MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

AMD is giving final touches to its Ryzen 7000G series desktop APUs that bring the 4 nm "Phoenix" monolithic processor silicon to the Socket AM5 desktop package. The star attraction with these processors is their large iGPU based on the latest RDNA3 graphics architecture, featuring up to 12 compute units worth 768 stream processors, and full DirectX 12 Ultimate feature-set support. These processors should be able to provide 720p to 1080p gaming with entry-medium settings, where you take take advantage of FSR for even better performance. At this point we don't know whether the Ryzen AI feature-set will make its way to the desktop platform. "Phoenix" features an 8-core/16-thread CPU based on the latest "Zen 4" microarchitecture.

An interesting development here is that not only is AMD bring the "Phoenix" silicon to the desktop platform, but the processor models highlighted in this leak reference the smaller "Phoenix 2" silicon. This chip is physically smaller, features a CPU with two "Zen 4" and four "Zen 4c" cores; and an iGPU that has no more than 4 compute units worth 256 stream processors. The OPN codes of at least three processor models surfaced on the web. These include the Ryzen 5 PRO 7500G (100-000001183-00), the Ryzen 5 7500G (100-00000931-00), and the Ryzen 3 7300G (100-000001187-00). No specs about these chips are known at this point. The PRO 7500G and regular 7500G are expected to feature the full 2+4 core configuration, while the 7300G could probably feature a 2+2 core configuration. If the company does plan a 7600G and 7700G, those would likely be based on "Phoenix" with 6 or 8 regular "Zen 4" cores.

In recent developments, Linux's open-source graphics ecosystem is making significant strides to accommodate AMD's upcoming RDNA3.5 architecture, also known as RDNA3+ or GFX11.5. Mesa 23.3, a library in the Linux graphics software stack, is now being updated for RDNA3.5, marking a substantial milestone. This upcoming update is particularly tailored for the impending Ryzen 8000 "Strix Point" APU series, which will incorporate the Navi 3.5 architecture. While AMD has maintained secrecy regarding specific enhancements accompanying this refresh, we expect decent performance improvements. This includes the anticipation that the Ryzen 8000 APUs will feature an increased number of Compute Units (CUs), where the current highest number is 12 CUs, and the increase could bump that figure to 16 CUs. The official announcement of the Ryzen 8000 series is expected in early 2024 when we will learn more about its GPU configuration and performance.

AMD is preparing to launch its first APUs on the Socket AM5 desktop platform, with the Ryzen 7000G series. While the company has standardized integrated graphics with the Ryzen 7000 series, it does not consider the regular Ryzen 7000 series "Raphael" processors as APUs. AMD considers APUs to be processors with overpowered iGPUs that are fit for entry-mainstream PC gaming. As was expected for a while now, for the Ryzen 7000G series, AMD is tapping into its 4 nm "Phoenix" monolithic silicon, the same chip that powers the Ryzen 7040 series mobile processors. Proof of "Phoenix" making its way to desktop surfaced with CPU support lists for the latest AGESA SMUs (system management units) compiled by Reous, with the AGESA ComboAM5PI 1.0.8.0 listing support for "Raphael," as well as "Phoenix." Another piece of evidence was an ASUS B650 motherboard support page that listed a UEFI firmware update encapsulating 1.0.8.0, which references an "upcoming CPU."

Unlike "Raphael" and "Dragon Range," "Phoenix" is a monolithic processor die built on the TSMC 4 nm foundry node. Its CPU is based on the latest "Zen 4" microarchitecture, and features an 8-core/16-thread configuration, with 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The star attraction here is the iGPU, which is based on the RDNA3 graphics architecture, meets the DirectX 12 Ultimate feature requirements, and is powered by 12 compute units worth 768 stream processors. Unlike "Raphael," the "Phoenix" silicon is known to feature an older PCI-Express Gen 4 root complex, with 24 lanes, so you get a PCI-Express 4.0 x16 PEG slot, one CPU-attached M.2 NVMe slot limited to Gen 4 x4, and a 4-lane chipset bus. "Phoenix" features a dual-channel (4 sub-channel) DDR5 memory controller, with native support for DDR5-5600. A big unknown with the Ryzen 7000G desktop APUs is whether they retain the Ryzen AI feature-set from the Ryzen 7040 series mobile processors.

Earlier this year, we introduced the world to the ROG Ally: a Windows gaming handheld that can play all your games, anywhere you go. With its bright and colorful 1080p 120 Hz screen, ergonomic form factor, and incredible AMD Ryzen Z1 Extreme APU, the ROG Ally is a AAA monster, taking modern handhelds to a new level. Now, we're happy to announce that the Ryzen Z1 variant of the ROG Ally is also available for purchase, with all the same features and a more affordable price tag.

The AMD Ryzen Z1 comes is built on the same Zen 4 architecture as the Ryzen Z1 Extreme, with the latest RDNA 3 graphics engine and full support for AMD's incredible upscaling technologies like FidelityFX Super Resolution (FSR) and Radeon Super Resolution (RSR). With six cores and twelve threads alongside four graphics compute units, the Ryzen Z1 has the same robust power delivery and ROG Intelligent Cooling improvements that make the Z1 Extreme so potent, at a more affordable price.

Lenovo's newly released ultra-thin Yoga Air 14s 2023 Ryzen Edition laptop packs an exclusively tuned variant from AMD's 7040 "Phoenix" APU series—we are seeing a whole bunch of these mobile chipsets finally arriving inside portable computer hardware and in handheld games systems (Ryzen Z1 series), following several delays earlier in the year. AMD and Lenovo have partnered up on a special Ryzen 7 7840S eight-core APU, with a custom 30 W TDP profile—likely implemented to synergize with the Yoga Air's thin and lightweight design. Folks in the west have started to enjoy playing around with Ryzen 7 7840HS-equipped laptops, this particular APU has a 45 W TDP rating—also shared by China-market specific 7840H variants.

The MyDrivers review team has been taking Lenovo's Yoga Air 14s 2023 Ryzen Edition for a spin—PC Mark results suggest 10 to 11 hours of normal operation on battery, while lighter office tasking bumps that up to 14 hours. A snazzy 14.5-inch OLED screen with 10-touch support seemed to be a highlighted feature on this fancy slimline laptop. A 5% overall difference in performance (across a number of benchmark suites) was noted by the reviewer—a flagship Ryzen 9 7940HS (45 W) APU narrowly beat its less greedy 30 W sibling. The Yoga Air was judged to offer "top tier" performance that competes with a larger class of notebook (15.6-inch). The reviewer was suitably impressed by Lenovo's chassis design: "To be honest, there are very few thin and light notebooks on the market priced at 8,000 yuan (~$1095) that can surpass Yoga Air 14s 2023 Ryzen Edition in terms of appearance and craftsmanship."

The 4 nm "Phoenix 2" monolithic APU silicon powering the lower end of AMD's Ryzen 7040-series mobile processors, could very well be the company's first hybrid core processor, even though the company doesn't advertise it as such. We first caught whiff of "Phoenix 2" back in July, when it was described as being a physically smaller chip than the regular "Phoenix." It was known to have just 6 CPU cores, and a smaller iGPU with 4 RDNA3 compute units; in comparison to the 8 CPU cores and 12 compute units of the "Phoenix" silicon. At the time a lack of 2 CPU cores and 8 CUs were known to be behind the significant reduction in die size from 178 mm² to 137 mm², but it turns out that there's a lot more to "Phoenix 2."

A die shot of "Phoenix 2" emerged on Chinese social media platform QQ, which reveals two distinct kinds of CPU cores. There are six cores in all, but two of them appear larger than the other four. The obvious inference here, is that the larger cores are "Zen 4," and the smaller ones are the compacted "Zen 4c." The "Zen 4c" core has the same core machinery as "Zen 4," albeit it is re-arranged to favor lower area on the die. The trade-off here is that the "Zen 4c" core operates at lower voltages and lower clock-speeds than the regular "Zen 4" cores. At the same clock speeds, both kinds of cores have an identical IPC. The two also have an identical ISA, so any software threads migrating between the cores will not encounter runtime errors. Unlike Intel Thread Director, AMD can use a less sophisticated software-based solution to ensure that the right kind of workload is allocated to the right kind of cores, and prevent undesirable migration between the two kinds of cores. Unlike the hardware-based Thread Director, AMD's solution can be continually updated.

PerformanceDatabases has uncovered details relating to an alleged engineering sample of AMD's Ryzen 8000 "Strix Point" APU—likely insider sourced CPU-Z screengrabs from early last month revealed that the upcoming Zen 5-based laptop chip (in their words): "is built on a 4 nm Process and features the Big.Little CPU architecture with 4 Performance Cores and 8 Efficiency Cores. Both the P and E-Cores support hyper-threading. On the P-Core and E-Core, the L1 Data cache is 48 KB, while the L1 instruction cache is 32 KB. Each P Core boasts 1 MB of cache, and with E-Cores, it looks like there are 4 in a group, sharing 1 MB of L2 Cache. This setup is quite similar to Intel's design. Keep in mind, it's still in the engineering sample (ES) stage, so there's more to come. We'll keep you posted on any further updates!"

Another "AMD Strix - Internal GPU" example emerged late last week, this time in the form of a leaked HWInfo64 screen grab with some information completely covered up—the visible parts seems to point to this "Strix Point" APU featuring a core configuration as seen in the earlier leak, along with 1024 unified shaders. We can presume that the sampled Zen 5-based mobile APU possessing 16 RDNA 3.5 compute units (16 × 64 = 1024). Other details include a 45 W TDP rating, and the socket type being FP8 (as utilized by current Ryzen 7040U and 7040H(S) mobile SoCs). The 512 MB GDDR6 memory configuration is very likely an error—according to HWInfo64, the tested system was fitted with 32 GB of LPDDR5 memory. "Strix Point" looks to be the logical successor (in 2024) to AMD's current "Phoenix" lineup of mobile processors, as featured in gaming handhelds and laptops. PC hardware enthusiasts are expressing excitement about the upcoming APU series wielding impressive iGPU performance, with the potential to rival modern discrete mobile solutions.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

Lenovo's Legion Go handheld gaming system was uncovered by Windows Report over a week ago following a series of minor leaks emerging throughout the summer. Key points of discovery included an AMD Ryzen Z1 APU, detachable Joy-Con-esque controllers and Windows 11 being the operating system of choice. The news site has today divulged even more details, thanks to a trusted anonymous source sending in an official product press release. It seems that Lenovo is planning to unveil the Go and matching accessories (AR glasses & headphones) at next month's IFA 2023 trade fair in Berlin. The handheld gaming device could launch in early October, with the base model starting at $799 (MSRP).

According to the leaked document, Lenovo's Legion Go is specced with an 8.8 inch, 2560 x 1600 pixel 144 Hz refresh rate IPS LCD touchscreen display—its maximum brightness is allegedly rated at 500 nits. AMD's Ryzen Z1 Extreme APU—that debuted with the ASUS ROG Ally—appears to run the show. The leak also indicates that 16 GB of LPDDR5X-7500 memory is soldered to the Go's mainboard, alongside a user-replaceable PCIe 4.0 NVMe M.2 2242 SSD. The document infers that Lenovo is prepping variants with 256 GB, 512 GB, and 1 TB SSD storage configurations.

AMD is aiming to launch its Ryzen 8000 desktop CPUs, codenamed "Granite Ridge," at some point next year. The next generation Zen 5 core microarchitecture is expected to arrive alongside (Navi) RDNA 3.5 iGPU cores according to the last batch of Team Red product roadmaps. Today, hardware tipsters Olrak29_ and Kepler_L2 have made claims on social media that part of the Ryzen 7000 CPU legacy will continue with the succeeding desktop processor lineup—we already know that Granite Ridge will exist as a Socket AM5 package, but today's leak proposes that these next-gen chips are lined up to utilize the same IO die as sported by AMD's current Zen 4 desktop family.

These new rumors suggest that the "reused" Ryzen 7000 IOD (I/O Die) chiplet will grant the familiar allocation of 28 PCIe Gen 5 lanes, memory controllers, USB functions, plus RDNA 2 iGPU cores. Wccftech points out that: "...interestingly, AMD lists the Ryzen 7000 "desktop" CPUs with Navi 3.0 support whereas the Radeon 710M iGPU in fact is based on the RDNA 2 graphics core. The next-gen lineup was mentioned to support the newest RDNA 3.5 GPU core which will be coming to the Strix APU family next year but that isn't the case either." The article proposes that "RDNA 3.5 GPU cores on the AM5 platform" could arrive with the advent of upcoming Ryzen APUs—namely 6 nm Rembrandt (6000G) and 4 nm Phoenix (7000G) desktop solutions.

After a couple of speculations, rumors, and leaks, the latest one confirms that Lenovo is indeed working on a handheld gaming console, the Legion Go, and it could be launching pretty soon. The latest leak shows it powered by AMD Ryzen Z1 APU and featuring detachable JoyCon-like controllers. It will run on Windows 11 OS and could be paired up with the Legion AR Glasses.

Unfortunately, the leak over at Windowsreport.com show does not include specifications, but according to pictures, it will feature dual speakers, two mics, microSD card reader, a couple of USB-C ports, dedicated FPS switch, a mouse wheel, integrated kickstand, and AMD Ryzen Z1 APU, same as the ASUS ROG Ally. Unfortunately, it is not clear if it will be the Ryzen Z1 or the Ryzen Z1 Extreme APU.

Based on details posted on Twitter/X by a pair of well known leakers, AMD appears to be working on a pair of different Ryzen 8000-series mobile processors. The previously known Strix Point is said to get up to four Zen 5 cores and eight Zen 5c cores, whereas the Strix Halo is said to get 16 Zen 5 cores, according to @Olrak29_. This is something that was posted by Moore's Law is Dead back in April as well, who claimed the chip will launch sometime at the end of 2024. MLID also suggested that the Strix Halo will feature a 40 CU GPU and a 256-bit LPDDR5X memory interface, making it a very different proposition from your average APU from AMD.

@kopite7kimi chimes in on Twitter to point out that "Strix Halo looks like a desktop Zen 5 with a different IOD." This is definitely something that would be possible for AMD to do and if we look at the MLID information, the Strix Halo processor appears to have something called a Mall Cache, which seems to be something of a catch all cache for the various components inside the chip, such as the AI Engine and the GPU. Time will tell if AMD delivers on Strix Halo or not, but this might be the first notebook processor that can handle gaming at a decent resolution without needing a discrete GPU. Then again, with a rumoured peak TDP of 120 W, this chip is also going to run hotter and draw more power than most mobile processors to date.

SolidRun has announced the world's first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun's Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.

Talking with XDA-Developers, AMD has confirmed more details about the upcoming Phoenix2 APU, which should debut with Ryzen 3 7440U and Ryzen 5 7540U APUs. Unlike the larger Phoenix APU, the Phoenix2 APU will have a hybrid design with Zen 4 and Zen 4c cores. As confirmed by AMD, the Phoenix2 APU will be a 6-core design, which makes it pretty clear it will feature two Zen 4 and four Zen 4c cores. It will also come with a Radeon 740M GPU with 4 RDNA3 compute units (CUs). The Phoenix2 APU will also lack the Ryzen AI core. Unlike Intel's hybrid approach, Zen 4c cores will have the same IPC as Zen 4, same instructions, but have less L3 cache per core.

AMD has previously confirmed that the Ryzen 3 7440U will have a smaller die size of 137 mm², compared to 178 mm² on the Ryzen 5 7640U. While AMD did not directly confirmed that the Ryzen 5 7540U will also be based on the Phoenix2 APU, official specification shows it with the same 4 GPU cores and without Ryzen AI core, making it pretty obvious it will be based on the same Phoenix2 APU. Hopefully, AMD will come up with more official details about its Phoenix2 APU as there are still a lot of unknowns.

Intel decided to drop the relatively new AVX-512 instruction set for laptop/mobile platforms when it was discovered that it would not work in conjunction with their E-core designs. Alder Lake was the last generation to (semi) support these sets thanks to P-cores agreeing to play nice, albeit with the efficiency side of proceedings disabled (via BIOS settings). Intel chose to fuse off AVX-512 support in production circa early 2022, with AMD picking up the slack soon after and working on the integration of AVX-512 into Zen 4 CPU architecture. The Ryzen 7040 series is the only current generation mobile platform that offers AVX-512 support. Phoronix decided to benchmark a Ryzen 7 7840U against older Intel i7-1165G7 (Tiger Lake) and i7-1065G7 (Ice Lake) SoCs in AVX-512-based workloads.

Team Red's debut foray into AVX-512 was surprisingly performant according to Phoronix's test results—the Ryzen 7 7840U did very well for itself. It outperformed the 1165G7 by 46%, and the older 1065G7 by an impressive 63%. The Ryzen 7 APU was found to attain the highest performance gain with AVX-512 enabled—a 54% performance margin over operating with AVX-512 disabled. In comparison Phoronix found that: "the i7-1165G7 Tiger Lake impact came in at 34% with these AVX-512-heavy benchmarks or 35% with the i7-1065G7 Ice Lake SoC for that generation where AVX-512 on Intel laptops became common."

As reported by Phoronix—references to GFX1150 & GFX1151 targets have been added to the AMDGPU LLVM backend/compiler, which seems to indicate that these are upcoming AMD APU models. AMD engineers have made to reference to GFX1150 as "Strix1" (full codename: Strix Point) in the past according to several sites, but the recent leak has GFX1151 mentioned for the first time.

Previous reports suggest that Team Red could be developing two Strix/Zen 5/RDNA 3.5 APUs with AI engine enhancements for laptops—a discovery of two separate GFX targets suggests that we are likely looking at different 12-core and 16-core models. The former is said to be a monolithic design with a TDP going up to 54 W. The 16-core "Strix Halo" (also known as "Starlak") is a very different type of product with leaks suggesting that it will have a maximum TDP of 120 W, and be based on a chiplet design. Zen 5 processor products are expected to arrive in the second half of 2024—with Granite Ridge filling in the desktop platform segment.

AMD's laptop-oriented Ryzen 7040 series of Zen 4 processors APUs—based on 4 nm "Phoenix" monolithic silicon—have been slow to hit the market, but folks have had plenty of time to study spec sheets and press material. The presence of similar-ish 7040HS and 7040H product assignments (also sharing nearly identical specifications) has caused some confusion within the PC hardware community. Team Red has finally got round to explaining the significance of their -HS and -H identifiers—product pages were updated with new information this month, showing that the Ryzen 7040H series exists as a Chinese market exclusive. NA, EMEA, APJ, LATAM regions will be getting the closely related Ryzen 7040HS lineup instead. ASUS, Lenovo, and Machenike are set to launch new laptop models in China that will feature Ryzen 7040H APUs—VideoCardz found it interesting that "some of them will not have discrete graphics and will have a higher TDP of 65 W".

Competition in the handheld gaming PC space is heating up yet again with AYA NEO releasing more teaser material for its upcoming NEXT II model - an estimated late 2023 launch is touted. This model was first revealed last year, with the company choosing to drip feed information since then. We know that it will sport an 8-inch IPS display and be powered by an AMD Ryzen 7000 series APU, plus an unspecified discrete GPU. The ASUS ROG Ally handheld is similarly equipped with AMD mobile chipsets (albeit in slightly "Z1" and "Z1 Extreme" customized forms), but an integrated GPU takes care of graphics processing. In contrast the AYA NEO NEXT II has been designed to temper an APU and dGPU combination that can pull up to 100 W of power, so this package will offer far less portability when compared to the competition.

AYA NEO appears to be branching out in the creation of larger handheld gaming computers - the NEXT II is the chunkiest example so far - with more sizable options marked for release in the future. Comparisons to Valve's Steam Deck have been made due to AYA NEO's debuting of touchpads for this model - yet this new contender is a different beast thanks to a more traditional control layout and the system's reliance on a power outlet being nearby to sustain lengthy gaming sessions. The "semi-portable" nature of the NEXT II (plus proposed successors) is a curious prospect - will its unparalleled performance potential be enough to attract buyers or will its appeal be limited by being anchored to indoor environments?

AMD is reported to be forming plans for its Instinct MI400 Accelerator series, according to a leaked internal email. This information was shared by a hardware tipster (HXL/@9550Pro) on Twitter, but their post has been deleted as some point today. Wccftech was quick enough to note down the details, and their report suggests that AMD is already making plans for an APU range that is set to succeed the unreleased Instinct MI300 lineup (expected later in 2023). Instinct MI400 accelerators are touted to drive next generation data center and cloud platforms.

The leaked email email contained information about three upcoming products: Weisshorn, MI450 and XSwitch. Kepler's recent tweet posits that Weisshorn is AMD's in-house moniker for Zen 6 "Morpheus" architecture-based Venice CPUs - these are alleged to form part of an upcoming EPYC lineup (slated for 2025 or 2026). Hardware experts reckon that AMD will introduce a new interconnect fabric with the MI400 series - "XSwitch" is speculated to be the company's main technological answer to NVIDIA's NVLINK.

Acer today announced the refreshed Acer Swift Edge 16 (SFE16-43) laptop, designed for dynamic professionals requiring high computing capability, productivity, and portability from their hardware. The lightweight laptop is powered by AMD Ryzen 7040 Series processors and up to AMD Radeon 780M graphics for next-gen performance and visuals, and features AMD Ryzen AI on select models with select processors, enabling the device to keep up with today's AI demands and more.

The Swift Edge 16 showcases a stunning 16-inch 3.2K OLED display with an upgraded refresh rate of 120 Hz and support for 100% DCI-P3 color gamut to provide true-to-life colors and images. The Windows 11 laptop also boasts compatibility with up to Wi-Fi 7, Microsoft Pluton, and a range of smart features so users can stay connected to fast wireless connections and have private data secured.

The future is here. The Republic of Gamers is proud to announce the ROG Ally, a brand-new Windows 11 gaming handheld featuring a 7-inch 1080p screen, up to 512 GB of NVMe storage, and enough power to play the latest AAA games at smooth framerates. Sporting an AMD Ryzen Z1 Extreme APU, the Ally has incredible graphics performance, rivaling modern living room consoles while weighing in at a lightweight 608 grams.

The Ally ushers in a new generation of handheld gaming consoles. Handhelds have always been a frustratingly compromised experience, with lower resolution graphics, lower framerates, and clunky controls - they allowed you to play games on the go, but it was never the same as the living room. In fact, many titles were handheld-friendly spinoffs of their console counterparts, rather than the same game. Now, all that changes: the Ally lets you play all your games, from any platform, wherever you go. Welcome to a new age of portable gaming.

The ASUS ROG Ally handheld games console emerged last month and it was revealed to pack some impressive "custom" AMD hardware - the two companies have boasted that the collaboration has resulted in two special SoCs - the Ryzen Z1 and Ryzen Z1 Extreme. Silicon enthusiasts were quick to point out that the Z1 series sported similar specifications to mobile/ultra-portable chipsets in AMD's 7040U family - in particular the Ryzen 7 7840U looks almost identical to its gaming equivalent (Ryzen Z1 Extreme). Andrew E. Freedman at Tom's Hardware was curious and motivated enough to request clarification (about this situation) from AMD. Team Red were happy to respond and acknowledged the apparent similarities between the gaming and laptop chipset ranges, but also stated that Z1 APUs have been tweaked by company engineers to a certain degree.

Matthew Hurwitz, a client PR manager at AMD, provided a response to the Tom's Hardware-issued query: "The Ryzen Z1 series are purpose-built with handheld gaming in mind. To accomplish this, AMD engineers had to validate entirely new power ranges and optimize the voltage curves specifically for this use case - this optimization and validation work should not be trivialized. So while the technology building blocks (like 'Zen 4' and RDNA 3) are similar between the 7040 and Z1 series, the resulting models have very distinct characteristics customized for their use cases. In addition, the AMD Ryzen AI engine is not available on AMD Ryzen Z1 series processors." Hurwitz also confirmed that AMD's XDNA AI engine is merely disabled (so not removed at hardware level) on the two Z1 APUs - this feature is only enabled on the range-topping Ryzen 7 7840U model and mid-range Ryzen 5 7640U. So yes, there are small differences but AMD and ASUS have probably saved some money on development costs by creating and adopting the "slightly adjusted" Z1 SoC series.

Update May 6th: Tom's Hardware has amended their article (as of May 5, 5:03 p.m. ET) - another source within AMD has informed them about the Z1 and Z1 Extreme APUs having configurable TDPs of 9 W to 30 W. The original story - and AMD's website - claimed a range of 15-30 W.

AMD is reported to be reissuing its old Zen+ (12 nm) tech in order to meet demand for cheaper, lower-end systems in China, according to information released by Board Channels this week. The insider source claims that a new production order has been placed for Ryzen 3000G series APUs (requesting up to 30,000 units) and these processors are likely to be sold as part of hardware bundles with (similar vintage) low-end AM4-based motherboards - for example the B450 and A320 series, these older boards are still popular budget choices in China and readily available. The leak does not mention whether AMD is choosing to issue completely new hardware or if it is simply reproducing its 2019-era SKUs.

AMD released two Ryzen 3000G models back in 2019 - the 3400G and 3200G, both are quad-core Picasso APUs although the latter is lacking in simultaneous multithreading. It is not clear whether the super low budget AMD Athlon 3000G model will be included as part of the alleged 30K unit order. The 3000G series' onboard iGPUs (based on AMD's first generation Vega architecture) are likely preferred by the budget-conscious buyer since a discrete graphics card is not an essential part of builds intended for an office setting or a simple/functional home computer setup.

AMD is late in releasing its Phoenix Zen 4 lineup of mobile APUs - the original April launch has been missed, and laptops bearing Ryzen 7000HS & H-series are expected to arrive at some point this month. Preview hardware has made its way into the hands of testers, and one particular outlet - Golden Pig Upgrade, a content creator on the Chinese Bilibili video site - has performed benchmark tests. He seems to be the first reviewer to get hands-on time with AMD Ryzen 7040 Phoenix APUs, and his findings point to class leading performance results in terms of graphical capabilities - the 7840HS (packing a Radeon 780M RDNA3 iGPU) is compared to the Rembrandt-based 7735H, as well as a pair of Intel Raptor Lake CPUs - the 13700H and 13500H models.

AMD's newest Phoenix APU is the group leader in GPU performance stakes, but the jump up from the last-gen Rembrandt (RDNA2 iGPU) chip is not all that significant. VideoCardz reckons that the Radeon 780M integrated GPU is roughly equivalent to an NVIDIA GeForce MX550 dGPU and not far off from a GeForce GTX 1650 Max-Q graphics card (in terms of benchmark performance). According to AMD's internal documentation the RDNA 3 core architecture utilized in Phoenix APUs is referred to as "2.5" so this perhaps explains why the 780M is not doing laps around its older silbing(s).