Enterprise storage/computing is becoming less centralized in datacenters and controlled environments and becoming more distributed. Data is being driven to the edge where operating conditions are more extreme, locations are not easy to reach, and often, on the constant move. A new breed of storage solutions is needed, which combines the benefits of industrial solid-state drives (SSDs) and enterprise solutions. ATP Electronics, the global leader in specialized storage and memory solutions, proudly unleashes a product class like no other, going beyond the limits of traditional storage solutions, and offering the best of both of industrial and enterprise worlds: the new Industrial Enterprise Series.

The Industrial Enterprise N651Sie Series SSDs leverage NVMe PCIe Gen 4 x4 and are available as M.2, U.2, and E1.S. They are built for the age of data deluge as centralized computing increasingly moves to the edge, and enterprise operations in uncontrolled environments become more prevalent. They combine the best of enterprise and industrial features, making them excellent as boot drives, data storage drives, or mixed-use drives.

ATP Electronics, a global leader in specialized storage and memory solutions, proudly announces the launch of the N751Pi PCIe Gen 4 NVMe M.2 2280 SSDs, which set a new industry standard with unmatched endurance among industrial solid state drives (SSDs) configured with pseudo single-level cell (pSLC) NAND.

The groundbreaking 150K P/E cycling configuration of NAND was achieved, thanks to a combination of ATP's exceptional strengths — from the use of prime NAND package, stringent NAND integrated circuits (IC) characterization and 100% NAND screening and validation capabilities, to ATP's own-developed firmware, specialized hardware configurations, and technologies.

ATP Electronics, the global leader in specialized storage and memory solutions, proudly unveils the N651Si Series E1.S solid state drives (SSDs), which offer best in class performance, endurance, and data retention capabilities for the most demanding applications.

Supporting industrial temperature operating range (-40°C to 85°C) along with hardware power loss protection (HW PLP), the new SSDs offer the highest levels of reliability and total cost of ownership value in harsh environments, making them especially beneficial for mission-critical applications running under extreme temperatures, such as automotive, data logger, data centers, and defense/aerospace. Engineered for 1U Edge servers, the EDSFF offering with 9.5 mm symmetrical enclosure is available with up to 8 TB capacity and is constructed with 512 Gb prime NAND die 176-layer 3D triple level cell (TLC).

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest high-speed N601 Series M.2 2280 and U.2 solid state drives (SSDs) sporting the 4th generation PCIe interface and supporting the NVMe protocol. The new ATP PCIe Gen 4 SSDs' 16 GT/s data rate is double that of the previous generation, translating to a bandwidth of 2 GB/s for every PCIe lane.

Using x4 lanes, these SSDs have a maximum bandwidth of 8 GB/s, meeting the growing need for high-speed data transfer in today's demanding applications and making them suitable for both read/write-intensive, mission-critical industrial applications such as networking/server, 5G, data logging, surveillance, and imaging, with performance on par, if not better, than mainstream PCIe Gen 4 consumer SSDs in the market.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its 64 GB DDR4 very low profile registered DIMMS (VLP RDIMMs) built for embedded blade compute and storage, industrial single-board computers, enterprise networking, and Internet of Things (IoT) systems processing memory-intensive workloads. The new product offers twice the density of typical 32 GB VLP RDIMMs available in the market to meet the increasing memory requirements resulting from the endless generation of data from connected cars, smart factories, and other 5G IoT applications.

The high-performance 64 GB VLP RDIMMs are organized as 8192 MB x 72 bits in a 288-pin DIMM. Each module utilizes 18 chips of 8Gx4 DDR4 SDRAMs in dual-die package (DDP) stacked chips, consists of a 512-byte serial EEPROM containing the module information, and includes error correction code (ECC) to support error detection and correction.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces the N600Si/Sc Series CFexpress cards Type B, the latest NAND-flash based high-speed memory cards to adopt the NVMe protocol over PCIe interface. Using the PCIe 4.0 x2 interface, they deliver superior, high-speed performance compared with other cards using the PCIe 3.0 x2 interface.

N600Si/Sc Series CFexpress cards offer convenient portability with enhanced sequential read/write performance of up to 3,500/3,200 MB/s. These removable storage devices are backward-compatible with XQD. The N600Si/Sc Series CFexpress cards sport the Gen. 4 x2 interface and are also backward compatible with CFexpress Gen. 3 x2. They are suitable for convenient movement among different devices and provide dependable access in environments with little or no network availability.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest 3D triple-level cell (TLC) flash storage solid state drives (SSDs): the N700 and N600 Series, which support the high-speed PCIe 3.0 interface x4 lanes and NVMe protocol. The new SSDs offer hardware-based security features, such as Write Protection and Quick Erase, by project and customer request. Enabled through the general input/output (GPIO) pins, HW Write Protect puts the SSD in "Read Only" mode, thus preventing the modification or tampering of stored data. HW Quick Erase, on the other hand, initiates a block-by-block data pattern write operation to systematically erase any trace of user data.

Available as M.2 2230 modules, they offer better power efficiency and are suitable for applications using small and light systems such as point-of-sale (POS) systems, mobile PCs, Internet of Things (IoT) devices, and server boot applications. The N700 and N600 Series accommodate a heatsink ball-grid array (HSBGA) on the M.2 2230 form factor. For customers who prefer a soldered-down, vibration-proof solution, ATP also offers M.2 Type 1620 HSBGA SSDs with the same firmware and NAND configuration.

ATP Electronics, the global leader in specialized storage and memory solutions, rolls out its N600Vc Series M.2 2242/2280 NVMe 1.3 PCIe Gen3x4 and A600Vc Series SATA 2.5", M.2 2242/2280, and mSATA Value Line solid state drives (SSDs). Built with triple-level cell (TLC) NAND on leading 100+-layer 3D architecture, the new line is geared toward industrial/embedded applications requiring reliable performance, wide range of capacity options, and long-term supply commitment at friendly price points.

The new N600Vc/A600Vc Series SSDs offer lower cost per GB compared to ATP's mainstream Superior Line, but use prime NAND die along with ATP's superior integrated circuits (IC) sorting process to guarantee drive quality, performance, reliability, and endurance better than other SSD solutions in the market that use pre-packaged ICs instead of wafers or die.

ATP Electronics, the global leader in specialized storage and memory solutions, has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND. Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration options. ATP's new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.

The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces the A750Pi and A650Si/Sc Series embedded SSDs built on 3D triple level cell (TLC) NAND flash. Manufactured using a new die package, the Serial ATA solid state drives (SATA SSDs) deliver 66% higher endurance in native TLC mode and 50% higher in pseudo single level cell (pSLC) mode, making them on par with drives built on multi-level cell (MLC) and SLC flash, respectively.

The new SSDs come in M.2 2280 and 2242 as well as 2.5" and mSATA form factors. A750Pi/A650Si SSDs support industrial temperature (I-Temp) ranges from -40°C to 85°C to perform reliably even when operating under extreme and harsh conditions. A650Sc SSDs can support commercial operating temperatures (C-Temp) from 0°C to 70°C. A650Si/Sc with native TLC NAND flash have capacities from 120 to 1920 GB, while A750Pi drives configured in pSLC offer 80 to 640 GB. Depending on project and specific part number request, ATP's new SATA embedded SSDs are also available as self-encrypting drives (SEDs) featuring AES-256 encryption and Opal TCG 2.0-compliant security.

ATP Electronics, a global leader in specialized storage and memory solutions, has announced that its A600Sc Series serial ATA solid state drives (SATA SSDs) have been successfully qualified for compatibility and interoperability with Adaptec Smart Storage PCIe Gen 4 Tri-Mode SmartRAID 3200, SmartHBA 2200, and HBA 1200 Smart Storage adapters.

Designed for storage platforms in next-generation data centers, the Adaptec PCIe Gen 4 SAS/SATA/NVMe HBA and RAID tri-mode adapters deliver significantly higher performance through PCIe Gen 4 x16 CPU interfaces as well as SAS and SATA storage. The new offerings simplify integration and provide flexibility to aggregate diverse storage devices with Microchip's proven security and manageability features for the most demanding server storage applications.

ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe Gen3 x4 NVMe solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package. Complying with M.2 specifications, the M.2 Type 1620 HSBGA measures just 16 (L) x 20 (W) x 1.6 (H) mm, supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications. N700 Series SSDs are built with 3D triple-level cell (TLC) configured as pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

In response to the growing need for data protection, ATP Electronics, the global leader in specialized storage and memory solutions, has launched the SecurStor microSD cards - the latest in its line of secure NAND flash storage products for the Internet of Things (IoT), education, automotive, defense, aerospace and other applications requiring confidentiality and reliability.

"Removable storage media such as microSD cards provide great convenience and versatility for storing and transporting data. However, such convenience also exposes them to risks of unauthorized access," said Chris Lien, ATP Embedded Memory Business Unit Head. "In many instances, the boot image may be compromised, corrupting the operating system or rendering the system unusable. Malware may be introduced, or private information may be disclosed and used for damaging intents. Amidst such dangerous scenarios, we have made security a key priority for all ATP products."

Triple level cell (TLC) flash, long considered for consumer applications only, is now making inroads into rigid industrial segments where reliable performance and extended endurance are essential. 3D TLC-based flash solutions are among the next-generation products that ATP Electronics will showcase during the 2019 Flash Memory Summit at the Santa Clara Convention Center in California, USA from August 6 to 8 in meeting room #205. ATP is the leading manufacturer of "Industrial Only" memory and storage solutions committed to delivering the best total cost of ownership (TCO) value through longevity support, extensive testing and screening, and uncompromising quality.

"As an industrial only manufacturer, ATP is dedicated to making sure that our customers get the most out of their TCO. We take pride in having full in-house ownership of the manufacturing process, which allows us greater flexibility to meet customer needs and guarantee superior quality. With ATP NAND packaging and stringent testing capabilities, we guarantee the NAND quality control of our own-built modules to deliver extended lifespan and longevity support even after other manufacturers have stopped making products for legacy systems," said Marco Mezger, ATP Vice President of Global Marketing.

Fueled by continuous big data generation, the ongoing industrial revolution requires storage solutions that offer not only high performance, but also uncompromising reliability and maximum endurance. ATP Electronics, a leading manufacturer of industrial memory and storage solutions, tackles these tough storage demands with its new industrial e.MMC product family.

The ATP industrial e.MMC, which adheres to JEDEC e.MMC v5.1 Standard (JESD84-B51), is poised to make its mark at the Flash Memory Summit 2018 in Santa Clara, USA from August 7 to 9, 2018.

The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.

"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.

Today, Intel is taking another step forward, with two new technology announcements: Intel Threat Detection Technology (Intel TDT), a set of silicon-level capabilities that will help the ecosystem detect new classes of threats, and Intel Security Essentials, a framework that standardizes the built-in security features across Intel processors. We are also announcing a strengthened academic partnership with Purdue University, to help accelerate the development and availability of cybersecurity talent.

Intel Threat Detection Technology leverages silicon-level telemetry and functionality to help our industry partners improve the detection of advanced cyberthreats and exploits. Today we are announcing the first two Intel Threat Detection Technology capabilities, including implementation plans by Microsoft and Cisco.

The first new capability is Accelerated Memory Scanning. Current scanning technologies can detect system memory-based cyberattacks, but at the cost of CPU performance. With Accelerated Memory Scanning, the scanning is handled by Intel's integrated graphics processor, enabling more scanning, while reducing the impact on performance and power consumption. Early benchmarking on Intel test systems show CPU utilization dropped from 20 percent to as little as 2 percent.

ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, spearheads the implementation of industrial temperature (iTemp) support on its latest NVMe M.2 solid state drive modules. The new SSD modules support a wide operating temperature range of -40°C to 85°C to capably address the power and heat issues common in fanless embedded systems as well as extreme temperature variations in Industrial Internet of Things (IIoT) applications, enabling them to perform reliably in harsh environments.

When operating at high speeds in high-throughput scenarios, onboard thermal sensors can detect abnormal temperature elevation and automatically enable a mechanism that adjusts performance to cool the system. According to Peter Huang, ATP Head of Embedded Solid State Drive Business Unit, "ATP Dynamic Thermal Throttling intelligently regulates speed and power to reduce heat without aggressive declines in performance, unlike other thermal solutions that cause abrupt drops and thus compromise stability." Additionally, the low typical power consumption of 3.3V makes ATP's NVMe M.2 SSDs energy efficient, translating to longer drive usage and cost savings.

ATP Electronics, a leading manufacturer of high-performance cost-effective DRAM modules, announces the release of fast, low-power DDR4 solutions for the latest Intel Xeon Platinum, Gold, Silver and Bronze Scalable processors and 8th-generation Intel Core i7/i5/i3 processors. ATP's latest DDR4 solutions are ideal for high-performance computing (HPC) applications requiring high density, low power, great scalability and efficiency, such as telecommunication infrastructures, networking storage systems, network-attached storage (NAS) servers, micro/cloud servers, and embedded systems like industrial PCs.

Built-in enterprise-level density dramatically increases the capabilities of growing embedded and cloud computing environments to meet large-scale, memory-intensive workloads. The 1.2V low power design delivers optimal savings, keeping systems cool without escalating power bills. The latest Intel Xeon Scalable processors provide native support for six memory channels that can operate at the same speed even at full load, so ATP's DDR4-2666 modules ensure a big boost in performance and productivity with their fast 2666 MT/s data rate. The increased interface speed from 2400/MTs to 2666 MT/s amplifies theoretical peak performance by 15%.

ATP, the leading manufacturer of rugged SSDs and DRAM modules for the industrial markets, debuts its first NVMe based M.2 2280 SSD offering twice the performance of SATA-based SSDs. This newest generation SSD is designed to meet the storage demand of I/O intensive data processing and low latency requirement for industrial and mission critical applications, including surveillance, medical imaging, and many network- storage systems with fast caching requirement.

By adopting NVMe Rev.1.2 specifications and integrating the latest 3D NAND MLC technology, ATP's M.2 2280 NVMe SSD is constructed via a PCIe Gen 3x4 bus interface offering from 128GB up to 1TB of memory capacity to boost its performance to exceed the previous bottleneck of AHCI standards, delivering Sequential Read up to 1,260 MB/s and Sequential Write up to 980 MB/s.

ATP Electronics Inc reveals its new 3D NAND based SATA product line up on the Embedded World 2017 in Nuremberg. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP's in-house self-packaging technology. Available form factors include 2.5", mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192 GB, 384 GB and 768 GB. The products will be showcased at ATP's booth in Hall 1, Booth #1-655.

ATP, the leading manufacturer of high performance DRAM and flash memory solutions, has announced the industry's first DDR3L ECC SODIMM technology capable of operating at 1866MHz. The ATP DDR3L-1866 modules are available with capacities of 4GB and 8GB and address the need for low voltage (1.35V) DDR3 memory running at 1866MHz (instead of 1600 MHz). As a result they can maximize system performance when used in conjunction with Intel Apollo Lake processors.

The new ECC SODIMM is available in both commercial temperature (CT 0°C to 85°C) and industrial temperature grade (IT -40°C to 95°C) options, providing the flexibility to meet the operating conditions of a wide variety of IoT (internet of things) systems. The industrial temperature range durability feature is especially beneficial in harsh environments and embedded applications such as industrial IoT and automation devices, telecommunication systems, healthcare technology and outdoor data collection systems.

ATP, the leading industrial Flash storage and DRAM memory solution provider, will be showing its industrial-grade M.2 and the latest SATA III interface products (SlimSATA, mSATA, and CFast) and ATP Testing Capabilities at the upcoming Embedded World 2015 at the Messe Nuremberg International Center Germany from 24th to 26th of February. ATP will be located at Hall 1, Booth #651.

ATP's brand-new industrial-grade SATAIII M.2 type 2242 and 2260, targets industrial embedded applications, which demand Solid State Storage with high performance and proven reliability in thin/limited spaces and extreme temperature conditions. In addition to the built-in features, such as BCH ECC checking, S.M.A.R.T monitor, TRIM and Advanced Wear-Leveling, ATP M.2 has its Power Cycling Protection (PowerProtector) and Data Integrity Protection (AutoRefresh) to ensure it outperforms other similar solutions in the market.

ATP, the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, introduces its latest technology, advancedMLC, also known as "aMLC". Developed by ATP, aMLC is an advanced firmware technology uniquely implemented onto ATP's NAND Flash products to vastly improve the endurance and performance of these storage devices while using mainstream MLC NAND to provide the best cost effective solution for any read/write intensive applications.

ATP will showcase this technology and related products at the Flash Memory Summit 2014 from August 5 to 7 at the Santa Clara Convention Center, booth# 516.

ATP, the leading manufacturer of embedded Flash, ruggedized SSD and DRAM modules, upgraded its product lines of the Horizontal and Vertical SATA DOM product series with a few refined features targeting networking, industrial automation/equipment, gaming, POS and digital signage markets. Due to diminishing supplies in the market for small NAND Flash form factors, the renewal of this product series has come at a good time. The ATP SLC based Horizontal and Vertical SATA DOM product series are available in densities ranging from 2G to 16GB and are available for sampling immediately.

The new ATP SATA DOM product series come with the latest development of the hardware based PowerProtector, which provides more coverage of data protection in the event of a sudden power outage. The latest generation of PowerProtector provides more power for the controller to flush the data once a power outage is detected, temporarily storing in the SRAM and DRAM along the data path in a NAND Flash product, and into the flash ICs. This means the PowerProtector offers more protection for the data integrity in the case of a sudden loss of power. Moreover, the SLC based products have more than twenty times program/erase life cycles over other MLC Flash based NAND Flash products on the market, demonstrating extended product usage life and robustness to meet the industrial challenges.