Pig Upgrade from Bilibili, at least the Ryzen 7840HS will launch on April 30th, and the 7840U SKU is probably expected on May 1st. As noted, AMD has announced the 7040 HS- and H-series SKUs, and has previously briefly mentioned the 15 W U-series SKUs, but has not officially unveiled any specifications. So far, three 7040 U-series SKUs have leaked online. Hopefully, AMD will share a bit more details by the end of this month.

As it turned out that ASUS ROG Ally handheld console is not actually an April Fools' Day prank, more details have started to appear about this Steam Deck competitor, and these first details look pretty promising. According to the Dave2D video, showing the prototype unit in full details, the ASUS ROG Ally will indeed be based on a 4 nm custom AMD APU, featuring Zen 4 CPU and RDNA3 iGPU, so we are most likely looking at a custom AMD Phoenix APU.

The video had a few nice pictures of the pre-production PCB as well as the cooling setup as well as details on the screen, and some performance of the ASUS ROG Ally. The ROG Ally measures at 280 x 133 x 39 mm and weighing 608 grams. This makes it shorter, narrower, thinner, as well as lighter, compared to the Steam Deck. It also comes with 7-inch display, but this time around, it is a 500 nits, 1920x1080 resolution, 16:9 aspect ratio, display with a 120 Hz refresh rate and 5 ms response time, which makes it much better compared to the Steam Deck.

Update: LinusTechTips is the second one to get access to ASUS ROG Ally prototype and has provided a bit more details on specifications, performance, and other things about the upcoming handheld console.

While AMD has yet to officially launch the 7040 Series Phoenix APUs, yet another SKU has been spotted online, the 6-core/12-thread AMD Ryzen 5 7540U. Based on AMD's Zen 4 architecture and featuring RDNA3 iGPU, this SKU will join the recently spotted Ryzen 5 7640U and the Ryzen 7 7840U.

It is not clear how many SKUs will AMD actually have in the Ryzen 7040 U-Series, but so far three SKUs have leaked online. The earlier slide, which mentioned the Ryzen 7040 Series, put it in the thin and light segment with TDP ranging from 15 W to 28 W. Bear in mind that AMD will also have the 7040 series non-U Phoenix APUs that will fit the 35 W - 45 W "thin enthusiast" HS-series segment. There is also the "ultra enthusiast" HX-series segment with the recently launched 7045 Series Dragon Range APUs.

Last weekend ASUS ROG started to tease a handheld gaming system, called the Ally. On April 1 the company uploaded an expensive looking trailer, that bordered on being a total spoof in the latter half. People were quick to dismiss the announcement as an April Fool's Day prank, but since then the company has continued to post preview material and has even highlighted a Best Buy interest page. The ROG Ally has been confirmed to be an entirely real bit of gaming hardware that runs via Windows 11. AMD has been revealed as collaborating with ASUS on a custom Ryzen APU for the handheld system, which is advertised as the "fastest AMD APU yet" in the reveal trailer. Exact specifications for this chipset have not been listed, so expect those details as part of a future announcement.

ASUS ROG looks to be pitching the Ally as potential alternative to the Steam Deck, but it is too early to speculate about its exact method of operation (always online, local vs. cloud, etc.). Games journalists and gaming communities have also compared the Ally to the AYANEO 2 and GPD WIN 4. ASUS has informed various web influencers that it is promising "competitive pricing" for the upcoming handheld gaming system. The ROG Ally features a Full HD display and a dual fan cooling system tuned to operate quietly via the ROG Intelligent System. A new version of Armoury Crate offers the user access to various games library sources (including Xbox Games Pass) and custom-mapping of control inputs. Extra graphical grunt can be provided by the external and proprietary ROG XG Mobile eGPU platform.

According to the latest leak, AMD's upcoming Phoenix accelerated processing units (APUs) could feature a hybrid design, featuring Performance and Efficiency cores. While there are no precise details, the latest AMD processor programming guide, leaked online, clearly marks these as two types of cores, most likely standard Zen 4 and energy-efficient Zen 4c cores.

These two set of cores will features a different feature set, and the latest document gives software designers guidelines. Such hybrid CPU design, similar to ARM's BIG.little architecture, will allow AMD to be more competitive with Intel's similar P- and E-core design, allowing it to achieve certain performance levels while also maintaining power efficiency.

AMD's entry-level Ryzen 3 4300G APU, which was being sold in the OEM/SI channels, is sneaking its way into the retail PIB space, with Japanese retailers listing it as a retail part. Until now, you could only get the 4300G as part of a pre-built, or as part of a retail "bundle," where they would simply pull one of these chips out of a tray, install it on an entry-level A520 or A320 chipset motherboard, and sell along with a stick of memory. The 4300G is commanding a roughly $100 (equivalent) price, which could make sense for entry-level mom-and-pop PCs.

The Ryzen 3 4300G is based on the 7 nm "Renoir" silicon, and is a Socket AM4 processor with integrated graphics. The processor has one of its two CCXs disabled, leaving you with a 4-core/8-thread CPU based on the "Zen 2" microarchitecture, that has 512 KB of L2 cache per core, and 4 MB of L3 cache shared among the four cores. The processor also features a dual-channel DDR4 memory interface, a PCI-Express Gen 3 interface, and an iGPU based on the Radeon "Vega" graphics architecture. It has a TDP of 65 W.

Atos today announces a contract to build and install a new high-performance computer for the Max Planck Society, a world-leading science and technology research organization. The new system will be based on Atos' latest BullSequana XH3000 platform, which is powered by AMD EPYC CPUs and Instinct accelerators. In its final configuration, the application performance will be three times higher than the current "Cobra" system, which is also based on Atos technologies.

The new supercomputer, with a total order value of over 20 million euros, will be operated by the Max Planck Computing and Data Facility (MPCDF) in Garching near Munich and will provide high-performance computing (HPC) capacity for many institutes of the Max Planck Society. Particularly demanding scientific projects, such as those in astrophysics, life science research, materials research, plasma physics, and AI will benefit from the high-performance capabilities of the new system.

ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800 MHz memory up to 64 GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications. The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.

Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades. The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800 MHz SO-DIMM memory up to 64 GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

MediaTek today announced its new Kompanio chipsets for Chromebooks: the Kompanio 520 and Kompanio 528. With upgraded computing performance and battery life for entry level Chromebooks, the newest Kompanio chipsets provide a seamless experience so consumers can browse, cloud game, stream and use Google Play apps while enjoying all-day battery life.

"Enhanced power efficiency, speedy performance and reliable connectivity are at the core of a great user experience, and that's exactly what MediaTek's new Kompanio chipsets deliver," said Adam King, Vice President and General Manager, Client Computing Business Unit at MediaTek. "As the No. 1 provider of Arm-based Chromebooks, MediaTek makes the latest AI, connectivity, display and imaging features accessible at every price point."

MediaTek today launched the Pentonic 1000, its latest flagship smart TV system-on-chip (SoC) designed for 4K 120 Hz displays. Pentonic 1000 integrates Wi-Fi 6/6E support, MEMC for smoother video, a powerful AI processor, Dolby Vision IQ with Precision Detail, and 8-screen Intelligent View so users can watch or preview multiple streams of content at once. The chipset also supports the most advanced video codecs and global TV broadcast standards in a single platform.

The MediaTek Pentonic 1000 combines a powerful multi-core CPU, dual-core GPU, dedicated AI processing unit (APU) and video decoding engines into a single chip. The chipset provides resolution support up to 4K at 120 Hz and is capable of VRR up to 4K at 144 Hz for gaming applications. In addition to supporting super-fast frame rates for smoother gaming, it provides a lag-free experience with Auto Low Latency Mode (ALLM).

Today, Alienware reaches new milestones with the launch of the most powerful 17" AMD Advantage laptop, introduction of the standard-defying 480 Hz panel technology for the first time, and unveiling of our first-ever 16-inch Dell G Series laptop. We continue to hold true to the Alienware ethos of creating the apex gaming experience. These advancements are dedicated to making your images sharper, your gameplay smoother, and your experience more immersive through a perfect storm of industry leading gaming technology and iconic design.

For those who value raw power, the Alienware m17 R5 is the laptop for you. It claims the throne as the world's most powerful 17" AMD Advantage laptop, delivering truly remarkable performance. The m17 R5 is forged from a partnership with AMD that features AMD Ryzen 6000 series processors, AMD Radeon RX 6000 series graphics, and new AMD Smart Technologies. Today's update welcomes the new AMD Radeon RX 6850M XT 12 GB GDDR6 GPU to the configuration lineup.

Valve, handlers of the world's most popular digital games store and manufacturers of the Steam Deck, have announced that they've been able to more than double weekly production of the handheld console. Due to the production "picking up", as Valve says it, the company expects to double the number of handhelds shipped each week. This is especially good news for users that were expecting to receive their devices in the 3Q - shipments for these particular orders will begin on June 30th.

Valve doesn't make it clear what exactly was bottlenecking production. Manufacturing and logistics have been showing signs of normalization following a couple of years with snag after snag due to the COVID-19 pandemic and the recent war in Ukraine. Overwhelming demand for graphics chips across the product spectrum may have pushed Valve to accept a smaller pie of AMD chips than the company would like to, and might be one of the reasons the company was forced to extend deliveries of pre-orders for the device.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

YouTuber Matt Perks, known as DIY Perks on Google's video-sharing platform, has achieved the title of owning the world's first "PS5 Slim" console... by creating a custom watercooling system that's aimed at keeping the AMD-designed chip in check while rendering some of the most impressive games of this generation. Thanks to the custom watercooling unit, the PS5's usual 4-inch width was reduced to a mere inch - and due to improved operating temperatures, it's likely the hardware will see increased longevity. Barring any catastrophic leakage, of course.

Perks made use of a copper sheet to channel water over the PS5's APU, while also including thermal bridges that distributed the contained water throughout the consoles' SSD and power delivery subsystem. There is a secret to the consoles' slim profile, however, which should also answer one question you're holding on your mind: where, in that single inch frame, did he fit the pump and radiator for the embedded watercooling?

AMD is allegedly preparing an upgraded quad-core APU with Zen 4 and RDNA3 architectures for a next-generation Steam Deck device according to Moore's Law is Dead. The report claims that the chip is referred to as a "Van Gogh Successor" internally with a die size between 110 mm² and 150 mm² resulting in an increased production cost. The chip should feature 4 Zen 4 cores and 8 threads offering 25% - 35% higher performance per clock (PPC) with a maximum boost of 4 GHz. The RDNA3 graphics will include 8 Compute Units with significantly higher PPC compared to their RDNA2 counterparts which combined with the updated CPU could see a performance improvement up to 50%. These rumors have not been confirmed with any potential Steam Deck processor far from being announced or released anytime soon.

AYANEO has recently announced the AYANEO 2 featuring AMD's latest "Rembrandt" Ryzen 7 6800U APU with Zen 3+ & RDNA2 architectures. The AMD Ryzen 7 6800U is a mobile processor with a configurable TDP of 15 - 28 W featuring 8 cores and 16 threads with a base clock of 2.7 GHz and a boost of 4.7 GHz. The processor also includes integrated Radeon 680M graphics with 12 RDNA2 cores running at 2.2 GHz which should offer performance almost twice of that as the Steam Deck. This APU is paired with an unspecified amount of LPDDR5 6400 MHz memory and a 7" 1280×800 IPS frameless display. The console is also set to feature an integrated fingerprint sensor and has been showcased running numerous games such as Metro Exodus, Cyberpunk 2077, Witcher 3, and Elden Ring. The AYANEO 2 is set to launch sometime later this year however an exact date or pricing was not shared.

AMD's next-generation Ryzen 7000-series "Phoenix" mobile processors are all the rage these days. Bound for 2023, these chips feature a powerful iGPU based on the RDNA3 graphics architecture, with performance allegedly rivaling that of a GeForce RTX 3060 Laptop GPU—a popular performance-segment discrete GPU. What's more, AMD is also taking a swing at Intel in the CPU core-count game, by giving "Phoenix" a large number of "Zen 4" CPU cores. The secret ingredient pushing this combo, however, is a large cache.

AMD has used large caches to good effect both on its "Zen 3" processors, such as the Ryzen 7 5800X3D, where they're called 3D Vertical Cache (3D V-cache); as well as its Radeon RX 6000 discrete GPUs, where they're called Infinity Cache. The only known difference between the two is that the latter is fully on-die, while the former is stacked on top of existing silicon IP. It's being reported now, that "Phoenix" will indeed feature a stacked 3D V-cache.

Today we got information that AMD's upcoming Instinct MI300 will be allegedly available as an Accelerated Processing Unit (APU). AMD APUs are processors that combine CPU and GPU into a single package. AdoredTV managed to get ahold of a slide that indicates that AMD Instinct MI300 accelerator will also come as an APU option that combines Zen4 CPU cores and CDNA3 GPU accelerator in a single, large package. With technologies like 3D stacking, MCM design, and HBM memory, these Instinct APUs are positioned to be a high-density compute the product. At least six HBM dies are going to be placed in a package, with the APU itself being a socketed design.

The leaked slide from AdoredTV indicates that the first tapeout is complete by the end of the month (presumably this month), with the first silicon hitting AMD's labs in Q3 of 2022. If the silicon turns out functional, we could see these APUs available sometime in the first half of 2023. Below, you can see an illustration of the AMD Instinct MI300 GPU. The APU version will potentially be of the same size with Zen4 and CDNA3 cores spread around the package. As Instinct MI300 accelerator is supposed to use eight compute tiles, we could see different combinations of CPU/GPU tiles offered. As we await the launch of the next-generation accelerators, we are yet to see what SKUs AMD will bring.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

It appears that one of AMD's partners has a Ryzen 7000 CPU or APU, with integrated graphics up and running in Linux. Based on details leaked, courtesy of the partner testing the chip using the Phoronix Test Suite and submitting the results to the OpenBenchmarking database. The numbers are by no means impressive, suggesting that this engineering sample isn't running at the proper clock speeds. For example, it only scores 63.1 FPS in Enemy Territory: Quake Wars, where a Ryzen 9 6900HX manages 182.1 FPS, where both GPUs have been allocated 512 MB of system memory as the minimum graphics memory allocation.

The integrated GPU goes under the model name of GFX1036, with older integrated RDNA2 GPUs from AMD having been part of the GFX103x series. It's reported to have a clock speed of 2000/1000 MHz, although it's presumably running at the lower of the two clock speeds, if not even slower, as it's only about a third of the speed or slower, than the GPU in the Ryzen 9 6900HX. That said, the GPU in the Ryzen 7000-series is as far as anyone's aware, not really intended for gaming, since it's a very stripped down GPU that is meant to mainly be for desktop use and media usage, so it's possible that it'll never catch up with the current crop of integrated GPUs from AMD. We'll hopefully find out more in less than two weeks time, when AMD has its keynote at Computex.