One of the electric vehicle driving forces in the car market, Tesla, has today announced that the company would have to issue a soft recall of a few select car models over an issue with overheating. The affected vehicles are Tesla Model 3 2022, Tesla Model S 2021-2022, Tesla Model X 2021-2022, and Tesla Model Y 2022. Tesla's infotainment system is powered by AMD Ryzen APUs, replacing the Intel Atom CPUs found in the previous models. With Ryzen APUs overheating, the infotainment system can lag or restart and sometimes cause it to get completely turned off. The problem is that the car's liquid cooling will prioritize cooling the batteries instead of the processor, causing it to overheat. Tesla issued a soft recall on these models, meaning that a regular firmware update will fix this issue.

TeslaTesla, Inc. (Tesla) is recalling certain 2021-2022 Model S, Model X, and 2022 Model 3 and Model Y vehicles operating certain firmware releases. The infotainment central processing unit (CPU) may overheat during the preparation or process of fast-charging, causing the CPU to lag or restart. A lagging or restarting CPU may prevent the center screen from displaying the rearview camera image, gear selection, windshield visibility control settings, and warning lights, increasing the risk of a crash. Tesla will perform an over-the-air (OTA) software update that will improve CPU temperature management, free of charge. Owner notification letters are expected to be mailed July 1, 2022. Owners may contact Tesla customer service at 1-877-798-3752. Tesla's number for this recall is SB-22-00-009.

AMD has confirmed its revamped APU strategy will be delivered throughout three different APU line-ups come 2023. While Raphael will take care of AMD's hopes in the desktop space, the company is readying a new, "Dragon Range" lineup of "pinnacle gaming"-oriented APUs, leveraging the company's upcoming Zen 4 architecture, DDR5, and PCIe 5. Dragon Range APUs will feature the "highest core, thread, and cache ever for a mobile gaming CPU" - although AMD stopped just short of confirming exactly what "highest" translates to. To aid in its extreme gaming aspirations, TDP for Dragon Range is set at 55 W - they thus "largely exist in the space where gaming laptops are plugged in the majority of the time," according to AMD director of technical marketing Robert Hallock.

Another APU family, Phoenix, will be aimed at thin and lights with a penchant for gaming. Phoenix too will leverage AMD's Zen 4 core, DDR5 memory subsystem, and PCIe 5 interfaces. Being aimed at thin and lights, Phoenix APUs are set for a 35 W - 45 W operating range. Interestingly, AMD didn't share any other details - more crucially, the graphics architecture that's to be employed in these high-performance APUs.

A Steam Deck enthusiast has done what Steam would not (at least not in the first rendition of its popular Steam Deck handheld console): he went and added an external GPU to the mix. The owner of the ETA Prime YouTube channel managed to increase the Steam Deck's APU-powered graphical oomph with a much more powerful AMD RX 6900 XT graphics card. To do so required sacrifices however: since the SteamDeck doesn't feature a proper Thunderbolt 3/4 connector, ETA Prime had to remove the Steam Deck's SSD from its M.2 port, instead mounting a special M.2 to PCIe adapter in the SSD slot itself.

This, of course, required that installed games be run off memory cards, which generally offer lower speeds (a less than stellar experience) than the onboard SSD. It also required butchering the Steam Deck's OS by replacing it with Windows 11. But it did allow the Steam Deck's APU to tap onto power otherwise unavailable to it, unlocking playable framerates with maxed out detail settings on games such as God of War, Cyberpunk 2077, Elden Ring, and others.

ASRock Industrial announces the 4X4 BOX-5000 Series Mini PCs 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, with enhancement powered by AMD Zen 3 Ryzen 5000 U-Series APUs- Ryzen 7 5800U, Ryzen 5 5600U, and Ryzen 3 5400U up to 8 cores/16 threads to energize performance, energy efficiency, and lower latency. Featuring a powerful yet compact design, the 4X4 BOX-5000 Series supports quad display outputs up to 4K with AMD Radeon Graphics for the enhanced visual experience. The Series also includes dual LAN ports up to 2.5 Gigabit with one DASH function and Wi-Fi 6E support of 6 GHz band for real-time connections. Moreover, it can uphold one M.2 Key M, one SATA 3.0 for storage, and five USB ports (three USB 3.2 Gen 2, two USB 2.0) for ultra-connectivity. The energized features make it the world's most advanced core for a wide range of home and business applications such as gaming, content creation, working from home, KIOSK, digital signage, and many more.

With AMD Ryzen 5000U Series Processors- Zen 3 Core Architecture, the 4X4 BOX-5000 Series Mini PCs deliver energized performance and reduced latency with up to 17% single-thread and multi-thread performance compared to Zen 2 along with improved graphics capabilities with AMD Radeon Graphics. Spanning from the flagship 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, the new Series is powered by AMD Ryzen 7 5800U, Ryzen 5 5600U, Ryzen 3 5400U to increase power efficiency with lower power consumption- 6.7 W at idle. The 4X4 BOX-5000 Series also supports dual-channel DDR4 3200 MHz SO-DIMM memory up to 64 GB for uncompromised multitask computing capabilities.

In addition to the Ryzen 7 5800X3D, which AMD claims to be the world's fastest gaming processor, AMD gave its desktop processor product-stack a major update, with as many as six other processor models spanning a wide range of price-points that help the company better compete with the bulk of the 12th Gen Core "Alder Lake" processor lineup. The new lineup sees the introduction of the Ryzen 7 5700X (not to be confused with the Ryzen 7 5700G). The 5700X is based on the same "Vermeer" multi-chip module (MCM) as the Ryzen 7 5800X, unlike the 5700G, which is a desktop APU based on the "Cezanne" monolithic silicon. Both "Vermeer" and "Cezanne" are based on the "Zen 3" microarchitecture.

The Ryzen 7 5700X is an 8-core/16-thread processor clocked at 3.40 GHz base and 4.60 GHz boost, compared to the 3.80 GHz base and 4.80 GHz boost frequency of the 5800X. Another key difference is its 65 W TDP, compared to 105 W of the 5800X, which could differentiate its boosting behavior and overclocking headroom compared to the 5800X. AMD is pricing the 5700X at USD $299 (MSRP), making it a competitor to the Intel Core i5-12600KF. Interestingly, the retail PIB (processor-in-box) package of the 5700X does not include a stock cooler despite its 65 W TDP. A 95 W-capable Wraith Spire wouldn't have hurt.

AMD Ryzen 7 5800X3D, the company's ambitious new 8-core/16-thread Socket AM4 processor that claims to match the Core i9-12900K "Alder Lake" in gaming performance, will launch at an MSRP of USD $449, according to prices of several upcoming AMD Ryzen processors leaked to the web. The 5800X3D is clocked lower than the 5800X, with 3.40 GHz base and 4.50 GHz boost frequencies, but the large 96 MB L3 cache from the 3D Vertical Cache memory, overcomes this.

The Ryzen 7 5700X is an interesting new 8-core/16-thread part. It's based on the "Vermeer" MCM just like the 5800X, and unlike the 5700G that's based on the "Cezanne" monolithic silicon. The 5700X is clocked at 3.40 GHz base, with 4.60 GHz boost, compared to the 3.80 GHz base and 4.70 GHz boost frequency of the 5800X. The Ryzen 7 5700X is launching at $299 MSRP, which implies that the company is cutting the MSRP of the Ryzen 5 5600X that originally occupied this price-point.Update Mar 9th: Correction: the Ryzen 5 5500 is a 6-core/12-thread part.

MSI released a new gaming desktop, the MAG Trident S 5M, a machine dedicated to cloud gaming and mobile gaming. It is different from traditional gaming desktops and focuses more on helping gamers enjoy games in the living room. Gamers only need to activate the Android system emulator (MSI APP Player) and the 30-day free XBOX GAME PASS ULTIMATE through the Game Stadium software exclusively developed by MSI to control mobile games on the sofa with only one joystick. You can easily access cloud games and other entertainment software.

The exclusive MSI APP Player allows players to emulate the Android system in the Windows system. Gamers can experience mobile games on a larger screen with better performance. They can also use the Multi-Instance Manager function to open different games in different windows. Certain games can also enable joystick mode, allowing players to use the same joystick to play. In STEAM, you can play games through the built-in Big Screen Mode. In Xbox Game Pass Ultimate, there is the same operation mode to let you use the joystick directly so that it can be perfectly applied to various game software.

MSI, a world leader in high-performance and innovative computing solutions, has announced the PRO AP241Z 5M All-in-One PC. Featuring powerful processors and eye care technology with an IPS panel for a wide viewing angle and enhanced viewing experience, PRO AP241Z Series is designed with efficiency and productivity in mind. While most All-in-One PCs in the market utilize mobile-grade processors, the PRO AP241Z 5M features the Desktop-grade AMD Ryzen 5000 Series APU for unparalleled performance. Giving users a better working experience with greater hardware and software support.

PRO AP241Z 5M can help improve workflow and efficiency. With an HDMI-out port, you are able to connect another monitor and easily multitask with navigating multiple windows or documents at the same time. Anti-flicker and low blue light technology for the display help to keep your eyes healthy and reduce fatigue throughout long work hours. Featuring up to AMD Ryzen 7 5700G Processor, PRO AP241Z stays responsive with low load times when multi-tasking while remaining cool thanks to its Server-grade cooling system to reduce CPU thermal throttling. Information security is always one of the most important things for businesses; the PRO AP241Z supports FW TPM technology which can protect device data from attacks by malicious software and unauthorized access.

If you've been waiting for more details about AMD's next mobile platform, then you're in luck, as the motherload has dropped today, with lots of details about the new Rembrandt APU's that are launching next year. Not only has a picture of the first motherboard, with adhering laptop showed up, but we also have a mostly complete block diagram and a list of expected SKU's, even though not all SKU models are revealed as yet.

AMD's Rembrandt APU will be its first APU with PCIe 4.0 support, which in itself might not be worth the wait, but if paired with the right GPU, this might help increase the performance somewhat compared to the previous generation of APUs from AMD. The bigger news is USB4 support, plus a new GPU which we so far don't know too much about, but it's speculated that it'll be called Radeon RX 680M and should offer 12 compute units. DDR5 memory support is also expected, so Rembrandt clearly has a new memory controller, since the APU is still based on the Zen 3 architecture.

Since the introduction of the NUC by Intel some years ago, the mini PC space has taken off and one of the more popular NUC alternatives has been the BRIX series from Gigabyte and the company has just announced the BRIX Extreme. This is Gigabyte's first BRIX series based on the AMD Ryzen 5000U series of APUs and three different options will be available, in the shape of the R3-5300U, R5-5500U and the R7-5700U. This translates to four, six and eight core CPUs with a 15 W TDP, although these are all Zen 2 based, rather than Zen 3, which is slightly disappointing.

This is also one of the first device we've seen that uses the new AMD RZ608 WiFi 6 and Bluetooth 5.2 module which was announced a little while back. Other features include 2.5 Gbps Ethernet, an M.2 PCIe 3.0 NVMe slot for an SSD, two HDMI 2.0a ports, a mini DP port port and a USB-C port with DP Alt mode, both supporting DP 1.4 and all display outputs can be used concurrently with four 4K displays. Gigabyte will offer the BRIX Extreme in a low profile chassis as well as a slightly bigger chassis that can either house a 2.5-inch SATA drive, or an optional expansion module.

Historically, AMD was working with two semiconductor manufacturing companies: TSMC and GlobalFoundries. According to the latest report coming from Gokul Hariharan, an analyst at J.P. Morgan, AMD could soon tap another semiconductor manufacturer to produce the company's growing list of processors. As the report indicates, AMD could start working with the South Korean giant Samsung and utilize the firm's 4LPP process that represents a second generation of the low-power 4 nm silicon node. This specific node is allegedly the choice for AMD APUs designed to fit inside Google's Chromebook devices, which require low-power designs to achieve excellent battery life.

AMD could realize this move in late 2022, as Samsung's 4LPP node goes into mass production at that point. It means that we could see the first Samsung-made AMD APUs in late 2022 or the beginning of 2023. And apparently, the two company's collaboration could be much more significant as AMD is evaluating Samsung's 3 nm nodes for other products spanning more segments in 2023/2024. There are no official, definitive agreements between the two, so we have to wait for more information and official responses from these parties. Anyways, if AMD decides to produce a part of its lineup at Samsung, the remaining TSMC capacity would ensure that the supply of every incoming chip remains sufficient.

The first trace of AMD's upcoming Ryzen 6000 mobile series has recently appeared with a processor of OPN code 100-000000518-41_N surfacing in the UserBenchmark database with the socket listed as FP7 which is the rumored platform for AMD's 6 nm Rembrandt family. The engineering sample features 8-cores and 16-threads with a base clock of 3.9 GHz and a boost of 4.1 GHz along with an integrated RDNA2 iGPU.

This marks the move from Vega to Navi 2 for the integrated GPU which should result in significant graphics performance and efficiency improvements. The processor was paired with a single 16 GB DDR5 memory module from Corsair running at 4800 MHz CL40, the computer is also listed as Corsair Xenomorph which is interesting as we are not aware of any plans for Corsair to release laptops. AMD is expected to announce Rembrandt at CES 2022 and the processors have allegedly already entered production.

As we await the update of AMD's highly anticipated 6000 series Rembrandt APUs based on Zen 3 cores and RDNA2 graphics, we are in for a surprise with information about the next generation, more than a year away, of Ryzen 7000 series mobile processors based on Zen 4 architecture. Codenamed Raphael-H, it co-exists with the upcoming lineup of Phoenix APUs, which come after the 6000 series Rembrandt APU lineup. This mobile variant of the forthcoming desktop Raphael processors features as many as 16 cores based on Zen 4 architecture. What is so special about the Raphael-H is that it represents a mobile adaptation of desktop processors, and we are not sure how it will be different from the Phoenix APUs. However, we assume that Phoenix is going to feature a more powerful graphics solution.

The confusing thing is the timeline of these processors. First comes the Rembrandt APUs (6000 series) and then both the Raphael-H and Phoenix mobile processors. AMD could disable iGPU on mobile Raphael-H designs. However, that is just a guess. We have to wait to find out more in the upcoming months.

Microsoft is potentially looking to refresh the Xbox Series S in late 2022 with an upgraded 6 nm AMD APU according to Moore's Law is Dead. The upgraded processor would be manufactured on TSMC's 6N process which boasts higher yields and could allow Microsoft to enable all 24 Compute Units on the APU compared to the 20 they currently enable. This increase in Compute Units and a clock speed boost could potentially increase the console's performance by 50%. This updated model would come in at close to 350 USD representing a 50 USD premium however the existing model would be retained and see a price cut to 189-249 USD. The rumor also claims that Microsoft will refresh the Xbox Series X in 2023 or later.

BIOSTAR, a leading brand of motherboards, graphics cards, and storage devices, today announced product support for the latest AMD Ryzen 5000G series Cezanne processors. AMD's next-generation Ryzen 5000G series desktop processors codenamed "Cezanne" are ready to invade the global market. The new 5000G series processors are based on Zen 3 architecture, AMD's Ryzen 5000 series of desktop APUs based on the Zen 3 CPU and Vega GPU microarchitectures succeeding the Ryzen 4000 "Renoir" series.

Extreme performance enabled for personal computing with up to 8 cores fueled by the world's most advanced 7 nm processor core technology, the AMD Ryzen 5000 G-series desktop processors with Radeon graphics deliver ultra-fast responsiveness and multi-threaded performance for any use case.

We have recently seen the first high-resolution die shots of AMD's Ryzen 5 5600G Cezanne APU thanks to the work of Fritzchens Fritz. The photos show the internal layout of the processor with its Zen 3 CPU, Vega GPU, and corresponding components. To get these shots, the chip had to be delidded by removing the IHS which has been made harder with the move to a soldered design. The Ryzen 5 5600G is a 6 core, 12 thread part with 7 Vega GPU cores which can all be seen in the annotated diagram of the die created by Locuza. The diagram also shows the suspected locations of various PCIe 3.0, and memory controllers along with cache placements for the CPU and GPU. The processor is manufactured on TSMC's 7 nm process and features a total of 10.7 Billion transistors packed into the 180 mm² die.

Previously, we have assumed that AMD 4700S desktop kit is based on Xbox Series X APU. Today, according to the findings of Bodnara, who managed to access one of these units, and we got some interesting discoveries. The chip powering the system is actually the PlayStation 5 SoC, which features AMD Zen 2 based system architecture, with 8 cores and 16 threads that can boost up to 3.2 GHz. The board that was tested features SK Hynix GDDR6 memory running at 14 Gbps, placed on the backside of the board. The APU is attached to AMD A77E Fusion Controller Hub (FCH), which was the one powering Xbox One "Durango" SoC, leading us to previously believe that the AMD 4700S is derived from an Xbox Series X system.

The graphics of this APU are disabled, however, it was the same variant of RDNA 2 GPU used by the PlayStation 5. Right out of the box, the system is equipped with a discrete GPU coming in a form of the Radeon 550, and this configuration was tested by the Bodnara team. You can find the images of the system and some performance results below.Performance:

Today, we have talked about AMD's upcoming Raphael lineup of processors in the article you can find here. However, it seems like the number of leaks on AMD's plans just keeps getting greater. Thanks to the "itacg" on Weibo, we have learned that AMD's Ryzen 8000 desktop series of processors are reportedly codenamed as Granite Ridge. This new codename denotes the Zen 5 based processors, manufactured on TSMC's 3 nm (N3) node. Another piece of information is that AMD's Ryzen 8000 series APUs are allegedly called Strix Point, and they also use the 3 nm technology, along with a combination of Zen 5 and Zen 4 core design IPs. We are not sure how this exactly works out, so we have to wait to find out more.

We have recently seen an influx of rumors about an upcoming "SteamPal" portable gaming computer under development by Valve. The first indication that this new device is real was a recently uncovered "SteamPal" device name referenced under the unreleased "Neptune" controller in the latest Steam Client Beta. This SteamPal device name reportedly refers to an upcoming portable gaming computer with a similar controller design to the Nintendo Switch albeit unremovable featuring a standard set of gamepad buttons and triggers, dual joysticks, at least one thumb-sized touchpad, and a 7"-8" touchscreen display. The SteamPal is still in the prototype stage so final hardware configurations are not confirmed and are subject to change.

There is good reason to believe these rumors are true after a recent cryptic comment from Gabe Newell about bringing Valve games to consoles with him stating that we will have a "better idea by the end of this year" which is in line with rumors stating that Valve is targeting a Q4 2021 announcement for the SteamPal. The device will reportedly feature a quad-core Van Gogh APU from AMD with 8 RDNA2 compute units which would allow gamers to run their entire Steam library on the portable device. Valve is reportedly targeting a 399 USD price for the device however as with all these rumors take it with a healthy dose of skepticism.

A fresh rumor straight from the rumor mill paints AMD's next APU iterations as being updated to the latest and greatest architectures the company has to offer. The rumor comes from ExecutableFix via Twitter, a leaker who has a relatively proven track record on being right regarding upcoming hardware releases. This rumor can lay some credence to others, painting AMD's Ryzen 7000 series as being the first AMD APU-only release since they began their journey with the Zen architecture - it makes sense for the company to integrate their latest architectures in the mobile-geared Rembrandt first, working out some possible interaction quirks that might arise between the two architectures when deployed in the same package.

The leaker further affirms that the Rembrandt APUs will feature up to 12 RDNA2 CUs, which would amount to 768 stream processors on-chip - a marked increase from the current-generation 8 CUs based on the Vega architecture on their Ryzen 4000 mobile series. The leaker also discloses that AMD's Warhol seems to be MIA in recent AMD documentation and planning when it comes to the deployment of Zen3+, and that Rembrandt should be the one to carry that particular architecture refinement through to the 6 nm process. It would seem that AMD's Vega would "finally" see its demise, bringing about some much-needed performance improvements to counter Intel's investments in GPU performance with Xe.

AMD launched the 7 nm Zen 3 microarchitecture which powers Ryzen 5000 processors in late 2020, we expect AMD to follow this up with a Zen 3+ on 6 nm later this year and a 5 nm Zen 4 in 2022. We are now beginning to receive the first rumors about the 3 nm Zen 5 architecture which is expected to launch in 2024 in Ryzen 8000 series products. The architecture is reportedly known as "Strix Point" and will be manufactured on TSMC's 3 nm node with a big.LITTLE core design similar to the upcoming Intel Alder Lake and the Apple M1. The Strix Point lineup will consist exclusively of APUs and could feature up to 8 high-performance and 4 low-performance cores which would be less than what Intel plans to offer with Alder Lake. AMD has allegedly already set graphics performance targets for the processors and that they will bring significant changes to the memory subsystem but with rumors for a product 3 years away from launch take them with a healthy dose of skepticism.

AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.

CPU-Z, the CPU monitoring tool used to gather information about the processor your system is running on, has been updated with version 1.96. This new update doesn't change the software much but rather brings support for new hardware. Starting from this revision, Intel's upcoming Alder Lake CPUs have received preliminary support in the tool. To go along with CPUs, the software is now also enabled to recognize Intel's Z6xx motherboards that pair with Alder Lake processors. Alongside that, the software now also brings support for next-generation DDR5 memory, which is supposed to feature speeds anywhere from 4800 to 8400 MT/s. When it comes to AMD, the tool received an update that enables it to read information about AMD's Ryzen 5700G, 5600G, and 5300G APUs, and Radeon RX 6900 XT, 6800 (& XT), 6700 XT GPUs.Download CPU-Z Version 1.96 Here.

The rumor mill keeps crushing away; in this case, regarding AMD's plans for their next-generation Zen designs. Various users have shared pieces of the same AMD roadmap, which apparently places AMD in an APU-focused landscape come their Ryzen 7000 series. we are currently on AMD's Ryzen 5000-series; Ryzen 6000 is supposed to materialize via a Zen 3+ design, with improved performance per watt obtained from improvements to its current Zen 3 family. However, Ryzen 7000-series is expected to debut on AMD's next-gen platform (let's call it AM5), which is also expected to introduce DDR5 support for AMD's mainstream computing platform. And now, the leaked, alleged roadmaps paint a Zen 4 + Navi 2 APU series in the works for AMD's Zen 4 debut with Raphael - roadmapped for manufacturing at the 5 nm process.

The inclusion of an iGPU chip with AMD's mainstream processors may signal a move by AMD to produce chiplets for all of its products, and then integrating them in the final product. You just have to think about it in the sense that AMD could "easily" pair one of the eight-core chiplets from the current Ryzen 5800X, for example, with an I/O die (which would likely still be fabricated with Global Foundries) an an additional Navi 2 GPU chiplet. It makes sense for AMD to start fabricating GPUs as chiplets as well - AMD's research on MCM (Multi-Chip Module) GPUs is pretty well-known at this point, and is a given for future development. It means that AMD needed only to develop one CPU chiplet and one GPU chiplet which they can then scale on-package by adding in more of the svelte pieces of silicon - something that Intel still doesn't do, and which results in the company's monolithic dies.

AMD has today decided to launch the next generation of Accelerated Processing Units (APUs), now in form of the 5000G lineup codenamed Cezanne. The APUs are getting launched as OEM-exclusive products for now, which means that only manufacturers like Dell, HP, Lenovo, etc. can have access to them. AMD is set to announce these processors for wider masses, such as consumer DIYers, later this year. So you must be wondering what is new about the 5000G APUs. For starters, the new APUs feature AMD's improved Zen 3 core with a notable IPC boost over Zen 2 found in last generation 4000G APUs. When it comes to graphics, the new APUs feature anywhere from 6-8 GPU cores, based on the Vega architecture.

When it comes to the available models, AMD lists six SKUs, all differentiating in CPU/GPU core count, TDP, and frequency. There are three regular SKUs, with their power-efficient variants. The regular SKUs are AMD Ryzen 7 5700G, Ryzen 5 5600G, and Ryzen 3 5300G. They are normal SKUs that have a TDP of 65 Watts, meaning a higher base frequency needing a more adequate cooling solution. However, as there are regular SKUs, there are also power-efficient, TDP-constrained models present. Called the AMD Ryzen 7 5700GE, Ryzen 5 5600GE, and Ryzen 3 5300GE, these models bring the TDP down to 35 Watts and reduce base frequency by a couple of hundreds of MHz.