Here is the first picture of the AMD Ryzen 7 4700G, the company's upcoming socket AM4 APU based on the 7 nm "Renoir" silicon, courtesy of VideoCardz. The picture reveals a standard-looking socket AM4 chip with commercial name and OPN markings (100-000000146), matching the Igor's Lab OPN code leak from earlier this week. The Ryzen 7 4700G offers an 8-core/16-thread CPU based on the "Zen 2" microarchitecture, and an integrated graphics solution that combines the SIMD machinery of the "Vega" graphics architecture, with the updated display- and media engines of "Navi." The iGPU is configured with 8 CUs (512 stream processors), which on the 4700G has an impressive maximum engine boost clock of 2.10 GHz, according to the Igor's Lab story.

The 8-core/16-thread CPU of the Ryzen 7 4700G has a nominal clock speed of 3.60 GHz, and a maximum boost frequency of 4.45 GHz, with several Precision Boost power-states in both directions of the nominal clock. The CPU features 512 KB of L2 cache per core, and 8 MB of shared L3 cache (4 MB per CCX). The iGPU engine clock goes all the way up to 2.10 GHz, which could help it overcome some of the CU deficit vs. "Picasso," which has 11 CUs (704 stream processors), but clocked only up to 1.40 GHz. Since the Ryzen 5 3400G has an unlocked multiplier, it stands to reason that even the 4700G could. If the platform I/O of "Renoir" in its mobile avatar is anything to go by, then the 4700G could feature a limited PCI-Express x8 lane setup for its PEG port. AMD is rating the TDP of the 4700G at 65 W.

Igor's Lab discovered that AMD may be working on as many as twelve desktop Ryzen G "Renoir" processors with integrated graphics. These include six SKUs each covering the 65 W and 35 W TDP categories, and include two each of 8-core/16-thread, 6-core/12-thread, and 4-core/8-thread SKUs per TDP category. All twelve chips feature increased power limits from their mobile siblings, and a reference memory frequency of DDR4-3200. The parts also feature iGPU maximum engine clock boost frequency as high as 2.10 GHz, to overcome the compute unit deficit "Renoir" has against its predecessor, "Picasso/Raven Ridge," with their up to 11 CUs.

The series appears to be led by an 8-core/16-thread SKU with CPU boost frequency as high as 4.45 GHz, iGPU engine clock as high as 2.10 GHz, and various power-state clock speeds detailed in the table below. The 6-core/12-thread part boosts up to 4.30 GHz, with iGPU engine clock up to 1.90 GHz. The 4-core/8-thread part boosts up to 4.10 GHz, with up to 1.70 GHz iGPU engine clocks. The 35 W TDP parts have, on average, 200-300 MHz lower max CPU core boost- and nominal clock speeds, but more aggressive power-management as defined in the various P-states. Half of these OPNs point to chips with identical clock speeds and core configurations. These are probably differentiated from each other with some of them being Ryzen PRO SKUs.

MediaTek today announced enhancements to its Dimensity 5G chipset family with the Dimensity 1000+, an enhanced 5G-integrated chip with a number of leading technologies and upgrades for gaming, video and power-efficiency.

Dimensity 1000+ is based on the flagship performance of the Dimensity 1000 series and delivers a high-end, premium user experience. With years of accumulated experience in integrated chip technologies, MediaTek has made breakthroughs and innovations in all aspects and has become a pioneer in the 5G era.

Earlier this year Chinese PC manufacturer Chuwi announced the AeroBox a new high performance mini office PC utilizing the yet to be announced AMD A9-9820 APU. The AeroBox looks suspiciously like a certain games console from afar and now in an exclusive with TechRadar Pro a Chuwi spokesperson confirmed that the Chuwi AeroBox will use the same motherboard as the Xbox One S. The spokesperson also described the AMD A9-9820 APU chip found inside the PC as a "new 7th-generation chip" that runs on Windows 10."

The A9-9820 is a eight core chip with a max frequency of 2.35 GHz and will be paired with a Radeon R7 350 GPU running at up to 985 MHz. The A9-9820 is expected to be based on the Jaguar microarchitecture like the APU found in the Xbox One S and use DDR3 memory. The AeroBox features four DDR3 slots and room for an 2.5" drive, in its base configuration the AeroBox will come with 8 GB of DDR3 memory and a 250 GB M.2 SATA SSD. Chuwi is yet to announce a price for the AeroBox and has confirmed it won't be available outside of Japan at launch.

Microsoft has confirmed the official specs for the Xbox Series X games console, due Holiday 2020 (think November). The new specs announcement confirms the powerhouse of a console this will be, with its peak 12 TFLOPs compute being 8 times that of the original Xbox One, and twice that of the Xbox One X, which already quite capable of powering true 4K experiences. This 12 TFLOPs figure is a mighty impressive one - just consider that AMD's current highest-performance graphics card, Radeon VII, features a peak 13.4 TFLOPs of computing power - and that's a graphics card that was launched just a year ago.

The confirmation also mentions support for Hardware-Accelerated raytracing, something that all but confirms the feature being built into AMD's RDNA 2 microarchitecture (of which we are expecting news anytime now). this, alongside Variable Rate Shading (VRS) support, brings AMD to feature parity with NVIDIA's Turing, and should allow developers to optimize their performance and graphical targets without any discernible quality loss.

A video posted by Notebook Italia may have spilled the beans on a whole new tier for AMD's mobile APUs. The video, which has since been taken down, showed Lenovo's upcoming Yoga Slim 14, which was listed in its specs list with an AMD Ryzen 9 4900U. Of course, the need for such an SKU is debatable: it's relatively unlikely AMD would bring more than 8 cores and 16 logical threads to the mobile landscape and its higher concern with autonomy rather than pure performance. Especially when one considers the particular Lenovo model involved: the Yoga lineup isn't so much associated with ultimate performance. However, there are desktop-replacement scenarios where users might definitely want to see a more than 8-core CPU powering their machine.

That said, this could simply be a higher clocked 8-core (the Ryzen 7 4800U does feature a base 1.8 GHz/up to 4.2 GHz boost clocks, so there's room for improvement). The Yoga Slim 14 where the Ryzen 9 4900U was listed does only weigh 1.1 Kg and has a quoted 11 hour battery life on the 4K screen option (versus 14 hours on the FHD version). We'll just have to wait and see, with our thinking hats on. A typo is possible, but hard to make in both the physical specs list on the pictures, and on the official Lenovo website. The fact that the original video has since been edited with the specs list obscured definitely means something's afoot. This could also be another AMD bullet for the mobile market, where it has achieved its biggest share growth in recent times.

ASRock at CES 2020 showcased their newfound commitment to AMD APUs and CPUs in the form of their new 1-liter Jupiter A320 mini-PC and the A320-M motherboard. The A320-M motherboard supports up to 65 W AMD APUs, features dual SODIMM memory sticks support, includes 1x NVMe M.2 storage slot and 1x SATA. Video outputs include 2x HDMI and one D-Sub.

ASRock also showcased their Jupiter A320 Mini-PC, which was previously an Intel-only product but will now be offered with AMD innards as well. Offering support for up to 65 W AMD APUs, the Jupiter A320 offers 2x NVMe M.2 storage expansion, 1x SATA, and 8x USB (including 2x Type C and 2x Type-A in the front panel). Video output is taken care of by 1x DisplayPort or 1x HDMI.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

A prominent Taiwanese newspaper reported that AMD will formally unveil its next-generation "Zen 3" CPU microarchitecture at the 2020 International CES. Company CEO Dr Lisa Su will head an address revealing three key client-segment products under the new 4th generation Ryzen processor family, and the company's 3rd generation EPYC enterprise processor family based on the "Milan" MCM that succeeds "Rome." AMD is keen on developing an HEDT version of "Milan" for the 4th generation Ryzen Threadripper family, codenamed "Genesis Peak."

The bulk of the client-segment will be addressed by two distinct developments, "Vermeer" and "Renoir." The "Vermeer" processor is a client-desktop MCM that succeeds "Matisse," and will implement "Zen 3" chiplets. "Renoir," on the other hand, is expected to be a monolithic APU that combines "Zen 2" CPU cores with an iGPU based on the "Vega" graphics architecture, with updated display- and multimedia-engines from "Navi." The common thread between "Milan," "Genesis Peak," and "Vermeer" is the "Zen 3" chiplet, which AMD will build on the new 7 nm EUV silicon fabrication process at TSMC. AMD stated that "Zen 3" will have IPC increases in line with a new microarchitecture.

Following the previous report about AMD's upcoming "Renoir" APU lineup of processors for notebook and desktop, we have new information about the new processor models and their configurations. Supposed to launch in early 2020, the Renoir lineup is supposed to feature up to 8 cores and 16 threads in high-end models. Dubbed Ryzen 4000 series, the new APU lineup will be available in four configurations determined by its TDP: 15 W and 45 W chips for notebooks, and 35 W and 65 W variants meant for desktop.

According to WCCFTech, AMD will launch high-performance Ryzen 9 4900H and Ryzen 7 4800H APUs soon in the first notebooks. Supposed to be part of the "H" series of mobile APUs, these models will feature high core count, that can reach up to 8 cores, SMT support as well, all within TPD of 45 Watts. A power-optimized Ryzen 7 4800HS has also appeared in the listings as a lower clocked alternative to Ryzen 7 4800H, which is supposed to feature lower TDP as well. All of the former processors appear listed as the base of ASUSes upcoming GA401 and GA502 laptops, featuring 16 GB of RAM, Windows 10, and a 14-inch display. While configurations of the laptop will affect its price, Ryzen 7 4800HS powered model is currently listed at 1904 EUR, featuring 16 GB of RAM and 1 TB of storage, so we now have a ballpark price estimate to speculate upon.

AMD's upcoming "Renoir" silicon will be the company's most important, as it will sit at the heart of not just desktops, but also notebooks and ultraportables. A brilliant report by _rogame on Reddit compiles the chip's many iGPU variants along with iGPU device-IDs, and slots them in various platform variants. Renoir will target four key market segments characterized by TDP: 15 W ultraportables, 45 W mainstream notebooks, 65 W mainstream desktops, and 35 W low-power desktops.

As for the iGPU itself, "Renoir" was last reported as being a processor that combines "Zen 2" CPU cores with an iGPU that has SIMD machinery from the "Vega" architecture, but with updated display- and multimedia-engines from "Navi." According to _rogame, Renoir's iGPU will have up to 13 NGCUs, which work out to 832 stream processors. AMD internally marks the iGPU as RV B##, where RV refers to "Radeon Vega," and B## referring to the iGPU variant. The commercial name of the iGPU will be different. B12 is the highest variant, with 12-13 CUs, B10 has 10-11 CUs, B8 has 8-9 CUs, B6 has 6 CUs, and B4 has 3-4 CUs. The B12 configuration will be exclusive to the mobile parts. The desktop parts cap out at B10. Renoir is expected to dominate AMD's processor launch cycle through the first half of 2020.

MediaTek today unveiled Dimensity, MediaTek's family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.

The MediaTek Dimensity 5G chipset family brings smart and fast together to power the world's most capable 5G devices. Dimensity represents a step toward a new era of mobility - the fifth dimension - to spur industry innovation and let consumers unlock the possibilities of 5G connectivity.

AMD today announced four new desktop processors across three very diverse markets. To begin with, the company crowned its socket AM4 mainstream desktop platform with the mighty new Ryzen 9 3950X processor. Next up, it released its new baseline entry-level APU, the Athlon 3000G. Lastly, it detailed the 3rd generation Ryzen Threadripper HEDT processor family with two initial models, the Ryzen Threadripper 3960X and the flagship Ryzen Threadripper 3970X. The company also formally released its AGESA Combo PI 1.0.0.4B microcode, and with it, introduced a killer new feature for all "Zen 2" based Ryzen processors, called ECO Mode.

The Ryzen 9 3950X is a 16-core/32-thread processor in the AM4 package, compatible with all socket AM4 motherboards, provided they have the latest BIOS update with AGESA Combo PI 1.0.0.4B microcode. The processor comes with clock-speeds of 3.50 GHz base, with 4.70 GHz maximum boost frequency, and the same 105 W TDP as the 12-core Ryzen 9 3900X. With 512 KB of dedicated L2 cache per core, and 64 MB of shared L3 cache, the chip has a mammoth 72 MB of "total cache."

AMD "Renoir" is the company's next-generation APU that improves iGPU and CPU performance over the current 12 nm "Picasso" APU. An AMD "Renoir" APU engineering sample running on a "Celadon-RN" platform prototyping board, was allegedly put through 3DMark 11, and its performance numbers surfaced on Reddit, in three data-sets corresponding with three hardware configurations. In the first one, dubbed "config 1," the CPU is clocked at 1.70 GHz, the iGPU at 1.50 GHz, and the system memory at DDR4-2667. In "config 2," the CPU runs at 1.80 GHz, and the iGPU and memory frequencies are unknown. In "config 3," the CPU runs at 2.00 GHz, the iGPU at 1.10 GHz, and the memory at DDR4-2667. Raw benchmark output from 3DMark 11 Performance preset are pasted for each of the configs below (in that order). The three mention 3DMark database result IDs, but all three are private when we tried to look them up.

The "config 1" machine scores 3,547 points in the performance preset of 3DMark 11. It's interesting to note here that the iGPU clock is significantly higher than that of "Picasso." In "config 2," a 3DMark performance score of 3,143 points is yielded. The CPU clock is increased compared to "config 1," but the score is reduced slightly, which indicates a possible reduction in iGPU clocks or memory speed, or perhaps even the iGPU's core-configuration. In "config 3," we see the highest CPU clock speed at 2.00 GHz, but a reduced iGPU clock speed at 1.10 GHz. This setup scores 2,374 points in the 3DMark performance preset, a 33% drop from "config 1," indicating not just reduced iGPU clocks, but possibly also reduced CU count. "Renoir" is expected to combine "Zen 2" CPU cores with an iGPU that has the number-crunching machinery of "Vega," but with the display- and multimedia-engines of "Navi."

AMD is expected to bring back its low-power APU family in 2020 with the new "Dali" silicon. Updated company roadmap slides see the inclusion of "Dali" as a "value mobile APU," positioned under "Renoir," a performance APU targeting both the mainstream notebook and desktop (socket AM4) platforms. AMD looks keen to branch out its APU business in two directions.

"Renoir" is expected to be a "Zen 2" based APU with CPU performance matching at least the Ryzen 5 3600 or 3700X, and a faster "Vega" based iGPU. It wouldn't surprise us if "Dali" is a monolithic 7 nm die with two "Zen 2" CPU cores and a tiny iGPU with 3-4 compute units. "Renoir," on the other hand, could be an MCM with an 8-core "Zen 2" chiplet and an enlarged I/O controller die that has the iGPU. "Dali" could see the light of the day only in 2020, by which time TSMC could substantially increase its 7 nm volumes and clear the decks for its new 7 nm EUV mass-production.

AMD's next-generation "Renoir" APU, which succeeds the company's 12 nm "Picasso," will be the company's truly next-generation chip to feature an integrated graphics solution. It's unclear as of now, if the chip will be based on a monolithic die, or if it will be a multi-chip module of a 7 nm "Zen 2" chiplet paired with an enlarged I/O controller die that has the iGPU. We're getting confirmation on two key specs - one, that the iGPU will be based on the older "Vega" graphics architecture, albeit with an updated display engine to support the latest display standards; and two, that the processor's memory controller will support the latest LPDDR4X memory standard, at speeds of up to 4266 MHz DDR. In comparison, Intel's "Ice Lake-U" chip supports LPDDX4X up to 3733 MHz.

Code-lines pointing toward "Vega" graphics with an updated display controller mention the new DCN 2.1, found in AMD's new "Navi 10" GPU. This controller supports resolutions of up to 8K, DSC 1.2a, and new resolutions of 4K up to 240 Hz and 8K 60 Hz over a single cable, along with 30 bits per pixel color. The multimedia engine is also suitably updated to VCN 2.1 standard, and provides hardware-accelerated decoding for some of the newer video formats, such as VP9 and H.265 at up to 90 fps at 4K, and 8K up to 24 fps, and H.264 up to 150 fps at 4K. There's no word on when "Renoir" comes out, but a 2020 International CES unveil is likely.

AMD reached a settlement in the Class Action Lawsuit filed against it, over alleged false-marketing of the core-counts of its eight-core FX-series processors based on the "Bulldozer" microarchitecture. Each member of the Class receives a one-time payout of USD $35 per chip, while the company takes a hit of $12.1 million. The lawsuit dates back to 2015, when Tony Dickey, representing himself in the U.S. District Court for the Northern District of California, accused AMD of false-marketing of its FX-series "Bulldozer" processor of having 8 CPU cores. Over the following four years, the case gained traction as a Class Action was built against AMD this January.

In the months that followed the January set-up of a 12-member Jury to examine the case, lawyers representing the Class and AMD argued over the underlying technology that makes "Bulldozer" a multi-core processor, and eventually discussed what a fair settlement would be for the Class. They eventually agreed on a number - $12.1 million, or roughly $35 per chip AMD sold, which they agreed was "fair," and yet significantly less than the "$60 million in premiums" consumers contended they paid for these processors. Sifting through these numbers, it's important to understand what the Class consists of. It consists of U.S. consumers who became interested to be part of the Class Action, and who bought an 8-core processor based on the "Bulldozer" microarchitecture. It excludes consumers of every other "Bulldozer" derivative (4-core, 6-core parts, APUs; and follow-ups to "Bulldozer" such as "Piledriver," "Excavator," etc.).Image Credit: Taylor Alger

AMD X570 is the company's first in-house design desktop motherboard chipset for the AM4 platform. The company sourced earlier generations of chipset from ASMedia. A chipset in context of the AM4 platform only serves to expand I/O connectivity, since an AM4 processor is a full-fledged SoC, with an integrated southbridge that puts out SATA and USB ports directly from the CPU socket, in addition to LPCIO (ISA), HD audio bus, and SPI to interface with the firmware ROM chip. The X470 "Promontory Low Power" chipset runs really cool, with a maximum TDP of 5 Watts, and the ability to lower power to get its TDP down to 3W. The X570, on the other hand, has a TDP of "at least 15 Watts." A majority of the X570 motherboards we've seen at Computex 2019 had active fan-heatsinks over the chipset. We may now have a possible explanation for this - there are just too many things on the chipset.

According to AMD, the X570 chipset by itself can be made to put out a staggering twelve SATA 6 Gbps ports (not counting the two ports put out by the AM4 SoC). A possible rationale behind this may have been to enable motherboard designers to equip every M.2 slot on the motherboard with SATA wiring in addition to PCIe, without needing switches that reroute SATA connection from one of the physical ports. It's also possible that AMD encouraged motherboard designers to not wire out SATA ports from the AM4 SoC as physical ports to save costs on switches, and dedicate one of them to the M.2 slot wired to the SoC. With the two SATA ports from the SoC out of the equation, and every other M.2 slot getting a direct SATA connection from the chipset, motherboard designers can wire out the remaining SATA ports as physical ports, without spending money on switches, or worrying about customer complaints on one of their drives not working due to automatic switching. This is an extreme solution to a rather simple problem.

At the bottom end of AMD's rather tall new Ryzen 3000 desktop processor product-stack are the Ryzen 3 3200G and Ryzen 5 3400G APUs. Unlike the rest of the Ryzen 3000 series, these two are based on the monolithic 12 nm "Picasso" silicon, which is essentially "Raven Ridge" redesigned for 12 nm with the "Zen+" microarchitecture. For the quad-core CPU, this means an improved Precision Boost algorithm that scales better across multiple cores, and faster on-die caches. For the iGPU based on the "Vega" architecture, this is a minor speed-bump.

The 3200G is configured with a 4-core/4-thread CPU and 8 out of 11 NGCUs of the iGPU enabled, yielding 512 stream processors. The maximum CPU clock speeds have been dialed up by 300 MHz over that of the 2200G, to now attain 4.00 GHz boost frequency, while the iGPU engine frequency is increased by 150 MHz, to 1250 MHz. The 3400G maxes out the silicon with a 4-core/8-thread CPU, and all 11 NGCUs enabled on the iGPU (704 stream processors). The CPU spools up to 4.20 GHz, and the iGPU up to 1400 MHz. AMD is including a bigger Wraith Spire cooling solution with the 3400G. Prices remain unchanged over the previous generation, with the 3200G being priced at USD $99, and the 3400G at $149, when the processors likely go on sale this July.

ECS has introduced a new model into their Liva series of Mini PCs - this time, powered by AMD Ryzen APUs. The ECS LIVA A320 is a 1-liter Mini Pc (book-sized, according to the company, but I guess that depends on the books you prefer to read), and makes use of either an AMD Ryzen 3 or Ryzen 5 APU with up to 35 W TDP.

There's a lot to like about this little Mini PC that could, which ECS is marketing at light gaming workloads and all other content consumption and office-related shenanigans. There is a tooless design for easy upgradeability, 2x DDR4 support in the SO-DIMM form factor, internal support for an M.2 drive (which helps save space in such a small enclosure, even though a 2.5" HDD or SSD is still supported). A VESA mount means this can be installed in the back of a monitor or television for your content consumption needs.

TechPowerUp GPU-Z is a handy graphics subsystem information, diagnostic, and monitoring utility no enthusiast can leave home without, and today we bring you its latest version. The new TechPowerUp GPU-Z v2.21.0 adds support for NVIDIA Quadro P500. More importantly, it fixes sensor data readouts being broken for the Radeon VII with Radeon Software 19.5.1 (or later) installed. A broken GPU load sensor for AMD "Raven Ridge" APUs has also been fixed. Lastly, OpenCL support detection has been added for Radeon VII and other graphics cards based on the "Vega 20" MCM. Grab it from the link below.DOWNLOAD: TechPowerUp GPU-Z

The change-log follows.

AMD is giving finishing touches to its Ryzen 3000 "Picasso" family of APUs, and Thai PC enthusiast TUM_APISAK has details on their CPU clock speeds. The Ryzen 3 3200G comes with 3.60 GHz nominal clock-speed and 4.00 GHz maximum Precision Boost frequency; while the Ryzen 5(?) 3400G ships with 3.70 GHz clock speeds along with 4.20 GHz max Precision Boost. The "Picasso" silicon is an optical shrink of the 14 nm "Raven Ridge" silicon to the 12 nm FinFET process at GlobalFoundries, the same one on which AMD builds "Pinnacle Ridge" and "Polaris 30."

Besides the shrink to 12 nm, "Picasso" features upgraded "Zen+" CPU cores that have improved Precision Boost algorithm and faster on-die caches, which contribute to a roughly 3% increase in IPC on "Pinnacle Ridge," but significantly improved multi-threaded performance compared to 1st generation Ryzen. Clock speeds of both the CPU cores and the integrated "Vega" iGPU are expected to increase. Both the 3200G and 3400G see a 100 MHz increase in nominal clock-speed, and 300 MHz increase in boost clocks, over the chips they succeed, the 2200G and 2400G, respectively. The iGPU is rumored to receive a similar 100-200 MHz increase in engine clock.

Just in time for the release of Bethesda's open-world first-person shooter Rage 2 (find our performance analysis here), AMD has released their latest installment of the Radeon Adrenalin 2019 edition drivers for their graphics cards to make the most of the game. Indeed, AMD claims an improvement in game performance of up to 16% on the Radeon VII relative to last month's 19.4.3 drivers, and this is in addition to added support for the big Windows 10 May 2019 update and instruction tracing for AMD's GPU Profiler version 1.5.X. There is a plethora of fixed issues listed as well, and the usual list of known bugs, all of which can be seen past the break. We have also hosted the drivers installer for your convenience, which can be found at the link below.DOWNLOAD: AMD Radeon Software Adrenalin 19.5.1

One of our readers discovered an interesting entry in the INF file of AMD's Adrenalin 19.4.3 graphics drivers. It includes two instances of "Radeon RX 640," and has the same device ID as the Radeon RX 550X from the current generation. The branding flies in the face of reports suggesting that with its next-generation "Navi" GPUs, AMD could refresh its client-segment nomenclature to follow the "Radeon RX 3000" series, but it's possible that the RX 600 series was carved out to re-brand the existing "Polaris" based low-end chips one step-down (i.e. RX 550X re-branding as RX 640, RX 560 possibly as RX 650, etc.).

The move to create the RX 600 series could also be driven by AMD's need to contain all "Navi" based SKUs in the RX 3000 series, and re-branded "Polaris" based ones in the RX 600, so that, at least initially, consumers aren't led to believe they're buying a re-branded "Polaris" SKU opting for an RX 3000-series graphics card. It's also possible that AMD may not create low-end chips based on "Navi" initially, and focus on the performance-segment with the highest sale volumes among serious gamers, the $200-400 price-range. Based on the 14 nm "Lexa" silicon, the RX 550X is equipped with 640 stream processors, 32 TMUs, 16 ROPs, and 2 GB of GDDR5 memory across a 128-bit wide memory bus. Given the performance gains expected from Intel's Gen11 "Ice Lake" iGPU and AMD's own refreshed "Picasso" APU, the RX 640 could at best be a cheap iGPU replacement for systems that lack it.Image Credit: Just Some Noise (TechPowerUp Forums)

AMD Ryzen 3 3200G is an upcoming processor featuring integrated graphics, forming the tail-end of the company's 3rd generation Ryzen desktop processor family. A Chinese PC enthusiast with access to an early sample pictured and de-lidded the processor. We know from older posts that while the "Matisse" MCM will form the bulk of AMD's 3rd gen Ryzen lineup, with core counts ranging all the way from 6 to 12, and possibly 16 later, the APU lineup is rumored to be based on older "Zen+" architecture.

The Ryzen 3 3200G and possibly the Ryzen 5 3400G, will be based on a derivative of the "Raven Ridge" silicon built on the 12 nm process at GlobalFoundries, and comes with a handful innovations AMD introduced with "Pinnacle Ridge," such as an improved Precision Boost algorithm and faster on-die caches. The 12 nm shrink also allows AMD to dial up CPU and iGPU engine clock speeds, and improve DDR4 memory support to work with higher DRAM clock speeds. AMD has used thermal paste as the sub-IHS interface material instead of solder for its "Raven Ridge" chips, and the story repeats with the 3200G.