Rumors of Intel's "Nova Lake-S" processors are increasing, meaning that the design is nearing completion. Expected to arrive in the second half of 2026, Nova Lake‑S will offer configurations ranging from mainstream quad‑core models to a flagship with 52 cores. Initial information suggests that Intel will employ a tile-based design, separating LPE cores from P-Cores and E-Cores to optimize flexibility and yield. At the top of the lineup is the rumored Core Ultra 9 model, possibly designated 385K. It will combine 16 P-cores, 32 E-cores, and four LPE-cores for a total of 52 cores, as previously rumored. With a TDP of 150 W, it will be the most powerful SKU Intel prepared for this generation. Below the flagship, Intel appears to be planning a Core Ultra 7 SKU with 14 P-cores, 24 E-cores, and four LPE cores, totaling 42 cores.

The Core Ultra 5 series may include three variants: a 28-core version with eight P-cores, 16 E-cores, and four LPE-cores; a 24-core version with eight P-cores, 12 E-cores, and four LPE-cores; and an 18-core model with six P-cores, eight E-cores, and four LPE-cores. Entry-level Core Ultra 3 parts would feature either a 16-core configuration with four P-cores, eight E-cores, and four LPE-cores, or a 12-core option with four P-cores, four E-cores, and four LPE-cores, both targeting a 65 W power envelope. All desktop SKUs are expected to feature four LPE cores on a separate die, suggesting a multi-tile package similar to Meteor Lake. Power demands will range from 65 W in entry-level segments to 150 W for high-end parts. Intel is reportedly preparing a new LGA 1954 socket even as it readies an Arrow Lake-S refresh for late 2025. Intel has also reportedly designated Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties.

MSI IPC is proud to unveil the MS-CF23, a high-performance Mini-ITX motherboard designed for mainstream embedded and industrial applications. Powered by the latest 15th Gen Intel Arrow Lake-S Core Ultra 9/7/5 Series processors and integrated with the Intel H810 chipset, the MS-CF23 delivers exceptional processing power, enhanced connectivity, and maximum flexibility in a compact size.

Notably, the Arrow Lake Core Ultra processors are Intel's first to include an integrated Neural Processing Unit (NPU), bringing dedicated AI acceleration directly on the chip for smarter and faster edge computing. Engineered to meet diverse application needs such as digital signage, automation, and edge computing, the MS-CF23 offers rich I/O, scalable memory support, and advanced display capabilities, all with robust reliability and simple integration. Ideal for applications such as automation, digital signage, and edge computing, the MS-CF23 is packed with features to support robust computing and connectivity.

The BCM RX880W is a new microATX motherboard built on Intel's latest Core Ultra platform, formerly known as Arrow Lake-S/Arrow Lake-S Refresh, pairing the Intel W880 chipset with the LGA1851 socket to support the 15th Gen Intel Core Ultra processors (Series 2). This board is designed to deliver cutting-edge performance while retaining robust legacy support, making it ideal for hardware and system engineers in the fields of medical & healthcare, industrial & automation, smart retail, digital signage, intelligent Kiosk, Edge AI server, security, and electronics distributors seeking next-generation solutions.

RX880W microATX New Design Features for Edge AI Computing and Compact Storage Servers
High-Performance with AI enabled CPU Support:

• LGA1851 socket supports Intel's latest Core Ultra 5/7/9 processors (Series 2), up to 125 W TDP
• Dual SlimSAS Connectors - High-Speed Storage in Compact Systems
  • The RX880W integrates two SlimSAS (SFF-8654) connectors—a standout feature rarely seen on industrial Micro ATX motherboards. Each SlimSAS supports PCIe Gen 4 x4, enabling flexible, high-bandwidth storage options ideal for dense, compact edge and storage platforms.

We have not heard much about Intel's much-debated "Arrow Lake-S Refresh" (or ARL-S Refresh) desktop CPU family in the second quarter of this year. Going back to March, Golden Pig Upgrade predicted another revival of Team Blue's troubled mid-gen update—aka the Core Ultra 300 series. A week or two later, Jaykihn—another tenured discloser of inside track info—theorized an upcoming lineup of "-K and -KF only" SKUs. Hardcore PC hardware enthusiasts and overclockers will likely welcome these unlocked offerings, but an alleged lack of "normal" refreshed options will sting certain consumer bases. The ever intrepid momomo_us has discovered an interesting tidbit; bringing and end to two+ months of "Arrow Lake-S Refresh" silence.

A leaked "W880 PCH" workstation-grade motherboard flow diagram mentions support for "Arrow Lake-S Refresh." This is under the banner of "Core Ultra (Series 2) processors up to 125 W TDP." Unsurprisingly, we are looking at repeat business with the current generation's LGA 1851 socket platform. Intel is still working on the "Nova Lake‑S" (NVL‑S) CPU range; serving as a natural successor to their "Arrow Lake-S" desktop lineup. Lately, data miners have unearthed details regarding a matching "LGA 1954" socket type. According to official announcements, "Nova Lake" processors are "on track" to launch somewhere within 2026. Before then, "Arrow Lake-S Refresh" CPUs are expected to arrive later this year—possibly signalling the final tranche of "ARL."

ADATA's XPG sub-brand is best known for producing gaming hardware, but Project INFINITY signals a significant diversification. Two demonstration sample DDR5 UDIMMs were mounted on an open plan build, at the company's Computex booth. Despite bearing XPG branding and gaming-oriented aesthetics, these memory modules are not wholly related to a freshly presented Lancer Neon DDR5 product line. Instead, ADATA has deemed Project INFINITY worthy of inclusion in their "AI Revolution" portfolio.

Impressive credentials are outlined in PR material: "XPG pushes overclocking to new heights with memory solutions that blend extreme performance, bold design, and sustainable materials. Project INFINITY delivers up to 9200 MT/s with 48 GB capacity per module, featuring RGB lighting and an infinity mirror heatsink for a stunning visual effect. For professional workloads." According to an accompanying placard, XPG's bare build utilizes an ultra-expensive ASUS ROG Maximus Z890 Hero mainboard foundation. Intel's Arrow Lake-S flagship CPU—Core Ultra 9 285K—drives the Project INFINITY-centric PC system. Appropriately, the XPG team has selected an ADATA Mars 980 BLADE Gen 5 M.2 SSD, for ultra-fast storage purposes. Hopefully, additional/refined Project INFINITY examples will turn up in the near future.

Today, Intel introduced a new "200S Boost" factory-approved overclocking profile for the unlocked Intel Core Ultra 200S "Arrow Lake" processors. Namely, the Core Ultra 9 285K, 7 265K/265KF, and 5 245K/245KF SKUs are supported when installed on a compatible Intel Z890 motherboard with one‑DIMM‑per‑channel Intel XMP DDR5 memory. Activating the 200S Boost profile in the BIOS raises the System-on-Chip (fabric) clock from 2.6 GHz to up to 3.2 GHz and the die‑to‑die interconnect from 2.1 GHz to up to 3.2 GHz (within VccSA ≤ 1.20 V) while pushing DDR5 speeds from stock 6,400 MT/s to as much as 8,000 MT/s (VDD2/VDDQ ≤ 1.40 V). Intel has validated the profile on a selection of Z890 boards, including ASRock Z890 Taichi OCF, ASUS ROG Maximus Z890 Hero, Gigabyte Z890 Aorus Master, MSI MEG Z890 Ace, and others. For memory kits, Intel validated DDR5 memory kits from ADATA, Corsair, G.SKILL, Team Groupp, and V‑COLOR.

Enabling 200S Boost requires a BIOS update, selecting the "Intel 200S Boost" preset under the overclocking menu, and rebooting; stability should then be verified with benchmarks like Cinebench, and thermals/voltages monitored via Intel XTU or similar tools. Perhaps the most important fact is that using the 200S Boost profile does not void Intel's three‑year limited warranty on boxed Core Ultra 200S CPUs, provided they weren't manually overclocked before profile activation. Intel cautions that actual gains depend on motherboard design, cooling, and memory quality, that two‑DIMM‑per‑channel setups aren't officially supported, and that damage to non‑Intel components remains outside warranty coverage. This is more of a safe heaven for anyone wanting to do manual tuning, but not wanting to break any warranty and thus risk damaging their CPU without a backup plan.

Introducing the MS-CF20, a high-performance ATX motherboard with the Intel W880 chipset, supporting the 15th Gen Intel Arrow Lake-S Series processors. Designed to meet the needs of advanced computing applications, the MS-CF20 combines next-generation CPU support with robust legacy features, offering unparalleled versatility for both modern and existing systems.

The MS-CF20 supports Intel Core U9/U7/U5, Pentium, and Celeron processors, leveraging the latest advancements in Intel 15th Gen Arrow Lake-S technology. With higher core counts, improved instructions per clock, and greater energy efficiency, the new processors deliver exceptional performance for demanding and AI-driven workloads. The board is equipped with 4 DDR5 UDIMM slots, supporting both ECC and non-ECC memory at speeds up to 5600 MT/s and a maximum capacity of 192 GB, enabling unmatched performance for data-intensive applications.

Back in February, we reported on Intel considering a resurrection of the "Arrow Lake Refresh" Core Ultra 300 series of CPUs. However, it seems that @Jaykihn, a reliable source of Intel leaks, has confirmed that Intel will indeed push the refresh of Arrow Lake in the form of Core Ultra 300 series of CPUs, limited to K and KF SKUs only. This means we will likely see only overclockable SKUs being refreshed, with possibly enhanced boost frequency and/or core count. With 125 W TDP, these new SKUs would target high-end markets, passionate overclockers, and system integrators selling high-end builds with these CPUs. The refresh's journey to confirmation has been turbulent. Initial rumors in 2023 suggested an ambitious core-count bump for Arrow Lake-S, followed by speculation that Intel would prioritize NPU upgrades, potentially mirroring Lunar Lake's reported 48 TOPS capability—a massive leap from the current Core Ultra 9 285 K's 13 TOPS. By late 2023, leaks hinted at the project's cancellation, but insiders like Chinese leaker Golden Pig Upgrade later revived hopes, asserting that desktop-focused "ARL-S Refresh" had been quietly resurrected.

Jaykihn's latest intel narrows the scope: only K/KF-series chips will receive tweaks, leaving non-overclockable SKUs untouched. Intel is also reportedly developing new performance profiles for existing Arrow Lake CPUs, separate from warranty-voiding BIOS tweaks. These optimizations, alongside the upcoming Intel Performance Optimization (IPO) program, aim to help OEMs and system integrators push pre-built systems further via safer, stability-focused adjustments to clock speeds, power limits, and memory overclocking. While enthusiasts may still prefer manual overclocking, IPO could democratize performance gains for mainstream users. The Core Ultra 300 series will slot into Intel's LGA-1851 roadmap between the base Arrow Lake-S (Core Ultra 200) and 2026's next-gen Nova Lake-S (Core Ultra 400).

MSI IPC, a global leader in computing and AI-driven solutions, is set to unveil its latest Edge AI Computing innovations at Booth No. 1-389, Embedded World 2025 in Nuremberg, Germany. Powered by the latest Intel platform, MSI's cutting-edge technologies will drive advancements in automation, digital signage management, and AI-driven customer interactions.

Several MSI's partners, including Alptech, Spo-comm, Spectra, and Elmark, are joining this event to showcase their cutting-edge solutions powered by MSI IPC products. Their demonstrations will feature a diverse range of applications, including 4U rackmount systems, Panel PCs (PPC), and KIOSK solutions, highlighting the versatility and performance of MSI's industrial computing technology in various sectors.

Intel is reported to be eyeing a revival of its "Arrow Lake Refresh" desktop processor design—Golden Pig Upgrade disclosed this "strange" revelation via an updated Weibo blog post. Back in 2023, the Chinese hardware reviewer and leaker extraordinaire theorized that Team Blue's much-rumored shelving of "ARL-S/HX Refresh" came down to cost/benefit considerations relating to accommodating an upgraded NPU in the chip's tile-based design. Last September, reports suggested that Intel had put the final kibosh on a 14th Gen Core Ultra 8P+32E "Arrow Lake Refresh" processor series—leaked roadmaps had a launch window marked down for late 2025, going into 2026. Industry watchdogs have picked up on Golden Pig Upgrade's latest forecast—prompting further theorizing.

Intel has its mobile segment's future covered with Panther Lake (later in 2025) and Nova Lake (2026), but a notable gap exists in their desktop world. Nova Lake's desktop S-series is slated for launch at some point in 2026, so this year could be prime territory for a mild refresh of existing Arrow Lake-S processors—on the LGA1851 socket. Golden Pig Upgrade reckons that refreshes of ARL-S (desktop) and ARL-HX (high-end laptop) are back on Team Blue's upcoming product roadmap. Industry moles reckon that an updated NPU design—potentially similar to the one housed in Lunar Lake mobile chips—will be the only major upgrade lined up for the so-called "Core Ultra 300" processor series. Intel's current-gen flagship model—Core Ultra 9 285K—has NPU performance topping off at 13 TOPS. Refreshed Arrow Lake SKUs could be deployed with an improved NPU aspect, perhaps capable of hitting 48 TOPS.

ASRock Industrial proudly unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. The new range of motherboards support up to DDR5 6400 MHz memory, offering versatile I/O, expansion options, quad display capabilities. Featuring PCIe Gen 5, and USB4/ Thunderbolt 4 for ultra-fast connectivity, select models offer 10G LAN to meet the demands of high-speed networking. With flexible form factors including Mini-ITX, Micro-ATX, and ATX, these motherboards cater to versatile edge AI applications across industrial automation, robotics, AI agents, kiosks, retail, gaming and beyond.

Mini-ITX Models (High Rise I/O): IMB-1246 and IMB-1247
Leveraging Intel Core Ultra 200S Processors, the IMB-1246 utilizes the H810 Chipset, while the IMB-1247 features the Q870 Chipset, offering enhanced scalability. Both models support up to 96 GB DDR5 memory via two CSO-DIMM (DDR5 6400 MHz) or SO-DIMM (DDR5 5600 MHz) slots. Offering various expansion capabilities and I/O tailored for diverse applications, including one PCIe x16 (Gen 5) and one USB4/ Thunderbolt 4. The IMB-1246 provides two USB 3.2 Gen 2, one USB 3.2 Gen 1, four USB 2.0, one M.2 Key E, one M.2 Key M, four COM ports, and two SATA 3 ports, while the IMB-1247 enhances connectivity with five USB 3.2 Gen 2, two USB 3.2 Gen 1, two USB 2.0, one M.2 Key B, one M.2 Key E, two M.2 Key M, four COM ports, and three SATA 3 ports. Networking feature offers one 2.5G LAN and one 1G LAN. Display support includes triple display output on the IMB-1246 with two HDMI 2.1 TMDS, one DP 2.1 (via Type-C), and one LVDS/eDP while the IMB-1247 supports quad display output, adding one DP 1.4a for greater flexibility.

Intel today launched "locked" 65 W variants of its Core Ultra "Arrow Lake-S" desktop processors in the Socket LGA1851 package. The company also announced more affordable motherboard chipset models, namely the Intel B860 mid-range chipset, and the Intel H810 value-ended chipset. The processor lineup is led by the Intel Core Ultra 9 285 (8P+16E, up to 5.60 GHz P-core boost), followed by the Core Ultra 7 265 (8P+12E, up to 5.30 GHz P-core boost); and the Core Ultra 5 245 (6P+8E, up to 5.10 GHz P-core boost). All three come with suitable boxed cooling solutions in the retail channel.

The Intel B860 chipset comes with a 4-lane DMI 4.0 chipset bus (half the bandwidth of the 8-lane chipset bus of the Intel Z890). The PCH puts out 14 PCI-Express 4.0 general purpose lanes, exactly half the number put out by the Z890. Storage connectivity, besides the configurability of the PCIe GPP lanes, include four SATA 6 Gbps ports. Networking includes a 1 GbE MAC, and Wi-Fi 6E integrated MAC, with Bluetooth 5.3. You can have up to 16 USB 3.2 lanes (each worth 5 Gbps), which can be configured as 5 Gbps, 10 Gbps, or 20 Gbps ports. The B860 lacks CPU overclocking support, but retains memory overclocking, including the ability to apply XMP 3.0 profiles.

Intel today hosts the 2025 International CES Keynote address with a slew of announcements from across its consumer and commercial processor product lines. The company is expected to expand its "Arrow Lake" and "Lunar Lake" processor lines that it debuted in 2024, across many new product segments. In particular, "Arrow Lake" is expected to hit critical mass in the mobile and commercial PC spaces. "Lunar Lake" will see many more processor models, letting it power the year's most popular Copilot+ AI PCs. The desktop Core Ultra "Arrow Lake-S" will enter mainstream segments alongside mid-range motherboard chipsets. Join us, as we blog the very latest from Intel's CES keynote.Update 16:32 UTC: The show is underway.

Update 16:37 UTC: Michelle Johnston Holthaus, Interim co-CEO, is expected to take centerstage.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

Here are some of the first pictures of the retail boxes of the Intel Core Ultra 200-series "Arrow Lake-S" 65 W desktop processors. Intel debuted the series with Unlocked K-series SKUs in October 2024, and will expand it in January 2025 with 65 W models that lack unlocked multipliers. The unlocked models lack any included stock cooling solution, while the 65 W models come with them. There's no word on what the coolers look like, but if we were to guess, Intel will reuse its Laminar series fan-heatsinks that it debuted with its 12th Gen Core "Alder Lake."

The new Socket LGA1851 retains cooler compatibility with the previous LGA1700, which is why the company could reuse the Laminar series. The Core Ultra 9 65 W retail box appears the largest, and so it could include the Laminar RH1 cooler that's capable of cooling the processor as it draws its maximum turbo power. This cooler comes with some blue LED illumination. The Core Ultra 7 and Core Ultra 5 65 W retail boxes appear to have the same thickness, which means the two could include the mid-tier Laminar RM1 cooler. The RM1 has a slightly thinner heatsink, but comes with an illuminated ring along the bore of the fan-frame. If Intel launches a Core Ultra 3 series (successor to the Core i3), Intel will likely include the Laminar RS1, the lightest variant, which lacks any lighting. The first three pictures (below) show boxes of the standard variants of the 65 W SKUs, the 4th and 5th pics show the boxes of the "F" SKUs which lack integrated graphics.

Intel today, in a letter to the press, presented an overview of the lower than expected performance of its latest Core Ultra "Arrow Lake-S" desktop processors, which the company released this October, to less than enthusiastic reviews. The top Core Ultra 9 285K ended up barely faster than the previous Core i9-14900K in gaming performance, and moderately faster in applications. AMD's November release of the Ryzen 7 9800X3D extended the green team's lead over Intel, prompting Intel to get to work on identifying why "Arrow Lake-S" isn't as fast as the company hoped, and if there was something the company could do about it.

Last month, Intel announced that it had identified probable reasons why "Arrow Lake-S" underperforms and that it is working on a combination of fixes that include OS-level updates from Microsoft, some motherboard-vendor level fixes to their UEFI setup programs, and a microcode update for its processors. Intel's microcode updates have been in the news throughout 2024, as one such update proved crucial in fixing the faulty voltage regulation behavior of its Core "Raptor Lake" processors, which was causing irreversible damage to the chips. Today, the company released documentation that highlights all issues the company identified by Intel, their technical root cause, and what's been done about it. Long story short—most of these issues are already addressed, but the Microcode update should be in circulation by January 2025, when the company expands its Core Ultra 200-series desktop processors with 65 W models.

Update Dec 19th: We tested the new OS patches, and unfortunately we have to report that this not a general fix for Arrow Lake, but just a fix for performance problems specific to 24H2. More in our article.

Update Dec 20th: Last night, ASUS released a non-Beta BIOS with microcode 0x114, we tested it and the findings are included in the Dec 19 article linked above.

Intel is significantly expanding its desktop Core Ultra 200 "Arrow Lake-S" lineup with new 65 W models along the sidelines of the 2025 International CES, but more importantly, it is bringing the "Arrow Lake" microarchitecture to the mobile space. The company is planning to launch at least 22 processor models this January, but not all of them are based on "Arrow Lake." Tom's Hardware reports that the lineup broadly revolves around the "Core 2-series" processor model numbering.

The Core Ultra 200H series consists of H-segment (conventional thickness notebook) processors in the 28 W to 45 W class, and are based on the "Arrow Lake-H" silicon. The Core Ultra 200HX series targets premium gaming notebooks and portable workstations, and consists of 55 W to 65 W class processors, including CPU overclocking capabilities on certain models. Things get interesting with the Core Ultra 200U series. These chips are based on the "Meteor Lake Refresh" silicon—an older microarchitecture—targeting the 7 W to 28 W segments for ultraportables. Lastly, there's the Core H 200 and Core U 200 series (no "Ultra" in the branding), which are based on the older "Raptor Lake" monolithic silicon, targeting mainstream notebooks.

The gaming performance of Intel's latest Core Ultra 200-series "Arrow Lake-S" desktop processors missed the mark by quite a bit, ending up slower than the 14th Gen Core "Raptor Lake" processors. Adding pressure to Intel is AMD's recent launch of the Ryzen 7 9800X3D, which extends the company's leadership in gaming performance, ending up to 12% faster than the top Core Ultra 9 285K at gaming (1080p). The company then announced that it has identified possible reasons why gaming performance of "Arrow Lake" ended up below expectations, and that it's working on a microcode-level update to the processor.

A discussion in the ASUS ROG Forums sheds light on what this microcode update could be. Allegedly, it's called the Intel 0x114 Microcode Update, and you can expect it soon in a beta UEFI firmware update from ASUS and other motherboard vendors, which makes it possible that we see a public release of the microcode either by yearend, or in Q1-2025. There's still no word on the extent of gaming performance gain from this microcode, but if we were to speculate, Intel wouldn't bother with such an update if it didn't at least bring "Arrow Lake" to the same gaming performance level as "Raptor Lake," if not higher.

The desktop version of AMD's next-generation "Zen 6" microarchitecture will retain Socket AM5, Kepler_L2, a reliable source with hardware leaks, revealed. What's more interesting is the rumor that the current "Zen 5" will remain AMD's mainstay for the entirety of 2025, and possibly even most of 2026, at least for the desktop platform. AMD will be banking heavily on the recently announced Ryzen 7 9800X3D, and its high core-count siblings, the Ryzen 9 9950X3D and possible 9900X3D, to see the company through for 2025 against Intel. The 9800X3D posted significantly higher gaming performance than Intel, and the 9950X3D is expected to be at least faster than the 7950X3D at gaming, which means its gaming performance, coupled with multithreaded application performance from its 16-core/32-thread count should be the face of AMD's desktop processor lineup for at least the next year.

It wouldn't be off-character for AMD to launch "Zen 6" on AM5, and not refresh the platform. The company had launched three microarchitectures (Zen thru Zen 3) on Socket AM4. With "Zen 6," AMD has the opportunity to not just increase IPC, but also core-counts per CCD, cache sizes, a new foundry node such as 3 nm, and probably even introduce features such as hybrid architecture and an NPU to the desktop platform, which means it could at least update the current 6 nm client I/O die (cIOD) while retaining AM5. A new cIOD could give AMD the much-needed opportunity to update the DDR5 memory controllers to support higher memory frequencies. The Kepler_L2 leak predicts a "late-2026 or early-2027" launch for desktop "Zen 6" processors. In the meantime, Intel is expected to ramp "Arrow Lake-S" on Socket LGA1851, and debut the "Panther Lake" microarchitecture on LGA1851 in 2025-26.

Kovan Yang set a new memory frequency record of DDR5-12196 (6097.6 MHz). This was possible with an Intel Core Ultra 7 265K with 2P+0E configuration running at a low 400 MHz, an MSI MEG Z890 Unify-X motherboard, and a single Kingston FURY Renegade 24 GB CKD module. The sub-timings achieved were 48-120-120-127-2. Not much else is known about the feat, such as the cooling or DRAM voltages used. The 5°C CPU temperature reading in the CPU-Z validation page suggests that an extreme cooling solution is being used. The Core Ultra "Arrow Lake-S" processor and Z890 platform, when paired with CUDIMMs (DDR5 DIMMs with client clock drivers) yield extreme memory overclocking capabilities, with several initial memory OC records breaching the 12000 MT/s mark. The HWBOT page can be accessed here, and the CPU-Z Validation page here.

The launch of Intel's "Arrow Lake-S" Core Ultra 200S series of desktop processors has been a bit of a disappointment for gamers, given a slight regression in the new generation's gaming performance. While excelling in productivity tasks, these CPUs are not seemingly the top choice for gamers. According to data from Mindfactory, one of Germany's largest retailers, Intel's Arrow Lake CPUs didn't account for even one Intel-powered CPU sale since the October 24 launch. This is a massive contradiction to US-based retailers like Amazon and Newegg, which sold out their Arrow Lake stock swiftly. However, the German retailer paints a different picture.

In terms of units sold, there were 730 AMD CPU units sold, while only 40 Intel. AMD accounted for 94.81% of that week's sales, with an average selling price of 267 Euros and Intel's average selling price of 388 Euros per unit. It is worth pointing out that this information is only based on one week of sales and should not be a general guide for Intel Arrow Lake sales in Germany. We are still left to see how many units will be sold in the coming weeks, especially with the upcoming holiday season. Below is the picture from TechEpiphany on X, showing all the sold units and their quantity.

Intel today released the latest version of its Arc GPU Graphics drivers. Version 101.6129 WHQL adds support for the Xe-LPG integrated graphics of the Core Ultra "Arrow Lake-S" desktop processors. The drivers also come with optimization for "Call of Duty: Black Ops 6," and performance improvements for "Diablo IV: Vessel of Hatred" to the Xe-LPG iGPU of Core Ultra 100-series "Meteor Lake" mobile processors. The drivers fix an issue applicable to Arc A-series discrete GPUs where Blender may experience an application crash. Grab the driver from the link below.

DOWNLOAD: Intel Arc GPU Graphics Drivers 101.6129 WHQL

Intel today formally launched its Core Ultra Series 2 "Arrow Lake-S" desktop processors in the new Socket LGA1851 package, along with compatible motherboards by partners based on the new Intel Z890 chipset. Launching today are models targeting the gaming PC and overclocker crowds, all models launching today are unlocked, and ready for overclocking. Leading the pack is the Core Ultra 9 285K (8P+16E, 36 MB L3 cache), priced at USD $590, followed by the Core Ultra 7 265K (8P+12E, 30 MB L3 cache), priced at $390; and the Core Ultra 5 245K (6P+8E, 24 MB L3 cache), priced at $310. The 265KF and 245KF are variants without iGPU, priced $15 lower than the 265K and 245K, respectively. You can read all about these chips in our detailed reviews linked below.

Intel Core Ultra 9 285K Review | Intel Core Ultra 7 265K Review | Intel Core Ultra 5 245K Review

Ahead of its launch, some of the first pictures of G.Skill Memory's Trident Z5 CK series DDR5 CUDIMMs leaked to the web. The "CK" brand extension is used to denote CUDIMMs, or DDR5 DIMMs with a client clock-driver (CKD) component. The CKD is a component that acts like a filter to the memory physical-layer digital waveform, "clearing up" the memory eyes at high memory clocks. This enables higher DDR5 speeds upward of 8000 MT/s, although CUDIMMs can also be found at speeds as low as 6400 MT/s. Intel considers DDR5-8000 the "sweetspot" memory speed for its Core Ultra "Arrow Lake-S" desktop processors, which means 8000 MT/s should be possible in Gear 2 mode, and future memory kits with speeds in excess of 10000 MT/s should be possible with Gear 4.

As Intel's Core Ultra "Arrow Lake-S" desktop processors near their launch, ASUS China put out a video presentation about its Z890 chipset motherboards ready for these processors, which included a technical run-down of Intel's first tile-based desktop processor, which included detailed die-shots of the various tiles. This is stuff that would require not just de-lidding the processor (removing the integrated heat-spreader), but also clearing up the top layers of the die to reveal the various components underneath.

The whole-chip die-shot gives us a bird's eye view of the four key logic tiles—Compute, Graphics, SoC, and I/O, sitting on top of the Foveros base tile. Our article from earlier this week goes into the die areas of the individual tiles, and the base tile. The Compute tile is built on the most advanced foundry node among the four tiles, the 3 nm TSMC N3B. Unlike the older generation "Raptor Lake-S" and "Alder Lake-S," the P-cores and E-core clusters aren't clumped into the two ends of the CPU complex. In "Arrow Lake-S," they follow a staggered layout, with a row of P-cores, followed by a row of E-core clusters, followed by two rows of P-cores, and then another row of E-core clusters, before the final row of P-cores, to achieve the total core-count of 8P+16E. This arrangement reduces concentration of heat when the P-cores are loaded (eg: when gaming), and ensures each E-core cluster is just one ringbus stop away from a P-core, which should improve thread-migration latencies. The central region of the tile has this ringbus, and 36 MB of L3 cache shared among the P-cores and E-core clusters.