ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800 MHz memory up to 64 GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications. The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.

Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades. The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800 MHz SO-DIMM memory up to 64 GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

MediaTek today announced its new Kompanio chipsets for Chromebooks: the Kompanio 520 and Kompanio 528. With upgraded computing performance and battery life for entry level Chromebooks, the newest Kompanio chipsets provide a seamless experience so consumers can browse, cloud game, stream and use Google Play apps while enjoying all-day battery life.

"Enhanced power efficiency, speedy performance and reliable connectivity are at the core of a great user experience, and that's exactly what MediaTek's new Kompanio chipsets deliver," said Adam King, Vice President and General Manager, Client Computing Business Unit at MediaTek. "As the No. 1 provider of Arm-based Chromebooks, MediaTek makes the latest AI, connectivity, display and imaging features accessible at every price point."

MediaTek today launched the Pentonic 1000, its latest flagship smart TV system-on-chip (SoC) designed for 4K 120 Hz displays. Pentonic 1000 integrates Wi-Fi 6/6E support, MEMC for smoother video, a powerful AI processor, Dolby Vision IQ with Precision Detail, and 8-screen Intelligent View so users can watch or preview multiple streams of content at once. The chipset also supports the most advanced video codecs and global TV broadcast standards in a single platform.

The MediaTek Pentonic 1000 combines a powerful multi-core CPU, dual-core GPU, dedicated AI processing unit (APU) and video decoding engines into a single chip. The chipset provides resolution support up to 4K at 120 Hz and is capable of VRR up to 4K at 144 Hz for gaming applications. In addition to supporting super-fast frame rates for smoother gaming, it provides a lag-free experience with Auto Low Latency Mode (ALLM).

Today, Alienware reaches new milestones with the launch of the most powerful 17" AMD Advantage laptop, introduction of the standard-defying 480 Hz panel technology for the first time, and unveiling of our first-ever 16-inch Dell G Series laptop. We continue to hold true to the Alienware ethos of creating the apex gaming experience. These advancements are dedicated to making your images sharper, your gameplay smoother, and your experience more immersive through a perfect storm of industry leading gaming technology and iconic design.

For those who value raw power, the Alienware m17 R5 is the laptop for you. It claims the throne as the world's most powerful 17" AMD Advantage laptop, delivering truly remarkable performance. The m17 R5 is forged from a partnership with AMD that features AMD Ryzen 6000 series processors, AMD Radeon RX 6000 series graphics, and new AMD Smart Technologies. Today's update welcomes the new AMD Radeon RX 6850M XT 12 GB GDDR6 GPU to the configuration lineup.

Valve, handlers of the world's most popular digital games store and manufacturers of the Steam Deck, have announced that they've been able to more than double weekly production of the handheld console. Due to the production "picking up", as Valve says it, the company expects to double the number of handhelds shipped each week. This is especially good news for users that were expecting to receive their devices in the 3Q - shipments for these particular orders will begin on June 30th.

Valve doesn't make it clear what exactly was bottlenecking production. Manufacturing and logistics have been showing signs of normalization following a couple of years with snag after snag due to the COVID-19 pandemic and the recent war in Ukraine. Overwhelming demand for graphics chips across the product spectrum may have pushed Valve to accept a smaller pie of AMD chips than the company would like to, and might be one of the reasons the company was forced to extend deliveries of pre-orders for the device.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

The Exascale supercomputing race is now well underway, as the US-based Frontier supercomputer got delivered, and now we wait to see the remaining systems join the race. Today, during 79th HPC User Forum at Oak Ridge National Laboratory (ORNL), Terri Quinn at Lawrence Livermore National Laboratory (LLNL) delivered a few insights into what El Capitan exascale machine will look like. And it seems like the new powerhouse will be based on AMD's Instinct MI300 APU. LLNL targets peak performance of over two exaFLOPs and a sustained performance of more than one exaFLOP, under 40 megawatts of power. This should require a very dense and efficient computing solution, just like the MI300 APU is.

As a reminder, the AMD Instinct MI300 is an APU that combines Zen 4 x86-64 CPU cores, CDNA3 compute-oriented graphics, large cache structures, and HBM memory used as DRAM on a single package. This is achieved using a multi-chip module design with 2.5D and 3D chiplet integration using Infinity architecture. The system will essentially utilize thousands of these APUs to become one large Linux cluster. It is slated for installation in 2023, with an operating lifespan from 2024 to 2030.

YouTuber Matt Perks, known as DIY Perks on Google's video-sharing platform, has achieved the title of owning the world's first "PS5 Slim" console... by creating a custom watercooling system that's aimed at keeping the AMD-designed chip in check while rendering some of the most impressive games of this generation. Thanks to the custom watercooling unit, the PS5's usual 4-inch width was reduced to a mere inch - and due to improved operating temperatures, it's likely the hardware will see increased longevity. Barring any catastrophic leakage, of course.

Perks made use of a copper sheet to channel water over the PS5's APU, while also including thermal bridges that distributed the contained water throughout the consoles' SSD and power delivery subsystem. There is a secret to the consoles' slim profile, however, which should also answer one question you're holding on your mind: where, in that single inch frame, did he fit the pump and radiator for the embedded watercooling?

AMD is allegedly preparing an upgraded quad-core APU with Zen 4 and RDNA3 architectures for a next-generation Steam Deck device according to Moore's Law is Dead. The report claims that the chip is referred to as a "Van Gogh Successor" internally with a die size between 110 mm² and 150 mm² resulting in an increased production cost. The chip should feature 4 Zen 4 cores and 8 threads offering 25% - 35% higher performance per clock (PPC) with a maximum boost of 4 GHz. The RDNA3 graphics will include 8 Compute Units with significantly higher PPC compared to their RDNA2 counterparts which combined with the updated CPU could see a performance improvement up to 50%. These rumors have not been confirmed with any potential Steam Deck processor far from being announced or released anytime soon.

AYANEO has recently announced the AYANEO 2 featuring AMD's latest "Rembrandt" Ryzen 7 6800U APU with Zen 3+ & RDNA2 architectures. The AMD Ryzen 7 6800U is a mobile processor with a configurable TDP of 15 - 28 W featuring 8 cores and 16 threads with a base clock of 2.7 GHz and a boost of 4.7 GHz. The processor also includes integrated Radeon 680M graphics with 12 RDNA2 cores running at 2.2 GHz which should offer performance almost twice of that as the Steam Deck. This APU is paired with an unspecified amount of LPDDR5 6400 MHz memory and a 7" 1280×800 IPS frameless display. The console is also set to feature an integrated fingerprint sensor and has been showcased running numerous games such as Metro Exodus, Cyberpunk 2077, Witcher 3, and Elden Ring. The AYANEO 2 is set to launch sometime later this year however an exact date or pricing was not shared.

AMD's next-generation Ryzen 7000-series "Phoenix" mobile processors are all the rage these days. Bound for 2023, these chips feature a powerful iGPU based on the RDNA3 graphics architecture, with performance allegedly rivaling that of a GeForce RTX 3060 Laptop GPU—a popular performance-segment discrete GPU. What's more, AMD is also taking a swing at Intel in the CPU core-count game, by giving "Phoenix" a large number of "Zen 4" CPU cores. The secret ingredient pushing this combo, however, is a large cache.

AMD has used large caches to good effect both on its "Zen 3" processors, such as the Ryzen 7 5800X3D, where they're called 3D Vertical Cache (3D V-cache); as well as its Radeon RX 6000 discrete GPUs, where they're called Infinity Cache. The only known difference between the two is that the latter is fully on-die, while the former is stacked on top of existing silicon IP. It's being reported now, that "Phoenix" will indeed feature a stacked 3D V-cache.

Today we got information that AMD's upcoming Instinct MI300 will be allegedly available as an Accelerated Processing Unit (APU). AMD APUs are processors that combine CPU and GPU into a single package. AdoredTV managed to get ahold of a slide that indicates that AMD Instinct MI300 accelerator will also come as an APU option that combines Zen4 CPU cores and CDNA3 GPU accelerator in a single, large package. With technologies like 3D stacking, MCM design, and HBM memory, these Instinct APUs are positioned to be a high-density compute the product. At least six HBM dies are going to be placed in a package, with the APU itself being a socketed design.

The leaked slide from AdoredTV indicates that the first tapeout is complete by the end of the month (presumably this month), with the first silicon hitting AMD's labs in Q3 of 2022. If the silicon turns out functional, we could see these APUs available sometime in the first half of 2023. Below, you can see an illustration of the AMD Instinct MI300 GPU. The APU version will potentially be of the same size with Zen4 and CDNA3 cores spread around the package. As Instinct MI300 accelerator is supposed to use eight compute tiles, we could see different combinations of CPU/GPU tiles offered. As we await the launch of the next-generation accelerators, we are yet to see what SKUs AMD will bring.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

It appears that one of AMD's partners has a Ryzen 7000 CPU or APU, with integrated graphics up and running in Linux. Based on details leaked, courtesy of the partner testing the chip using the Phoronix Test Suite and submitting the results to the OpenBenchmarking database. The numbers are by no means impressive, suggesting that this engineering sample isn't running at the proper clock speeds. For example, it only scores 63.1 FPS in Enemy Territory: Quake Wars, where a Ryzen 9 6900HX manages 182.1 FPS, where both GPUs have been allocated 512 MB of system memory as the minimum graphics memory allocation.

The integrated GPU goes under the model name of GFX1036, with older integrated RDNA2 GPUs from AMD having been part of the GFX103x series. It's reported to have a clock speed of 2000/1000 MHz, although it's presumably running at the lower of the two clock speeds, if not even slower, as it's only about a third of the speed or slower, than the GPU in the Ryzen 9 6900HX. That said, the GPU in the Ryzen 7000-series is as far as anyone's aware, not really intended for gaming, since it's a very stripped down GPU that is meant to mainly be for desktop use and media usage, so it's possible that it'll never catch up with the current crop of integrated GPUs from AMD. We'll hopefully find out more in less than two weeks time, when AMD has its keynote at Computex.

One of the electric vehicle driving forces in the car market, Tesla, has today announced that the company would have to issue a soft recall of a few select car models over an issue with overheating. The affected vehicles are Tesla Model 3 2022, Tesla Model S 2021-2022, Tesla Model X 2021-2022, and Tesla Model Y 2022. Tesla's infotainment system is powered by AMD Ryzen APUs, replacing the Intel Atom CPUs found in the previous models. With Ryzen APUs overheating, the infotainment system can lag or restart and sometimes cause it to get completely turned off. The problem is that the car's liquid cooling will prioritize cooling the batteries instead of the processor, causing it to overheat. Tesla issued a soft recall on these models, meaning that a regular firmware update will fix this issue.

TeslaTesla, Inc. (Tesla) is recalling certain 2021-2022 Model S, Model X, and 2022 Model 3 and Model Y vehicles operating certain firmware releases. The infotainment central processing unit (CPU) may overheat during the preparation or process of fast-charging, causing the CPU to lag or restart. A lagging or restarting CPU may prevent the center screen from displaying the rearview camera image, gear selection, windshield visibility control settings, and warning lights, increasing the risk of a crash. Tesla will perform an over-the-air (OTA) software update that will improve CPU temperature management, free of charge. Owner notification letters are expected to be mailed July 1, 2022. Owners may contact Tesla customer service at 1-877-798-3752. Tesla's number for this recall is SB-22-00-009.

AMD has confirmed its revamped APU strategy will be delivered throughout three different APU line-ups come 2023. While Raphael will take care of AMD's hopes in the desktop space, the company is readying a new, "Dragon Range" lineup of "pinnacle gaming"-oriented APUs, leveraging the company's upcoming Zen 4 architecture, DDR5, and PCIe 5. Dragon Range APUs will feature the "highest core, thread, and cache ever for a mobile gaming CPU" - although AMD stopped just short of confirming exactly what "highest" translates to. To aid in its extreme gaming aspirations, TDP for Dragon Range is set at 55 W - they thus "largely exist in the space where gaming laptops are plugged in the majority of the time," according to AMD director of technical marketing Robert Hallock.

Another APU family, Phoenix, will be aimed at thin and lights with a penchant for gaming. Phoenix too will leverage AMD's Zen 4 core, DDR5 memory subsystem, and PCIe 5 interfaces. Being aimed at thin and lights, Phoenix APUs are set for a 35 W - 45 W operating range. Interestingly, AMD didn't share any other details - more crucially, the graphics architecture that's to be employed in these high-performance APUs.

A Steam Deck enthusiast has done what Steam would not (at least not in the first rendition of its popular Steam Deck handheld console): he went and added an external GPU to the mix. The owner of the ETA Prime YouTube channel managed to increase the Steam Deck's APU-powered graphical oomph with a much more powerful AMD RX 6900 XT graphics card. To do so required sacrifices however: since the SteamDeck doesn't feature a proper Thunderbolt 3/4 connector, ETA Prime had to remove the Steam Deck's SSD from its M.2 port, instead mounting a special M.2 to PCIe adapter in the SSD slot itself.

This, of course, required that installed games be run off memory cards, which generally offer lower speeds (a less than stellar experience) than the onboard SSD. It also required butchering the Steam Deck's OS by replacing it with Windows 11. But it did allow the Steam Deck's APU to tap onto power otherwise unavailable to it, unlocking playable framerates with maxed out detail settings on games such as God of War, Cyberpunk 2077, Elden Ring, and others.

ASRock Industrial announces the 4X4 BOX-5000 Series Mini PCs 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, with enhancement powered by AMD Zen 3 Ryzen 5000 U-Series APUs- Ryzen 7 5800U, Ryzen 5 5600U, and Ryzen 3 5400U up to 8 cores/16 threads to energize performance, energy efficiency, and lower latency. Featuring a powerful yet compact design, the 4X4 BOX-5000 Series supports quad display outputs up to 4K with AMD Radeon Graphics for the enhanced visual experience. The Series also includes dual LAN ports up to 2.5 Gigabit with one DASH function and Wi-Fi 6E support of 6 GHz band for real-time connections. Moreover, it can uphold one M.2 Key M, one SATA 3.0 for storage, and five USB ports (three USB 3.2 Gen 2, two USB 2.0) for ultra-connectivity. The energized features make it the world's most advanced core for a wide range of home and business applications such as gaming, content creation, working from home, KIOSK, digital signage, and many more.

With AMD Ryzen 5000U Series Processors- Zen 3 Core Architecture, the 4X4 BOX-5000 Series Mini PCs deliver energized performance and reduced latency with up to 17% single-thread and multi-thread performance compared to Zen 2 along with improved graphics capabilities with AMD Radeon Graphics. Spanning from the flagship 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, the new Series is powered by AMD Ryzen 7 5800U, Ryzen 5 5600U, Ryzen 3 5400U to increase power efficiency with lower power consumption- 6.7 W at idle. The 4X4 BOX-5000 Series also supports dual-channel DDR4 3200 MHz SO-DIMM memory up to 64 GB for uncompromised multitask computing capabilities.

In addition to the Ryzen 7 5800X3D, which AMD claims to be the world's fastest gaming processor, AMD gave its desktop processor product-stack a major update, with as many as six other processor models spanning a wide range of price-points that help the company better compete with the bulk of the 12th Gen Core "Alder Lake" processor lineup. The new lineup sees the introduction of the Ryzen 7 5700X (not to be confused with the Ryzen 7 5700G). The 5700X is based on the same "Vermeer" multi-chip module (MCM) as the Ryzen 7 5800X, unlike the 5700G, which is a desktop APU based on the "Cezanne" monolithic silicon. Both "Vermeer" and "Cezanne" are based on the "Zen 3" microarchitecture.

The Ryzen 7 5700X is an 8-core/16-thread processor clocked at 3.40 GHz base and 4.60 GHz boost, compared to the 3.80 GHz base and 4.80 GHz boost frequency of the 5800X. Another key difference is its 65 W TDP, compared to 105 W of the 5800X, which could differentiate its boosting behavior and overclocking headroom compared to the 5800X. AMD is pricing the 5700X at USD $299 (MSRP), making it a competitor to the Intel Core i5-12600KF. Interestingly, the retail PIB (processor-in-box) package of the 5700X does not include a stock cooler despite its 65 W TDP. A 95 W-capable Wraith Spire wouldn't have hurt.

AMD Ryzen 7 5800X3D, the company's ambitious new 8-core/16-thread Socket AM4 processor that claims to match the Core i9-12900K "Alder Lake" in gaming performance, will launch at an MSRP of USD $449, according to prices of several upcoming AMD Ryzen processors leaked to the web. The 5800X3D is clocked lower than the 5800X, with 3.40 GHz base and 4.50 GHz boost frequencies, but the large 96 MB L3 cache from the 3D Vertical Cache memory, overcomes this.

The Ryzen 7 5700X is an interesting new 8-core/16-thread part. It's based on the "Vermeer" MCM just like the 5800X, and unlike the 5700G that's based on the "Cezanne" monolithic silicon. The 5700X is clocked at 3.40 GHz base, with 4.60 GHz boost, compared to the 3.80 GHz base and 4.70 GHz boost frequency of the 5800X. The Ryzen 7 5700X is launching at $299 MSRP, which implies that the company is cutting the MSRP of the Ryzen 5 5600X that originally occupied this price-point.Update Mar 9th: Correction: the Ryzen 5 5500 is a 6-core/12-thread part.

MSI released a new gaming desktop, the MAG Trident S 5M, a machine dedicated to cloud gaming and mobile gaming. It is different from traditional gaming desktops and focuses more on helping gamers enjoy games in the living room. Gamers only need to activate the Android system emulator (MSI APP Player) and the 30-day free XBOX GAME PASS ULTIMATE through the Game Stadium software exclusively developed by MSI to control mobile games on the sofa with only one joystick. You can easily access cloud games and other entertainment software.

The exclusive MSI APP Player allows players to emulate the Android system in the Windows system. Gamers can experience mobile games on a larger screen with better performance. They can also use the Multi-Instance Manager function to open different games in different windows. Certain games can also enable joystick mode, allowing players to use the same joystick to play. In STEAM, you can play games through the built-in Big Screen Mode. In Xbox Game Pass Ultimate, there is the same operation mode to let you use the joystick directly so that it can be perfectly applied to various game software.

MSI, a world leader in high-performance and innovative computing solutions, has announced the PRO AP241Z 5M All-in-One PC. Featuring powerful processors and eye care technology with an IPS panel for a wide viewing angle and enhanced viewing experience, PRO AP241Z Series is designed with efficiency and productivity in mind. While most All-in-One PCs in the market utilize mobile-grade processors, the PRO AP241Z 5M features the Desktop-grade AMD Ryzen 5000 Series APU for unparalleled performance. Giving users a better working experience with greater hardware and software support.

PRO AP241Z 5M can help improve workflow and efficiency. With an HDMI-out port, you are able to connect another monitor and easily multitask with navigating multiple windows or documents at the same time. Anti-flicker and low blue light technology for the display help to keep your eyes healthy and reduce fatigue throughout long work hours. Featuring up to AMD Ryzen 7 5700G Processor, PRO AP241Z stays responsive with low load times when multi-tasking while remaining cool thanks to its Server-grade cooling system to reduce CPU thermal throttling. Information security is always one of the most important things for businesses; the PRO AP241Z supports FW TPM technology which can protect device data from attacks by malicious software and unauthorized access.

If you've been waiting for more details about AMD's next mobile platform, then you're in luck, as the motherload has dropped today, with lots of details about the new Rembrandt APU's that are launching next year. Not only has a picture of the first motherboard, with adhering laptop showed up, but we also have a mostly complete block diagram and a list of expected SKU's, even though not all SKU models are revealed as yet.

AMD's Rembrandt APU will be its first APU with PCIe 4.0 support, which in itself might not be worth the wait, but if paired with the right GPU, this might help increase the performance somewhat compared to the previous generation of APUs from AMD. The bigger news is USB4 support, plus a new GPU which we so far don't know too much about, but it's speculated that it'll be called Radeon RX 680M and should offer 12 compute units. DDR5 memory support is also expected, so Rembrandt clearly has a new memory controller, since the APU is still based on the Zen 3 architecture.